KR101651904B1 - Antenna structure - Google Patents

Antenna structure Download PDF

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Publication number
KR101651904B1
KR101651904B1 KR1020150042230A KR20150042230A KR101651904B1 KR 101651904 B1 KR101651904 B1 KR 101651904B1 KR 1020150042230 A KR1020150042230 A KR 1020150042230A KR 20150042230 A KR20150042230 A KR 20150042230A KR 101651904 B1 KR101651904 B1 KR 101651904B1
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KR
South Korea
Prior art keywords
bracket
side wall
rear cover
coupled
conductive line
Prior art date
Application number
KR1020150042230A
Other languages
Korean (ko)
Inventor
김덕현
김명수
Original Assignee
(주)파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)파트론 filed Critical (주)파트론
Priority to KR1020150042230A priority Critical patent/KR101651904B1/en
Application granted granted Critical
Publication of KR101651904B1 publication Critical patent/KR101651904B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components

Abstract

The present invention relates to an antenna structure capable of guaranteeing sufficient transmission and reception performance even if being installed in an electronic device that is miniaturized and slim. The antenna structure that forms at least a part of a case of an electronic device according to an embodiment of the present invention comprises: a backside cover; a bracket coupled with the backside cover and having a side wall unit extended from a part which is coupled with an edge of the backside cover; a side antenna unit coupled with and surround at least a part of the exterior of the side wall unit of the side wall, and formed with a conductive material; and a conductive line unit coupled with the bracket and extended into the side wall while being electrically connected to the side wall antenna unit.

Description

Antenna structure [0002]

The present invention relates to an antenna structure mounted on an electronic device supporting a wireless communication function.

Electronic devices such as smart phones, tablet computers, portable terminals, and laptop-top computers in recent years often support wireless communication. To this end, the electronic device is equipped with an antenna. Recent electronic devices are supporting not only cellular wireless communication but also various kinds of wireless communication such as Wi-Fi, Bluetooth, NFC, and GPS. For this purpose, it is common that a plurality of antennas are mounted on one electronic device.

On the other hand, electronic devices are being developed in a trend of miniaturization and thinning. However, the antenna must be formed with a certain physical size of the antenna pattern. Therefore, it is very important to appropriately form the antenna for miniaturization and thinning of the electronic device.

Korean Patent Registration No. 10-1101491 (registered on December 26, 2011) discloses an antenna frame structure in which an antenna is embedded in a case of an electronic device to integrally form the antenna. However, there is a problem that it is difficult to elaborate the antenna pattern of the antenna structure having such a structure. In addition, the position within the electronic device in which the antenna can be formed is limited, so that the antenna pattern design is limited.

Recently, as design elements of electronic devices are emphasized, there is an increasing demand for a new type of antenna structure that can be mounted on miniaturized and thinned electronic devices, while not impairing the aesthetics of the appearance of electronic devices.

SUMMARY OF THE INVENTION An object of the present invention is to provide an antenna structure capable of ensuring sufficient transmitting and receiving performance even when mounted on a miniaturized and thinned electronic device.

Another problem to be solved by the present invention is to provide an antenna structure that is mounted on a case of an electronic device and does not impair the aesthetics of the appearance.

Another object of the present invention is to provide an antenna structure capable of achieving a waterproof and dustproof function with a simple structure.

According to an aspect of the present invention, there is provided an antenna structure including at least a part of a case of an electronic device, the structure comprising: a rear cover; a cover coupled to the rear cover; A side antenna part connected to the side wall part at least partly surrounding the outside of the side wall part and formed of an electrically conductive material and connected to the bracket, and in a state of being electrically connected to the side antenna part, And a conductive line portion extending to the inside of the portion.

In one embodiment of the present invention, the side antenna portions may be formed of a plurality of structures separated from each other.

In an embodiment of the present invention, the rear cover may be formed of a conductive material, and the side antenna unit may be spaced apart from the rear cover.

In one embodiment of the present invention, the conductive line portion may be formed of a plating layer bonded to the bracket.

In one embodiment of the present invention, the bracket is formed of a resin material containing a metal compound as an additive, which is initially non-conductive but becomes conductive when a laser is irradiated, and the conductive line portion is a portion of the bracket, As shown in FIG.

