WO2008044845A1

WO2008044845A1 - Antenna module, method of forming the same and radio communication terminal comprising the same

Info

Publication number: WO2008044845A1
Application number: PCT/KR2007/004894
Authority: WO
Inventors: Byung Hoon Ryou; Won Mo Sung; Gi Seck Seoung
Original assignee: E.M.W. Antenna Co., Ltd.
Priority date: 2006-10-10
Filing date: 2007-10-08
Publication date: 2008-04-17
Also published as: KR100840514B1; KR20080032485A

Abstract

The present invention relates to an antenna module, in which it enables easy electrical connection to a board, has improved quality and durability, and allows for an active design, and a method of forming the same and a radio communication terminal comprising the same. The antenna module of the present invention includes an antenna pattern, which is formed by forming an activated pattern of a specific shape on a surface of a base frame made of a material, including a laser reactant, using a laser and then metallizing the activated pattern, a terminal portion provided on at least part of the antenna pattern and configured to electrically connect the antenna pattern to a circuit board, and a clamping portion configured to penetrate the base frame on which the antenna pattern is formed and the terminal portion and then clamp the terminal portion on the antenna pattern.

Description

ANTENNA MODULE, METHOD OF FORMING THE SAME AND RADIO COMMUNICATION TERMINAL COMPRISING

THE SAME

Technical Field

[1] The present invention relates to an antenna module, and a method of forming the same and a radio communication terminal comprising the same, and more particularly, to an antenna module which enables easy electrical connection to a board, has improved quality and durability, and allows for an active design, and a method of forming the same and a radio communication terminal comprising the same. Background Art

[2] In general, an antenna is used in mobile communication terminals such as mobile phones. The antenna is mounted inside or outside a body of a terminal and can transmit/receive necessary information to/from external devices wirelessly. In the prior art, for the purpose of smooth wireless communication, a structure has been used in which the antenna is exposed externally, or displaced in such a manner as to be telescoped or stretched, if necessary. However, along with the development of technologies related to the antenna, the antenna is built in the terminal body rather than being exposed externally, and many active researches have been in progress on the an tenna in order for the antenna to perform its own unique function without influencing other internal components.

[3] An example of the antenna built in the terminal body will be described below with reference to FIG. 1.

[4] An injection body 10 can be used as a front housing for protecting the front side of a mobile communication terminal. A minute antenna pattern 11 can be formed on the inside of the injection body 10. The antenna pattern 11 extends up to a front wall and sidewalls on the inside of the injection body 10 and is formed across the surfaces of both walls that are curved with respect to each other, thus forming a three-dimensional structure.

[5] Meanwhile, the injection body 10 is not limited to the front housing, and other components included in the terminal can be used as the injection body 10. Further, the injection body 10 can be formed to have a support of a specific shape such that the antenna pattern 11 can be supported and can have an appropriate positional relationship with a circuit board within the terminal.

[6] The antenna pattern 11 can be made of metal, such as copper (Cu), gold (Au) or nickel (Ni), and contact points 13 for connection to the circuit within the terminal are formed at the ends of the pattern.

[7] In this example, the antenna pattern is formed on the inside of the injection body.

However, the antenna pattern can be formed on both the inside and outside of the injection body as well as the outside of the injection body. Further, the antenna pattern can be formed simply or complicatedly. A micro pattern can also be formed on the surface of the injection body. The antenna pattern 11 can include several metal components that can be formed by plating.

[8] The antenna pattern 11 constructed as above is integrally mounted in the injection body. Several methods for integrally mounting the antenna pattern in a module injection body can be used. For example, after a metal sheet is cut so that it corresponds to the injection body and the antenna pattern, the cut metal sheet can be integrally mounted in the injection body. In particular, in the event that the injection body has a three-dimensional shape not a plane, to mount the antenna pattern in the injection body integrally becomes more complicated and difficult.

[9] In this process, a method such as dual injection double-shot molding and hot stamping can be used. The antenna pattern (that is, a conductor) can be fabricated using a press mold and then coupled to the three-dimensional injection body.

[10] However, a method of separately molding the antenna pattern and the injection body requires a long-term development period, is difficult in small scale production and sample production, and has a lot of difficulties such as an excessive cost according to a design change and limitations of miniaturization.

