JP2011143537A5 - - Google Patents

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Publication number
JP2011143537A5
JP2011143537A5 JP2011062864A JP2011062864A JP2011143537A5 JP 2011143537 A5 JP2011143537 A5 JP 2011143537A5 JP 2011062864 A JP2011062864 A JP 2011062864A JP 2011062864 A JP2011062864 A JP 2011062864A JP 2011143537 A5 JP2011143537 A5 JP 2011143537A5
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JP
Japan
Prior art keywords
polishing apparatus
ring
polishing
cylinder
ring member
Prior art date
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Application number
JP2011062864A
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English (en)
Japanese (ja)
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JP5291746B2 (ja
JP2011143537A (ja
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Priority to JP2011062864A priority Critical patent/JP5291746B2/ja
Priority claimed from JP2011062864A external-priority patent/JP5291746B2/ja
Publication of JP2011143537A publication Critical patent/JP2011143537A/ja
Publication of JP2011143537A5 publication Critical patent/JP2011143537A5/ja
Application granted granted Critical
Publication of JP5291746B2 publication Critical patent/JP5291746B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2011062864A 2011-03-22 2011-03-22 研磨装置 Expired - Lifetime JP5291746B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011062864A JP5291746B2 (ja) 2011-03-22 2011-03-22 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011062864A JP5291746B2 (ja) 2011-03-22 2011-03-22 研磨装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005079166A Division JP4817687B2 (ja) 2004-11-01 2005-03-18 研磨装置

Publications (3)

Publication Number Publication Date
JP2011143537A JP2011143537A (ja) 2011-07-28
JP2011143537A5 true JP2011143537A5 (enExample) 2013-03-28
JP5291746B2 JP5291746B2 (ja) 2013-09-18

Family

ID=44458845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011062864A Expired - Lifetime JP5291746B2 (ja) 2011-03-22 2011-03-22 研磨装置

Country Status (1)

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JP (1) JP5291746B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2688712B1 (en) * 2011-03-21 2017-01-04 Lawrence Livermore National Security, LLC Method and system for convergent polishing
JP6074985B2 (ja) 2012-09-28 2017-02-08 ソニー株式会社 半導体装置、固体撮像装置、および半導体装置の製造方法
JP5967044B2 (ja) * 2013-09-19 2016-08-10 信越半導体株式会社 研磨パッドの評価方法及びウェーハの研磨方法
KR102154022B1 (ko) * 2013-12-24 2020-09-09 주식회사 케이씨텍 화학 기계적 연마장치용 캐리어 헤드
JP6250406B2 (ja) 2014-01-15 2017-12-20 株式会社荏原製作所 基板処理装置の異常検出装置、及び基板処理装置
JP6234325B2 (ja) 2014-05-23 2017-11-22 株式会社荏原製作所 圧力校正用治具、及び、基板処理装置
JP6454199B2 (ja) * 2015-03-25 2019-01-16 株式会社荏原製作所 圧力校正用治具、及び、基板処理装置
JP2025518293A (ja) * 2022-06-03 2025-06-12 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ保持リングの音響モニタリング

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP2001277098A (ja) * 2000-03-29 2001-10-09 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
CN1655906A (zh) * 2000-08-22 2005-08-17 兰姆研究有限公司 控制作为抛光头和半导体衬底之间的重叠面积的函数的抛光压力的抛光设备和方法
JP2002170794A (ja) * 2000-12-04 2002-06-14 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2002187061A (ja) * 2000-12-22 2002-07-02 Matsushita Electric Ind Co Ltd 研磨温度測定方法、研磨方法、ワーク保持機構および研磨装置

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