In one embodiment of the present invention, the metal compound may have a spinel structure.

In one embodiment of the present invention, the conductive line portion may be formed as a circuit pattern formed on the flexible film.

In one embodiment of the present invention, an opening is formed in the side wall portion, and the conductive line portion may extend from the outside to the inside of the side wall portion through the opening.

In one embodiment of the present invention, the waterproof packing member may further include a watertight sealing member for sealing the opening.

According to an embodiment of the present invention, the bracket may further include a protrusion formed inside the side wall part so as to protrude from the periphery, and the conductive line part may be formed on the upper surface of the protrusion.

In an embodiment of the present invention, a portion of the conductive line portion extending to the inside of the side wall portion may be electrically connected to a transmission line connected to a communication portion of the electronic device.

According to an embodiment of the present invention, the side wall portion may be formed with a groove having a depth corresponding to the thickness of the side antenna portion on the outside, and the side antenna portion may be inserted and coupled into the groove.

According to another aspect of the present invention, there is provided a method of manufacturing an antenna structure including at least a part of a case of an electronic device, the method comprising: providing a rear cover that forms at least a part of a rear surface of the electronic device; Molding a bracket including at least a part of the side wall part formed to extend from a part of the rear cover which is engaged with the rear cover part and engaging with a rim part of the rear cover; Forming a conductive line portion to extend to the inside of the side wall portion, and coupling the side antenna portion to surround at least a part of the outside of the side wall portion, the conductive line portion being electrically connected to the conductive line portion.

According to an embodiment of the present invention, the step of injection-molding the bracket may be performed by injection-molding a metal compound which is initially non-conductive but becomes conductive when a laser is irradiated, with a resin material containing an additive, May include irradiating a portion of the surface of the bracket with a laser beam and immersing at least a portion of the bracket irradiated with the laser beam into the plating solution.

The antenna structure according to an embodiment of the present invention can secure sufficient transmission and reception performance even when mounted on a miniaturized and thinned electronic device.

In addition, the antenna structure according to an embodiment of the present invention may be mounted on a case of an electronic device and may not impair the aesthetics of the appearance.

In addition, the antenna structure according to an embodiment of the present invention can achieve a waterproof and dustproof function with a simple structure.

1 is a perspective view of an antenna structure according to an embodiment of the present invention.
2 is a rear perspective view of an antenna structure according to an embodiment of the present invention.
3 is an exploded perspective view of an antenna structure according to an embodiment of the present invention.
FIG. 4 is an enlarged perspective view of a portion of a bracket that is not coupled with a side antenna in an antenna structure according to an embodiment of the present invention.
5 is an enlarged perspective view of a portion of a bracket in an antenna structure according to another embodiment of the present invention.
6 is a flowchart illustrating a method of manufacturing an antenna structure according to an embodiment of the present invention.
7 is a perspective view illustrating a step of providing a rear cover in a method of manufacturing an antenna structure according to an embodiment of the present invention.
8 is a perspective view illustrating a step of injection-molding a bracket in a method of manufacturing an antenna structure according to an embodiment of the present invention.
9 is a perspective view illustrating a step of forming a conductive line part in the method of manufacturing an antenna structure according to an embodiment of the present invention.
FIG. 10 is a perspective view illustrating a step of joining a side antenna unit in a method of manufacturing an antenna structure according to an embodiment of the present invention. Referring to FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that it is possible to make the gist of the present invention obscure by adding a detailed description of a technique or configuration already known in the field, it is omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express embodiments of the present invention, which may vary depending on the person or custom in the field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, an antenna structure according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4 attached hereto. 1 is a perspective view of an antenna structure according to an embodiment of the present invention. 2 is a rear perspective view of an antenna structure according to an embodiment of the present invention. 3 is an exploded perspective view of an antenna structure according to an embodiment of the present invention. FIG. 4 is a perspective view of a portion of a bracket not coupled to a side antenna portion of an antenna structure according to an exemplary embodiment of the present invention, viewed from the outside of the bracket. FIG. FIG. 5 is a perspective view of a portion of a bracket in an antenna structure according to an embodiment of the present invention, as viewed from the inside of the bracket. FIG.

