TW200941822A - Thin-film antenna assembly and its manufacturing method - Google Patents

Thin-film antenna assembly and its manufacturing method Download PDF

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Publication number
TW200941822A
TW200941822A TW97110382A TW97110382A TW200941822A TW 200941822 A TW200941822 A TW 200941822A TW 97110382 A TW97110382 A TW 97110382A TW 97110382 A TW97110382 A TW 97110382A TW 200941822 A TW200941822 A TW 200941822A
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Taiwan
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antenna
conductive
combined
film antenna
combination
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TW97110382A
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Chinese (zh)
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jia-yu Liao
yuan-ming Zhang
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Paragon Technologies Co Ltd
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Priority to TW97110382A priority Critical patent/TW200941822A/en
Publication of TW200941822A publication Critical patent/TW200941822A/en

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Abstract

A thin-film antenna assembly and its manufacturing method, comprising: an antenna main body constructed by a conducting film, disposed on a substrate, having a signal connecting unit; a feeder line; a conductive medium, to combine the feeder line at one side of which, and the other side of which is positioned to the signal link unit of the antenna main body. Therefore, it can provide a thin-film antenna assembly to prevent destruction of the antenna structure and achieve the proper electrically connection status. This completely solves the combination problems involved in the thin-film antenna and the antenna feeding line. Indeed, having progressive effect and industrial production utilization.

Description

200941822 九、發明說明: 【發明所屬之技術領域】 本發明係涉及一種薄膜天線,特 ^ λ ,, a 竹別疋私其天線主體蛊 饋入線之間結合結構型態及製法之釗新設計者。 、 【先前技術】 ▲為因應現今資訊發達的社會,電子產品導入 ❹::成為難以避免的趨勢,也因此’藉以產生 : =天線構件,成為以電子產品結構中不可或缺的= 鼻件之-,除了大眾所普遍使用的㈣電話需要設置 皮!及使用的筆記型電腦、個人數位助理 輸、無線上網之目的。線u以達到無線傳 習知天線結構,通常係藉由金屬板材沖壓曲折 之立體天線型態(如倒F形天線),惟,隨著電子產 ❹逐漸輕小化、薄形化設計發展趨勢’無論行動電話、二己 :電腦、隱之結構體積、内部空間均有大幅度縮小化趨 ,如此’其内部各構件亦必須相對縮小方能因應,因此 ’習知天線之立體型態因所佔體積仍舊過大而無法適用於 J、化的電子產品結構中’基於此,遂有業界研發出—種 溥膜天線以為因應。 種 斤辽薄膜天線,主要是在電子產品結構中預定基材 電路板、機殼等)表面透過印刷、蒸艘、賤 合-薄層型態之天線構造,藉此令天線構造達到薄形二 200941822 .目广;惟’天線結構組成上,天線的饋入點及接地部必項 與一同軸境線(即饋入線)之芯線及外導體相互電性連= 以促成天線收發時之訊號饋入,而其連結狀態的達成對^ 立體天線而言,由於立體天線為金屬板材,可透過焊接手 段與同㈣線直接達成結合且無破壞之虞,然而 膜天線而§,由於薄膜天線是結合於基材表面的薄層構迭 而已’結構性極為薄弱而不耐高溫,若採用 =天線與同轴纔線之結合,其焊接時的高溫將造成= ❹天線的過度融炫破壞現象,甚至間接造成基 :述基材通常是塑膠材…因此,如何克服前述因難 膜:線:同轴纜線之結合問題點,儼然成為相關業 I肩努力心索突破的重要技術課題。 '、 疋以’針對上述習知薄膜天線結構所存在之問題點, 可研發出一種能夠更具理想實用性之創新構造,實有待 相關業界再加以思食突破之目標及方向者。 、 有鑑於此,發明人本於多年從事相關產品之製造開發 ❹:!計:驗丄針對上述之目標,詳加設計與審慎評估後, 終传一確具實用性之本發明。 【發明内容】 及直::明之主要目的,係在提供-種薄膜天線組合構; 方法,其所欲解決之問題點,係針對如何解決《 膜天線與饋入線之結合問題加以思索突破; 本發明解決問題之技術特點,就所述薄膜天線組合# 200941822 造而言’主要包括下述構成··天線主豸,為一 造設於一基材,所述天線部具有訊號連沾运 電介質,#-側與—饋入線結合,該導:二饋:線;導 〆争包介質之另側則 位組合於天線主體之訊號連結部; 疋 而就所述薄膜天線的製造方法而言,主要在於基 定部位所結合的導電薄層狀天線主體預 連結部係藉由導電介質與饋入線達成組合= ::: 狀態’精此創新獨特設計’使本發明大致可達到如下優: Ο 由於所述饋入線是透過導電介質定位組合於天線主體 提Γ=線係直接焊接於天線之習知結構型態,藉此 k供-種確實符合薄膜天線結構之組合式饋人線結合定位 设计’得以確保薄膜天線結構免於破壞,同時達到 之 電性f結狀態,徹底解決㈣天線與饋人線之結合問題而 確具實用進步性及產業利用效益。 【實施方式】 、請參閱第1、2圖所示,係本發明薄膜天線及其製造 方法之較佳實施例,惟此等實施例無論係第i、2圖之韓 射:形狀及其各種變形,或第3圖之互補型輻射元形狀及 其種變形,在專利申請上並不受此結構之限制,合先叙 明;,百先,就所述薄膜天線之組合結構加以說明,係包括 下述構成: —基材10,所述基材1〇可為電路板或電子產品的殼體 200941822 . 結柄部位或其它支架、零組件部位者· 一天線主體20 ’為一導電薄層構造設於基材1〇預定部 位,所述天線主體20具有訊號連結部μ,所述訊號連結部 21係包括訊號饋入部212以及訊號接地部211 ; 一饋入線30,為一同軸纜線,其包括有一芯線31以及 一外導體32 (註.實際上並包括有一中間絕緣層,本案中 予以省略呈現,特此申明); 導電;I吳40,其一側係與饋入線相結合,並令該 © 導電介質40之另一侧定位組合於天線主體20之訊號連結部 21 ;而所述定位組合手段之具體結構實施型態可為多種, 容於後文說明。 