[11] Thus, in recent years, Laser Direct Structuring (LDS) for forming an accurate pattern and circuits using laser processing and plating has been proposed. In the LDS method, the pattern and circuits can be formed simply by performing laser activation and electroless plating on the injection body. Further, since the pattern is formed by a laser, a micro pattern can be formed.

[12] Above all, the LDS method is advantageous in that a variety of pattern tasks are possible by simply changing program data pertinent to the moving path of a laser radiator without fabricating an additional mold or mask in order to form the pattern. Thus, the antenna pattern can be formed conveniently.

[13] However, if the antenna pattern is formed using the LDS process, it is difficult to electrically connect the antenna pattern and an internal circuit board.

[14] More specifically, the antenna pattern is electrically connected to an internal circuit board using a terminal having a specific shape. If the antenna is formed using the LDS process, bonding is impossible in terms of the characteristic of the injection body. Thus, the terminal and the antenna pattern could not be coupled using the conventional method in structure.

[15] Thus, in order to electrically connect the antenna pattern and the circuit board, a terminal having a C-clip shape, which is fixed to the board using a screw or soldering, must be formed and then connected to the antenna pattern. In this case, there were many limits to the design of the board and the antenna. Disclosure of Invention

Technical Problem

[16] Accordingly, the present invention has been made in view of the above problems occurring in the prior art, and an object of the present invention is to provide an antenna module in which a terminal can be easily coupled on an antenna pattern, making smooth an electrical connection to a board, and a method of forming the same and a radio communication terminal comprising the same.

[17] Another object of the present invention is to provide an antenna module in which it can make hard and fast an electrical connection structure between an antenna pattern and an internal circuit board, thus improving the quality and durability, and a method of forming the same and a radio communication terminal comprising the same.

[18] Still another object of the present invention is to provide an antenna module in which it can improve an electrical connection method of the circuit board and the antenna pattern, enabling an active design, and a method of forming the same and a radio communication terminal comprising the same. Technical Solution

[19] To achieve the above objects, an antenna module according to the present invention includes an antenna pattern, which is formed by forming an activated pattern of a specific shape on a surface of a base frame made of a material, including a laser reactant, using a laser and then metallizing the activated pattern, a terminal portion provided on at least part of the antenna pattern and configured to electrically connect the antenna pattern to a circuit board, and a clamping portion configured to penetrate the base frame on which the antenna pattern is formed and the terminal portion and then clamp the terminal portion on the antenna pattern.

[20] At least part of the clamping portion may be made of a material that can be thermally bonded and clamps the terminal portion on the antenna pattern through thermal bonding.

[21] The clamping portion may include penetration parts penetrating the base frame and the terminal portion, a stopper formed on one side of the penetration parts, and thermally bonded parts formed on the other side of the penetration parts and configured to fix the terminal portion on the antenna pattern through thermal bonding.

[22] The antenna module may further include a conductive layer provided between the antenna pattern and the terminal portion and configured to establish an electrical connection between the antenna pattern and the terminal portion. [23] The conductive layer may include an anisotropic conductive film (ACF).

[24] A reception groove for receiving the clamping portion may be further formed in the base frame, and the antenna pattern may be formed on a surface of the reception groove.

[25] A method of forming an antenna module according to the present invention includes the steps of molding a base frame using a material containing a laser reactant, activating a pattern of a specific shape on a surface of the base frame using a laser, forming an antenna pattern by metallizing the activated pattern, forming through-holes in the base frame on which the antenna pattern is formed, penetrating a clamping portion through the base frame and a terminal portion for an electrical connection of a board, and thermally bonding at least part of a portion of the clamping portion, which penetrates the base frame and the terminal portion, and thus fixing the terminal portion on the antenna pattern.

[26] The method may further include the step of forming a conductive layer between the antenna pattern and the terminal portion so as to establish an electrical connection between the antenna pattern and the terminal portion.

Advantageous Effects

[27] The antenna module constructed as above, and the method of forming the same and the radio communication terminal comprising the same according to the present invention have the following advantages.