1 to 5, the antenna structure includes a back cover 100, a bracket 200, a side antenna unit 300, and a conductive line unit 400.

Referring to FIG. 1, the antenna structure may be a structure that forms at least a part of a case of an electronic device. Here, the electronic device may be, for example, a smartphone, a tablet computer, a laptop computer, a media player, a navigation device, a wearable device including a wristwatch, a sound device, and various types of electronic devices Device. The case of the electronic device may have a rear surface opposed to the front surface and the front surface, and a side wall portion connecting the front surface and the rear surface.

The antenna structure shown in Fig. 1 may be a portion that forms at least a part of the back surface and the side wall portion in the case of the electronic device. A front surface disposed to face the rear surface in a state of being spaced apart from the rear surface may be joined later. Here, the front surface may be a display device. Further, the side wall portions may be subsequently joined so as to further extend at one end of the side wall portion 230 of the antenna structure shown in Fig. The electronic device thus has an internal space surrounded at least in part by the antenna structure. And various components are accommodated in such an inner space.

Referring to FIG. 2, the rear cover 100 is a portion forming at least a part of the rear surface of the electronic device. The rear cover 100 may be formed to cover most of the rear surface of the electronic device. As shown in FIG. 1, the rear cover 100 can be coupled with the bracket 200 from the inside. The rear cover 100 may be formed of a metal material, a plastic material, a tempered glass, or a glass fiber material.

Referring to FIG. 3, the bracket 200 is coupled to the inside of the rear cover 100. Specifically, the bracket 200 is formed by injection molding so as to be coupled to the inside of the rear cover 100. More specifically, the back cover 100 may be disposed inside the mold in advance, and the bracket 200 may be formed by injecting plastic resin into the inside of the mold.

The rear cover 100 may have a protrusion 110 for increasing the contact area with the bracket 200 from the inside. The protrusions 110 protrude from the inner side of the rear cover 100 to be engaged with the bracket 200 and are formed so that at least a part thereof is covered by the bracket 200. As a result, the contact area between the rear cover 100 and the bracket 200 increases, and the coupling performance can be improved.

At least a portion of the bracket (200) is engaged with the rim portion of the rear cover (100). And the bracket 200 includes a side wall portion 230 extending from a portion of the rear cover 100 coupled with the rim portion thereof. The side wall portion 230 may extend to a predetermined height. The side wall portion 230 may extend in a direction substantially perpendicular to the rear cover 100. The sidewall portion 230 may form at least a portion of a side surface of the electronic device.

The side antenna portion 300 is a conductive material having a predetermined length extending in a direction surrounding the side wall portion 230. The side antenna unit 300 may include a plurality of structures separated from each other. One side antenna portion 300 structure may function as a radiator of the antenna. Specifically, the structure of one side antenna unit 300 may be formed to have a predetermined length so as to transmit and receive wireless communication signals in a predetermined frequency band. Here, the length may be a length extending in a direction surrounding the side wall portion 230. The structures of the plurality of side antenna units 300 may have different lengths and may be formed to be suitable for transmitting and receiving wireless communication signals of different frequency bands.

The side antenna part 300 surrounds at least part of the outside of the side wall part 230 and is coupled. The plurality of side antenna portions 300 may be disposed to be spaced apart from each other when they are coupled to the side wall portion 230. In addition, the side antenna unit 300 may be coupled to the side wall 230 in a state of being electrically separated from the rear cover 100.

The side wall part 230 may be formed with a coupling part 231 to be coupled to the side antenna part 300, which will be described later. The fastening portion 231 may be a groove 231 formed to be recessed from the outside of the side wall portion 230, for example. The groove 231 may have a depth corresponding to the thickness of the side antenna unit 300 coupled to the coupling unit 230. When the side antenna part 300 is inserted into the groove 231 and the side surface part 230 of the bracket 200 corresponding to the side surface of the electronic device is coupled with the outer surface of the side antenna part 300, . Accordingly, the side wall portion 230 of the bracket 200 and the side antenna portion 300 are combined to minimize the sense of heterogeneity, thereby improving the feel and feel of the entire electronic device.

