JPWO2013073541A1 - Electronic module and method for manufacturing electronic module - Google Patents

Abstract

First, the flexible base material 100 on which the electronic components 130 and 140 are mounted is held on the first mold 200. At this time, the protrusion 240 formed on the first mold 200 is inserted into the through hole 150 formed on the flexible base material 100 from the back surface side to the front surface side. Next, the second mold 300 is joined to the first mold 200, and resin is injected from the gate 250 into the cavity 400 formed by the first mold 200 and the second mold 300. At this time, in a state where the protrusion 240 is inserted into the through hole 150, the resin flows into the cavity 400 so that the resin flowing out from the gate outlet 260, which is the outlet of the gate 250, spreads on the surface of the flexible substrate 100. inject. Thereby, the appearance of the electronic module can be improved.

Description

  The present invention relates to an electronic module and a method for manufacturing the electronic module, and more particularly to a technique for sealing an electronic component on the surface of a flexible substrate with a resin.

Electronic devices such as communication devices and personal computers include, for example, an electronic module such as a central processing unit (CPU) and an integrated circuit (Multi-chip Module: MCM), a display, a battery, and a housing for housing these. It consists of the body. The electronic module is configured, for example, by sealing a plurality of electronic components on a base material with a resin.
In recent years, with the full-scale arrival of a ubiquitous network society, there has been a strong demand for miniaturization and thinning of electronic devices.
Patent Document 1 discloses a technique for sealing an electronic component mounted on a substrate with a resin. In this technique, first, the back surface of the substrate on which the electronic component is mounted is sucked and the back surface of the substrate is brought into close contact with the mold. Next, in a state where the back surface of the substrate is in close contact with the mold, the resin is injected into the cavity of the mold, and the cavity is filled with the resin. At this time, a gate for injecting resin into the cavity is provided on the side of the substrate. Then, the resin in the cavity is cooled to solidify the resin. Thereby, the electronic component mounted on the substrate is sealed with the resin, and the electronic module is completed.
As described above, in the technique described in Patent Document 1, the resin is injected into the cavity by adsorbing the plate-like base material and fixing the plate-like base material to the mold. The deformation of the substrate due to the injection pressure was reduced.
Other related techniques are disclosed in, for example, Patent Documents 2 to 5.
JP 2006-303327 A JP 2009-158781 A JP 2000-340714 A JP 2002-270638 A JP 2010-232208 A

However, in the technique described in Patent Document 1, a gate for injecting resin into the cavity is provided on the side portion of the base material. For this reason, even if the resin is injected into the cavity with the base material adsorbed and fixed to the mold, the resin flows along the surface of the substrate after colliding with the end face of the base material. For this reason, the base material may be turned over by the pressure of the resin to be injected. This phenomenon is particularly remarkable when a flexible material is used, such as a flexible printed circuit (hereinafter referred to as FPC).
As described above, in the technique described in Patent Document 1, in particular, when a flexible material is used for the base material, the base material may be turned or wrinkled, and the appearance of the electronic module is not good. There was a problem.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic module having a good appearance of the electronic module and a method of manufacturing the electronic module.

The electronic module manufacturing method of the present invention has a flexible substrate having a through hole and an electronic component mounted on the surface thereof, and a gate for injecting resin on the surface side of the flexible substrate. A base material holding step for holding the first mold; a mold bonding step for bonding a second mold that forms a cavity together with the first mold to the first mold; and the first mold A resin sealing step of injecting the resin into the cavity formed by the metal mold and the second metal mold from the gate to seal the electronic component on the surface side of the flexible base material The first mold has a protrusion corresponding to the through hole, and a gate outlet that is an outlet of the gate is formed at a tip of the protrusion. In the material holding step, the protrusion is inserted into the through hole from the back side of the flexible substrate. The flexible base material is held in a first mold, and in the resin sealing step, the protruding portion is inserted into the through hole and flows out from the gate outlet portion. The resin is poured into the cavity so that the resin spreads on the surface of the flexible substrate.
The electronic module of the present invention includes a flexible base material on which an electronic component is mounted, and a sealing portion that seals the electronic component on the surface side of the flexible base material with a resin. The flexible base material has a through hole for inserting a gate for injecting the resin into the front surface side of the flexible base material from the back surface side to the front surface side of the flexible base material. It is formed in the region where the part is provided.

  According to the present invention, the appearance of the electronic module can be improved.

