TWI659678B - Antenna composite molding structure of mobile electronic device and manufacturing method thereof - Google Patents

Abstract

An antenna composite molding structure for a mobile electronic device, especially a method that uses conductive ink to be printed on different areas of an IML film to form different antenna segments, and then puts the printed antenna film into a mold and injects it into the back cover integrally. Insert molding. When the antenna film is integrally injection-molded with the back cover, a bare plastic opening is formed at the position of the back cover relative to the electrical connection area. After the injection molding, the plastic opening is filled in the plastic opening. The conductive adhesive is inserted, and a copper nail protruding to the inner surface of the back cover is inlaid at the same time, so that it becomes an external contact point of the antenna module, so as to realize remote or near-end communication. It has the effect of maintaining the stability and reliability of communication of mobile electronic devices and saving costs.

Description

Antenna composite molding structure of mobile electronic device and manufacturing method thereof

The invention relates to an antenna composite molding structure of a mobile electronic device, and more particularly to a structure in which an antenna film and a back cover are integrally injection-molded.

According to the development of mobile electronic devices such as smartphones and tablets, the design trend is to be short and thin. Therefore, in order to meet the dual requirements of short and thin, the placement of internal components of mobile electronic devices and how to simplify these built-in components The structure appears to be even more important. Among them, the antenna is an important component for transmitting and receiving signals of the mobile electronic device, and its setting position and manufacturing method have a great relationship to reduce costs and improve performance.

Second press, with the increasingly powerful functions of smartphones, in addition to the main antennas necessary to realize calls, there are also antennas such as Bluetooth, WIFI, RFID, GPS, FM, etc. These antennas are mostly achieved by different manufacturing technologies of the model. For example, traditional antennas are mostly etched with PET film + copper foil and affixed to the antenna support. Later, the antenna area was printed on the main circuit board PCB to make an implanted antenna. Currently, the latest technology LDS (Laser Direct Structuring), LSP ( Laser Selective Plat (3D) antenna, and RFID antenna made by printing conductive ink directly on an insulating substrate (film) using conductive printing to form conductive lines.

1A and 1B show a mobile communication terminal device 10 disclosed by Samsung Electronics, which includes: a casing 11; a film antenna 12 is provided on the inner surface of the casing 11; a printed circuit board 13, It is disposed in the casing 11; a connector 14 electrically connects the film antenna 12 and the printed circuit board 13. However, it is found that such mobile communication devices 10 and 10 are still difficult to meet the dual requirements of shortness, lightness, and thinness, and the electrical connection between the connector 14 and the film antenna 12 and the printed circuit board 13 is liable to shake due to assembly problems. Which affects the stability of the antenna, Good space.

Therefore, solving the above-mentioned problems of the traditional mobile electronic device is the main subject of the present invention.

The reason is that the main object of the present invention is to provide an antenna composite molding structure for a mobile electronic device. The antenna and the back cover are integrally formed, which makes the antenna performance more stable and does not cause vibration due to assembly problems, which affects the stability of the antenna. In addition, it saves the production steps and labor costs that originally required multiple steps to assemble multiple antennas, thereby reducing product costs.

Another object of the present invention is to provide a composite antenna structure for a mobile electronic device. The printed antenna module can be easily changed into any shape, such as the surface of an object with different curvatures and angles, to meet the requirements of customization. Without degrading any performance.

Yet another object of the present invention is to provide an antenna composite molding structure for a mobile electronic device, which can be accurately adjusted to a desired target value by locally changing a line width, a thickness of a wafer layer, and the like.

In order to achieve the above-mentioned object, the technical means adopted by the present invention includes: a transparent substrate on which a printing area can be provided; a liquid crystal display module, which is arranged below the transparent substrate; a middle-shell bracket, which is arranged on the Below the liquid crystal display module; a circuit board and a battery are arranged below the middle shell bracket; a back cover is relatively coupled to the bottom edge of the middle shell bracket, and has a receiving space for storing the aforementioned The component is characterized in that: an antenna film is integrally injection-molded with the back cover, and the antenna film sheet is printed with a predetermined conductivity on an In-Mold Label (IML) film It consists of a patterned antenna module. The antenna module is provided with an electrical connection area. Furthermore, the antenna film is placed in a mold that matches its shape. When it is integrally injection-molded with the back cover, the back cover is formed on the back cover. The position of the electrical connection area is a bare plastic opening. After injection molding, a conductive adhesive is poured into the plastic opening, and a metal nail protruding to the inner surface of the back cover is inserted to make it To be an external contact point of the antenna module; and at least one elastic piece is arranged between the back cover and the circuit board in a curved shape, one end of which is fixed to the circuit board, and the other end is connected to conduct the external contact point of the antenna module, According to this, the circuit board inside the mobile electronic device can realize remote communication through the antenna film integrally injection-molded with the back cover.

