TW201711544A - Antenna composite molding structure of mobile electronic device and manufacturing method thereof capable of maintaining communication stability and reliability of a mobile electronic device - Google Patents
Antenna composite molding structure of mobile electronic device and manufacturing method thereof capable of maintaining communication stability and reliability of a mobile electronic device Download PDFInfo
- Publication number
- TW201711544A TW201711544A TW104130383A TW104130383A TW201711544A TW 201711544 A TW201711544 A TW 201711544A TW 104130383 A TW104130383 A TW 104130383A TW 104130383 A TW104130383 A TW 104130383A TW 201711544 A TW201711544 A TW 201711544A
- Authority
- TW
- Taiwan
- Prior art keywords
- antenna
- film
- back cover
- electronic device
- mobile electronic
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 21
- 239000002131 composite material Substances 0.000 title claims abstract description 12
- 238000004891 communication Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004033 plastic Substances 0.000 claims abstract description 28
- 229920003023 plastic Polymers 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000002372 labelling Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000005192 partition Methods 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RRKGBEPNZRCDAP-UHFFFAOYSA-N [C].[Ag] Chemical compound [C].[Ag] RRKGBEPNZRCDAP-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Details Of Aerials (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
本發明係有關一種行動電子裝置之天線複合成型結構，尤指一種將天線薄膜與背蓋一體注塑成型(insert molding)之結構。The present invention relates to an antenna composite molding structure of a mobile electronic device, and more particularly to a structure in which an antenna film and an back cover are integrally molded by insert molding.
按，智慧手機、平板電腦等行動電子裝置之發展，係以短小輕薄為設計趨勢，因此為能達到短小輕薄之雙重要求，因此，行動電子裝置內部元件位置的配設，及如何簡化這些內置元件之結構，顯得益加重要。其中天線作為行動電子裝置的收發信號重要元件，其設置位置及製法對於降低成本及提升使用性能，皆有莫大的關係。According to the development of mobile electronic devices such as smart phones and tablet computers, the design trend is short and light, so in order to achieve the short and light requirements, the internal components of the mobile electronic device are arranged, and how to simplify these built-in components. The structure seems to be important. Among them, the antenna is an important component of the transmission and reception signal of the mobile electronic device, and its setting position and manufacturing method have a great relationship for reducing the cost and improving the performance.
次按，隨著智慧手機功能日益強大，智慧手機中除了集成實現通話所必需的主天線以外，還有藍牙、WIFI、RFID、GPS、FM等天線；這些天線大多通過機種不同製造技術來達成，例如傳統天線多用PET film+銅箔蝕刻後貼附在天線支架上，後來又有在主電路板PCB上印刷天線區域作成植入式天線，目前又有利用最新技術LDS(Laser Direct Structuring) ,LSP (Laser Selective Plat)技術製作的3D天線，以及利用印刷技術直接將導電油墨印刷在絕缘基板（薄膜）上形成導電線路而製作出的RFID天線。With the push of the smart phone function, in addition to the main antenna necessary for the realization of the call, there are also Bluetooth, WIFI, RFID, GPS, FM and other antennas; these antennas are mostly achieved by different manufacturing technologies. For example, the conventional antenna is etched with PET film+copper foil and attached to the antenna bracket. Later, the antenna area is printed on the main circuit board PCB to form an implantable antenna. Currently, the latest technology LDS (Laser Direct Structuring), LSP ( A 3D antenna made by Laser Selective Plat) and an RFID antenna fabricated by directly printing conductive ink on an insulating substrate (film) using a printing technique to form a conductive line.
圖1A及圖1B所示，係三星電子所公開的一種移動通信終端裝置10，其包括:一殼體11；膜式天線12係設在該殼體11內表面上；一印刷電路板13，設置在該殼體11內；一連接器14，將膜式天線12與印刷電路板13電連接。惟查，此種移動通信移動通信裝置10裝置10整體上尚難達到短小輕薄之雙重要求，且連接器14與膜式天線12及印刷電路板13之電連接方式，容易因組裝問題而產生晃動從而影響天線穩定性，因此尚有改善空間。1A and 1B are a mobile communication terminal device 10 disclosed by Samsung Electronics, comprising: a housing 11; a membrane antenna 12 is disposed on an inner surface of the housing 11; and a printed circuit board 13, Provided in the housing 11; a connector 14 electrically connects the membrane antenna 12 to the printed circuit board 13. However, it is difficult to achieve the short and light requirements of the device 10 of the mobile communication device 10 as a whole, and the electrical connection between the connector 14 and the membrane antenna 12 and the printed circuit board 13 is easy to shake due to assembly problems. This affects the stability of the antenna, so there is room for improvement.