FIG. 1A is a cross-sectional view for explaining the method for manufacturing the electronic module according to the first embodiment of the present invention. FIG. 1B is a cross-sectional view for explaining the method for manufacturing the electronic module according to the first embodiment of the present invention. FIG. 1C is a cross-sectional view for explaining the method for manufacturing the electronic module according to the first embodiment of the present invention. FIG. 2A is a diagram showing a configuration of a flexible base material on which electronic components are mounted, and is a plan view showing a configuration of the flexible base material on which electronic components are mounted. 2B is a diagram illustrating a configuration of a flexible base material on which an electronic component is mounted, and is a cross-sectional view illustrating a cross section when cut along a BB cut surface in FIG. 2A. FIG. 3A is a diagram showing the configuration of the first mold, and is a plan view of the first mold. FIG. 3B is a diagram showing the configuration of the first mold, and is a cross-sectional view showing a cross section when cut along the CC cut surface of FIG. 3A. FIG. 4A is a diagram showing the configuration of the second mold, and is a plan view of the second mold. FIG. 4B is a diagram showing the configuration of the second mold, and is a cross-sectional view showing a cross section when cut along the DD cut surface in FIG. 4A. FIG. 5A is a diagram illustrating a configuration in the mold when the flexible base material on which the electronic component is mounted is held in the cavity of the mold, and is cut along the AA cut surface in FIG. 1B. It is sectional drawing which shows the cross section of. FIG. 5B is a diagram illustrating a configuration in the mold when the flexible base material on which the electronic component is mounted is held in the cavity of the mold, and is cut along the EE cut surface in FIG. 5A. It is sectional drawing which shows the cross section of. FIG. 6A is a diagram showing the configuration of the electronic module according to the first embodiment of the present invention, and is a top view of the electronic module according to the first embodiment of the present invention. FIG. 6B is a diagram showing the configuration of the electronic module according to the first embodiment of the present invention, and is a cross-sectional view showing a cross section when cut along the FF section of FIG. 6A. FIG. 6C is a diagram illustrating the configuration of the electronic module according to the first embodiment of the present invention, and is a bottom view of the electronic module. FIG. 7A is a cross-sectional view for explaining the method for manufacturing the electronic module according to the second embodiment of the present invention. FIG. 7B is a cross-sectional view for illustrating the method for manufacturing the electronic module according to the second embodiment of the present invention. FIG. 7C is a cross-sectional view for describing the method for manufacturing the electronic module according to the second embodiment of the present invention. FIG. 8 is a cross-sectional view showing the configuration of the electronic module according to the third embodiment of the present invention.