承上述結構,接著,先就本發明薄膜天線製造方法說 明如下,請參第1圖所示,其主要核心設計係在於:基材 預定部位所結合的導電薄層狀天線主體2〇,該天線主體2〇 之訊號連結部21係藉由導電介質40與饋入線30達成定位組 合及電性連結狀悲者’而就上述方法之順序而言可為多種 © ,例如:可令所述導電介質40先與饋入線30結合之後,再 將導電介質40組合於天線主體20之訊號連結部21。或者, 亦可令所述導電介質40先組合於天線主體2〇訊號連結部 之後’再令該饋入線30與導電介質40進行結合者;又,於 所述基材10形成天線主體20之步驟可為最前置步驟,亦可 為於導電介質40組合於天線主體20之後再進行之加工 狀態者。 其中’所述天線主體20結合於基材1〇的方式可採用下 8 200941822 -述任其中一種或其叙合:印刷、蒸鍍、濺鑛、嗔冷或以 塗佈手段。 —分八 其中,所述導電介質40可為金屬(如金屬板片 '金屬 環圈、金屬彈片等)、導電谬、溶接材料任—種結構型態 &gt; 所述導電介質40與天線主體2〇訊料接部21之定位包 合手段,則可為藉由下述任一種構成或任一構成組合型態 達成:嫘合元件、彈性元件、嵌卡元件、壓制元件、黏著 0 劑料等。 &quot; 所述導電介質40與饋入線30可藉由可導電之焊接材料 、可導電之熔接材料或可導電之膠合材料相結合者。 以下,即配合圖面就所述導電介質4〇以及導電介質肋 與天線主體20訊號連接部21之定位組合型態之具體實施型 態說明如下: 如第1、2圖所示,本實施例之天線主體2〇為電場型 0 輻射元形狀,其導電介質40為二金屬環圈41、42所構成, 其一金屬環圈41結合於饋入線30之芯線31 ,另一金屬環圈 42、’Ό 口於饋入線3〇之外導體32,而其定位組合手段則藉由 一卡柱51、52來達成,所述卡柱51、52可為基材1〇 一體成 型或組合定位型態,復令該二金屬環圈41、42各別藉由二 卡柱51、52組合定位於基材10之夫線主體2〇訊號連結部21 之訊號接地部211以及訊號饋入部212達成具體電性連結 狀態者。第3圖所示之天線主體20Β則為一磁場型天線, 其為互補型輻射元形狀,而本實施例之定位組合手段,同 9 200941822 圖所示,gp 樣疋猎由二卡柱51、、去jl 狂 52達成,細部同第1 不重複贅述。 以下實施例中’為簡化圖示以及文字說明,所述饋入 線30須藉由其芯線31 ^ ¥體32與天線主體20訊號連結部 之«接地㉝211及訊號饋入部M2達成電性連結之狀 -’將僅以饋入線3〇之—端點連結狀態簡化表示及說明, 先此敛明。 #第4、5圖所不,本實施例之導電介質40為一金屬 板片43,令饋入線30焊接於該金屬板片43頂面,其定位址 合手段則藉由黏著劑料53來達成,所述黏著劑料53若採用 導電膠時,可如第4圖所示採用佈設於金屬板片43全部區 域(或局部區域)之型態·以使金屬板片43與天線主體2〇達 成電性連結狀態。而所述黏著劑料53若為非導電性之膠劑 時,則須採用塗佈於該金屬板片43底面局部區域之型態: 構成金屬板片43底®有局冑區域直接抵靠接觸於天線^體 20達成電性連結組合狀態。 如苐6圖所示,本實施例之導電介質4〇同樣為一金屬 板片43,而其定位組合手段則藉由一卡柱54來達成,所述 卡柱54係為基材1〇所一體成型,令該金屬板片肋設有一穿 孔44,藉此該金屬板片43之穿孔44可套組於所述卡柱%, 再將卡柱54之頂端凸伸部位藉由熱壓手段形成擴徑端頭阳 ,即可將金屬板片43與天線主體2〇之組合狀態定位。其中 所述卡柱亦可為單獨製成後再插組定位於基材所設一插孔 中之結構型態。第7圖所示之定位組合手段係藉由另一種 10 200941822 • 型磕之肷卡兀件來達成,本實施例之嵌卡元件係具有一抵 靠板面541藉以靠合於天線主體20上,該抵靠板面541底 部則具有嵌插腳542 ,藉以可嵌插配合於基材1〇所預設的 卡槽11中達成定位狀態。 ^ 如第8圖所示,本實施例之導電介質4〇同樣為一金屬 板片43,其定位組合手段則藉由則為一壓制元件56來達成 ,所述壓制元件56可為一塊狀體,其底部具一嵌卡槽561 恰可壓制卡合於金屬板片43上,該虔制元件56之底部則可 ❹透過嵌卡或谬合方式結合^位於天線主體⑼之訊號連 21上。 如第9圖所示,本實施例之導電介質仙為一金屬 'tt Μ U 4Γ t . „ . w y ^ ^ ^ 5. 45,該金屬彈片45 —側具一向下a %夕γh J ^ n卜曲折之彈性抵壓端451 , 其疋位組合手段則藉由一插接挺57央;告士、 々 «個任狂w术達成,以使基材1〇开 成一凸管部11恰可供該插接柱57緊插達成定位。 如第ίο圖所示,所述導電介f4Q亦可為焊料仙直接相 成者,其製作方法如圖之箭號指向所示,係於饋人線心 431先結合-定劑量之焊料46,該焊⑽初步呈球型, 接著將該焊料46加以沖壓呈扁平狀,真 、 τ狀冉將该沖平之焊料4( 以超音波方式固定於天線主體2〇上。 參考前段第10圖所示之結構型能 ^ 偁可知,本發明所述導 电介質40可為一體結構型態所達成, 或例如可採用導電膠, 俾可精由導電膠之導電性及黏著性, … ife &gt;## λ ^ QH 同T達成導電介質41 與饋入線30之結合狀態,以及導 入—,u 电;丨質4〇舆天線主體10 3 組合定位狀態者。 200941822 其中,所述導電介質40結合於饋入線30芯線31的方式 除了可採用焊接結合方式之外,亦'可如第u圖所示,於所 述導電介質4〇頂面設一爽持部47 ’以將饋入線3〇之芯線31 加以夾持定位而達成連結狀態者。 ❹ 本發明之優點: 本發明主要藉 介質定位組合於天 線是透過導電介質 接焊接於天線之習 一種確實符合薄膜 及製法設計,得以 部位之破壞,同時 底解決薄膜天線與 及較佳之產業利用 由該饋 線主體 定位組 知結構 天線結 確保薄 達到應 饋入線 效益者 入線係結合導電介質’復將導電 之創新獨特設計,由於所述饋入 合於天線主體,不同於饋入線直 天線結構型態,藉此,俾可提供 構之組合式饋入線結合構造型態 膜天線結構免於受到饋入線結合 有之穩定電性連結狀態,進而徹 之結合問題,確具有實用進步性 ❹ 上述實施例所揭示者係藉以具體說明本發明,且文 :透二特定的術語進行說明,當不能以此限定本發明之專 神悉此項技術領域之人士當可在瞭解本發明之精 等變:m行變更與修改而達到等效之目的,而此 定範_中\“ L蓋於如后所述之中請專利範圍所界 12 200941822 【圖式簡單說明】 (為電場型天線 第1圖.本發明第—實施例之組合立體圖 第2圖.本發明第—實施例之組合剖視圖。 第3圖:本發明之天線主體為磁場型天線之實施例圖。 第4圖.本發明第二實施例之組合立體圖。 第5圖.係第4圖所揭結構之組合剖視圖。 ❹200941822 IX. Description of the Invention: [Technical Field] The present invention relates to a thin film antenna, which is a new designer of the combination structure type and the manufacturing method of the antenna body 蛊 蛊 , , , , , . [Prior Art] ▲In response to today's information-developed society, the introduction of electronic products:: has become an inevitable trend, and therefore 'by the following: = antenna components, become indispensable in the structure of electronic products = nose pieces - In addition to the popular use of the public (four) the phone needs to set the skin! And the use of notebook computers, personal digital assistants, wireless Internet access purposes. The line u is used to reach the wireless transmission structure of the antenna. It is usually a three-dimensional antenna type (such as an inverted-F antenna) that is stamped and bent by