[28] First, the present invention includes the clamping portion for fixing the terminal portion on the antenna pattern. Accordingly, there is an advantage in that an electrical connection between the antenna pattern and the circuit board is smooth since the terminal is easily coupled on the antenna pattern.

[29] In particular, since the clamping portion is thermally bonded to the terminal portion, the terminal portion and the antenna pattern can be coupled conveniently.

[30] Second, the antenna pattern and the terminal portion can be fixed firmly by thermally bonding the clamping portion. Thus, an electrical contact between the antenna pattern and the terminal portion during use can be smooth. Accordingly, there is an advantage in that the quality and durability of the antenna module can be improved.

[31] Third, since the terminal portion is directly fixed on the antenna pattern not a circuit board, the antenna module can be used as a general antenna structure and a mold need not to be newly fabricated according to a processing method. Accordingly, there is an advantage in that the antenna module can be designed actively. Brief Description of the Drawings

[32] Further objects and advantages of the invention can be more fully understood from the following detailed description taken in conjunction with the accompanying drawings in which: [33] FIG. 1 is a perspective view showing an internal pattern of a general antenna pattern; [34] FIG. 2 is a view illustrating the composition of a base frame constituting an antenna module according to the present invention; [35] FIG. 3 is a perspective view showing a process of forming an activated pattern on the surface of the base frame;

[36] FIG. 4 is a perspective view showing the antenna pattern formed in the base frame;

[37] FIG. 5 is a dismantled perspective view showing the antenna module according to an embodiment of the present invention;

[38] FIG. 6 is a front perspective view illustrating the coupling state of FIG. 5;

[39] FIG. 7 is a rear perspective view illustrating the coupling state of FIG. 5;

[40] FIG. 8 is a sectional view sequentially showing a process of forming the antenna module of FIG. 5; [41] FIG. 9 is a flowchart illustrating a process of forming the antenna module of FIG. 5; and [42] FIG. 10 is a sectional view showing a modified example of FIG. 5.

Best Mode for Carrying Out the Invention [43] The present invention will now be described in detail in connection with specific embodiments with reference to the accompanying drawings. [44] A process of forming an antenna pattern according to the present invention will be described below with reference to FIGS. 2 to 4. [45] FIG. 2 is a view illustrating the composition of a base frame constituting an antenna module according to the present invention. FIG. 3 is a perspective view showing a process of forming an activated pattern on the surface of the base frame. FIG. 4 is a perspective view showing the antenna pattern formed in the base frame. [46] In an injection body according to the present embodiment, the antenna pattern can be formed by plating and can be simply formed through laser activation and electroless plating. Further, since the pattern is formed using a laser, a micro pattern can be formed. [47] Referring first to FIG. 2, a mixture 20 constituting the base frame is formed using a base polymer 22 and a laser reactant. The laser reactant can include a filler 24 and metal components 26. [48] The base polymer 22 may employ thermoplastic resin, but may also employ several polymers on which plastic injection molding can be performed. For example, the base polymer 22 may employ semi-aromatic polyamide (PA6/6T), thermoplastic ester (PBT, PET), crosslinked Polybutylenterephatalate (PBT), liquid crystal polymer, polycarbonate and so on.

[49] In the plastic injection body, the laser reactant includes heavy metal nuclei. The heavy metal nuclei can be formed by breaking up an organic heavy metal complex on a micro porous surface of the injection body. Further, the heavy metal nuclei can immediately perform a metallization reaction without the need to remove unprocessed portions additionally.

[50] Further, the plastic injection body contains micro porous or micro rough supporting particles combined with the heavy metal nuclei, and a deposited metal conductive path has an excellent adhesive property. For example, at the time of the metallization reaction, copper (Cu) is grown into the aperture, accomplishing firm adherence. Due to this, conductive lines formed in the plastic injection body can guarantee an optimal adherence.

[51] The supporting particles can employ a support for a heavy metal complex, which is resistant to electromagnetic UV radiation. Alternatively, inorganic-mineral supporting particles made of fuming silicic acid or aerogels may also be used. The supporting particles is a mixture of the filler and the metal components, and can be made of fuming silicic acid or aerogels having the BET surface area of 200 D/g.