是以，解決傳統行動電子裝置之上述問題點，為本發明之主要課題。Therefore, solving the above problems of the conventional mobile electronic device is a main subject of the present invention.
緣是，本發明主要目的，係在提供一種行動電子裝置之天線複合成型結構，其天線與背蓋一體式成型，使得天線性能更加穩定，不會因為組裝問題而產生晃動，從而影響天線穩定性；再者節約了原先需要多步組裝多個天線的生產步驟及人力成本，從而降低產品成本。The main purpose of the present invention is to provide an antenna composite molding structure for a mobile electronic device, in which the antenna and the back cover are integrally formed, so that the antenna performance is more stable, and no shaking occurs due to assembly problems, thereby affecting antenna stability. In addition, the production steps and labor costs that originally required multiple antennas to be assembled in multiple steps are saved, thereby reducing product costs.
本發明另一要目的，則在提供一種行動電子裝置之天線複合成型結構，其印刷的天線模塊可以依需求方便地改變成任何形狀，如不同曲率、角度的物體表面，以達客製化要求，而不降低任何使用性能。Another object of the present invention is to provide an antenna composite molding structure for a mobile electronic device, wherein the printed antenna module can be easily changed into any shape according to requirements, such as an object surface with different curvatures and angles, to meet the customization requirements. Without reducing any performance.
本發明再一目的，在提供一種行動電子裝置之天線複合成型結構，其具有可以通過局部改變線的寬度，改變晶片層的厚度等精確調整到所需的目標值。Still another object of the present invention is to provide an antenna composite molding structure for a mobile electronic device which can be precisely adjusted to a desired target value by locally changing the width of a line, changing the thickness of a wafer layer, and the like.
為達上述目的，本發明所採用之技術手段包含: 一透明基板，其上可設有一印刷區；一液晶顯示模組，係設在該透明基板之下方； 一中殼支架，係設在該液晶顯示模組的下方；一電路板及一電池，係設在該中殼支架下方 ；一背蓋，係相對結合在該中殼支架底緣，其具有一容置空間，用以收納前述之構件；其特徵在於： 一天線薄膜，係與該背蓋一體注塑成型(insert molding)，該天線薄膜片係於一模內貼標(In-Mold Label,簡稱IML)膜片上印刷有預定導電圖案之天線模塊所構成，該天線模塊上設有一電性連接區，再者該天線薄膜係放置在一與其形狀吻合的模具中，與該背蓋一體注塑成型時，並於該背蓋相對該電性連接區之位置係呈裸露之塑膠開孔，待注塑成型後，於該塑膠開孔內灌入一導電膠，同時鑲嵌一凸伸至該背蓋內表面之金屬釘，使其成為該天線模塊之外接點；以及至少一彈片，係呈彎曲狀設在該背蓋與該電路板之間，其一端固定在該電路板上，另一端係連接導通該天線模塊之外接點，據以使該行動電子裝置內部之電路板，通過該與該背蓋一體注塑成型之天線薄膜，實現遠端通訊。In order to achieve the above object, the technical means adopted by the present invention comprises: a transparent substrate on which a printing area can be disposed; a liquid crystal display module disposed below the transparent substrate; and a middle case bracket disposed thereon a circuit board and a battery are disposed under the middle case bracket; a back cover is oppositely coupled to the bottom edge of the middle case support, and has a receiving space for receiving the foregoing The component is characterized in that: an antenna film is integrally molded with the back cover, and the antenna film is printed on a film of In-Mold Label (IML) with predetermined conductivity. The antenna module of the pattern is provided with an electrical connection region, and the antenna film is placed in a mold matching the shape thereof, and is integrally molded with the back cover, and the back cover is opposite to the back cover The position of the electrical connection zone is a bare plastic opening. After the injection molding, a conductive adhesive is poured into the plastic opening, and a metal nail protruding to the inner surface of the back cover is embedded to make the Antenna module An external contact; and at least one elastic piece is disposed between the back cover and the circuit board in a curved shape, one end of which is fixed on the circuit board, and the other end is connected to the external contact point of the antenna module, so as to make the action The circuit board inside the electronic device realizes remote communication through the antenna film integrally molded with the back cover.