a metal plate. However, as the electronic production is gradually reduced, the design trend is thinner. Regardless of the mobile phone, the two computers: the computer, the hidden structure volume, and the internal space have been greatly reduced, so that the internal components must be relatively reduced in order to respond, so the stereotype of the conventional antenna is occupied. The volume is still too large to be suitable for J, the structure of the electronic product 'based on this, the industry has developed a kind of 溥 film antenna to respond. The antenna structure of the Jinliao film is mainly used in the structure of the electronic product, such as the predetermined substrate circuit board, the casing, etc., through the printing, steaming, kneading-thin layer type antenna structure, thereby making the antenna structure thin. 200941822 . Wide; but the antenna structure, the feed point and the ground of the antenna must be electrically connected to the core and outer conductor of a coaxial line (ie, the feed line) = to facilitate the signal feed when the antenna is sent and received. The connection state is achieved for the stereo antenna. Since the stereo antenna is a metal plate, it can be directly combined with the same (four) wire through soldering and has no damage. However, the film antenna is §, because the film antenna is bonded to the base. The thin layer of the surface of the material has been structurally extremely weak and not resistant to high temperatures. If the combination of the antenna and the coaxial wire is used, the high temperature during welding will cause excessive melting and destruction of the antenna, even indirectly. Base: The substrate is usually a plastic material... Therefore, how to overcome the above-mentioned problem of the difficult film: the line: the coaxial cable, has become an important technology for the relevant industry. Subject. ', 疋 ’ 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对 针对In view of this, the inventor has been engaged in the manufacturing and development of related products for many years. Counting: After the detailed design and careful evaluation of the above objectives, the final inspection is a practical invention. SUMMARY OF THE INVENTION The main purpose of the invention is to provide a thin-film antenna assembly method. The technical feature of the invention solves the problem, and the film antenna assembly #200941822" mainly includes the following structure: an antenna main body, which is built on a substrate, and the antenna portion has a signal connection medium. The combination of the #-side and the feed line, the guide: the two-feed: the line; the other side of the guide packet is combined with the signal connection portion of the antenna body; and in terms of the manufacturing method of the film antenna, The conductive thin layer antenna body pre-joining portion combined in the base portion is combined with the feed line by the conductive medium = ::: state 'this innovative unique design' enables the present invention to achieve the following advantages: Ο The feed line is a conventional structure in which the antenna body is positioned and coupled to the antenna through the conductive medium, and the line is directly soldered to the antenna, thereby providing a combined feed that conforms to the structure of the film antenna. The human-wire combined positioning design ensures that the film antenna structure is protected from damage and at the same time achieves the electrical f-junction state, completely solving the problem of the combination of the antenna and the feeder line, and it has practical progress and industrial utilization benefits. [Embodiment] Please