A method for manufacturing an antenna composite molding structure for a mobile electronic device, the steps include: a). Printing conductive ink on the in-mold labeling film according to the required area and size shape of different antenna modules, so that the in-mold sticker The standard film is printed with a plurality of antenna modules arranged in order, and each antenna module is provided with an electrical connection area; b). Each group of antenna modules on the in-mold label film is cut into The required size and shape of the unit; c). The outer shape of the back cover required for the compression molding of the unit's in-mold labeling film to form a three-dimensional shape with curved edges; d). Cut off the in-mold labeling film There is excess waste material on the chip, and a hollow or through hole is provided at a predetermined position to form a thin antenna mold; e). The antenna film printed with the antenna module is placed in a mold matching its shape, and injection molding is performed. The plastic film is combined with the antenna film to form a cover, and the position of the electrical connection area is not covered by the plastic layer during the injection molding process, so that a plastic opening is formed for bare use.于 连接; f). Relative to the antenna The position of the electrical connection area of the block is filled with a conductive adhesive in the plastic opening of the plastic layer, and a metal nail is inlaid at the same time as the external point of the antenna module; and g). Shrapnel, with the shrapnel and metal nails inlaid on the back cover The electrical connection is conducted, so that the circuit board inside the mobile electronic device can realize remote communication through the antenna film integrally injection-molded with the back cover.

With the help of the above-mentioned technical means, the present invention designs a conventional antenna into a structure in which the antenna film and the back cover are integrally injection-molded, which has the stability and reliability that can maintain the remote communication of the mobile electronic device, and can save Increased cost effectiveness.

20‧‧‧ transparent substrate

21‧‧‧Printing Area

22‧‧‧Medium shell bracket

30‧‧‧LCD Display Module

40‧‧‧Circuit Board

50‧‧‧ battery

60‧‧‧back cover

61‧‧‧plastic opening

62‧‧‧Conductive Adhesive

63‧‧‧Bronze nails

64‧‧‧external point

65‧‧‧plastic layer

70‧‧‧antenna film

71‧‧‧In-mold labeling diaphragm

72‧‧‧ Antenna Module

721‧‧‧ Electrical connection

73‧‧‧arc

74‧‧‧ Hollow or through hole

80‧‧‧ shrapnel

81‧‧‧upper

82‧‧‧ bottom

90‧‧‧mould

91‧‧‧ film

92‧‧‧ under film

921‧‧‧Gate

922‧‧‧module

100‧‧‧ mobile electronic device

FIG. 1A is a structural cross-sectional view of a conventional mobile communication terminal device.

FIG. 1B is an enlarged perspective view of the connector in FIG. 1A.

FIG. 2 is an exploded perspective view of a feasible embodiment of the present invention.

FIG. 3 is a combined perspective view of a feasible embodiment of the present invention.

4A to 4D are schematic diagrams of a process of forming an antenna film according to the present invention.

FIG. 5 is a schematic diagram of forming an antenna film and a back cover in a mold according to the present invention.

FIG. 6 is a schematic diagram of an antenna film and the back cover integrally injection-molded according to the present invention.

FIG. 7A to FIG. 7C are schematic diagrams of a process of disposing a copper nail in a plastic opening of the present invention.

FIG. 8 is a sectional view of a feasible embodiment of the present invention.

FIG. 9 is an enlarged view shown at 9 in FIG. 8.