一種行動電子裝置之天線複合成型結構之製作方法，其步驟包括: a).將導電油墨依照不同天線模塊所需要的需求區域和大小形狀印刷在模內貼標膜片上，使該模內貼標膜片上印刷有多數個依序排列之天線模塊，該每一天線模塊上設有一電性連接區； b).將該模內貼標膜片上的每一組天線模塊，裁切成需要的大小形狀的單元； c). 將該單元的模內貼標膜片熱壓成形所需的背蓋外圍形狀，形成弧邊的立體形狀； d).切掉將該模內貼標膜片上周邊多餘廢料，並於預定處設有鏤空或通孔，據以形成一天線薄模； e).將印有該天線模塊的該天線薄膜放置在與其形狀吻合的一模具中，通過注塑成 型，使一塑膠層結合該天線薄膜，一體成型為一被蓋，且該電性連接區之位置，於注塑成型過程中，不被該塑膠層所覆蓋，從而形成一塑膠開孔，裸露用於連接； f).相對於該天線模塊的電性連接區之位置，在該塑膠層的塑膠開孔中，灌入一導電膠，同時鑲嵌一金屬釘作為天該線模塊的外接點；以及 g).在一電路板上焊接一彈片，以該彈片和該背蓋上鑲嵌的金屬釘進行電性連接導通，據以使該行動電子裝置內部之電路板，通過該與該背蓋一體注塑成型之天線薄膜，實現遠端通訊。A method for manufacturing an antenna composite molding structure of a mobile electronic device, the steps comprising: a) printing a conductive ink on an in-mold labeling film according to a required area and size of different antenna modules, so that the in-mold label is attached A plurality of sequentially arranged antenna modules are printed on the standard film, and each antenna module is provided with an electrical connection region; b) cutting each set of antenna modules on the in-mold labeling film into The required size and shape of the unit; c). The outer shape of the back cover required for the hot stamping of the in-mold labeling film of the unit, forming a three-dimensional shape of the arc edge; d) cutting off the in-mold labeling film Excess waste on the periphery of the sheet, and a hollow or through hole at the predetermined place, thereby forming an antenna thin mold; e) placing the antenna film printed with the antenna module in a mold matching the shape thereof, by injection molding Forming, a plastic layer is combined with the antenna film, integrally formed into a cover, and the position of the electrical connection zone is not covered by the plastic layer during the injection molding process, thereby forming a plastic opening for bare exposure to f). Relative to the position of the electrical connection region of the antenna module, a conductive adhesive is poured into the plastic opening of the plastic layer, and a metal nail is embedded as an external contact point of the line module; and g Soldering a shrapnel on a circuit board, and electrically connecting the shrapnel and the metal studs embedded in the back cover, so that the circuit board inside the mobile electronic device is integrally molded by the back cover The antenna film enables remote communication.
藉助上揭技術手段，本發明將傳統的天線，設計成天線薄膜與該背蓋一體注塑成型(insert molding)之構造，具有可以保持行動電子裝置遠端通訊的穩定性及可靠性，又能節約成本之功效增進。By means of the above-mentioned technical means, the conventional antenna is designed as an insert molding structure of the antenna film and the back cover, which can maintain the stability and reliability of the remote communication of the mobile electronic device, and saves The cost is enhanced.