[52] Further, what the heavy metal complex (that is, the base polymer 22) is combined using the supporting particles can be accomplished by making the supporting particles absorbed by a heavy metal complex solution. The fabricated supporting particles are mixed with a polymer material from which a plastic molding is injected and molded. Alternatively, the supporting particles can be mixed with a binder (in particular, a lacquer) together with the heavy metal complex and then coated on the plastic injection body as a coating material.

[53] The laser reactant includes the filler 24 and the metal components 26. Preferably, an organic metal or heavy metal components may be used as the laser reactant. The laser reactant can experience physical-chemical reactions through a laser and is then separated from an atomic bonding having different metal components, so it can remain in portions through which the laser has passed.

[54] At this time, the base polymer 22 may employ a palladium complex or a heavy metal complex containing palladium. As known in the art, the heavy metal complexes are particularly suitable for minute structuring. Further, since the complexes can be separated without being heated, the material of an action region can be prevented from being melted. Consequently, the edges of a region having separated heavy metal nuclei can be very accurate and sharp and therefore is very advantageous in forming a metallization structure minutely and accurately.

[55] According to another embodiment, the palladium complex can be formed by making palladium diacetate react with an organic complexation agent. As known in the art, a very stable multifunctional chelating agent having several ligand atoms, such as N, O, S or P, in the palladium complex itself, can be used. Alternatively, the multifunctional chelating agent may also be used together with an ionization radical, such as a hydroxyl radical or a carboxyl radical.

[56] In general, it is preferred that the laser reactant itself have non-conductivity and non-catalysis and excellent solubility or distribution in a polymer structure. It is also preferred that the laser reactant itself have thermal endurance and chemical resistance.

[57] After the base polymer 22 is mixed with the laser reactant (that is, the mixture of the filler 24 and the metal components 26), the complex polymer 22 can be provided as a small granule form before being used for injection molding. The small granules in which the components are mixed are switched to a melted state before and after they are entered into a mold for injection molding, and are then used for molding.

[58] The same three-dimensional mold as that of the injection body can be formed through such injection molding. The moldings have a curved structure or a curved portion as complex polymer molding and therefore can have a variety of shapes according to a designer. Further, it is common that the entire complex polymer molding 110 has the components of a complex polymer, but only part of the injection body may have a complex polymer component, if appropriate.

[59] In this structure, a portion comprised of the complex polymer and a portion comprised of a general polymer can be assembled and provided. Alternatively, the portion comprised of the complex polymer can be disposed within the mold and the general polymer can experience dual injection and be then provided.

[60] Referring to FIG. 3, a pattern having a specific shape is formed on the inside of the base frame 100 formed of the mixture 20 using a focused laser. The laser L is moved along a previously programmed pattern path, but can be moved over some periods along the shape and thickness of a pattern or can be moved along a specific path.

[61] When the laser passes through portions that are partially curved or projected and thus formed in a three-dimensional manner, a holder that holds the plastic injection body can be rotated or moved together with the plastic injection body so that the laser can be irradiated on the three-dimensional portion effectively.

[62] The laser L may employ a UV laser, an excimer laser or electromagnetic radiation from an UV radiator. For example, in order to free the micro porous filler particles and separate the heavy metal nuclei, a KrF excimer laser having a wavelength of about 248nm can be used.

[63] The bonding of the atoms combined with the metal components is dissolved on the surface though which the laser L has passed. Surrounding atoms can react with other surrounding components with leaving the metal components through a physical reaction or a chemical reaction. Some atoms can be evaporated and some atoms can be combined with other atoms, thus forming other molecules. In general, some of the components on the surface can be removed through evaporation and only the metal components 102 can remain. The remaining metal components 102 exist on the surface of the pattern formed by the laser or on the inside of the surface thereof, and can function as a seed layer of plating to be described later on.

[64] Meanwhile, the filler 24 constituting the base frame 100 is not dissolved by UV radiation applied to the surface of the injection body. Thus, only part of the base polymer 22 is removed and the filler 24 is exposed, so that the availability of the micro pores that provide adherence can be further enhanced.