4 to 5, the conductive line unit 400 is coupled to the bracket 200. [ Specifically, the conductive line part 400 is located in the vicinity of the side wall part 230 of the bracket 200 and the vicinity thereof. The conductive line part 400 may be formed to extend from the outside to the inside of the side wall part 230. The side wall portion 230 may have a through hole 233 communicating from the outside to the inside. The conductive line part 400 is connected from the outside to the inside of the side wall part 230 through the through hole 233.

One end of the conductive line unit 400 on the outer side of the side wall unit 230 is electrically connected to the side antenna unit 300. Specifically, the conductive line unit 400 may be connected to the side antenna unit 300 from the outside of the through-hole 233 of the side wall unit 230. The other end of the conductive line portion 400 extends to the inside in the vicinity of the side wall portion 230. A protrusion 250 protruding from the surrounding portion of the bracket 200 may be formed near the inner side of the side wall 230. At least a portion of the other end of the conductive line portion 400 may be disposed on the protrusion 250.

The conductive line unit 400 may function as an antenna feeding terminal of the structure of the side antenna unit 300 that functions as an antenna radiator. At least two conductive line portions 400 may exist, and at least two conductive line portions 400 may be coupled to the structure of one side antenna portion 300, as the case may be. In this case, one conductive line unit 400 is a positive feeding terminal that is electrically connected to the communication unit of the electronic device, and the other conductive line unit 400 includes an ingressive feeding terminal electrically connected to the ground of the electronic device .

The conductive line portion 400 may be formed of a plating layer bonded to the surface of the bracket 200. Specifically, the conductive line unit 400 of the plating layer may be formed by a selective plating method by LDS (Laser Direct Structuring) method or a selective plating method by double injection of plastic.

Specifically, in order to form a plating layer on the surface of the bracket 200 by the LDS method, the bracket 200 may be formed of a resin material containing an additive. The bracket 200 may be, for example, a resin material containing a metal oxide as an additive. The additive may be a metal oxide that is initially a non-conductive material but has a conductive nature when irradiated with a laser of a particular wavelength or power. The additive may specifically be a metal oxide having a spinel structure or a similar structure. The additive may be, for example, copper spinel chromate (CuCr 2 O 4 ). The additives may be mixed in the resin material at 0.01 to 20% by weight.

When a predetermined region of the surface of the bracket 200 is irradiated with a laser, the metal oxide located in the region irradiated with the laser changes to a conductive property. This means that the area irradiated with the laser is changed into a property to be selectively plated. When such a bracket 200 is immersed in a plating solution, a plating layer is selectively formed only in a region irradiated with a laser. The plating method may be electrolytic plating or non-electrolytic plating. The plated layer is grown around the laser-irradiated metal oxide and tightly bonded to the laser-irradiated surface of the bracket 200.

Specifically, in order to form a plating layer on the surface of the bracket 200 by the plastic double injection method, the bracket 200 is formed of two different plastic resin materials. The portion where the plating layer is to be formed is formed of a material which reacts with an exemplary etching solution, and the other portion is formed of a material which does not react. When the bracket 200 is processed by the above etching solution, only the portion where the plating layer is to be formed is etched. Thereafter, a plating layer is selectively formed only on the portion to be etched through the plating process.

Hereinafter, an antenna structure according to another embodiment of the present invention will be described with reference to FIG. 5 is an enlarged perspective view of a portion of a bracket in an antenna structure according to another embodiment of the present invention.

This other embodiment is characterized in that the bracket 200 and the side antenna portion 300 are hermetically sealed so that the waterproof or dustproof function of the electronic device is achieved is different from the embodiment described with reference to Figs. Do. Therefore, we will focus on this point.

Referring to FIG. 5, the through-hole may be filled with a waterproof packing member and sealed. The waterproof packing member can be applied to seal the through hole at the inside or outside of the through hole. The waterproof packing member may be made of a flexible material such as silicone, epoxy, or rubber and may be in close contact with the inner peripheral surface of the through hole. The inside and outside of the side wall portion of the bracket can be watertightly sealed by the waterproof packing member. Thereby, the waterproof or dustproof function of the electronic device can be achieved. The waterproof packing member 500 may be applied before the side antenna portion is joined to the side wall portion 230 of the bracket 200 or may be applied after the side antenna portion is coupled.