首先，請參閱圖2～圖8所示，本發明所揭露之行動電子裝置100之天線複合成型結構，其一可行實施例包含: 一透明基板20，其外周緣上可設有一非透明之印刷區21； 一液晶顯示模組30，係設在該透明基板20之下方；一中殼支架22，係設在該液晶顯示模組30的下方；一電路板40及一電池50，係設在該中殼支架22下方；以及 一背蓋60，係相對結合在該中殼支架22底緣，其具有一凹型的容置空間，用以收納前述之構件；惟，上揭構件係屬先前技術(Prior Art)，非本發明之專利標的，容不贅述。First, referring to FIG. 2 to FIG. 8 , the antenna composite molding structure of the mobile electronic device 100 disclosed in the present invention includes a transparent substrate 20 having a non-transparent printing on the outer periphery thereof. a liquid crystal display module 30 is disposed under the transparent substrate 20; a middle case holder 22 is disposed under the liquid crystal display module 30; a circuit board 40 and a battery 50 are disposed at The bottom cover of the middle case support 22; and a back cover 60 is oppositely coupled to the bottom edge of the middle case support 22, and has a concave receiving space for accommodating the foregoing members; however, the upper cover member belongs to the prior art. (Prior Art), which is not a patent of the present invention, is not described here.
本發明之主要特徵在於：一天線薄膜70，係與該背蓋60一體注塑成型(insert molding)，該天線薄膜70係於一模內貼標(In-Mold Label,簡稱IML) 膜片71上印刷有預定導電圖案之天線模塊72所構成，該每一天線模塊72上設有一電性連接區721，再者該天線薄膜70係放置在一與其形狀吻合的模具90中(如圖5所示)，而該天線薄膜70與該背蓋60一體注塑成型時，並於該背蓋60相對該電性連接區721之位置係呈裸露之塑膠開孔61，且如圖7A至圖7C所示，於該塑膠開孔61內灌入一導電膠62，同時鑲嵌一凸伸至該背蓋60內表面之銅釘63，使其成為該天線模塊72之外接點64；以及至少一彈片80，係由導電材質所構成，呈彎曲狀設在該背蓋60與該電路板40之間，其一上端81固定在該電路板40上，另其下端82係連接導通該天線模塊72之外接點64，據以使該行動電子裝置100內部之電路板40，通過該與該背蓋60一體注塑成型之天線薄膜70，實現遠端通訊功能。The main feature of the present invention is that an antenna film 70 is integrally molded with the back cover 60, and the antenna film 70 is attached to an In-Mold Label (IML) diaphragm 71. An antenna module 72 is printed with a predetermined conductive pattern. Each antenna module 72 is provided with an electrical connection region 721. The antenna film 70 is placed in a mold 90 matching the shape thereof (as shown in FIG. 5). When the antenna film 70 is integrally molded with the back cover 60, and the position of the back cover 60 relative to the electrical connection region 721 is a bare plastic opening 61, and as shown in FIG. 7A to FIG. 7C. A conductive adhesive 62 is poured into the plastic opening 61, and a copper nail 63 protruding from the inner surface of the back cover 60 is inlaid, so as to become an external contact 64 of the antenna module 72; and at least one elastic piece 80, The conductive material is formed in a curved shape between the back cover 60 and the circuit board 40. An upper end 81 is fixed on the circuit board 40, and a lower end 82 is connected to the external contact of the antenna module 72. 64. The circuit board 40 inside the mobile electronic device 100 is passed through the back cover 60. Injection molded body of the antenna film 70, the distal end to achieve communication.
