JP2011146712A - 発光装置のためのパッケージのフレーム - Google Patents
発光装置のためのパッケージのフレーム Download PDFInfo
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- JP2011146712A JP2011146712A JP2011005865A JP2011005865A JP2011146712A JP 2011146712 A JP2011146712 A JP 2011146712A JP 2011005865 A JP2011005865 A JP 2011005865A JP 2011005865 A JP2011005865 A JP 2011005865A JP 2011146712 A JP2011146712 A JP 2011146712A
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- inclined surfaces
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- 239000008393 encapsulating agent Substances 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】発光装置のためのパッケージのフレームは、本体と、カップとを含む。前記本体は、ベースと、それぞれが該ベースから伸びる複数の脚とを備える。前記脚は前記カップから露出しており、該カップは、前記本体に取り付けられており、前記本体を露出させる中空部を備える。前記中空部は、複数の傾斜面の組からなる反射面をもつ側壁を有する。各傾斜面の組は複数の傾斜面からなる。発光素子から放射された光は、前記パッケージの発光効率を向上させるために前記光の再配分効果を生じさせるため、異なる高さにおいて異なる角度で反射される。
【選択図】図1
Description
11 中空部
12、12A、12B、12C 反射面
13、14、13A、14A、131B、141B 傾斜面
20 本体
22 ベース
23 ワイヤ
24 脚
30 発光素子
122、122B、123B、122C、123C 反射セグメント
124 仕切りセグメント
222 チップ取付け面
Claims (11)
- 発光装置のためのパッケージのフレームであって、
ベースと、それぞれが該ベースから隔てられた複数の接続用の脚とを備える本体と、
前記本体に取り付けられたカップであって前記ベースを露出させる中空部を備えるカップとを含み、
前記脚は前記カップから露出しており、前記中空部は側壁を有し、該側壁は、複数の傾斜面の組からなる反射面を有し、各傾斜面の組は複数の傾斜面からなる、発光装置のためのパッケージのフレーム。 - 前記反射面は少なくとも1つの反射セグメントを有し、該反射セグメントは複数の傾斜面の組からなる、請求項1に記載の発光装置のためのパッケージのフレーム。
- 各傾斜面の組は、異なる傾斜角度を有する2つの傾斜面からなる、請求項2に記載の発光装置のためのパッケージのフレーム。
- 前記傾斜面の組の前記傾斜面の前記傾斜角度は前記傾斜面のうち最下方の傾斜面から最上方の傾斜面に向けて漸増している、請求項3に記載の発光装置のためのパッケージのフレーム。
- 前記傾斜面の組の前記傾斜面の前記傾斜角度は前記傾斜面のうち最下方の傾斜面から最上方の傾斜面に向けて漸減している、請求項3に記載の発光装置のためのパッケージのフレーム。
- 前記反射セグメントの前記傾斜面の前記傾斜角度は異なる、請求項4又は5に記載の発光装置のためのパッケージのフレーム。
- 前記反射セグメントの前記傾斜面は前記反射面の周方向の全体に存在する、請求項6に記載の発光装置のためのパッケージのフレーム。
- 前記反射面は、隣接する2つの反射セグメントの間に平坦な面からなる仕切りセグメントを形成するため、間隔を置かれた複数の反射セグメントを有する、請求項6に記載の発光装置のためのパッケージのフレーム。
- 各傾斜面の組の隣接する2つの傾斜面は、前記隣接する2つの傾斜面の傾斜角度の比により定義される角度差を有し、該角度差は1ないし5である、請求項1ないし5のいずれか1項に記載の発光装置のためのパッケージのフレーム。
- 前記本体の前記ベースに取り付けられ、前記脚に電気的に接続された少なくとも1つの発光素子と、
前記カップの前記中空部に満たされ、前記発光素子を封入する封入材とを含む、請求項1ないし5のいずれか1項に記載の発光装置のためのパッケージのフレーム。 - 各傾斜面の組の隣接する2つの傾斜面は、前記隣接する2つの傾斜面の傾斜角度の比により定義される角度差を有し、該角度差は1ないし5である、請求項10に記載の発光装置のためのパッケージのフレーム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99101204A TWI383522B (zh) | 2009-12-29 | 2010-01-18 | Light - emitting device package bracket structure and package module |
TW099101204 | 2010-01-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011146712A true JP2011146712A (ja) | 2011-07-28 |
Family
ID=44461233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011005865A Pending JP2011146712A (ja) | 2010-01-18 | 2011-01-14 | 発光装置のためのパッケージのフレーム |
Country Status (2)
Country | Link |