[65] The micro porous or micro rough filler 24, which is necessary to attach metal, can be exposed through activation by the laser. The heavy metal nuclei necessary for the metal seed can be exposed through dissolving of the conductive organic heavy metal complex.

[66] A non-conductive organic heavy metal complex may be combined with the micro porous or micro rough filler 24. As electromagnetic UV radiation is selectively applied along the conductive line, the supporting particles can be exposed by partially removing the base polymer 22. As the non-conductive heavy metal complex is broken up, the heavy metal nuclei can be exposed to the outside, so a conductive metal line can be formed by a chemical reduction.

[67] It is advantageous that a metallization reaction by the chemical reduction is performed immediately after electromagnetic UV radiation. UV radiation causes the breakup of the heavy metal complex in a region where the conductive line will be formed. Thus, the heavy metal nuclei can be separated and the conductive line can have a very accurate and sharp contour. Further, it may be advantageous in performing accurate metallization to a necessary thickness when the reactivity of the heavy metal nuclei is high.

[68] The metal components 26 of the laser reactant, including the heavy metal nuclei, are exposed to only some patterns by the laser activation reaction.

[69] Referring to FIG. 4, plating is performed through the medium of the metal components 102 remaining within the pattern. The plating is electroless plating and can be performed using copper (Cu), gold (Au), nickel (Ni) or the like. The metal is grown through the medium of the remaining metal components 102, thus forming the antenna pattern 110. The antenna pattern 110 includes contact points 112 for connecting to an external circuit. The antenna pattern extends from the contact points 112.

[70] The construction of the antenna module according to an embodiment of the present invention is described with reference to FIGS. 5 to 7. [71] FIG. 5 is a dismantled perspective view showing the antenna module according to an embodiment of the present invention. FIG. 6 is a front perspective view illustrating the coupling state of FIG. 5. FIG. 7 is a rear perspective view illustrating the coupling state of FIG. 5.

[72] The antenna module according to the present embodiment basically includes the base frame 100 formed by the above method, and the antenna pattern 110, a terminal portion 130 and a clamping portion 150, which are formed in the base frame 100.

[73] The base frame 100 may have a shape and size in which the antenna pattern 110 and the board within the terminal can be disposed having an appropriate positional relationship, according to the shape, an internal space, etc. of the terminal. The antenna pattern 110 is formed on the surface of the base frame 100, having a specific pattern, through a laser. Though not shown, the antenna pattern 110 may be formed on any surface, such as the front, rear or lateral surface of the base frame 100, and may have an appropriate shape according to a wavelength, a bandwidth, the number of the band, etc. in which the antenna is operated. However, the antenna pattern 110 is basically electrically connected to the contact points 112.

[74] The terminal portion 130 is a constituent element for electrically connecting the antenna pattern 110 to a circuit board 200. The terminal portion 130 has one side touching the antenna pattern 110 on which the processes, such as laser activation and electroless plating, have been performed as described above and the other side touching the circuit board 200, thereby electrically connecting the antenna pattern 110 and the circuit board 200. It has been shown that the terminal portion 130 has two terminals. However, the terminal portion 130 may have one terminal according to the shape of an antenna. For example, when the antenna has an inverse F type, the terminal portion 130 may have two terminals, and when the antenna has an inverse L type, the terminal portion 130 may have one terminal. Furthermore, the number of the contact points 112 may vary according to the shape of an antenna.

[75] The terminal portion 130 is an electrical conductor for electrically connecting the antenna pattern 110 and the circuit board 200. Further, the terminal portion 130 can be formed by several machining processes, but is generally processed by a press process.

[76] Moreover, through-holes 132 are preferably formed in the terminal portion 130 so that the clamping portion 150 can be inserted into the through-holes 132.

[77] Meanwhile, the terminal portion 130 is not coupled to the antenna pattern 110, which is formed by laser activation and electroless plating, in structure. Thus, the present invention further includes the clamping portion 150 for coupling the terminal portion 130 and the antenna pattern 110 while they are electrically connected to each other. [78] The clamping portion 150 clamps the terminal portion 130 on the antenna pattern

110 through the base frame 100 on which the antenna pattern 110 is formed and the terminal portion 130. Further, at least part of the clamping portion 150 is made of material that can be thermally bonded, and functions to clamp the terminal portion 130 on the antenna pattern 110 through thermal bonding.