<First Embodiment>
The manufacturing method of the electronic module in 1st Embodiment is demonstrated based on figures.
1A, 1B, and 1C are cross-sectional views for explaining a method of manufacturing an electronic module according to the first embodiment of the present invention.
As shown in FIG. 1A, first, a flexible substrate 100, a first mold 200, and a second mold 300 are prepared. Below, the structure of the flexible base material 100, the 1st metal mold | die 200, and the 2nd metal mold | die 300 is demonstrated.
First, the structure of the flexible base material 100 is demonstrated based on figures. The flexible substrate 100 is formed in a plate shape. Moreover, the flexible base material 100 has a softness | flexibility and can deform | transform the shape of the said base material. As an example of the flexible base material 100, a flexible printed circuit board (FPC) etc. are mentioned, for example.
2A and 2B are diagrams illustrating a configuration of the flexible base material 100 on which electronic components are mounted. FIG. 2A is a plan view showing the configuration of the flexible substrate 100 on which electronic components are mounted. 2B is a cross-sectional view showing a cross section when cut along the BB cut surface of FIG. 2A.
As shown in FIGS. 2A and 2B, a plurality of electronic components 130 and 140 are mounted on the surface of the flexible substrate 100. The electronic components 130 and 140 are, for example, a resistor, a coil, a memory chip, an LED (Light Emitting Diode), an RFID (Radio Frequency Identification), a temperature sensor, an acceleration sensor, and the like. At this time, a plurality of these may be mixed. In addition, a through hole 150 is formed in the central portion of the flexible substrate 100. Here, the through hole 150 is a rectangular opening. However, the shape of the through hole 150 shown in FIGS. 2A and 2B is merely an example, and the through hole 150 may be formed in, for example, a polygonal shape, a circular shape, or an elliptical shape.
Next, the structure of the 1st metal mold | die 200 is demonstrated based on figures. As will be described in detail later with reference to FIG. 1B, the first mold 200 is joined to the second mold 300 to form a mold cavity 400.
3A and 3B are diagrams showing the configuration of the first mold 200. FIG. FIG. 3A is a plan view of the first mold 200. In FIG. 3B, for convenience, a flexible base material placement region 210 where the flexible base material 100 is placed and a cavity formation region 220 corresponding to the cavity 400 of the mold are indicated by a two-dot chain line. Show. 3B is a cross-sectional view showing a cross section taken along the line CC of FIG. 3A.
As shown in FIGS. 3A and 3B, the first mold 200 is formed in a plate shape. The first mold 200 includes a placement surface 230, a protrusion 240, a gate 250, and a gate outlet 260.
The placement surface 230 is provided on the surface of the first mold 200 in order to place the flexible substrate 100.
The protrusion 240 is formed at the center of the first mold 200 so as to protrude from the mounting surface 230. As shown in FIG. 3A, the projecting portion 240 is disposed at the central portion of the flexible substrate disposing region 210 and at the central portion of the cavity forming region 220.
The gate 250 is used to inject resin into the cavity 400 of the mold. More specifically, the gate 250 is formed in the center of the protrusion 240 so as to penetrate the first mold 200. Further, a gate outlet 260 is provided at the tip of the protrusion 240. Thus, since the gate outlet 260 is provided at the tip of the protrusion 240, the protrusion 240 is inserted into the through hole 150 of the flexible base material 100, and the gate 250 is inserted into the mold cavity 400. When resin is injected into the resin, the resin flows onto the surface of the flexible substrate 100.
The suction port 270 is provided to suck the back surface of the flexible substrate 100 to the placement surface 230. Thereby, the flexible substrate 100 can be held so as not to move on the placement surface 230 of the first mold 200 while preventing the flexible substrate 100 from wrinkling or slackening. . As shown in FIG. 3A, a plurality of suction ports 270 are formed in the arrangement region 220 of the flexible substrate of the first mold 200.
Next, the structure of the 2nd metal mold | die 300 is demonstrated based on figures. As will be described in detail later with reference to FIG. 1B, the second mold 300 is joined to the first mold 200 to form a mold cavity 400.
4A and 4B are diagrams showing the configuration of the second mold 300. FIG. FIG. 4A is a plan view of the second mold 300. FIG. 4B is a cross-sectional view showing a cross section taken along the line DD in FIG. 4A.
As shown in FIGS. 4A and 4B, the shape of the second mold 300 is a shape in which a side wall is provided around a rectangular plate. As shown in FIG. 4B, a recess 310 is formed on the back side of the second mold 300. The recess 310 corresponds to the mold cavity 400.
The configuration of the flexible substrate 100, the first mold 200, and the second mold 300 has been described above.
Returning to FIG. 1A, after the preparation of the flexible substrate 100, the first mold 200, and the second mold 300 is completed, the flexible substrate 100 on which the electronic components 130 and 140 are mounted in advance is mounted. And held on the mounting surface 230 of the first mold 200. At this time, the protrusion 240 of the first mold 200 is inserted into the through hole 150 of the flexible base material 100 from the back surface side to the front surface side of the flexible base material 100. Thereby, the positioning operation | work at the time of hold | maintaining the flexible base material 100 to the 1st metal mold | die 200 becomes easy. That is, the flexible base material 100 can be easily and accurately held in the flexible base material placement region 210 of the first mold 200. Further, the gate outlet 260 at the tip of the protrusion 240 is arranged so as to face the center of the recess 310 of the second mold 300 through the through hole 150. Further, the suction port 270 is used to suck the back surface of the flexible base material 100 (in the Z1 direction in FIG. 1A), thereby bringing the back surface of the flexible base material 100 into close contact with the placement surface 230. Thereby, the flexible base material 100 can be more reliably held in the flexible base material arrangement region 210 in the first mold 200.
Next, as shown in FIG. 1B, the first mold 200 and the second mold 300 are joined. Thereby, the cavity 400 by both the 1st and 2nd metal mold | dies 200 and 300 is formed.
FIG. 5A and FIG. 5B are diagrams showing a configuration in the mold when the flexible substrate 100 on which the electronic components 130 and 140 are mounted is held in the cavity 400 of the mold. FIG. 5A is a cross-sectional view showing a cross section when cut along the AA section of FIG. 1B. FIG. 5B is a cross-sectional view showing a cross section taken along the line EE of FIG. 5A.
As shown in FIGS. 5A and 5B, the flexible substrate 100 is held on the mounting surface 230 of the first mold 200. At this time, the protrusion 240 is inserted into the through hole 150 of the flexible substrate 100. For this reason, the position shift of the flexible base material 100 can be avoided. Further, as shown in FIG. 5B, the gate outlet 260 at the tip of the protrusion 240 is disposed so as to face the center of the recess 310 of the second mold 300 through the through hole 150. Yes.
