CN106532226A - Antenna composite forming structure of mobile electronic device and manufacturing method thereof - Google Patents
Antenna composite forming structure of mobile electronic device and manufacturing method thereof Download PDFInfo
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- CN106532226A CN106532226A CN201510608410.9A CN201510608410A CN106532226A CN 106532226 A CN106532226 A CN 106532226A CN 201510608410 A CN201510608410 A CN 201510608410A CN 106532226 A CN106532226 A CN 106532226A
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- 239000002131 composite material Substances 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004033 plastic Substances 0.000 claims abstract description 26
- 229920003023 plastic Polymers 0.000 claims abstract description 26
- 238000000465 moulding Methods 0.000 claims abstract description 21
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 238000007639 printing Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000004891 communication Methods 0.000 claims abstract description 4
- 239000004568 cement Substances 0.000 claims description 13
- 239000012634 fragment Substances 0.000 claims description 11
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 238000005192 partition Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 239000011435 rock Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
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- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 150000001875 compounds Chemical class 0.000 description 1
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- 239000011889 copper foil Substances 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
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Landscapes
- Details Of Aerials (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Telephone Set Structure (AREA)
Abstract
An antenna composite forming structure of mobile electronic device, especially a method for printing conductive ink on different areas of IML membrane to form different antenna partitions, then putting the printed antenna film into a mould, and integrally injection moulding (insert molding) with the back cover, when the antenna film and the back cover are integrally injection moulding, the back cover is a naked plastic open hole relative to the electric connection area, after injection moulding, filling conductive adhesive into the plastic open hole, and inlaying a copper nail protruding to the inner surface of the back cover to make it become the external connection point of the antenna module, so as to realize remote or near-end communication. The method has the advantages of keeping the stability and the reliability of the communication of the mobile electronic device and saving the cost.
Description
Technical field
The present invention is the antenna composite molding structure about a kind of electronic apparatus, and espespecially one kind will
The structure of antenna film and back-cover integrated injection molding (insert molding).
Background technology
The development of the electronic apparatus such as smart mobile phone, tablet PC, with it is short and small it is frivolous as design
Trend, therefore for short and small frivolous double requirements can be reached, therefore, group inside electronic apparatus
The arranging of part position, and how to simplify the structure of these installed with built-in component, it appears it is increasingly important.Wherein
Receiving and transmitting signal significant components of the antenna as electronic apparatus, its set location and preparation method are for drop
Low cost and lifting performance, all have greatest relation.
Secondary person, as smart mobile phone function is become stronger day by day, except integration realization is conversed in smart mobile phone
Beyond necessary main antenna, the also antenna such as bluetooth, WIFI, RFID, GPS, FM；These days
Line mostly by machine difference manufacturing technology reaching, the multiplex PET film+ Copper Foils of such as traditional antenna
It is attached to after etching on antenna holder, has the printed antenna region on main circuit board PCB to make later again
Into implanted antenna, have using state-of-the-art technology LDS (Laser Direct again at present
Structuring), the 3D antennas of LSP (Laser Selective Plat) fabrication techniques, and
Directly electrically conductive ink is printed on insulated substrate (thin film) using printing technology and forms conducting wire
And the RFID antenna produced.
Shown in Figure 1A and Figure 1B, it is a kind of mobile communication terminal 10 disclosed in Samsung,
Which includes：One housing 11；Film type antenna 12 is located on 11 inner surface of housing；One printed circuit board (PCB)
13, it is arranged in the housing 11；A connector 14, by film type antenna 12 and printed circuit board (PCB) 13
Electrical connection.But look into, still difficulty reaches 10 device 10 of this kind of mobile communication mobile communications device on the whole
Short and small frivolous double requirements, and adapter 14 and film type antenna 12 and the electricity of printed circuit board (PCB) 13
Connected mode, easily produces because of packing problem and rocks so as to affect antenna stabilization, therefore still have
Improve space.
Therefore solving the problems referred to above point of traditional electronic apparatus, it is the major subjects of the present invention.