refer to Figs. 1 and 2 for a preferred embodiment of the film antenna of the present invention and a method of manufacturing the same, except that the embodiments are not the same as the Han shots of the i and 2 figures: The deformation, or the shape of the complementary radiation element of Fig. 3 and its kind of deformation, are not limited by the structure in the patent application, and are described first; The invention comprises the following components: a substrate 10, which may be a circuit board or an electronic product housing 200941822. A handle portion or other bracket, a component part, and an antenna body 20' is a conductive thin layer The antenna body 20 has a signal connection portion μ, the signal connection portion 21 includes a signal feed portion 212 and a signal ground portion 211, and a feed line 30 is a coaxial cable. The utility model comprises a core wire 31 and an outer conductor 32 (note. actually includes an intermediate insulating layer, which is omitted in the present invention, and is hereby declared); conductive; I Wu 40, one side of which is combined with the feed line, and The © conductive medium 40 The other side is combined with the signal connecting portion 21 of the antenna main body 20; and the specific configuration of the positioning combining means can be various, which will be described later. According to the above structure, the method for manufacturing the film antenna of the present invention will be described below. Please refer to FIG. 1 , the main core design is: a conductive thin layer antenna body 2 结合 which is bonded to a predetermined portion of the substrate, the antenna The signal connection portion 21 of the main body 2 is formed by the conductive medium 40 and the feed line 30 to form a combination and an electrical connection. The order of the above method may be various, for example, the conductive medium may be made. After the 40 is first combined with the feed line 30, the conductive medium 40 is combined with the signal connection portion 21 of the antenna main body 20. Alternatively, the conductive medium 40 may be first combined with the antenna body 2 after the signal connection portion to re-engage the feed line 30 and the conductive medium 40. Further, the step of forming the antenna body 20 on the substrate 10 It may be the most advanced step, or may be a state in which the conductive medium 40 is combined with the antenna body 20 and then processed. Wherein the antenna body 20 is bonded to the substrate 1 可采用 can be used in the following 8 200941822 - one of which or a combination thereof: printing, evaporation, sputtering, chilling or coating means. In one embodiment, the conductive medium 40 may be a metal (such as a metal plate 'metal ring, a metal dome, etc.), a conductive raft, a fusion material, or any structure type> the conductive medium 40 and the antenna body 2 The positioning and assembling means of the material receiving portion 21 can be achieved by any one of the following configurations or any combination of the following: a twisting element, an elastic element, an inserting element, a pressing element, a bonding agent, and the like. . &lt; The conductive medium 40 and the feed line 30 may be combined by an electrically conductive solder material, an electrically conductive solder material or an electrically conductive glue material. Hereinafter, a specific embodiment of the positioning combination pattern of the conductive medium 4 〇 and the conductive medium rib and the antenna body 20 of the antenna main body 20 is described as follows: As shown in FIGS. 1 and 2, the embodiment The antenna body 2 is in the shape of an electric field type 