JP2011129886A - 軟性回路基板の部品実装構造及びその実装方法 - Google Patents

軟性回路基板の部品実装構造及びその実装方法 Download PDF

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Publication number
JP2011129886A
JP2011129886A JP2010240909A JP2010240909A JP2011129886A JP 2011129886 A JP2011129886 A JP 2011129886A JP 2010240909 A JP2010240909 A JP 2010240909A JP 2010240909 A JP2010240909 A JP 2010240909A JP 2011129886 A JP2011129886 A JP 2011129886A
Authority
JP
Japan
Prior art keywords
component
circuit board
flexible circuit
plating layer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010240909A
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English (en)
Japanese (ja)
Inventor
Hyeon U Kim
キム、ヒョン−ウ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FLEXCOM Inc
Original Assignee
FLEXCOM Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FLEXCOM Inc filed Critical FLEXCOM Inc
Publication of JP2011129886A publication Critical patent/JP2011129886A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2010240909A 2009-12-17 2010-10-27 軟性回路基板の部品実装構造及びその実装方法 Pending JP2011129886A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0126189 2009-12-17
KR1020090126189A KR100961272B1 (ko) 2009-12-17 2009-12-17 연성회로기판의 부품 실장구조 및 그 실장방법

Publications (1)

Publication Number Publication Date
JP2011129886A true JP2011129886A (ja) 2011-06-30

Family

ID=42369569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010240909A Pending JP2011129886A (ja) 2009-12-17 2010-10-27 軟性回路基板の部品実装構造及びその実装方法

Country Status (3)

Country Link
JP (1) JP2011129886A (ko)
KR (1) KR100961272B1 (ko)
CN (1) CN102105019A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101582548B1 (ko) * 2012-11-21 2016-01-05 해성디에스 주식회사 인터포져 제조 방법 및 이를 이용한 반도체 패키지 제조 방법
KR101991922B1 (ko) * 2017-04-28 2019-06-21 주식회사 진영알앤에스 금 적층 구리 필름 및 그 제조 방법
US20230038731A1 (en) * 2020-03-27 2023-02-09 Avary Holding (Shenzhen) Co., Limited. Covering film, and circuit board and manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352049A (ja) * 2005-06-20 2006-12-28 Sumitomo Bakelite Co Ltd 回路基板
JP2008042145A (ja) * 2006-08-10 2008-02-21 Toshiba Corp プリント配線板、機器ユニットおよび電子機器
JP2009200113A (ja) * 2008-02-19 2009-09-03 Nitto Denko Corp シールド配線回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100608A (ja) 2004-09-30 2006-04-13 Aica Kogyo Co Ltd 多層プリント配線板
JP2009026898A (ja) 2007-07-18 2009-02-05 Daisho Denshi:Kk 多層プリント配線板の製造方法、多層プリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352049A (ja) * 2005-06-20 2006-12-28 Sumitomo Bakelite Co Ltd 回路基板
JP2008042145A (ja) * 2006-08-10 2008-02-21 Toshiba Corp プリント配線板、機器ユニットおよび電子機器
JP2009200113A (ja) * 2008-02-19 2009-09-03 Nitto Denko Corp シールド配線回路基板

Also Published As

Publication number Publication date
CN102105019A (zh) 2011-06-22
KR100961272B1 (ko) 2010-06-03

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