Returning to FIG. 1B, resin is injected into the cavity 400 from the gate 250 (Z2 direction in FIG. 1B), and the electronic components 130 and 140 are sealed on the surface side of the flexible substrate 100. As the resin material, for example, acrylic, ABS, PC, epoxy resin, urethane resin, silicon resin, or the like can be used. At this time, as described above, the gate outlet 260 at the tip of the protrusion 240 is disposed so as to face the center of the recess 310 of the second mold 300 through the through hole 150. Then, in a state where the protrusion 240 is inserted into the through hole 150, the resin is injected into the cavity 400 so that the resin flowing out from the gate outlet 260 spreads on the surface of the flexible substrate 100. As shown in FIG. 1B, the resin injected into the cavity 400 rebounds after colliding with the surface of the recess 310 of the second mold 300 and flows from the upper surface of the flexible substrate 100. Then, the resin is filled into the cavity 400 while spreading in all directions from the through hole 150 that is the central portion of the flexible substrate 100. Thereby, since the pressure of resin to inject | pour is not applied to the end surface of the flexible base material 100, it can avoid that a base material turns up like the technique of patent document 1. FIG. In addition, when the resin is being injected, the suction port 270 is used to suck the back surface of the flexible substrate 100. Thereby, the back surface of the flexible base material 100 can be more closely attached to the placement surface 230. For this reason, when the resin is injected into the cavity 400, the flexible substrate 100 can be more reliably avoided from turning over.
Next, as shown in FIG. 1B and FIG. 1C, after injecting a resin into the cavity 400 of the mold, the resin in the cavity 400 is cooled to solidify the resin. Thereby, as shown in FIG. 1C, the resin in the cavity 400 is solidified to form the sealing portion 500. The sealing part 500 seals the electronic components 130 and 140 mounted on the flexible substrate 100.
Then, when the first mold 200 and the second mold 300 are opened and a gate pin (not shown) formed in the gate 250 is cut, the electronic module 1000 is completed as shown in FIG. 1C. At this time, preferably, in the cutting of the gate pin, the gate pin is cut in the vicinity of the surface where the tip of the protrusion 240 shown in FIG. 1C is disposed. At this time, the gate pin is cut at least so as not to protrude from the back surface of the electronic module 1000 (the back surface of the flexible substrate 100). In addition, the trace which cut | disconnected the gate pin is also called a gate trace.
Next, a specific configuration of the electronic module 1000 will be described with reference to the drawings.
6A, 6B, and 6C are diagrams showing the configuration of the electronic module 1000 according to the first embodiment of the present invention. FIG. 6A is a top view of electronic module 1000 according to the first embodiment of the present invention. However, in FIG. 6A, the electronic components 130 and 140 and the like are shown by dotted lines through the flexible base material 100 and the like. FIG. 6B is a cross-sectional view showing a cross section when cut along the FF cut surface in FIG. 6A. FIG. 6C is a bottom view of the electronic module according to the first embodiment of the present invention.
As shown in FIGS. 6A, 6B, and 6C, the electronic module 1000 includes a flexible substrate 100 and a sealing portion 500.
Electronic components 130 and 140 are mounted on the surface of the flexible substrate 100. In addition, the sealing unit 500 seals the electronic components 130 and 140 on the surface side of the flexible substrate 100.
A through hole 150 is formed in the flexible base material 100. As described above, the through hole 150 is provided to insert the gate 250 for injecting the resin into the front surface side of the flexible base material 100 from the back surface side to the front surface side of the flexible base material 100. ing. Further, the through hole 150 is formed in the flexible substrate 100 and in a region where the sealing portion 500 is formed.
A gate recess 510 is formed along the outer shape of the protrusion 240. The gate recess 510 is formed inside the through hole 150. In the gate recess 510, the aforementioned gate mark is accommodated.
As described above, the method for manufacturing the electronic module 1000 according to the first embodiment of the present invention includes the base material holding step, the mold bonding step, and the resin sealing step. In the substrate holding step, the flexible substrate 100 is held in the first mold 200. The flexible substrate 100 has a through hole 150. In addition, the electronic components 130 and 140 are mounted on the surface of the flexible substrate 100. The first mold 200 has a gate 250 for injecting resin on the surface side of the flexible substrate 100. In the mold bonding step, the second mold 300 that forms the cavity 400 together with the first mold 200 is bonded to the first mold 200. In the resin sealing step, resin is injected from the gate 250 into the cavity 400 formed by the first mold 200 and the second mold 300. Then, the electronic components 130 and 140 are sealed on the surface side of the flexible substrate 100. Further, the first mold 200 has a protrusion 240 corresponding to the through hole 150. A gate outlet 260 that is an outlet of the gate 250 is formed at the tip of the protrusion 240. In the base material holding step, the protrusion 240 is inserted into the through hole 150 from the back surface side to the front surface side of the flexible base material 100, and the flexible base material 100 is held in the first mold 200. In the resin sealing step, the resin is injected into the cavity 400 so that the resin flowing out from the gate outlet portion 260 spreads on the surface of the flexible substrate 100 with the protrusions 240 inserted into the through holes 150.
As described above, in the method for manufacturing the electronic module 1000 according to the first embodiment of the present invention, the flexible substrate 100 on which the electronic components 130 and 140 are mounted has the through hole 150. Further, the first mold 200 has a protrusion 240 having a gate outlet 260 formed at the tip. The through hole 150 and the protrusion 240 correspond to each other, and in the substrate holding step, the protrusion 240 is inserted into the through hole 150 from the back surface side to the front surface side of the flexible substrate 100. Thereby, the flexible base material 100 can be easily held in the flexible base material arrangement region 210 of the first mold 200. Further, as described above, the gate outlet 260 at the tip of the protrusion 240 is arranged so as to face the center of the second mold 300 through the through hole 150. With the protrusion 240 inserted into the through hole 150, the resin is injected into the cavity 400 so that the resin flowing out from the gate outlet 260 spreads on the surface of the flexible substrate 100. Thereby, the resin injected into the cavity 400 flows from the upper side of the surface of the flexible substrate 100. Then, the resin is filled in the cavity 400 while spreading in all directions from the central portion of the flexible substrate 100. Thereby, since the pressure of resin to inject | pour is not applied to the end surface of the flexible base material 100, it can avoid that a base material turns up like the technique of patent document 1. FIG. Accordingly, it is possible to avoid wrinkling or slackening of the flexible base material 100. As a result, the appearance of the electronic module can be improved.