為實現本發明行動電子裝置100之天線複合成型結構，其製作方法包括如下步驟: a).首先，如圖4A所示，將導電油墨依照不同天線模塊72所需要的需求區域和大小形狀印刷在模內貼標膜片71上，使該模內貼標膜片71上印刷有多數個依序排列之天線模塊72，本實施例中，製作該模內貼標膜片71之材料可以選自為聚碳酸酯(PC)或聚對苯二甲酸乙二醇酯(PET)等樹脂材料，該導電油墨可由金、銀、銅、導電碳粉、銀碳粉、石墨粉或碳與石墨之混合粉末之一種或多種混合而成。 b).接著，如圖4B所示，將模內貼標膜片71上的每一組天線模塊72，裁切成需要的大小形狀單元70a。 c). 然後，如圖4C所示，將每一單元天線模塊72熱壓成形所需的背蓋60外圍形狀，例如周圍形成弧邊73的立體形狀70b。 d).進一步，如圖4D所示，切掉將天線模塊72周邊多餘廢料，並於預定處設有鏤空或通孔74，據以形成一天線薄模70。 e). 如圖5所示，將印有天線模塊72的天線薄膜70放置在與其形狀吻合的模具90中，該模具90包括一上模91及一下模92，下模92設有澆口921及模塊922，通過注塑成型(insert molding)之方式，已成形之塑膠層65結合天線薄膜70，一體成型該行動電子裝置100的被蓋60(如圖6所示)，且該電性連接區721之位置，於注塑成型過程中，不被塑膠層65所覆蓋，從而形成一塑膠開孔61，裸露用於連接；塑膠層65之材料可選自為聚乙烯、聚醯胺、聚碳酸酯、丙烯睛-苯乙烯-丁二烯共聚合物、聚甲基丙烯酸甲酯或聚對苯二甲酸乙二醇酯等材料中之任一種。 f). 接著，如圖7A至圖7C所示，相對於該天線模塊72的電性連接區721之位置，在塑膠層65的塑膠開孔61中，點入導電膠62，同時鑲嵌銅釘63作為天線模塊72的外接點64。 g). 最後，如圖8至圖9所示，利用在電路板40焊接的彈片80和背蓋60上鑲嵌的天線連接金屬釘63進行連接導通，從而實現通訊功能。本實施例中，該金屬釘63可選擇銅、鐵、鋁等導電性能較好之金屬材質，較常採用銅釘，如此可使背蓋60之天線模塊72，通過金屬釘63與行動電子裝置100內部之電路板40，可確保殼體之天線模塊72與行動電子裝置100之內部電路連接穩定。In order to implement the antenna composite molding structure of the mobile electronic device 100 of the present invention, the manufacturing method comprises the following steps: a). First, as shown in FIG. 4A, the conductive ink is printed according to the required area and size of the different antenna modules 72. On the in-mold labeling film 71, a plurality of sequentially arranged antenna modules 72 are printed on the in-mold labeling film 71. In this embodiment, the material for forming the in-mold labeling film 71 may be selected from It is a resin material such as polycarbonate (PC) or polyethylene terephthalate (PET). The conductive ink may be gold, silver, copper, conductive carbon powder, silver carbon powder, graphite powder or a mixture of carbon and graphite. One or more of the powders are mixed. b). Next, as shown in Fig. 4B, each set of antenna modules 72 on the in-mold labeling film 71 is cut into a desired size unit 70a. c). Then, as shown in FIG. 4C, each unit antenna module 72 is thermoformed into a desired peripheral shape of the back cover 60, for example, a three-dimensional shape 70b around which an arc edge 73 is formed. d) Further, as shown in Fig. 4D, excess waste around the antenna module 72 is cut and a hollow or through hole 74 is provided at a predetermined location to form an antenna die 70. e). As shown in FIG. 5, the antenna film 70 printed with the antenna module 72 is placed in a mold 90 conforming to its shape, the mold 90 includes an upper mold 91 and a lower mold 92, and the lower mold 92 is provided with a gate 921. And the module 922, by means of insert molding, the formed plastic layer 65 is combined with the antenna film 70 to integrally form the cover 60 of the mobile electronic device 100 (as shown in FIG. 6), and the electrical connection region The position of 721 is not covered by the plastic layer 65 during the injection molding process, thereby forming a plastic opening 61 for bare connection; the material of the plastic layer 65 may be selected from the group consisting of polyethylene, polyamide, and polycarbonate. Any one of materials such as acrylonitrile-styrene-butadiene copolymer, polymethyl methacrylate or polyethylene terephthalate. f). Next, as shown in FIG. 7A to FIG. 7C, in relation to the position of the electrical connection region 721 of the antenna module 72, in the plastic opening 61 of the plastic layer 65, the conductive adhesive 62 is inserted and the copper nail is embedded. 63 serves as an external point 64 of the antenna module 72. g). Finally, as shown in FIG. 8 to FIG. 9, the antenna pin 63 soldered on the circuit board 40 and the antenna connection metal studs 63 mounted on the back cover 60 are connected and turned on, thereby realizing the communication function. In this embodiment, the metal nail 63 can be selected from copper, iron, aluminum and other metal materials with better conductivity, and copper nails are often used, so that the antenna module 72 of the back cover 60 can pass through the metal nail 63 and the mobile electronic device. The internal circuit board 40 of the 100 ensures that the internal circuit connection of the antenna module 72 of the housing and the mobile electronic device 100 is stable.