0 radiant element, and the conductive medium 40 is composed of two metal ring rings 41 and 42. One metal ring 41 is coupled to the core wire 31 of the feed line 30, and the other metal ring 42 is 'The opening is made up of the conductor 32 outside the feed line 3, and the positioning and combination means is achieved by a post 51, 52, which can be a one-piece or a combination of the substrate 1 The two metal ring rings 41 and 42 are respectively arranged by the combination of the two posts 51 and 52 on the signal grounding portion 211 of the signal line connecting portion 21 of the substrate 10 and the signal feeding portion 212. Electrical connection status. The antenna body 20 所示 shown in FIG. 3 is a magnetic field type antenna, which is in the shape of a complementary radiation element, and the positioning combination means of the embodiment is the same as that shown in FIG. 9 200941822, and the gp-like hunting is performed by two-column 51. Go to jl mad 52 to achieve, the details are the same as the first one. In the following embodiments, the feed line 30 is electrically connected to the grounding portion 3311 and the signal feeding portion M2 of the antenna main body 20 by the core wire 31 ^ ¥ 32 and the antenna main body 20 signal connecting portion. - 'The feed line is only 3' - the end point connection status is simplified and indicated. #4, 5, the conductive medium 40 of the present embodiment is a metal plate 43, so that the feed line 30 is soldered to the top surface of the metal plate 43, and the positioning means is provided by the adhesive material 53. When the adhesive material 53 is made of a conductive paste, it can be arranged in the entire area (or partial area) of the metal plate 43 as shown in FIG. 4 to make the metal plate 43 and the antenna main body 2 Achieved electrical connection status. When the adhesive material 53 is a non-conductive glue, it must be applied to a partial area of the bottom surface of the metal plate 43: The bottom of the metal plate 43 is formed to have a direct contact area. The antenna body 20 is in an electrically connected state. As shown in FIG. 6, the conductive medium 4 of the present embodiment is also a metal plate 43, and the positioning and assembly means is achieved by a post 54 which is a substrate 1 In one piece, the metal plate rib is provided with a through hole 44, whereby the through hole 44 of the metal plate 43 can be sleeved on the column %, and the protruding portion of the top end of the post 54 is formed by hot pressing. By expanding the end of the head, the combined state of the metal plate 43 and the antenna body 2 can be positioned. The post may also be a structural type that is separately formed and then inserted into a jack provided in the substrate. The positioning combination means shown in FIG. 7 is achieved by another type of 10 200941822 磕 肷 , , , , , , , , , , , , , , , 嵌 嵌 嵌 541 541 541 541 541 541 541 541 541 541 541 541 541 541 541 The bottom of the abutting plate surface 541 has a fitting leg 542 for inserting and fitting into the predetermined slot 11 of the substrate 1 to achieve a positioning state. As shown in FIG. 8, the conductive medium 4 of the present embodiment is also a metal plate 43, and the positioning and assembly means is achieved by a pressing member 56, which can be a piece. The bottom of the body has a latching groove 561 which can be pressed onto the metal plate 43. The bottom of the clamping element 56 can be coupled to the signal connector 21 of the antenna body (9) by means of an embedded card or a clamping method. . As shown in FIG. 9, the conductive medium of this embodiment is a metal 'tt Μ U 4Γ t . „ . wy ^ ^ ^ 5. 