The content of the invention
Technical problem underlying to be solved by this invention is to overcome the above-mentioned of prior art presence to lack
Fall into, and a kind of antenna composite molding structure of electronic apparatus is provided, its antenna is with back-cover integrally
Formula molding so that antenna performance is more stable, will not produce because of packing problem and rock, so as to
Affect antenna stabilization；Furthermore saved the production stage for originally needing multistep to assemble multiple antennas and
Human cost, so that reduce product cost；The Anneta module of its printing easily can change on demand
Become any shape, the such as body surface of different curvature, angle, with up to customized requirement, and not
Reduce any performance；Which has the width that can change line by local, changes chip layer
Thickness etc. is accurately adjusted to required desired value.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of antenna composite molding structure of electronic apparatus, including：One transparency carrier, thereon
A Printing Zone can be provided with；One liquid crystal display module, is located at the lower section of the transparency carrier；
Shell support in one, is located at the lower section of the liquid crystal display module；One circuit board and a battery, if
In this below shell support；One back-cover, relative to combine shell support root edge in this, which has an appearance
Between being empty, to receive aforesaid component；It is characterized in that：
One antenna film, with the back-cover integrated injection molding (insert molding), the antenna is thin
Diaphragm is printed with predetermined conductive patterns on an in-mold label (In-Mold Label, abbreviation IML) diaphragm
Anneta module constituted, the Anneta module is provided with an electric connection area, furthermore the antenna film
It is placed in a mould coincideing with its shape, during with the back-cover integrated injection molding, and in the back of the body
The position in the relative electric connection area of lid is in exposed plastic cement perforate, after injection mo(u)lding, in the modeling
A conducting resinl is poured in glue perforate, while inlaying a peg for protruding out to the back-cover inner surface, is made
Which becomes the outer contact of the Anneta module；And an at least shell fragment, be located in bending the back-cover with
Between the circuit board, its one end is fixed on the board, and other end connection turns on the Anneta module
Outer contact so that the circuit board inside the electronic apparatus, noted by this and this back-cover one
Molded antenna film, realizes telecommunication.
A kind of manufacture method of the antenna composite molding structure of electronic apparatus, its step include：
A). electrically conductive ink is printed according to the demand region required for different antennae module and size shape
Brush on in-mold label diaphragm makes to be printed with the antenna of several sequentials on the in-mold label diaphragm
Module, each Anneta module are provided with an electric connection area；
B). by each group of Anneta module on the in-mold label diaphragm, cut into the size shape of needs
Unit；
C). by the back-cover peripheral shape needed for the in-mold label diaphragm hot forming of the unit, formed
The three-dimensional shape on arc side；
D). cut away the in-mold label diaphragm upper periphery excess waste, and in book office be provided with hollow out or
Through hole, to form the thin mould of an antenna；
E). the antenna film for being printed on the Anneta module is placed on the mould being coincide with its shape
In, by injection mo(u)lding, make a plastic layer combine the antenna film, be integrally molded so as one and be covered,
And the position in the electric connection area, in injection molding process, do not covered by the plastic layer, from
And a plastic cement perforate is formed, it is exposed for connecting；
F). relative to the position in the electric connection area of the Anneta module, in the plastic cement perforate of the plastic layer
In, a conducting resinl is poured into, while a peg is inlayed as the outer contact of the day wire module；And
G). a shell fragment is welded on a circuit board, is entered with the peg inlayed on the shell fragment and the back-cover
Row is electrically connected with conducting, so that the circuit board inside the electronic apparatus, by this and the back-cover
The antenna film of integrated injection molding, realizes telecommunication.
By technological means are above taken off, traditional antenna is designed to antenna film and the back of the body by the present invention
The construction of lid integrated injection molding (insert molding), with can keep electronic apparatus
The stability and reliability of telecommunication, and the cost-effective effect of energy.
The invention has the beneficial effects as follows, its antenna and back-cover integral molding so that antenna performance is more
Plus it is stable, will not produce because of packing problem and rock, so as to affect antenna stabilization；Furthermore save
Multistep is about originally needed to assemble production stage and the human cost of multiple antennas, so as to reducing product
Cost；The Anneta module of its printing can easily change over any shape on demand, such as different bent
The body surface of rate, angle, to reach customized requirement, and does not reduce any performance；Its tool
There is the width that can change line by local, change needed for thickness of chip layer etc. is accurately adjusted to
Desired value.
Description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Figure 1A is a kind of structure sectional view of existing mobile communication terminal.
Figure 1B is the stereo amplification figure of the adapter in Figure 1A.
Fig. 2 is the exploded perspective view of possible embodiments of the present invention.
Fig. 3 is the combination stereogram of possible embodiments of the present invention.
Fig. 4 A to Fig. 4 D are the schematic diagrams of inventive antenna film formation process.
Fig. 5 is the schematic diagram of inventive antenna thin film and back-cover in in-mold molding.
Fig. 6 is the schematic diagram of inventive antenna diaphragm and the back-cover integrated injection molding.
Fig. 7 A to Fig. 7 C are the schematic diagrams that plastic cement perforate of the present invention arranges fastener process.
Fig. 8 is the sectional view of possible embodiments of the present invention.