藉助上揭技術手段，本發明將傳統的天線，設計成天線薄膜70與該背蓋60一體注塑成型(insert molding)之構造，可獲得如下之功效增進: 1. 天線薄膜70與背蓋60一體式成型，使得天線性能更加穩定，不會因為組裝問題而產生晃動，具有可以保持行動電子裝置100的可靠性。 2. 再者，節約了原先需要多步組裝多個天線的生產步驟及人力成本，又能節約成本之功效。 3. 印刷的天線模塊72可以依需求方便地改變成任何形狀，如不同曲率、角度的物體表面，以達客製化要求，而不降低任何使用性能。 4. 其具有可以通過局部改變線的寬度，改變晶片層的厚度等精確調整到所需的目標值。By means of the above-mentioned technical means, the conventional antenna is designed as an insert molding structure of the antenna film 70 and the back cover 60, and the following enhancements can be obtained: 1. The antenna film 70 is integrated with the back cover 60. Forming makes the antenna performance more stable, does not sway due to assembly problems, and has the reliability to maintain the mobile electronic device 100. 2. In addition, it saves the production steps and labor costs that need to assemble multiple antennas in multiple steps, and saves cost. 3. The printed antenna module 72 can be easily changed to any shape, such as an object surface with different curvatures and angles, as needed to meet the customization requirements without any use performance. 4. It has a precise adjustment to a desired target value by locally changing the width of the line, changing the thickness of the wafer layer, and the like.
綜上所述，本發明所揭示之技術手段，確具「新穎性」、「進步性」及「可供產業利用」等發明專利要件，祈請 鈞局惠賜專利，以勵發明，無任德感。In summary, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patent to encourage the invention. German sense.
惟，上述所揭露之圖式、說明，僅為本發明之較佳實施例，大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或等效變化，仍應包括在本案申請專利範圍內。The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.
20‧‧‧透明基板
21‧‧‧印刷區
22‧‧‧中殼支架
30‧‧‧液晶顯示模組
40‧‧‧電路板
50‧‧‧電池
60‧‧‧背蓋
61‧‧‧塑膠開孔
62‧‧‧導電膠
63‧‧‧銅釘
64‧‧‧外接點
65‧‧‧塑膠層
70‧‧‧天線薄膜
71‧‧‧模內貼標膜片
72‧‧‧天線模塊
721‧‧‧電性連接
73‧‧‧弧邊
74‧‧‧鏤空或通孔
80‧‧‧彈片
81‧‧‧上端
82‧‧‧下端
90‧‧‧模
91‧‧‧上膜
92‧‧‧下膜
921‧‧‧澆口
922‧‧‧模塊
100‧‧‧行動電子裝置20‧‧‧Transparent substrate
21‧‧‧Printing area
22‧‧‧Shed bracket
30‧‧‧LCD module
40‧‧‧ boards
50‧‧‧Battery
60‧‧‧Back cover
61‧‧‧Plastic opening
62‧‧‧ conductive adhesive
63‧‧‧Bronze nails
64‧‧‧External points
65‧‧‧Plastic layer
70‧‧‧Antenna film
71‧‧•In-mold labeling membrane
72‧‧‧Antenna Module
721‧‧‧Electrical connection
73‧‧‧Arc edge
74‧‧‧ hollow or through hole
80‧‧‧Shrap
81‧‧‧Upper
82‧‧‧Bottom
90‧‧
91‧‧‧Upper film
92‧‧‧Under film
921‧‧‧ gate
922‧‧‧ module
100‧‧‧Mobile electronic devices
圖1A係習用一種移動通信終端裝置之結構剖視圖。 圖1B係圖1A中之連接器的立體放大圖。 圖2係本發明可行實施例之分解立體圖。 圖3係本發明可行實施例之組合立體圖。 圖4A至圖4D係本發明天線薄膜成型過程之示意圖。 圖5係本發明天線薄膜與背蓋在模具內成型之示意圖。 圖6係本發明天線膜片與該背蓋一體注塑成型之示意圖。 圖7A至圖7C係本發明塑膠開孔設置銅釘過程之示意圖。 圖8係本發明可行實施例之剖視圖。 圖9係圖8中9所示之放大圖。Fig. 1A is a cross-sectional view showing the structure of a mobile communication terminal device. Figure 1B is a perspective enlarged view of the connector of Figure 1A. Figure 2 is an exploded perspective view of a possible embodiment of the present invention. Figure 3 is a combined perspective view of a possible embodiment of the present invention. 4A to 4D are schematic views showing a molding process of the antenna film of the present invention. Fig. 5 is a schematic view showing the molding of the antenna film and the back cover of the present invention in a mold. Fig. 6 is a schematic view showing the injection molding of the antenna film of the present invention and the back cover. 7A to 7C are schematic views showing the process of setting the copper nails in the plastic opening of the present invention. Figure 8 is a cross-sectional view of a possible embodiment of the present invention. Figure 9 is an enlarged view of 9 in Figure 8.