45, the metal dome 45 has a downward direction a % γ γh J ^ n The elastic bending end 451 of the zigzag, the clamping combination means is achieved by a plugging; the sergeant, the 々« 任 狂 术 达成, to make the substrate 1 split into a convex tube portion 11 The plug-in post 57 is inserted tightly to achieve the positioning. As shown in FIG. ίο, the conductive interface f4Q can also be a direct formation of the solder fairy, and the manufacturing method is as shown by the arrow of the figure, and is connected to the feeding line. The core 431 is first combined with a dose-doped solder 46. The solder (10) is initially spherical, and then the solder 46 is stamped in a flat shape, and the solder 4 is soldered in a true, τ-like manner (fixed to the antenna by ultrasonic means) Referring to the structural type shown in FIG. 10 of the foregoing paragraph, the conductive medium 40 of the present invention can be realized in an integral structural form, or for example, a conductive adhesive can be used, and the conductive adhesive can be made of conductive adhesive. Conductivity and adhesion, ... ife &gt;## λ ^ QH with T to achieve the combination of conductive medium 41 and feed line 30, and import - , u electric; 丨 4 〇舆 antenna body 10 3 combined positioning state. 200941822 wherein the conductive medium 40 is coupled to the feed line 30 core line 31 in addition to the welding combination, also can be as u As shown in the figure, a sealing portion 47' is disposed on the top surface of the conductive medium 4 to clamp and position the core wire 31 of the feeding wire 3 to achieve a connection state. 优点 Advantages of the Invention: The present invention mainly uses a medium Positioning combined with the antenna is soldered to the antenna through the conductive medium. It is indeed compatible with the film and the method design, so that the damage of the part can be solved at the same time. The bottom of the film antenna and the better industrial use are ensured by the structure of the feeder body. The innovative and unique design of the conductive line that combines the conductive medium with the conductive medium should be achieved. Since the feed is integrated into the antenna body, it is different from the straight antenna structure type of the feed line, thereby providing a combination of structures. The feed line combined with the structural film antenna structure is protected from the stable electrical connection state of the feed line, and the problem is completely combined. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> The essence of the present invention is changed: the m-line is changed and modified to achieve the purpose of equivalence, and the specification _zhong\"L is covered by the patent scope as described later. 12 200941822 [Simple description of the schema] Fig. 3 is a sectional view showing a combination of the first embodiment of the present invention. Fig. 3 is a view showing an embodiment of the antenna body of the present invention which is a magnetic field type antenna. Fig. 4 is a perspective view showing the combination of the second embodiment of the present invention. Fig. 5 is a sectional view showing the combination of the structure shown in Fig. 4. ❹