In addition, since the gate 250 is formed on the back side of the flexible base material 100 and inside the through hole 150, the gate mark generated when the gate 250 is cut does not protrude from the surface of the electronic module 1000. Absent. That is, since the gate outlet 260 is formed at the tip of the protrusion 240, the gate pin formed by injecting resin into the gate and the electronic module 1000 is joined to the gate formed by the protrusion 240. It is accommodated in the recess 510. The gate recess 510 is formed inside the through hole 150 of the flexible substrate 100. For this reason, if a gate pin is cut | disconnected in the vicinity of the junction part of a gate pin and the electronic module 1000, the cut surface of the said gate pin can be accommodated inside the through-hole 150 of the flexible base material 100. FIG. As a result, the appearance of the electronic module can be improved.
In the method for manufacturing the electronic module 1000 according to the first embodiment of the present invention, the height of the protrusion 240 is preferably substantially the same as the thickness of the flexible substrate 100. As a result, the resin injected into the cavity 400 can efficiently flow from the upper side of the surface of the flexible substrate 100. As a result, it is possible to avoid the occurrence of wrinkles in the flexible substrate 100 more efficiently, and to improve the appearance of the electronic module.
Further, in the method for manufacturing the electronic module 1000 according to the first embodiment of the present invention, the protrusion 240 and the through hole 150 are positioning members when holding the flexible substrate 100 in the first mold 200. is there. For example, by making the through holes 150 and the protrusions 240 rectangular or polygonal, the through holes 150 and the protrusions 240 function as positioning members. That is, if the through holes 150 and the protrusions 240 are rectangular or polygonal, when the flexible base 100 is placed on the first mold 200, the flexible base 100 is left and right. It is possible to suppress shifting and rotation. As a result, the flexible substrate 100 can be accurately placed on the first mold 200.
In the method for manufacturing the electronic module 1000 according to the first embodiment of the present invention, the through hole 150 is formed in the central portion of the region sealed with the resin in the surface of the flexible base material 100. ing. As a result, the resin can be more efficiently filled into the mold cavity 400.
Moreover, in the manufacturing method of the electronic module 1000 according to the first embodiment of the present invention, in the base material holding step, the back surface of the flexible base material 100 is removed by adsorbing the back surface of the flexible base material 100. The flexible substrate 100 is held on the first mold 200 while being in close contact with the first mold 200. Thereby, the back surface of the flexible base material 100 can be more firmly attached to the mounting surface 230 of the first mold 200. For this reason, it can avoid more reliably that the flexible base material 100 turns over when inject | pouring resin in the cavity 400. FIG. As a result, it is possible to more reliably avoid the occurrence of wrinkles or slack in the flexible substrate 100, and the appearance of the electronic module can be further improved.
The electronic module 1000 according to the first embodiment of the present invention includes a flexible substrate 100 and a sealing unit 500. Electronic components 130 and 140 are mounted on the surface of the flexible substrate 100. The sealing unit 500 seals the electronic components 130 and 140 on the surface side of the flexible substrate 100 with resin. In addition, a through hole 150 is formed in the flexible base material 100 in a region where the sealing portion 500 is provided. The through hole 150 is for inserting a gate 250 for injecting resin into the front surface side of the flexible base material 100 from the back surface side to the front surface side of the flexible base material 100. The electronic module 1000 is a result of the electronic module manufacturing method described above. Therefore, the electronic module 1000 can similarly avoid the occurrence of wrinkles or slack in the flexible base material 100 and improve the appearance of the electronic module.
In addition, since the appearance of the electronic module 1000 obtained in this way is good, the surface of the sealing portion 500 of the electronic module 1000 is formed on a part of the exterior surface of the electronic device (not shown) that houses the electronic module 1000. Can be used. Thereby, an electronic device having a good appearance can be configured.
Furthermore, since the surface of the sealing portion 500 of the electronic module 1000 can be used as a part of the exterior surface of the electronic device, the number of parts of the electronic device can be reduced. As a result, the electronic device can be reduced in weight and thickness.
Next, the method for manufacturing the electronic module 1000 according to the first embodiment of the present invention is compared with two general methods for manufacturing an electronic module.
First, as a first general manufacturing method of an electronic module, a technique is known in which a resin is filled in a cavity of a mold while the outer periphery of a flexible substrate is sandwiched between two molds. Specifically, first, the outer periphery of the flexible base material on which the electronic component is mounted is sandwiched between two molds, and a resin is filled into the cavity of the mold. Then, a flexible base material is cut | disconnected along the external shape of shape | molded resin, and an electronic module is completed. In this case, when injecting the resin into the cavity of the mold, the outer periphery of the flexible base is sandwiched and fixed between the two molds, so that the gate is provided on the outer peripheral side of the flexible base. Even so, the flexible base material is not turned over by the injection pressure of the resin. However, this manufacturing method requires a step of cutting the flexible base material along the outer shape of the molded resin, and thus there is a problem that the cost is increased. In addition, in this manufacturing method, it is necessary to prepare a flexible base material corresponding to the outer shape of the electronic module, and thus there is a problem that design flexibility is low.
As a second general manufacturing method of an electronic module, a flexible base material on which an electronic component is mounted is fixed inside the mold, and a flexible base material is formed from a gate provided on the upper surface of the mold. It is known to inject a resin toward the surface of the substrate. In this case, when injecting the resin into the mold, the resin is injected from the gate provided on the upper surface of the mold onto the surface of the flexible base material. It does not join the end face. For this reason, in this manufacturing method, a flexible base material does not turn over by the injection pressure of resin. Further, unlike the first general manufacturing method of the electronic module, there is no need to hold the outer periphery of the flexible substrate with two molds, so a flexible substrate corresponding to the outer shape of the electronic module can be provided. There is no need to prepare. However, a gate mark remains on the resin surface on the upper surface of the electronic module. Therefore, there is a problem that the appearance of the electronic module is not good. In this case, the appearance of the electronic module can be improved by providing a special process such as, for example, scraping the gate trace with a file. However, there is a problem that the production cost is increased by providing such a special process.