Fig. 9 is the enlarged drawing in Fig. 8 shown in 9.
Label declaration in figure：
20 transparency carriers
21 Printing Zones
Shell support in 22
30 liquid crystal display modules
40 circuit boards
50 batteries
60 back-covers
61 plastic cement perforates
62 conducting resinls
63 fasteners
64 outer contacts
65 plastic layers
70 antenna films
71 in-mold label diaphragms
72 Anneta modules
721 are electrically connected with
73 arc sides
74 hollow outs or through hole
80 shell fragments
81 upper ends
82 lower ends
90 moulds
Film on 91
92 lower films
921 cast gates
922 modules
100 electronic apparatus
Specific embodiment
First, refer to shown in Fig. 2～Fig. 8, disclosed herein electronic apparatus 100 day
Line composite molding structure, one possible embodiments include：One transparency carrier 20, can on its outer peripheral edge
It is provided with a nontransparent Printing Zone 21；One liquid crystal display module 30, is located under the transparency carrier 20
Side；Shell support 22 in one, is located at the lower section of the liquid crystal display module 30；One circuit board 40 and is electric
Pond 50, is located in this below shell support 22；And a back-cover 60, it is relative to combine shell support in this
22 root edges, which has the accommodation space of a matrix, to receive aforesaid component；But, above take off structure
Part belongs to prior art (Prior Art), and the patent purpose of non-invention, appearance are not repeated.
The present invention is characterized in：One antenna film 70, with 60 integrated injection molding of back-cover
(insert molding), the antenna film 70 is in an in-mold label (In-Mold Label, abbreviation
IML the Anneta module 72 for) being printed with predetermined conductive patterns on diaphragm 71 is constituted, each antenna mould
Block 72 is provided with an electric connection area 721, furthermore the antenna film 70 is placed on one and is coincide with its shape
Mould 90 in (as shown in Figure 5), and the antenna film 70 with 60 integrated injection molding of back-cover when,
And in the position in the 60 relative electric connection area 721 of the back-cover be in exposed plastic cement perforate 61, and as schemed
Shown in 7A to Fig. 7 C, a conducting resinl 62 is poured in the plastic cement perforate 61, while inlay one protruding out to
The fastener 63 of 60 inner surface of back-cover so as to become the outer contact 64 of the Anneta module 72；And extremely
A few shell fragment 80, is made up of conductive material, is located at the back-cover 60 and the circuit board 40 in bending
Between, one upper end 81 is fixed on the circuit board 40, and another its connection of lower end 82 turns on the antenna mould
The outer contact 64 of block 72, so that the circuit board 40 inside the electronic apparatus 100, by this and this
The antenna film 70 of 60 integrated injection molding of back-cover, realizes remote communicating function.
For realizing the antenna composite molding structure of electronic apparatus of the present invention 100, its manufacture method bag
Include following steps：
A). first, as shown in Figure 4 A, by electrically conductive ink according to the need required for different antennae module 72
Ask region and size shape to be printed on in-mold label diaphragm 71, make to print on the in-mold label diaphragm 71
The Anneta module 72 of more several sequentials is brushed with, in the present embodiment, the in-mold label diaphragm is made
71 material can be selected from and set for Merlon (PC) or polyethylene terephthalate (PET) etc.
Fat material, the electrically conductive ink can be by gold, silver, copper, conductive carbon powder, silver-colored carbon dust, graphite powder or carbon
Mix with one or more of the mixed-powder of graphite.
B). then, as shown in Figure 4 B, by each group of Anneta module 72 on in-mold label diaphragm 71,
Cut into the size shape unit 70a of needs.
C). and then, as shown in Figure 4 C, by the back of the body needed for each 72 hot forming of element antenna module
60 peripheral shape of lid, such as surrounding form the three-dimensional shape 70b on arc side 73.
D). further, as shown in Figure 4 D, cut away 72 periphery excess waste of Anneta module, and in
Book office is provided with hollow out or through hole 74, to form the thin mould of an antenna 70.
E). as shown in figure 5, be placed on the antenna film 70 for being printed on Anneta module 72 kissing with its shape
In the mould 90 of conjunction, the mould 90 includes on one mould 91 and once mould 92, and lower mould 92 is provided with cast gate 921
And module 922, by way of injection mo(u)lding (insert molding), formed plastic layer 65
With reference to antenna film 70, covered 60 (as shown in Figure 6) of the electronic apparatus 100 are integrally formed,
And the position in the electric connection area 721, in injection molding process, do not covered by plastic layer 65,
It is so as to form a plastic cement perforate 61, exposed for connecting；The material of plastic layer 65 is may be selected from as poly- second
Alkene, polyamide, Merlon, acrylonitrile-styrene butadiene copolymers compound, polymethyl
Any one in the material such as sour methyl ester or polyethylene terephthalate.
