JP2011143537A5 - - Google Patents
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- Publication number
- JP2011143537A5 JP2011143537A5 JP2011062864A JP2011062864A JP2011143537A5 JP 2011143537 A5 JP2011143537 A5 JP 2011143537A5 JP 2011062864 A JP2011062864 A JP 2011062864A JP 2011062864 A JP2011062864 A JP 2011062864A JP 2011143537 A5 JP2011143537 A5 JP 2011143537A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing apparatus
- ring
- polishing
- cylinder
- ring member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011062864A JP5291746B2 (ja) | 2011-03-22 | 2011-03-22 | 研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011062864A JP5291746B2 (ja) | 2011-03-22 | 2011-03-22 | 研磨装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005079166A Division JP4817687B2 (ja) | 2004-11-01 | 2005-03-18 | 研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011143537A JP2011143537A (ja) | 2011-07-28 |
| JP2011143537A5 true JP2011143537A5 (cg-RX-API-DMAC7.html) | 2013-03-28 |
| JP5291746B2 JP5291746B2 (ja) | 2013-09-18 |
Family
ID=44458845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011062864A Expired - Lifetime JP5291746B2 (ja) | 2011-03-22 | 2011-03-22 | 研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5291746B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5968418B2 (ja) * | 2011-03-21 | 2016-08-10 | ローレンス リバモア ナショナル セキュリティー， エルエルシー | コンバージェント研磨方法およびコンバージェント研磨システム |
| JP6074985B2 (ja) | 2012-09-28 | 2017-02-08 | ソニー株式会社 | 半導体装置、固体撮像装置、および半導体装置の製造方法 |
| JP5967044B2 (ja) * | 2013-09-19 | 2016-08-10 | 信越半導体株式会社 | 研磨パッドの評価方法及びウェーハの研磨方法 |
| KR102154022B1 (ko) * | 2013-12-24 | 2020-09-09 | 주식회사 케이씨텍 | 화학 기계적 연마장치용 캐리어 헤드 |
| JP6250406B2 (ja) | 2014-01-15 | 2017-12-20 | 株式会社荏原製作所 | 基板処理装置の異常検出装置、及び基板処理装置 |
| JP6234325B2 (ja) | 2014-05-23 | 2017-11-22 | 株式会社荏原製作所 | 圧力校正用治具、及び、基板処理装置 |
| JP6454199B2 (ja) * | 2015-03-25 | 2019-01-16 | 株式会社荏原製作所 | 圧力校正用治具、及び、基板処理装置 |
| WO2023234973A1 (en) * | 2022-06-03 | 2023-12-07 | Applied Materials, Inc. | Acoustic monitoring of cmp retaining ring |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
| US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
| JP2001277098A (ja) * | 2000-03-29 | 2001-10-09 | Matsushita Electric Ind Co Ltd | 研磨装置および研磨方法 |
| TW570860B (en) * | 2000-08-22 | 2004-01-11 | Lam Res Corp | Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head |
| JP2002170794A (ja) * | 2000-12-04 | 2002-06-14 | Tokyo Seimitsu Co Ltd | ウェーハ研磨装置 |
| JP2002187061A (ja) * | 2000-12-22 | 2002-07-02 | Matsushita Electric Ind Co Ltd | 研磨温度測定方法、研磨方法、ワーク保持機構および研磨装置 |
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2011
- 2011-03-22 JP JP2011062864A patent/JP5291746B2/ja not_active Expired - Lifetime