Compared to these general manufacturing methods for electronic modules, in the manufacturing method for the electronic module 1000 according to the first embodiment of the present invention, in particular, the through hole 150 is formed in the flexible base material 100, and further possible. Protrusions 240 are formed on the first mold 200 on which the flexible substrate 100 is held. Then, the protruding portion 240 is inserted into the through hole 150 from the back surface side to the front surface side of the flexible base material 100, and the flexible base material 100 is held by the first mold 200. Furthermore, the resin flowing out from the gate outlet portion 260 in the state where the gate outlet portion 260 which is the gate outlet is formed at the tip portion of the protruding portion 240 and the protruding portion 240 is inserted into the through hole 150 is a flexible base material. The resin is injected into the cavity 400 so as to spread over the surface of the 100. For this reason, the resin injected into the cavity 400 flows from the upper side of the surface of the flexible substrate 100 and fills the cavity 400. As described above, in the method for manufacturing the electronic module 1000 according to the first embodiment of the present invention, the resin injection pressure is applied to the surface side of the flexible substrate 100, so that the first general manufacturing of the electronic module is performed. It is not necessary to hold the outer periphery of the flexible substrate 100 as in the method. For this reason, in this invention, the process of cut | disconnecting the outer periphery of the flexible base material 100 is not required like the 1st general manufacturing method of an electronic module.
Further, in the method for manufacturing electronic module 1000 according to the first embodiment of the present invention, since gate outlet 260 is formed at the tip of projection 240, the gate is formed by injecting resin into the gate. The joint between the pin and the electronic module 1000 is accommodated in the gate recess 510 formed by the protrusion 240. The gate recess 510 is formed inside the through hole 150 of the flexible substrate 100. For this reason, if a gate pin is cut | disconnected in the vicinity of the junction part of a gate pin and the electronic module 1000, the cut surface of the said gate pin can be accommodated inside the through-hole 150 of the flexible base material 100. FIG. For this reason, in the manufacturing method of the electronic module 1000 according to the first embodiment of the present invention, gate traces remain on the resin surface on the upper surface of the electronic module, as in the second general manufacturing method of the electronic module. There is no end. In addition, no special process is required to prevent the gate trace from protruding on the resin surface of the electronic module.
<Second Embodiment>
Next, the manufacturing method of the electronic module in 2nd Embodiment is demonstrated based on figures.
7A, 7B, and 7C are cross-sectional views for explaining a method for manufacturing an electronic module according to the second embodiment of the present invention.
Here, in the manufacturing method of the electronic module 2000 in the second embodiment, the electronic module 2000 is manufactured by using the electronic module 1000 in the first embodiment.
As shown in FIG. 7A, first, an electronic module 1000, a third mold 600, and a fourth mold 700 are prepared. The third mold 600 is joined to the fourth mold 700 to form a mold cavity 800.
First, the structure of the 3rd metal mold | die 600 and the 4th metal mold | die 700 is demonstrated based on FIG. 7A.
The third mold 600 is formed in a rectangular shape, and an electronic module housing portion 610 that is a rectangular recess is formed in the central portion of the upper surface thereof. The electronic module housing portion 610 is formed corresponding to the size of the electronic module 1000. A plurality of suction ports 670 are formed in the third mold 600. The suction port 670 performs the same function as the suction port 270 described above.
The 4th metal mold | die 700 is formed in the rectangular parallelepiped shape, and the rectangular recessed part 710 is formed in the center part of the lower surface. The concave portion 710 corresponds to the size of the electronic module housing portion 610. That is, the recess 710 corresponds to the outer shape of the electronic module 1000. As shown in FIG. 7A, the gate 720 is provided at the end of the fourth mold 700. At this time, the gate 720 is provided outside the region facing the electronic module housing portion 610 of the third mold 600.
As described above, the configurations of the third mold 600 and the fourth mold 700 have been described.
The manufacturing method of the electronic module in the second embodiment of the present invention is as follows.
As shown in FIG. 7A, first, the electronic module 1000 is accommodated in the electronic module accommodation portion 610 such that the back surface of the flexible base material 100 is on the upper surface side (the upper side in FIG. 7A). At this time, since the size of the electronic module 1000 and the size of the electronic module housing portion 610 correspond to each other, as shown in FIG. 7A, the joint surface between the third mold 600 and the fourth mold 700 The back surface of the flexible substrate 100 of the electronic module 1000 has substantially the same height. Further, the electronic module 1000 is sucked using the suction port 670 and the electronic module 1000 is brought into close contact with the electronic module housing portion 610. Thereby, the electronic module 1000 can be reliably held in the electronic module housing part 610.
Next, as shown in FIG. 7B, the third mold 600 and the fourth mold 700 are joined. As a result, a mold cavity 800 composed of the third mold 600 and the fourth mold 700 is formed. At this time, a part of the cavity 800 is occupied by the electronic module 1000. Then, resin is injected into the mold cavity 800 from the gate 720, and the cavity 800 is filled with resin. Note that the electronic module 1000 is sucked using the suction port 670 while the resin is being injected. Thereby, it can suppress that the electronic module 1000 protrudes from the inside of the electronic module accommodating part 610 by injection | pouring of resin.
Next, as shown in FIGS. 7B and 7C, after injecting resin into the cavity 800 of the mold, the resin in the cavity 800 is cooled to solidify the resin. Thereby, the resin in the cavity 800 is solidified to form the second sealing portion 900. The surface of the electronic module 1000 where the flexible substrate 100 is exposed is sealed by the second sealing portion 900.
Then, when the third mold 600 and the fourth mold 700 are opened and a gate pin (not shown) formed in the gate 720 is cut, as shown in FIG. 7C, the electronic module 2000 in the present embodiment. Is completed.