F). then, as shown in Fig. 7 A to Fig. 7 C, relative to the electric connection of the Anneta module 72
The position in area 721, in the plastic cement perforate 61 of plastic layer 65, clicks and enters conducting resinl 62, while edge
Outer contact 64 of the embedding fastener 63 as Anneta module 72.
G). it is last, as shown in Fig. 8 to Fig. 9, using 80 He of shell fragment in the welding of circuit board 40
The antenna connection peg 63 inlayed in back-cover 60 is attached conducting, so as to realize communication function.
In the present embodiment, the peg 63 may be selected the preferable metal material of the electric conductivities such as copper, ferrum, aluminum,
Compared with frequently with fastener, the Anneta module 72 of back-cover 60 can be so made, by peg 63 and movement
Circuit board 40 inside electronic installation 100, it can be ensured that the Anneta module 72 of housing is filled with mobile electron
Put 100 internal circuit stable connection.
By technological means are above taken off, traditional antenna is designed to antenna film 70 and is somebody's turn to do by the present invention
The construction of 60 integrated injection molding of back-cover (insert molding), can obtain following effect：
1. antenna film 70 and 60 integral molding of back-cover so that antenna performance is more stable, no
Can produce because of packing problem and rock, with the reliability that can keep electronic apparatus 100.
Furthermore 2., saved the production stage and manpower that originally needed multistep to assemble multiple antennas into
This, and the cost-effective effect of energy.
3. the Anneta module 72 of printing can easily change over any shape on demand, such as different
The body surface of curvature, angle, to reach customized requirement, and does not reduce any performance.
4. which has the width that can change line by local, changes thickness of chip layer etc. accurate
Desired value needed for being adjusted to.
The above, is only presently preferred embodiments of the present invention, not makees any shape to the present invention
Restriction in formula, it is any simple that every technical spirit according to the present invention is made to above example
Modification, equivalent variations and modification, still fall within the range of technical solution of the present invention.
In sum, the present invention is accorded with completely in structure design, using in practicality and cost benefit
Close needed for industry development, and disclosed structure is also, with unprecedented innovative structure, have
Novelty, creativeness, practicality, meet the regulation about patent of invention important document, therefore lift in accordance with the law
Application.
Claims (3)
1. the antenna composite molding structure of a kind of electronic apparatus, including：
One transparency carrier, which is provided with a Printing Zone；
One liquid crystal display module, is located at the lower section of the transparency carrier；
Shell support in one, is located at the lower section of the liquid crystal display module；
One circuit board and a battery, are located in this below shell support；
One back-cover, relative to combine shell support root edge in this, which has an accommodation space, to receive
Receive aforesaid component；It is characterized in that：
One antenna film, with the back-cover integrated injection molding, the antenna film is in an in-mold label film
The Anneta module of predetermined conductive patterns is printed with piece, and the Anneta module is provided with an electric connection area,
Furthermore the antenna film is placed in a predetermined mold being coincide with its shape, note with the back-cover one
When molded, and it is in exposed plastic cement perforate in the position in the relative electric connection area of the back-cover, treats
After injection mo(u)lding, conducting resinl is poured in the plastic cement perforate, while inlay one protruding out in the back-cover
The fastener on surface so as to become the outer contact of the Anneta module；And
An at least shell fragment, is located in bending between the back-cover and the circuit board, and its one end is fixed on
On the circuit board, other end connection turns on the outer contact of the Anneta module, so that the mobile electron is filled
The circuit board of inside is put, by the antenna film with the back-cover integrated injection molding, is realized long-range
Communication.
2. the antenna composite molding structure of electronic apparatus according to claim 1, its feature
It is, the bending is made up of conductive material by the shell fragment that the forniciform upper end of the shell fragment is fixed
On the board, its lower end connection turns on the outer contact of the Anneta module.