Hereinafter, a method of manufacturing an antenna structure according to another embodiment of the present invention will be described with reference to FIGS. 6 is a flowchart illustrating a method of manufacturing an antenna structure according to an embodiment of the present invention. 7 is a perspective view illustrating a step of providing a rear cover in a method of manufacturing an antenna structure according to an embodiment of the present invention. 8 is a perspective view illustrating a step of injection-molding a bracket in a method of manufacturing an antenna structure according to an embodiment of the present invention. 9 is a perspective view illustrating a step of forming a conductive line part in the method of manufacturing an antenna structure according to an embodiment of the present invention. FIG. 10 is a perspective view illustrating a step of joining a side antenna unit in a method of manufacturing an antenna structure according to an embodiment of the present invention. Referring to FIG.

This another embodiment corresponds to a method of manufacturing the antenna structure of the embodiment described with reference to Figs. Therefore, a description of some of the contents overlapping with those described above will be omitted.

Referring to FIG. 6, a method of manufacturing an antenna structure according to an embodiment of the present invention includes a step S100 of providing a rear cover, a step S200 of injecting a bracket, a step S300 of forming a conductive line, Step S400. The antenna structure thus formed is formed as a structure constituting at least a part of the case of the electronic device.

Referring to Fig. 7, step S100 of providing a rear cover will be described. The back cover 100 is at least a part of the back surface of the electronic device. The rear cover 100 may be formed of a metal plate.

Referring to Fig. 8, description will be made of a step (S200) of injection molding the bracket. The bracket 200 may be injection molded so as to be coupled to the inside of the rear cover 100. Specifically, the bracket 200 can be injection-molded by injecting a resin material into a mold in which the rear cover 100 is disposed in advance.

The bracket 200 may include a side wall portion 230 extending in a portion coupled with a rim portion of the rear cover 100. The side wall portion 230 may extend in a direction substantially perpendicular to the rear cover 100 to form at least a portion of a side surface of the electronic device.

The bracket 200 may be formed of a plastic resin material. Specifically, the bracket 200 may be formed of a plastic resin material including an additive of a metal oxide, which is initially a non-conductive material but has a conductive property when a laser of a specific wavelength or power is irradiated. The metal oxide may be, for example, copper spinel chromate (CuCr 2 O 4 ). The additives may be mixed in the resin material at 0.01 to 20% by weight.

Referring to Fig. 9, description will be made of a step S300 of forming a conductive line portion. The conductive line unit 400 may be coupled to the bracket 200. The conductive line portion 400 may be formed of, for example, a plating layer or a flexible circuit board coupled to the bracket 200.

In the case where the conductive line portion 400 is a plating layer bonded to the bracket 200, the plating layer may be a plating layer formed in the LDS method. Specifically, in order to form the conductive line part 400 by the LDS method, a laser of a specific wavelength or power is irradiated to one area of the bracket 200 on which the conductive line part 400 is to be formed. As a result, the metal oxide located in the region irradiated with the laser changes to a conductive nature. When such a bracket 200 is immersed in a plating solution, a plating layer is selectively formed only in a region irradiated with a laser. The plating method may be electrolytic plating or non-electrolytic plating. The plated layer is grown around the laser-irradiated metal oxide and tightly bonded to the laser-irradiated surface of the bracket 200.

Referring to FIG. 10, the step S400 of joining the side antenna portions will be described. The side antenna unit 300 is a conductive structure extending a predetermined length in a direction surrounding the side wall of the bracket 200. The side antenna portion 300 is coupled to the side wall portion 230 of the bracket 200. As the side antenna unit 300 is coupled to the side wall unit 230, the side antenna unit 300 is electrically connected to one end of the conductive line unit 400. As a result, the side antenna unit 300 can be electrically connected to the inside of the bracket 200 and extended.