First, please refer to FIG. 2 to FIG. 8. The antenna composite molding structure of the mobile electronic device 100 disclosed in the present invention. A possible embodiment includes a transparent substrate 20, and a non-transparent printing can be provided on the outer periphery thereof. Zone 21; a liquid crystal display module 30 is disposed below the transparent substrate 20; a middle case bracket 22 is disposed below the liquid crystal display module 30; a circuit board 40 and a battery 50 are disposed on Below the middle shell bracket 22; and a back cover 60, which is relatively coupled to the bottom edge of the middle shell bracket 22, and has a concave receiving space for receiving the aforementioned Component; however, the above-mentioned component is a prior art (Prior Art), which is not the subject of the patent of the present invention, so I won't go into details.

The main feature of the present invention is: an antenna film 70 is integrally injection-molded with the back cover 60, and the antenna film 70 is attached to an In-Mold Label (IML) film 71 The antenna module 72 is printed with a predetermined conductive pattern. Each antenna module 72 is provided with an electrical connection area 721, and the antenna film 70 is placed in a mold 90 that conforms to its shape (as shown in FIG. 5). ), And when the antenna film 70 and the back cover 60 are integrally injection-molded, exposed plastic openings 61 are formed at the position of the back cover 60 relative to the electrical connection area 721, as shown in FIGS. 7A to 7C. A conductive adhesive 62 is filled into the plastic opening 61, and a copper nail 63 protruding to the inner surface of the back cover 60 is inlaid at the same time, so that it becomes a contact 64 outside the antenna module 72; and at least one elastic piece 80, It is made of conductive material and is bent between the back cover 60 and the circuit board 40. An upper end 81 is fixed on the circuit board 40, and a lower end 82 is connected to the external contact of the antenna module 72. 64. According to this, the circuit board 40 inside the mobile electronic device 100 passes through the back cover 60. The antenna film 70, which is integrally injection-molded, realizes the remote communication function.

In order to realize the antenna composite molding structure of the mobile electronic device 100 of the present invention, a manufacturing method thereof includes the following steps:

a). First, as shown in FIG. 4A, conductive ink is printed on the in-mold labeling film 71 according to the required area and size shape of different antenna modules 72, so that the in-mold labeling film 71 is printed with A plurality of antenna modules 72 arranged in sequence. In this embodiment, the material for making the in-mold labeling film 71 can be selected from polycarbonate (PC) or polyethylene terephthalate (PET). Resin material, the conductive ink can be made by mixing one or more of gold, silver, copper, conductive carbon powder, silver carbon powder, graphite powder or carbon and graphite mixed powder.

b). Next, as shown in FIG. 4B, each group of antenna modules 72 on the in-mold labeling film 71 is cut. Cut into desired size and shape units 70a.

c). Then, as shown in FIG. 4C, the outer shape of the back cover 60 required for each unit antenna module 72 by thermocompression molding, such as a three-dimensional shape 70b with an arc edge 73 formed around it.

d). Further, as shown in FIG. 4D, the excess waste material around the antenna module 72 is cut out, and a hollow or through hole 74 is provided at a predetermined position to form an antenna thin mold 70.

e). As shown in FIG. 5, the antenna film 70 printed with the antenna module 72 is placed in a mold 90 that matches its shape. The mold 90 includes an upper mold 91 and a lower mold 92. The lower mold 92 is provided with a gate 921. And module 922, by insert rmolding, the formed plastic layer 65 is combined with the antenna film 70 to integrally form the cover 60 of the mobile electronic device 100 (as shown in FIG. 6), and the electrical connection area The position of 721 is not covered by the plastic layer 65 during the injection molding process, thereby forming a plastic opening 61 that is exposed for connection; the material of the plastic layer 65 may be selected from polyethylene, polyamide, and polycarbonate Any of materials such as acrylonitrile-styrene-butadiene copolymer, polymethyl methacrylate, or polyethylene terephthalate.

f). Next, as shown in FIG. 7A to FIG. 7C, with respect to the position of the electrical connection area 721 of the antenna module 72, in the plastic opening 61 of the plastic layer 65, point in the conductive adhesive 62 and inlay copper nails 63 serves as an external point 64 of the antenna module 72.

g). Finally, as shown in FIG. 8 to FIG. 9, the antenna connection metal nail 63 embedded on the elastic sheet 80 soldered on the circuit board 40 and the back cover 60 is used for connection and conduction, thereby realizing the communication function. In this embodiment, the metal nail 63 may be selected from copper, iron, aluminum and other conductive materials. Copper nails are more commonly used. This allows the antenna module 72 of the back cover 60 to pass through the metal nail 63 and the mobile electronic device. The circuit board 40 inside 100 can ensure a stable connection between the antenna module 72 of the casing and the internal circuit of the mobile electronic device 100.