[79] More specifically, in the present embodiment, the clamping portion 150 includes penetration parts 154 that penetrate the base frame 100 and the terminal portion 130, a stopper 152 formed on one side of the penetration parts 154, and thermally bonded parts 156 formed on the other side of the penetration parts 154.

[80] The stopper 152 has a cross section larger than that of the penetration parts 154, and functions to fix the terminal portion 130 on the antenna pattern 110 together with the thermally bonded parts 156.

[81] Meanwhile, the present embodiment illustrates a structure in which a reception groove 104 (refer to FIG. 8) for receiving the stopper 152 is formed in the base frame 100. The stopper 152 has a quadrilateral plate, but not limited thereto. The stopper 152 may have a variety of shapes. The antenna pattern 110 is also formed on the surface of the reception groove 104, so that the electrical length of the antenna pattern 110 can be extended. In particular, since the stopper 152 of a dielectric material is received in the reception groove 104, there is an effect in that the electrical length of the antenna is extended.

[82] The thermally bonded parts 156 are thermally bonded at specific temperature and pressure, and function to fix the terminal portion 130 on the antenna pattern 110 and also maintain the electrical contact of the terminal portion 130 and the antenna pattern 110.

[83] Thus, the thermally bonded parts 156 are preferably made of material that is thermally bonded easily. Further, the thermally bonded parts 156 may be preferably made of an electrical insulator. The materials may include, for example, polycarbonate (PC).

[84] In the present embodiment, it has been described that the penetration parts 154, the stopper 152 and the thermally bonded parts 156 are integrally formed to constitute the clamping portion 150. However, the penetration parts 154, the stopper 152 and the thermally bonded parts 156 may be fabricated separately and then combined together in order to constitute the clamping portion 150.

[85] Meanwhile, though not shown, a coating layer for protecting the antenna pattern

110 from external scratch, peripheral temperature change, etc. may be formed on the antenna pattern 110 and peripheral portions thereof. The coating layer may be formed from various coating materials that are able to protect the pattern. In general, a UV coating agent can be coated on the antenna pattern 110 and then hardened by exposing it to ultraviolet rays. If the coating layer is employed, the antenna pattern 110 and peripheral portions thereof can be protected and therefore can perform their unique functions according to environment conditions, such as thermal endurance and chemical resistance, which are necessary for products. [86] A method of forming the antenna module according to the present embodiment is described below with reference to FIGS. 8 and 9. [87] FIG. 8 is a sectional view sequentially showing a process of forming the antenna module of FIG. 5. FIG. 9 is a flowchart illustrating a process of forming the antenna module of FIG. 5. [88] The base frame 100 is molded using material including the laser reactant (Sl). At this time, the reception groove 104 is formed in the base frame 100 so that the stopper

152 of the clamping portion 150 can be inserted into the reception groove 104, as shown in FIG. 8(a). [89] The pattern 106 having a specific shape is activated on one side of the base frame

100 using a laser (S3), as shown in FIG. 8(b). The activated pattern is metallized using a laser, thus forming the antenna pattern 110 (S5), as shown in FIG. 8(c). [90] Thereafter, as shown in FIG. 8(d), the through-holes 114 are formed in the base frame 100 in which the antenna pattern 110 is formed so that the clamping portion 150 can be inserted into the through-holes 114 (S7). As shown in FIG. 8(e), the clamping portion 150 penetrates the base frame 100, and the terminal portion 130 for an electrical connection to the board 200 (S9). [91] At this time, the stopper 152 of the clamping portion 150 is received in the reception groove 104. The clamping portion 150 penetrates the through-holes 114 of the base frame 100 and the terminal portion 130 and is thus projected upwardly. [92] Thereafter, as shown in FIG. 8(f), a top end of the clamping portion 150 is thermally bonded, thus forming the thermally bonded parts 156. Thus, the terminal portion 130 is fixed on the antenna pattern 110 (Sl 1). [93] Finally, as shown in FIG. 8(g), the terminal portion 130 touches the board 200, so that the antenna pattern 110 and the board 200 are electrically connected by the terminal portion 130. [94] In this case, the board 200 is generally fixed on the main body of the device in structure in order to maintain a contact with the terminal portion 130. Alternatively, the terminal portion 130 may be fixed on the board 200 using a screw, soldering or the like. [95] A modified example of the antenna module according to the present invention is described below with reference to FIG. 10. [96] A basic construction of the antenna module according to the present modified example is identical to that of the above embodiment. However, in the present embodiment, a conductive layer 170 is further included between the antenna pattern 110 and the terminal portion 130 so that the antenna pattern 110 and the terminal portion 130 are electrically connected to each other more smoothly.