The embodiments of the antenna structure of the present invention and the manufacturing method thereof have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

100: Rear cover 200: Bracket
230: side wall portion 231: fastening portion, opening
300: side antenna part 400: conductive line part

Claims (14)

A structure comprising at least a part of a case of an electronic device,
Rear cover;
A bracket coupled to the rear cover and including a side wall portion extending from a portion of the rear cover coupled with the rim portion;
A side antenna part connected to the side wall part to surround at least part of the outside of the side wall part and formed of a conductive material; And
And a conductive line portion coupled to the bracket and extending to the inside of the side wall portion in a state of being electrically connected to the side antenna portion,
The bracket is formed of a resin material containing a metal compound which is initially non-conductive but becomes conductive when a laser is irradiated,
Wherein the conductive line portion is formed of a plating layer bonded to a laser-irradiated portion of the bracket.
A structure comprising at least a part of a case of an electronic device,
Rear cover;
A bracket coupled to the rear cover and including a side wall portion extending from a portion of the rear cover coupled with the rim portion;
A side antenna part connected to the side wall part to surround at least part of the outside of the side wall part and formed of a conductive material; And
And a conductive line portion coupled to the bracket and extending to the inside of the side wall portion in a state of being electrically connected to the side antenna portion,
An opening is formed in the side wall portion,
The conductive line portion extending from the exterior to the interior of the sidewall portion through the opening.
A structure comprising at least a part of a case of an electronic device,
Rear cover;
A bracket coupled to the rear cover and including a side wall portion extending from a portion of the rear cover coupled with the rim portion;
A side antenna part connected to the side wall part to surround at least part of the outside of the side wall part and formed of a conductive material; And
And a conductive line portion coupled to the bracket and extending to the inside of the side wall portion in a state of being electrically connected to the side antenna portion,
Wherein the bracket further includes a protrusion formed inside the side wall portion so as to protrude from the periphery thereof,
Wherein the conductive line portion is formed on an upper surface of the protrusion.
4. The method according to any one of claims 1 to 3,
Wherein the side antenna portions are formed of a plurality of structures separated from each other.
The backlight unit according to any one of claims 1 to 3, wherein the rear cover is formed of a conductive material,
Wherein the side antenna portion is spaced apart from the rear cover.
4. The method according to any one of claims 1 to 3,
Wherein the conductive line portion is formed of a plating layer bonded to the bracket.
The method according to claim 1,
Wherein the metal compound has a spinel structure.
4. The method according to any one of claims 1 to 3,
Wherein the conductive line portion is formed of a circuit pattern formed on the flexible film.
3. The method of claim 2,
And a waterproof packing member sealing the opening watertight.
delete 4. The method according to any one of claims 1 to 3,
And a portion of the conductive line portion extending to the inside of the side wall portion is electrically connected to a transmission line connected to a communication portion of the electronic device.
4. The method according to any one of claims 1 to 3,
Wherein the side wall part is formed with a groove having a depth corresponding to the thickness of the side antenna part,
And the side antenna portion is inserted into the groove.
A method of manufacturing a structure comprising at least a portion of a case of an electronic device,
Providing a rear cover comprising at least a portion of a back surface of the electronic device;
Molding a bracket including at least a part of the bracket coupled to the rear cover and a side wall part extending from a part of the rear cover coupled with the rim of the rear cover;
Forming a conductive line portion coupled to the bracket and extending from the exterior of the sidewall portion to the interior of the sidewall portion; And
And joining the side antenna portion to at least part of the outside of the side wall portion, the side antenna portion being electrically connected to the conductive line portion,
The step of injection-molding the bracket comprises:
Injection molding is performed with a resin material containing an additive as a metal compound which is initially non-conductive but becomes conductive when the laser is irradiated,
Wherein forming the conductive line portion comprises:
Irradiating a part of the surface of the bracket with a laser; And
And immersing at least a portion of the bracket irradiated with the laser in a plating solution.
delete
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WO2018048660A1 (en) 2016-09-06 2018-03-15 Apple Inc. Interlock features of a portable electronic device
CN108759970A (en) * 2018-08-03 2018-11-06 真兰仪表科技有限公司 A kind of Internet of Things gas meter, flow meter antenna holder and its application method
KR102129567B1 (en) * 2019-03-08 2020-07-02 (주)파트론 Electronics device
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WO2020251186A1 (en) * 2019-06-13 2020-12-17 삼성전자 주식회사 Antenna and electronic device comprising same
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KR20120117048A (en) * 2011-04-14 2012-10-24 삼성전자주식회사 Antenna device for portable terminal

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