With the help of the above-mentioned technical means, the present invention designs a conventional antenna into a structure in which the antenna film 70 and the back cover 60 are integrally injection-molded. The following effects can be obtained:

1. The antenna film 70 and the back cover 60 are integrally formed, so that the antenna performance is more stable, and there is no shaking due to assembly problems, and the reliability of the mobile electronic device 100 can be maintained.

2. Furthermore, it saves the production steps and labor costs that previously required multiple steps to assemble multiple antennas, and can also save costs.

3. The printed antenna module 72 can be easily changed into any shape according to requirements, such as object surfaces with different curvatures and angles, so as to meet customized requirements without reducing any use performance.

4. It can be precisely adjusted to the desired target value by locally changing the width of the line, changing the thickness of the wafer layer, etc.

In summary, the technical means disclosed in the present invention do have invention patent elements such as "newness", "progressivity" and "available for industrial use". A sense of virtue.

However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention. Modifications or equivalent changes made by those skilled in the art in accordance with the spirit of this case should still be included in the scope of patent application for this case.

Claims (3)

An antenna composite molding structure for a mobile electronic device includes: a transparent substrate on which a printing area can be provided; a liquid crystal display module provided below the transparent substrate; and a middle case support provided on the liquid crystal Below the display module; a circuit board and a battery are arranged below the middle shell bracket; a back cover is relatively connected to the bottom edge of the middle shell bracket and has a receiving space for storing the aforementioned components It is characterized in that: an antenna film is integrally injection-molded with the back cover, the antenna film is formed by an antenna module with a predetermined conductive pattern printed on an in-mold labeling film, and the antenna module is provided with an electrical property The connection area, and the antenna film is placed in a predetermined mold that matches its shape. When it is integrally injection-molded with the back cover, exposed plastic openings are formed at the position of the back cover relative to the electrical connection area. After injection molding, conductive plastic is poured into the plastic opening, and a copper nail protruding to the inner surface of the back cover is inlaid at the same time, so that it becomes an external contact point of the antenna module; and at least one elastic sheet is guided by The curved shape made of the material is arranged between the back cover and the circuit board, one end of which is fixed on the circuit board, and the other end is connected to the external contact of the antenna module, so as to make the circuit board inside the mobile electronic device. Through the antenna film integrally injection-molded with the back cover, remote communication is realized. According to the antenna composite molding structure of the mobile electronic device according to item 1 of the scope of the patent application, the curved upper end of the elastic piece is fixed on the circuit board, and the lower end thereof is connected to conduct the external contacts of the antenna module. A method for manufacturing an antenna composite molding structure for a mobile electronic device, the steps include: a). Printing conductive ink on the in-mold labeling film according to the required area and size shape of different antenna modules, so that the in-mold sticker The standard film is printed with a plurality of antenna modules arranged in order, and each antenna module is provided with an electrical connection area; b). Each group of antenna modules on the in-mold label film is cut into The required size and shape of the unit; c). The outer shape of the back cover required for the compression molding of the unit's in-mold labeling film to form a three-dimensional shape with curved edges; d). Cut off the in-mold labeling film There is excess waste material on the chip, and a hollow or through hole is provided at a predetermined position to form a thin antenna mold; e). The antenna film printed with the antenna module is placed in a mold matching its shape, and injection molding is performed. The plastic film is combined with the antenna film to form a cover, and the position of the electrical connection area is not covered by the plastic layer during the injection molding process, so that a plastic opening is formed for bare use.于 连接; f). Relative to the antenna The position of the electrical connection area of the block is filled with a conductive adhesive in the plastic opening of the plastic layer, and a metal nail is inlaid at the same time as the external point of the antenna module; and g). The shrapnel is electrically connected with the shrapnel and the metal nail embedded in the back cover, so that the circuit board inside the mobile electronic device can realize remote communication through the antenna film integrally injection-molded with the back cover.