As described above, in the method for manufacturing electronic module 2000 according to the second embodiment of the present invention, in addition to the surface of flexible substrate 100, the back surface of flexible substrate 100 is sealed with resin. The resin sealing step is further included. Thereby, since the flexible base material 100 is completely sealed with resin, the electronic module excellent in environmental resistance, such as waterproof and dustproof, can be provided.
<Third Embodiment>
Next, the manufacturing method of the electronic module in 3rd Embodiment is demonstrated based on figures.
FIG. 8 is a cross-sectional view showing a configuration of an electronic module 3000 according to the third embodiment of the present invention.
As shown in FIG. 8, the electronic module 3000 in the third embodiment is manufactured using the electronic module 1000 in the first embodiment.
That is, as shown in FIG. 8, the decorative film 990 is attached and fixed to the back surface of the electronic module 1000 prepared in advance with an adhesive. More specifically, the decorative film 990 is attached and fixed to at least the surface of the electronic module 1000 where the flexible substrate 100 is exposed. As a material of the decorative film 990, for example, a PET sheet can be used. The decorative film 990 corresponds to the film of the present invention.
As described above, in the method for manufacturing the electronic module 3000 according to the third embodiment of the present invention, in addition to the surface of the flexible substrate 100, the back surface of the flexible substrate 100 is covered with the decorative form 990. It further includes a coating step. As a result, the flexible substrate 100 is completely sealed by the decorative form 990, so that the electronic module is excellent in environmental resistance such as waterproofing and dustproofing in the same manner as the effect shown in the second embodiment. Can provide.
The third embodiment has been described above.
In the description of each embodiment, an example in which the electronic components 130 and 140 are mounted on the surface of the flexible substrate 100 has been shown. However, particularly in the second and third embodiments, the electronic components 130 and 140 may be mounted on both surfaces of the flexible substrate 100. In this case, a notch (not shown) corresponding to the electronic components 130 and 140 is provided on the mounting surface 230 of the first die 200 so that the electronic components 130 and 140 and the first die 200 do not interfere with each other. It is good to provide.
A part or all of the above embodiments can be described as in the following supplementary notes, but is not limited thereto.
(Appendix 1)
A base material having a through hole and holding a flexible base material on which an electronic component is mounted on a surface thereof in a first mold having a gate for injecting resin on the surface side of the flexible base material Holding step;
A mold joining step of joining a second mold that forms a cavity together with the first mold to the first mold;
Resin that injects the resin from the gate into the cavity formed by the first mold and the second mold and seals the electronic component on the surface side of the flexible substrate. Sealing step,
The first mold has a protrusion corresponding to the through hole,
A gate outlet portion that is an outlet of the gate is formed at the tip of the protrusion,
In the base material holding step, the protrusion is inserted into the through hole from the back side to the front side of the flexible base material, and the flexible base material is held in the first mold.
In the resin sealing step, the resin flows into the cavity so that the resin flowing out from the gate outlet portion spreads on the surface of the flexible substrate in a state where the protrusion is inserted into the through hole. Manufacturing method of electronic module to be injected.
(Appendix 2)
The height of the said protrusion part is a manufacturing method of the electronic module of Additional remark 1 which is substantially the same as the thickness of the said flexible base material.
(Appendix 3)
The manufacturing method of the electronic module according to appendix 1 or 2, wherein the protrusion and the through hole are positioning members when the flexible base is held in the first mold.
(Appendix 4)
The said through-hole is a manufacturing method of the electronic module in any one of Additional remarks 1-3 currently formed in the center part of the area | region sealed with the said resin among the surfaces of the said flexible base material.
(Appendix 5)
In the substrate holding step, the flexible substrate is attached to the first mold while adhering the back surface of the flexible substrate to the first mold by adsorbing the back surface of the flexible substrate. The manufacturing method of the electronic module in any one of the additional remarks 1-4 hold | maintained to 1 metal mold | die.
(Appendix 6)
The electronic module according to any one of appendices 1 to 5, further including a second resin sealing step of sealing the back surface of the flexible base material with the resin in addition to the surface of the flexible base material. Manufacturing method.
(Appendix 7)
The method for manufacturing an electronic module according to any one of appendices 1 to 5, further including a covering step of covering the back surface of the flexible base material with a form in addition to the surface of the flexible base material.
(Appendix 8)
A flexible substrate with electronic components mounted on the surface;
A sealing part that seals the electronic component on the surface side of the flexible substrate with a resin,
The flexible base material has a through hole for inserting a gate for injecting the resin into the front surface side of the flexible base material from the back surface side to the front surface side of the flexible base material. An electronic module formed in a region where a sealing portion is provided.
(Appendix 9)
The electronic module according to appendix 8, wherein the through hole is formed in a central portion of a formation region of the sealing portion in the surface of the flexible base material.
(Appendix 10)
The electronic module according to appendix 8 or 9, further comprising a second sealing portion that seals the back surface of the flexible base material with a resin.
(Appendix 11)
The electronic module according to appendix 8 or 9, further comprising a film that covers the back surface of the flexible substrate with a resin.
(Appendix 12)
An electronic device including the electronic module according to any one of appendices 8 to 11,
An electronic device using a surface of the sealing portion as a part of an exterior surface of the electronic device.
The present invention has been described above based on the embodiment. The embodiment is an exemplification, and various modifications, increases / decreases, and combinations may be added to the above-described embodiments without departing from the gist of the present invention. It will be understood by those skilled in the art that modifications to which these changes, increases / decreases, and combinations are also within the scope of the present invention.
This application claims the priority on the basis of Japanese application Japanese Patent Application No. 2011-252658 for which it applied on November 18, 2011, and takes in those the indications of all here.