[97] In other words, the conductive layer 170 functions to establish an electrical connection between the antenna pattern 110 and the terminal portion 130. More specifically, in the previous embodiment, the antenna pattern 110 and the terminal portion 130 are brought in contact with each other by mechanical pressure by means of bonding of the clamping portion 150. Thus, the connection state of the antenna pattern 110 and the terminal portion 130 can be varied according to various clearances, which may occur in the fabrication process, such as a variation in the bonding pressure and a surface condition of the terminal portion 130 or the antenna pattern 110. In the present embodiment, the conductive layer 170 is disposed and therefore functions to minimize the influence by the clearances since the conductive layer 170 is closely adhered to the antenna pattern 110 and the terminal portion 130.

[98] The conductive layer 170 may be made of various materials such as an electrical conductor, but may be preferably made of a plastic material for close contact with the antenna pattern 110 and the terminal portion 130. That is, the conductive layer 170 is intervened between the antenna pattern 110 and the terminal portion 130 with flexibility, and then hardened to closely fix them. In the present embodiment, the conductive layer 170 is made of an anisotropic conductive film (ACF) or a conductive adhesive.

[99] The present invention has so far been described in connection with an example in which the antenna module is a mobile phone terminal. However, the present invention is not limited to the above embodiments, but can be applied to various devices requiring communication using an antenna.

[100] Although the specific embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

Claims

[1] An antenna module, comprising: an antenna pattern, which is formed by forming an activated pattern of a specific shape on a surface of a base frame made of a material, including a laser reactant, using a laser and then metallizing the activated pattern; a terminal portion provided on at least part of the antenna pattern and configured to electrically connect the antenna pattern to a circuit board; and a clamping portion configured to penetrate the base frame on which the antenna pattern is formed and the terminal portion and then clamp the terminal portion on the antenna pattern. [2] The antenna module of claim 1, wherein at least part of the clamping portion is made of a material that can be thermally bonded and clamps the terminal portion on the antenna pattern through thermal bonding. [3] The antenna module of claim 2, wherein the clamping portion comprises: penetration parts penetrating the base frame and the terminal portion; a stopper formed on one side of the penetration parts; and thermally bonded parts formed on the other side of the penetration parts and configured to fix the terminal portion on the antenna pattern through thermal bonding. [4] The antenna module of claim 1, further comprising a conductive layer provided between the antenna pattern and the terminal portion and configured to establish an electrical connection between the antenna pattern and the terminal portion. [5] The antenna module of claim 4, wherein the conductive layer includes an anisotropic conductive film (ACF). [6] The antenna module of claim 1, wherein: the base frame has a reception groove formed therein for receiving the clamping portion therein, and the antenna pattern is formed on a surface of the reception groove. [7] A method of forming an antenna module, comprising the steps of: molding a base frame using a material containing a laser reactant; activating a pattern of a specific shape on a surface of the base frame using a laser; forming an antenna pattern by metallizing the activated pattern; forming through-holes in the base frame on which the antenna pattern is formed; penetrating a clamping portion through the base frame and a terminal portion for an electrical connection of a board; and thermally bonding at least part of a portion of the clamping portion, which penetrates the base frame and the terminal portion, and thus fixing the terminal portion on the antenna pattern. [8] The method of claim 7, further comprising the step of forming a conductive layer between the antenna pattern and the terminal portion so as to establish an electrical connection between the antenna pattern and the terminal portion. [9] A radio communication terminal comprising an antenna module according to any one of claims 1 to 6.