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JP (1) | JP2011146712A (ja) |
KR (1) | KR101245715B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150340576A1 (en) * | 2012-06-29 | 2015-11-26 | Sharp Kabushiki Kaisha | Light-emitting device, illumination device and backlight for display device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102086359B1 (ko) * | 2013-08-23 | 2020-03-10 | 삼성전자주식회사 | 발광모듈 |
KR102632274B1 (ko) * | 2016-10-31 | 2024-02-05 | 주식회사 아모센스 | 센서용 발광 다이오드 모듈 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10294495A (ja) * | 1997-04-17 | 1998-11-04 | Matsushita Electron Corp | 電子部品 |
JP2006294804A (ja) * | 2005-04-08 | 2006-10-26 | Sharp Corp | 発光ダイオード |
JP2007157805A (ja) * | 2005-12-01 | 2007-06-21 | Stanley Electric Co Ltd | Ledパッケージ、発光装置及びledパッケージの製造方法 |
JP3134119U (ja) * | 2007-02-02 | 2007-08-02 | 凱鼎科技股▲ふん▼有限公司 | 発光ダイオード |
JP2009087596A (ja) * | 2007-09-28 | 2009-04-23 | Puratekku:Kk | リフレクタ及び照明器具並びに照明モジュール |
WO2009107193A1 (ja) * | 2008-02-25 | 2009-09-03 | テスコ・エコライティング株式会社 | 照明方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311153A (ja) | 2004-04-23 | 2005-11-04 | Harison Toshiba Lighting Corp | 発光素子の外囲器 |
KR101139891B1 (ko) * | 2005-01-31 | 2012-04-27 | 렌슬러 폴리테크닉 인스티튜트 | 확산 반사면을 구비한 발광 다이오드 소자 |
KR200461195Y1 (ko) * | 2007-02-02 | 2012-06-28 | 렉스타 일렉트로닉스 코포레이션 | 발광다이오드 |
KR20090007763U (ko) * | 2008-01-28 | 2009-07-31 | 알티전자 주식회사 | 발광다이오드 패키지 |
-
2011
- 2011-01-13 KR KR1020110003412A patent/KR101245715B1/ko not_active IP Right Cessation
- 2011-01-14 JP JP2011005865A patent/JP2011146712A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10294495A (ja) * | 1997-04-17 | 1998-11-04 | Matsushita Electron Corp | 電子部品 |
JP2006294804A (ja) * | 2005-04-08 | 2006-10-26 | Sharp Corp | 発光ダイオード |
JP2007157805A (ja) * | 2005-12-01 | 2007-06-21 | Stanley Electric Co Ltd | Ledパッケージ、発光装置及びledパッケージの製造方法 |
JP3134119U (ja) * | 2007-02-02 | 2007-08-02 | 凱鼎科技股▲ふん▼有限公司 | 発光ダイオード |
JP2009087596A (ja) * | 2007-09-28 | 2009-04-23 | Puratekku:Kk | リフレクタ及び照明器具並びに照明モジュール |
WO2009107193A1 (ja) * | 2008-02-25 | 2009-09-03 | テスコ・エコライティング株式会社 | 照明方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150340576A1 (en) * | 2012-06-29 | 2015-11-26 | Sharp Kabushiki Kaisha | Light-emitting device, illumination device and backlight for display device |
US9680076B2 (en) * | 2012-06-29 | 2017-06-13 | Sharp Kabushiki Kaisha | Light-emitting device, illumination device and backlight for display device |
Also Published As
Publication number | Publication date |
---|---|
KR20110084830A (ko) | 2011-07-26 |
KR101245715B1 (ko) | 2013-03-25 |
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