3. the manufacture method of the antenna composite molding structure of a kind of electronic apparatus, it is characterised in that
Step includes：
A). electrically conductive ink is printed according to the demand region required for different antennae module and size shape
Brush on in-mold label diaphragm makes to be printed with the antenna of several sequentials on the in-mold label diaphragm
Module, each Anneta module are provided with an electric connection area；
B). by each group of Anneta module on the in-mold label diaphragm, cut into the size shape of needs
Unit；
C). by the back-cover peripheral shape needed for the in-mold label diaphragm hot forming of the unit, formed
The three-dimensional shape on arc side；
D). cut away the in-mold label diaphragm upper periphery excess waste, and in book office be provided with hollow out or
Through hole, to form the thin mould of an antenna；
E). the antenna film for being printed on the Anneta module is placed on the mould being coincide with its shape
In, by injection mo(u)lding, make a plastic layer combine the antenna film, be integrally molded so as one and be covered,
And the position in the electric connection area, in injection molding process, do not covered by the plastic layer, from
And a plastic cement perforate is formed, it is exposed for connecting；
F). relative to the position in the electric connection area of the Anneta module, in the plastic cement perforate of the plastic layer
In, a conducting resinl is poured into, while a peg is inlayed as the outer contact of the day wire module；And
G). a shell fragment is welded on a circuit board, is entered with the peg inlayed on the shell fragment and the back-cover
Row is electrically connected with conducting, so that the circuit board inside the electronic apparatus, by this and the back-cover
The antenna film of integrated injection molding, realizes telecommunication.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104130383A TWI659678B (en) | 2015-09-15 | 2015-09-15 | Antenna composite molding structure of mobile electronic device and manufacturing method thereof |
| TW104130383 | 2015-09-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106532226A true CN106532226A (en) | 2017-03-22 |
Family
ID=58348228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510608410.9A Pending CN106532226A (en) | 2015-09-15 | 2015-09-22 | Antenna composite forming structure of mobile electronic device and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106532226A (en) |
| TW (1) | TWI659678B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106935965A (en) * | 2017-03-24 | 2017-07-07 | 苏州胜利精密制造科技股份有限公司 | A kind of housing and preparation technology with antenna decorating function |
| CN108075230A (en) * | 2018-01-08 | 2018-05-25 | 西安易朴通讯技术有限公司 | Antenna module and electronic equipment |
| CN108539403A (en) * | 2018-04-26 | 2018-09-14 | 常州信息职业技术学院 | A kind of manufacturing method of lightweight antenna |
| CN108615973A (en) * | 2018-04-26 | 2018-10-02 | 常州信息职业技术学院 | A kind of manufacturing method of antenna for intelligent terminal |
| CN108899633A (en) * | 2018-06-27 | 2018-11-27 | 上海徕木电子股份有限公司 | A kind of electronics external shell structure for car-mounted device |
| CN109103588A (en) * | 2018-08-10 | 2018-12-28 | Oppo广东移动通信有限公司 | Antenna and preparation method thereof, electronic equipment |
| CN109273824A (en) * | 2017-07-17 | 2019-01-25 | Ls美创有限公司 | Wireless communication chips and its manufacturing method, wireless communication chips built-in antenna |
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- 2015-09-22 CN CN201510608410.9A patent/CN106532226A/en active Pending
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| CN102299397A (en) * | 2010-06-25 | 2011-12-28 | 百慕大商泰科资讯科技有限公司 | Antenna device and manufacturing method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935965A (en) * | 2017-03-24 | 2017-07-07 | 苏州胜利精密制造科技股份有限公司 | A kind of housing and preparation technology with antenna decorating function |
| CN106935965B (en) * | 2017-03-24 | 2024-03-19 | 苏州胜利精密制造科技股份有限公司 | Shell with antenna decoration function and preparation process |
| CN109273824A (en) * | 2017-07-17 | 2019-01-25 | Ls美创有限公司 | Wireless communication chips and its manufacturing method, wireless communication chips built-in antenna |
| CN109273824B (en) * | 2017-07-17 | 2021-01-12 | Ls美创有限公司 | Wireless communication chip, method for manufacturing same, and built-in antenna for wireless communication chip |
| CN108075230A (en) * | 2018-01-08 | 2018-05-25 | 西安易朴通讯技术有限公司 | Antenna module and electronic equipment |
| CN108539403A (en) * | 2018-04-26 | 2018-09-14 | 常州信息职业技术学院 | A kind of manufacturing method of lightweight antenna |
| CN108615973A (en) * | 2018-04-26 | 2018-10-02 | 常州信息职业技术学院 | A kind of manufacturing method of antenna for intelligent terminal |
| CN108899633A (en) * | 2018-06-27 | 2018-11-27 | 上海徕木电子股份有限公司 | A kind of electronics external shell structure for car-mounted device |
| CN109103588A (en) * | 2018-08-10 | 2018-12-28 | Oppo广东移动通信有限公司 | Antenna and preparation method thereof, electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201711544A (en) | 2017-03-16 |
| TWI659678B (en) | 2019-05-11 |
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