第6圖·本發明第三實施例之組合剖視圖。 第7圖·本發明第四實施例之組合剖視圖。 第8圖.本發明第五實施例之組合立體圖。 第9圖·本發明第六實施例之組合立體圖。 第10圖:本發明之導電介質為焊料直接構成之實施例圖。 第11圖:本發明之導電介質藉夹持部結合於饋入線之實施 例圖。 【主要元件符號說明】 基材 10 卡槽 11 凸管部 1 2 天線主體 2 0、2 0 B 訊號連結部 2 1 訊號接地部 2 11 訊號饋入部 2 12 饋入線 3 0 芯線 3 1 外導體 13 200941822 導電介質 4 0 金屬環圈 4 1、4 2 金屬板片 4 3 穿孔 4 4 金屬彈片 4 5 彈性抵壓端 4 5' 1 焊料 4 6 夹持部 4 7 卡柱 5 1 ' 5 2 黏著劑料 5 3 卡柱 5 4 抵靠板面 5 4 1 嵌插腳 5 4 2 擴徑端頭 5 5 壓制元件 5 6 敌卡槽 5 6 1 插接柱 5 7 14Figure 6 is a cross-sectional view showing a combination of a third embodiment of the present invention. Figure 7 is a cross-sectional view showing a combination of a fourth embodiment of the present invention. Fig. 8 is a perspective view showing the combination of the fifth embodiment of the present invention. Fig. 9 is a perspective view showing the combination of the sixth embodiment of the present invention. Fig. 10 is a view showing an embodiment in which the conductive medium of the present invention is directly formed of solder. Fig. 11 is a view showing an embodiment in which the conductive medium of the present invention is bonded to the feed line by the nip portion. [Description of main component symbols] Substrate 10 Card slot 11 Concave tube part 1 2 Antenna main body 2 0, 2 0 B Signal connection part 2 1 Signal grounding part 2 11 Signal feeding part 2 12 Feeding line 3 0 Core line 3 1 Outer conductor 13 200941822 Conductive medium 4 0 Metal ring 4 1、4 2 Metal plate 4 3 Perforation 4 4 Metal dome 4 5 Elastic pressing end 4 5' 1 Solder 4 6 Clamping part 4 7 Post 5 1 ' 5 2 Adhesive Material 5 3 Cartridge 5 4 Abutment plate 5 4 1 Inserting pin 5 4 2 Expanding end 5 5 Pressing element 5 6 Enemy card slot 5 6 1 Plug post 5 7 14

Claims (1)

200941822 十、申請專利範圍: 包括: 種薄膜天線組合構造, 基材; 天線主體’為一導雷键θ 电/專層構造設於基材,所述天線主 體具有訊號連結部; 饋入線; ❹ ❹ 導電介質,其一側係盘扯 你興饋入線結合,導電介質之另側 則必須定位組合於天線 入深主體之訊號連結部。 ‘依據申請專利範圍第] 項所述之薄膜天線組合構造, 中所述導電介質可兔τ 1 了為下述任其中一種結構:金屬、 知接材料、導電膠、熔接材料。 依據申請專利範圍第 # ^ ^ 弟1項所述之薄膜天線組合構造, 其中所述導電介質盥 π法# 貝/、天線主體訊號連接部之定位組合 可為糟由下述任一鐘播#上、 冓成或任一構成組合型態達成: 螺σ 7L件、彈性亓杜、山μ 肷卡70件、壓制元件、黏著劑 料。 依據申請專利範圍第1 項所迷之薄膜天線組合構造, 具中所述導電介皙I 丨貝/、天線主體訊號連接部之定位組合 可為一體結構别態m ;击 生〜、所達成,如採用導電膠。 3=利範圍第1項所述之薄膜天線組合構造, 手段採用心介質與天線主體訊號連接部之定位組合 肷卡元件時,所述喪卡元件可為基材一體成 15 200941822 型者、亦可為單獨製成#組合於基材之結構B ^ 、依射請專利範圍第丨項所述之薄膜天線組合構造, 其中所述導電介質與饋入線可藉由可導電之焊接材料 、可導電之溶接材㈣或可導電之膠合材料相結合。 、依據中請專利範圍第!項所述之薄膜天線組合構造, 其中所述導電介質可設有夹持部,以將饋入線加以夾 持定位達成連結狀態。 、依據中請專利範圍第i項所述之薄膜天線組合構造, 其中所述訊號連結部係包括訊號饋入部以及訊號接地 部。 9、-種薄膜天線製造方法,包含:於基材預定部位所結 合㈣電薄層狀天線主體,該天線主體之訊號連結部 係猎由^ $介質與饋入線達成定位組合及電性連結狀 態。 〇 10、依據申請專利範圍第9項所述之薄膜天線製造方法, /、中所述天線主體結合於基材的方式可採用下述任其 中一種或其組合:印刷、蒸鑛、濺鍍、噴塗或各式塗 佈手段。 11依據申凊專利範圍第9項所述之薄膜天線製造方法, 其中所述導電介質可採用焊接結合方式、失持結合方 式、導電路膠合任其中—種或其組合方式與饋入線達 成結合。 16 200941822 12 13 14 ❹ 15 依據申請專利範圊 1由^弟9項所述之薄膜天線製造方法’ 其中可令所述導電介曾 兩人所 丨貝先與饋入線結合之後,再將導 …組合於天線主體之訊號連結部。 :據申请專利範圍第9項所述之薄膜天線製造方法, 中可令所述導電介質先組合於天線主體訊號連結部 之後’再令饋人線與導電介質進行結合。依據申„月專利乾圍第9項所述之薄膜天線製造方法, 其中所述導電介質於天線主體訊號連結部之結合可採用下述任其中'—種方人 喱万式或其組合:鎖迫定位方式、嵌卡定位方式、壓制定位方式、黏著定位方式。 依據申請專利範圍第9項所述之薄膜天線組合構造, 其中所述訊號連結部係包括訊號饋人部以及訊號接地 部0 〇 17200941822 X. Patent application scope: including: a film antenna antenna assembly structure, a substrate; the antenna body 'is a lightning conductor θ electric/single layer structure is disposed on the substrate, the antenna body has a signal connection portion; a feed line;导电 Conductive medium, one side of which is connected to the wire and the other side of the conductive medium must be positioned and combined with the signal connection part of the antenna into the deep body. According to the film antenna assembly structure described in the above-mentioned patent application scope, the conductive medium can be one of the following structures: metal, a splicing material, a conductive paste, and a splicing material. According to the thin film antenna assembly structure described in claim 1 of the patent application, wherein the conductive medium 盥π method#Bei/, the antenna body signal connection portion can be combined by any of the following clocks# The combination of the upper, the bismuth or any of the constituent forms is achieved: a screw σ 7L piece, an elastic 亓 Du, a mountain μ 肷 card 70 pieces, a pressing element, an adhesive material. According to the film antenna assembly structure disclosed in claim 1 of the