  The electronic module manufacturing method of the present invention can be applied, for example, when manufacturing an electronic module used in an electronic device such as a communication device or a personal computer.

DESCRIPTION OF SYMBOLS 100 Flexible base material 130,140 Electronic component 140 Heating element 130 Boiling heat receiving part 150 Through-hole 200 1st metal mold | die 210 Flexible base material arrangement | positioning area | region 220 Cavity formation area 230 Mounting surface 240 Protrusion part 250 Gate 260 Gate Outlet portion 270 Suction port 300 Second mold 310 Recessed portion 400 Cavity 500 Sealing portion 510 Gate recessed portion 600 Third mold 610 Electronic module housing portion 670 Suction port 700 Fourth mold 710 Recessed portion 720 Gate 800 Cavity 900 First Sealing part 2 990 Decorative film 1000 Electronic module

Claims (9)

A base material having a through hole and holding a flexible base material on which an electronic component is mounted on a surface thereof in a first mold having a gate for injecting resin on the surface side of the flexible base material Holding step;
A mold joining step of joining a second mold that forms a cavity together with the first mold to the first mold;
Resin that injects the resin from the gate into the cavity formed by the first mold and the second mold and seals the electronic component on the surface side of the flexible substrate. Sealing step,
The first mold has a protrusion corresponding to the through hole,
A gate outlet portion that is an outlet of the gate is formed at the tip of the protrusion,
In the base material holding step, the protrusion is inserted into the through hole from the back side to the front side of the flexible base material, and the flexible base material is held in the first mold.
In the resin sealing step, the resin flows into the cavity so that the resin flowing out from the gate outlet portion spreads on the surface of the flexible substrate in a state where the protrusion is inserted into the through hole. Manufacturing method of electronic module to be injected.   The method of manufacturing an electronic module according to claim 1, wherein a height of the protruding portion is substantially the same as a thickness of the flexible base material.   3. The method of manufacturing an electronic module according to claim 1, wherein the protrusion and the through hole are positioning members when the flexible base is held in the first mold. 4.   The said through hole is formed in the center part of the area | region sealed with the said resin among the surfaces of the said flexible base material, Manufacture of the electronic module of any one of Claims 1-3 Method.   In the substrate holding step, the flexible substrate is attached to the first mold while adhering the back surface of the flexible substrate to the first mold by adsorbing the back surface of the flexible substrate. The manufacturing method of the electronic module of any one of Claims 1-4 hold | maintained to 1 metal mold | die.   6. The method according to claim 1, further comprising a second resin sealing step of sealing a back surface of the flexible base material with the resin in addition to the surface of the flexible base material. Method of manufacturing the electronic module.   The method for manufacturing an electronic module according to any one of claims 1 to 5, further comprising a covering step of covering the back surface of the flexible base material with a form in addition to the surface of the flexible base material. A flexible substrate with electronic components mounted on the surface;
A sealing part that seals the electronic component on the surface side of the flexible substrate with a resin,
The flexible base material has a through hole for inserting a gate for injecting the resin into the front surface side of the flexible base material from the back surface side to the front surface side of the flexible base material. An electronic module formed in a region where a sealing portion is provided. An electronic device comprising the electronic module according to claim 8,
An electronic device using a surface of the sealing portion as a part of an exterior surface of the electronic device.

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