20‧‧‧透明基板 20‧‧‧Transparent substrate
21‧‧‧印刷區 21‧‧‧Printing area
22‧‧‧中殼支架 22‧‧‧Shed bracket
30‧‧‧液晶顯示模組 30‧‧‧LCD module
40‧‧‧電路板 40‧‧‧ boards
50‧‧‧電池 50‧‧‧Battery
60‧‧‧背蓋 60‧‧‧Back cover
65‧‧‧塑膠層 65‧‧‧Plastic layer
70‧‧‧天線薄膜 70‧‧‧Antenna film
100‧‧‧行動電子裝置 100‧‧‧Mobile electronic devices
Claims (3)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104130383A TWI659678B (en) | 2015-09-15 | 2015-09-15 | Antenna composite molding structure of mobile electronic device and manufacturing method thereof |
| CN201510608410.9A CN106532226A (en) | 2015-09-15 | 2015-09-22 | Antenna composite forming structure of mobile electronic device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104130383A TWI659678B (en) | 2015-09-15 | 2015-09-15 | Antenna composite molding structure of mobile electronic device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201711544A true TW201711544A (en) | 2017-03-16 |
| TWI659678B TWI659678B (en) | 2019-05-11 |
Family
ID=58348228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104130383A TWI659678B (en) | 2015-09-15 | 2015-09-15 | Antenna composite molding structure of mobile electronic device and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106532226A (en) |
| TW (1) | TWI659678B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935965B (en) * | 2017-03-24 | 2024-03-19 | 苏州胜利精密制造科技股份有限公司 | Shell with antenna decoration function and preparation process |
| KR102266626B1 (en) * | 2017-07-17 | 2021-06-17 | 엘에스엠트론 주식회사 | Wireless Communication Chip Having Internal Antenna, Internal Antenna for Wireless Communication Chip, and Method for Fabricating Wireless Communication Chip Having Internal Antenna |
| CN108075230A (en) * | 2018-01-08 | 2018-05-25 | 西安易朴通讯技术有限公司 | Antenna module and electronic equipment |
| CN108615973A (en) * | 2018-04-26 | 2018-10-02 | 常州信息职业技术学院 | A kind of manufacturing method of antenna for intelligent terminal |
| CN108539403A (en) * | 2018-04-26 | 2018-09-14 | 常州信息职业技术学院 | A kind of manufacturing method of lightweight antenna |
| CN108899633A (en) * | 2018-06-27 | 2018-11-27 | 上海徕木电子股份有限公司 | A kind of electronics external shell structure for car-mounted device |
| CN109103588A (en) * | 2018-08-10 | 2018-12-28 | Oppo广东移动通信有限公司 | Antenna and preparation method thereof, electronic equipment |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200941822A (en) * | 2008-03-24 | 2009-10-01 | Paragon Technologies Co Ltd | Thin-film antenna assembly and its manufacturing method |
| KR100997983B1 (en) * | 2008-05-27 | 2010-12-03 | 삼성전기주식회사 | Mobile communication terminal |
| KR100945117B1 (en) * | 2009-04-23 | 2010-03-02 | 삼성전기주식회사 | Antenna pattern frame, method for manufacturing the same |
| CN102299397B (en) * | 2010-06-25 | 2015-07-29 | 百慕大商泰科资讯科技有限公司 | Antenna assembly and preparation method thereof |
| TWM411099U (en) * | 2011-04-18 | 2011-09-01 | Chi Mei Comm Systems Inc | Electromagnetic shielding |
| KR101808862B1 (en) * | 2011-12-16 | 2018-01-19 | 삼성전자주식회사 | Ground devic and portable terminal having the same |