patent application, the positioning combination of the conductive interface I and the signal connection portion of the antenna body can be an integral structure m; the hitting~, achieved, If using conductive glue. 3= The combination of the film antenna structure according to Item 1 of the present invention, wherein the card component is combined with the positioning of the core medium and the signal connecting portion of the antenna body, the card component can be integrated into the substrate 15 200941822 type, The film antenna assembly structure of the structure of the invention is the same as that of the invention. The conductive medium and the feed line can be electrically conductive by a conductive material. The dissolved material (4) or the electrically conductive bonding material is combined. According to the scope of the patent in the middle! The thin film antenna assembly structure according to the invention, wherein the conductive medium is provided with a clamping portion for clamping and positioning the feeding line to achieve a connected state. The film antenna assembly structure according to the above-mentioned patent scope, wherein the signal connection portion includes a signal feed portion and a signal ground portion. 9. A method for manufacturing a thin film antenna, comprising: combining (4) an electric thin layered antenna body at a predetermined portion of the substrate, wherein the signal connecting portion of the antenna main body is positioned and combined by the medium and the feeding line to form a positioning combination and an electrical connection state. . The method for manufacturing a film antenna according to claim 9, wherein the antenna body is bonded to the substrate in any one of the following or a combination thereof: printing, steaming, sputtering, Spray or various coating methods. The method for manufacturing a film antenna according to claim 9, wherein the conductive medium can be combined with the feed line by a solder bonding method, a loss-holding combination method, a conductive circuit bonding method, or a combination thereof. 16 200941822 12 13 14 ❹ 15 According to the patent application model 1 by the method of manufacturing the film antenna described in [9], which can make the conductive media have been combined with the feed line first, then ... Combined with the signal connection portion of the antenna body. According to the method of manufacturing a film antenna according to claim 9, the conductive medium is first combined with the antenna main body signal connecting portion, and then the feeding line is combined with the conductive medium. According to the method for manufacturing a film antenna according to the ninth aspect of the invention, wherein the combination of the conductive medium and the signal connection portion of the antenna main body can be any of the following: - a kind of square gel or a combination thereof: a lock The film antenna assembly structure according to claim 9 , wherein the signal connection portion includes a signal feeding portion and a signal ground portion 0 〇 迫 定位 迫 迫 迫 迫 迫 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜17
TW97110382A 2008-03-24 2008-03-24 Thin-film antenna assembly and its manufacturing method TW200941822A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659678B (en) * 2015-09-15 2019-05-11 大陸商東莞錢鋒特殊膠黏製品有限公司 Antenna composite molding structure of mobile electronic device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659678B (en) * 2015-09-15 2019-05-11 大陸商東莞錢鋒特殊膠黏製品有限公司 Antenna composite molding structure of mobile electronic device and manufacturing method thereof

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