JP2011155060A - 発光デバイス - Google Patents

発光デバイス Download PDF

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Publication number
JP2011155060A
JP2011155060A JP2010014312A JP2010014312A JP2011155060A JP 2011155060 A JP2011155060 A JP 2011155060A JP 2010014312 A JP2010014312 A JP 2010014312A JP 2010014312 A JP2010014312 A JP 2010014312A JP 2011155060 A JP2011155060 A JP 2011155060A
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting device
scattering structure
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010014312A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011155060A5 (enExample
Inventor
Masahiro Fukuda
福田　　匡広
Nobuhiro Sato
信宏 佐藤
Hiroyuki Tsukada
浩之 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Electronics Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP2010014312A priority Critical patent/JP2011155060A/ja
Publication of JP2011155060A publication Critical patent/JP2011155060A/ja
Publication of JP2011155060A5 publication Critical patent/JP2011155060A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Led Device Packages (AREA)
JP2010014312A 2010-01-26 2010-01-26 発光デバイス Pending JP2011155060A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010014312A JP2011155060A (ja) 2010-01-26 2010-01-26 発光デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010014312A JP2011155060A (ja) 2010-01-26 2010-01-26 発光デバイス

Publications (2)

Publication Number Publication Date
JP2011155060A true JP2011155060A (ja) 2011-08-11
JP2011155060A5 JP2011155060A5 (enExample) 2013-02-07

Family

ID=44540837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010014312A Pending JP2011155060A (ja) 2010-01-26 2010-01-26 発光デバイス

Country Status (1)

Country Link
JP (1) JP2011155060A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013070001A (ja) * 2011-09-26 2013-04-18 Toshiba Lighting & Technology Corp 発光装置及びこれを備えた照明器具
WO2016021132A1 (ja) * 2014-08-04 2016-02-11 パナソニックＩｐマネジメント株式会社 発光装置の製造方法、発光装置、および発光装置の製造装置
US10408391B2 (en) 2016-11-30 2019-09-10 Tactotek Oy Illuminated structure and related method of manufacture
JP2022028040A (ja) * 2013-11-14 2022-02-14 晶元光電股▲ふん▼有限公司 発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006324418A (ja) * 2005-05-18 2006-11-30 Mitsubishi Chemicals Corp 発光装置
WO2009028807A2 (en) * 2007-08-27 2009-03-05 Lg Innotek Co., Ltd Light emitting device package and method for fabricating the same
JP2009158541A (ja) * 2007-12-25 2009-07-16 Citizen Electronics Co Ltd 発光ダイオードの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006324418A (ja) * 2005-05-18 2006-11-30 Mitsubishi Chemicals Corp 発光装置
WO2009028807A2 (en) * 2007-08-27 2009-03-05 Lg Innotek Co., Ltd Light emitting device package and method for fabricating the same
JP2009158541A (ja) * 2007-12-25 2009-07-16 Citizen Electronics Co Ltd 発光ダイオードの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013070001A (ja) * 2011-09-26 2013-04-18 Toshiba Lighting & Technology Corp 発光装置及びこれを備えた照明器具
JP2022028040A (ja) * 2013-11-14 2022-02-14 晶元光電股▲ふん▼有限公司 発光装置
JP7277557B2 (ja) 2013-11-14 2023-05-19 晶元光電股▲ふん▼有限公司 発光装置
WO2016021132A1 (ja) * 2014-08-04 2016-02-11 パナソニックＩｐマネジメント株式会社 発光装置の製造方法、発光装置、および発光装置の製造装置
US10408391B2 (en) 2016-11-30 2019-09-10 Tactotek Oy Illuminated structure and related method of manufacture

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