| KR101978242B1 (en) * | 2012-12-21 | 2019-05-14 | 삼성전자주식회사 | Electronic device |
| KR101550061B1 (en) * | 2014-03-04 | 2015-09-04 | 주식회사 핀크래프트엔지니어링 | Hybrid Type Antenna Radiator and the Manufacturing Method of the Same |
| CN104269119B (en) * | 2014-09-29 | 2017-04-19 | 深圳创维－Rgb电子有限公司 | Ultra-thin liquid crystal display device and method for assembling same |
| CN104882663B (en) * | 2015-05-05 | 2018-05-04 | 广东劲胜智能集团股份有限公司 | The preparation method of communication terminal and its antenna attachment structure and antenna attachment structure |
| TWM518416U (en) * | 2015-09-15 | 2016-03-01 | Victory Specific Material Co Ltd M | Composite molding structure of antenna for mobile electronic device |
-
2015
- 2015-09-15 TW TW104130383A patent/TWI659678B/en not_active IP Right Cessation
- 2015-09-22 CN CN201510608410.9A patent/CN106532226A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN106532226A (en) | 2017-03-22 |
| TWI659678B (en) | 2019-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI659678B (en) | Antenna composite molding structure of mobile electronic device and manufacturing method thereof | |
| CN206364003U (en) | Packaging, system in package device and electronic equipment | |
| CN101594400A (en) | Mobile communication terminal | |
| US20070216583A1 (en) | Antenna structure for electronic device | |
| KR101651904B1 (en) | Antenna structure | |
| US8643550B2 (en) | Flexible antenna | |
| CN101500381A (en) | Housing, manufacturing method for the housing and electronic apparatus applying the housing | |
| WO2008044845A1 (en) | Antenna module, method of forming the same and radio communication terminal comprising the same | |
| KR101506501B1 (en) | Manufacturing method of wireless mobile Built-in antenna case or cover and its mold | |
| US20160029492A1 (en) | Structure, wireless communication device and method for manufacturing structure | |
| KR20080008633A (en) | Mobile communication terminal | |
| KR20160055573A (en) | Antenna module and electronic device including the same | |
| KR101898059B1 (en) | Electronic device with slot antenna | |
| TWM518416U (en) | Composite molding structure of antenna for mobile electronic device | |
| CN108539369A (en) | Antenna module, the production method of antenna module and electronic equipment | |
| CN108539370B (en) | Shell assembly, antenna assembly and electronic equipment | |
| CN108541156B (en) | Shell assembly, antenna assembly, electronic equipment and machining method | |
| KR101459709B1 (en) | Built-in antenna for electronic devices and its manufacturing method of mold | |
| KR20120123895A (en) | Terminal for communication and method of manufacturing the same | |
| KR100826392B1 (en) | Mobile apparatus and method of manufacturing the same | |
| CN108539373A (en) | Housing unit, antenna module, the production method of antenna module and electronic equipment | |
| KR101598293B1 (en) | Antenna pattern frame and electronic device including the same | |
| KR20130051054A (en) | Mobile device case with built-in antenna and manufacturing method of the same | |
| TWM373574U (en) | Modular antenna device | |
| KR101486463B1 (en) | Antenna terminal structure for mobile communication terminal and method for manufacturing and method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |