JP2011129886A - Mounting structure and mounting method of parts on flexible printed circuit board - Google Patents

Mounting structure and mounting method of parts on flexible printed circuit board Download PDF

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JP2011129886A
JP2011129886A JP2010240909A JP2010240909A JP2011129886A JP 2011129886 A JP2011129886 A JP 2011129886A JP 2010240909 A JP2010240909 A JP 2010240909A JP 2010240909 A JP2010240909 A JP 2010240909A JP 2011129886 A JP2011129886 A JP 2011129886A
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component
circuit board
flexible circuit
plating layer
region
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Hyeon U Kim
キム、ヒョン−ウ
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FLEXCOM Inc
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FLEXCOM Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a part-mounting structure and a method thereof to securely reinforce the component region of a flexible printed circuit board. <P>SOLUTION: A top gold plating layer 122 and solder 140 are laminated in order on the upper surface of an opening of a top coverlay 110 in a region wherein a component 142 is electrically connected to the top surface of a signal line, and further the component is coupled to the solder, further, a bottom gold plating layer 120 is formed on the bottom surface of an opening of a bottom coverlay 100 in a ground region of the component region, and a conductive tape 130 and conductive metal 132 are laminated in order on the bottom surface of the bottom coverlay and bottom gold plating layer in the component region. The conductive tape and conductive metal are laminated to be electrically connected for reinforcement, so the resistance value of a ground part of the flexible printed circuit board is made smaller while solidity of a component mounting surface is maintained. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、軟性回路基板(FPCB)の部品実装構造及びその実装方法に関するものであって、特に、軟性回路基板上に実装された部品の軟性回路基板の反対面の部品領域に伝導性テープ及び伝導性金属をグラウンドと電気的に通じるように積層して部品領域の軟性回路基板が堅固に補強されるようにするための軟性回路基板の部品実装構造及びその実装方法に関する。   The present invention relates to a component mounting structure of a flexible circuit board (FPCB) and a mounting method thereof, and in particular, a conductive tape and a conductive tape on a component area on the opposite side of the flexible circuit board of a component mounted on the flexible circuit board. The present invention relates to a component mounting structure of a flexible circuit board and a mounting method thereof for stacking conductive metals in electrical communication with ground so that the flexible circuit board in the component region is firmly reinforced.

軟性回路基板は柔軟に曲がる銅箔(銅膜)を張った回路基板の原板であって、軟性回路基板の特定領域には所定の部品が実装される。この時、部品が実装される軟性回路基板領域の堅固さを補強しなければならない。これと関連して、従来の技術により部品が実装される軟性回路基板領域の堅固さを補強する例を見れば次の通りである。   The flexible circuit board is an original board of a circuit board on which a copper foil (copper film) that is flexibly bent is stretched, and predetermined components are mounted on specific areas of the flexible circuit board. At this time, it is necessary to reinforce the rigidity of the flexible circuit board area on which the component is mounted. In relation to this, an example of reinforcing the firmness of the flexible circuit board area on which components are mounted by the conventional technique is as follows.

まず、部品が実装される軟性回路基板領域の堅固さを補強するために用いられる補強材としてＣＥＭ３及びＦＲ−４などのガラス繊維が織造されたベースにレジンを含浸させて硬化させた資材を主に用いる。このような補強材を軟性回路基板上に実装された部品の軟性回路基板の反対面の部品領域に熱硬化性テープを利用して取り付ける。   First, as a reinforcing material used to reinforce the firmness of the flexible circuit board region on which the components are mounted, a material obtained by impregnating a resin into a base woven with glass fibers such as CEM3 and FR-4 and curing it is mainly used. Used for. Such a reinforcing material is attached to a component region on the opposite surface of the component mounted on the flexible circuit board using a thermosetting tape.

しかし、このような従来の技術にあっては軟性回路基板のグラウンド体積が比較的小さいため、グラウンド部分の抵抗値が比較的大きくなって軟性回路基板を通じる信号の強さを弱化させる欠点がある。また、軟性回路基板のグラウンド体積が比較的小さいため、グラウンドに電磁気波が浸透して軟性回路基板を通じる信号にノイズを誘発させる問題点もある。このような電磁気波の浸透問題を解決するために軟性回路基板の両面に別途のシールドフィルムを取り付ける工程をさらに遂行する煩わしいことがある。   However, in such a conventional technique, since the ground volume of the flexible circuit board is relatively small, the resistance value of the ground part is relatively large, and the strength of the signal passing through the flexible circuit board is weakened. . In addition, since the ground volume of the flexible circuit board is relatively small, there is a problem that electromagnetic waves penetrate into the ground and induce noise in the signal passing through the flexible circuit board. In order to solve the electromagnetic wave penetration problem, it may be troublesome to further perform a process of attaching separate shield films on both sides of the flexible circuit board.

特開２００６−１４７８８１号公報JP 2006-147881 A 特開２００７−３３５４５５号公報JP 2007-335455 A

本発明は、前述した課題を解決するために案出したものであって、軟性回路基板上に実装された部品の軟性回路基板の反対面の部品領域に伝導性テープ及び伝導性金属をグラウンドと電気的に通じるように積層して部品領域の軟性回路基板が堅固に補強されるようにするための軟性回路基板の部品実装構造及びその実装方法を提供するのにその目的がある。   The present invention has been devised to solve the above-described problems, and a conductive tape and a conductive metal are grounded on a component region on the opposite side of the flexible circuit board of a component mounted on the flexible circuit board. It is an object of the present invention to provide a component mounting structure of a flexible circuit board and a mounting method thereof, which are laminated so as to be electrically communicated so that the flexible circuit board in the component region is firmly reinforced.

このような目的を達成するために、本発明の一形態によれば、上部カバーレイ及び下部カバーレイの間に信号線がパターニングされた軟性回路基板上の部品領域に部品が実装された構造であって、前記部品が前記信号線の上側表面に電気的に連結される領域の前記上部カバーレイがオープンされ、前記上部カバーレイがオープンされた領域の前記信号線の上側表面に上部金めっき層及び半田が順に積層されて前記部品が前記半田に電気的に連結し、前記部品領域のうちグラウンド領域の前記下部カバーレイがオープンされ、前記下部カバーレイがオープンされた領域の前記信号線の下側表面に下部金めっき層が形成され、前記部品領域の前記下部カバーレイ及び前記下部金めっき層の下側表面に伝導性テープ及び伝導性金属が順に積層されたことを特徴とする。   In order to achieve such an object, according to one aspect of the present invention, a component is mounted on a component region on a flexible circuit board in which signal lines are patterned between an upper cover lay and a lower cover lay. The upper cover lay in an area where the component is electrically connected to the upper surface of the signal line is opened, and an upper gold plating layer is formed on the upper surface of the signal line in the area where the upper cover lay is opened. And the solder are sequentially laminated so that the component is electrically connected to the solder, the lower cover lay in the ground region of the component region is opened, and the lower part of the signal line in the region in which the lower cover lay is opened. A lower gold plating layer is formed on the side surface, and a conductive tape and a conductive metal are sequentially laminated on the lower surface of the lower coverlay and the lower gold plating layer in the component region. And wherein the door.

前記信号線は下部銅箔、絶縁体、及び上部銅箔が順に積層され、前記積層された下部銅箔、絶縁体、及び上部銅箔の上側、下側、左側、右側表面に銅めっき層が形成されたことを特徴とする。   The signal line is formed by sequentially laminating a lower copper foil, an insulator, and an upper copper foil, and a copper plating layer is formed on the upper, lower, left, and right surfaces of the laminated lower copper foil, the insulator, and the upper copper foil. It is formed.

前記伝導性金属はステンレス鋼であることを特徴とする。
本発明の他の形態によれば、上部カバーレイ及び下部カバーレイの間に信号線がパターニングされた軟性回路基板上の部品領域に部品を実装する方法であって、前記部品が前記信号線の上側表面に電気的に連結される領域の前記上部カバーレイ及び前記部品領域のうちグラウンド領域の前記下部カバーレイをオープンする第１工程、前記上部カバーレイがオープンされた領域の前記信号線の上側表面に上部金めっき層を形成し、前記下部カバーレイがオープンされた領域の前記信号線の下側表面に下部金めっき層を形成する第２工程、前記部品領域の前記下部カバーレイ及び前記下部金めっき層の下側表面に伝導性テープ及び伝導性金属を順に積層する第３工程、及び前記部品を前記上部金めっき層に半田を通じて電気的に連結しながら前記軟性回路基板上の部品領域に実装する第４工程を含むことを特徴とする。 The conductive metal is stainless steel.
According to another aspect of the present invention, there is provided a method of mounting a component on a component region on a flexible circuit board in which a signal line is patterned between an upper cover lay and a lower cover lay, wherein the component is connected to the signal line. A first step of opening the upper cover lay in a region electrically connected to the upper surface and the lower cover lay in a ground region of the component region; an upper side of the signal line in the region in which the upper cover lay is opened A second step of forming an upper gold plating layer on the surface and forming a lower gold plating layer on the lower surface of the signal line in the region where the lower cover lay is opened, the lower cover lay and the lower portion of the component region A third step of sequentially laminating a conductive tape and a conductive metal on the lower surface of the gold plating layer; and while electrically connecting the component to the upper gold plating layer through solder Characterized in that it comprises a fourth step of mounting the component regions of the sexual circuit board.

前記信号線は下部銅箔、絶縁体、及び上部銅箔の順に積層され、前記積層された下部銅箔、絶縁体、及び上部銅箔の上側、下側、左側、右側表面に銅めっき層が形成されたことを特徴とする。   The signal lines are laminated in the order of a lower copper foil, an insulator, and an upper copper foil, and a copper plating layer is formed on the upper, lower, left, and right surfaces of the laminated lower copper foil, insulator, and upper copper foil. It is formed.

前記伝導性金属はステンレス鋼であることを特徴とする。   The conductive metal is stainless steel.

本発明は、軟性回路基板上に実装された部品の軟性回路基板の反対面の部品領域に伝導性テープ及び伝導性金属をグラウンドと電気的に通じるように積層して部品領域の軟性回路基板が堅固に補強されるようにするため、部品実装面の堅固さを維持しながら軟性回路基板のグラウンド体積を増加させてグラウンド部分の抵抗値がさらに小さくなって軟性回路基板を通じる信号の強さが弱化されない効果がある。また、軟性回路基板のグラウンド体積が大きいため、グラウンドに電磁気波が浸透できないので、軟性回路基板を通じる信号にノイズが誘発されない長所もある。   According to the present invention, a conductive tape and a conductive metal are laminated on a component region on the opposite side of the flexible circuit substrate of the component mounted on the flexible circuit substrate so as to be in electrical communication with the ground. In order to be firmly reinforced, the ground volume of the flexible circuit board is increased while maintaining the rigidity of the component mounting surface, and the resistance value of the ground portion is further reduced, so that the signal strength through the flexible circuit board is increased. There is an effect that is not weakened. Further, since the ground volume of the flexible circuit board is large, electromagnetic waves cannot penetrate into the ground, and therefore, there is an advantage that noise is not induced in the signal passing through the flexible circuit board.

本発明による軟性回路基板の部品実装方法の一実施例を工程別に示した断面図。Sectional drawing which showed one Example of the component mounting method of the flexible circuit board by this invention according to process. 本発明による軟性回路基板の部品実装方法の一実施例を工程別に示した断面図。Sectional drawing which showed one Example of the component mounting method of the flexible circuit board by this invention according to process. 本発明による軟性回路基板の部品実装方法の一実施例を工程別に示した断面図。Sectional drawing which showed one Example of the component mounting method of the flexible circuit board by this invention according to process. 本発明による軟性回路基板の部品実装方法の一実施例を工程別に示した断面図。Sectional drawing which showed one Example of the component mounting method of the flexible circuit board by this invention according to process. 本発明による軟性回路基板の部品実装方法の一実施例を工程別に示した断面図。Sectional drawing which showed one Example of the component mounting method of the flexible circuit board by this invention according to process.

以下、添付の図面を参照して本発明による実施例を詳細に説明すれば次の通りである。図１ａ〜図１ｅは本発明による軟性回路基板の部品実装方法の一実施例を工程別に示した断面図である。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1a to 1e are cross-sectional views showing one embodiment of a component mounting method for a flexible circuit board according to the present invention.

まず、図１ａのような上部カバーレイ１１０及び下部カバーレイ１００の間に信号線がパターニング軟性回路基板を設ける。この時、信号線は下部銅箔１０２、絶縁体(ポリイミド)１０４、及び上部銅箔１０６が順に積層され、積層された下部銅箔１０２、絶縁体１０４、及び上部銅箔１０６の上側、下側、左側、右側表面に銅めっき層１０８が形成されてなる。   First, a signal line is provided between the upper coverlay 110 and the lower coverlay 100 as shown in FIG. At this time, the lower copper foil 102, the insulator (polyimide) 104, and the upper copper foil 106 are laminated in this order on the signal line, and the upper and lower sides of the laminated lower copper foil 102, the insulator 104, and the upper copper foil 106 are laminated. The copper plating layer 108 is formed on the left and right surfaces.

図１ｂのように部品が信号線の上側表面に電気的に連結される領域の上部カバーレイ１１０及び部品領域のうちグラウンド領域の下部カバーレイ１００をオープンする。
図１ｃのように上部カバーレイ１１０がオープンされた領域の信号線の上側表面に上部金めっき層１２２を形成し、下部カバーレイ１００がオープンされた領域の信号線の下側表面に下部金めっき層１２０を形成する。 As shown in FIG. 1b, the upper cover lay 110 in the region where the component is electrically connected to the upper surface of the signal line and the lower cover lay 100 in the ground region in the component region are opened.
As shown in FIG. 1c, the upper gold plating layer 122 is formed on the upper surface of the signal line in the region where the upper cover lay 110 is opened, and the lower gold plating is formed on the lower surface of the signal line in the region where the lower cover lay 100 is opened. Layer 120 is formed.

図１ｄのように部品領域の下部カバーレイ１００及び下部金めっき層１２０の下側表面に伝導性テープ１３０及び伝導性金属１３２を順に積層する。この時、伝導性金属１３２としてステンレス鋼を用いて伝導性金属１３２の電気的特性を半永久的に向上させる。すなわち、ステンレス鋼はクロムと炭素の他に用途によってニッケル、タングステン、バナジウム、銅、ケイ素などの元素を含有した耐食性鋼鉄であって、さびず薬品にも腐蝕しない。   As shown in FIG. 1d, the conductive tape 130 and the conductive metal 132 are sequentially laminated on the lower surface of the lower cover lay 100 and the lower gold plating layer 120 in the component region. At this time, the electrical characteristics of the conductive metal 132 are semipermanently improved by using stainless steel as the conductive metal 132. That is, stainless steel is a corrosion-resistant steel containing elements such as nickel, tungsten, vanadium, copper, and silicon in addition to chromium and carbon, and does not corrode against rust or chemicals.

図１ｅのように部品１４２を上部金めっき層１２２に半田１４０を通じて電気的に連結しながら軟性回路基板上の部品１４２領域に実装する。
このような本発明は軟性回路基板上に実装された部品１４２の軟性回路基板の反対面の部品１４２領域に伝導性テープ１３０及び伝導性金属１３２をグラウンドと電気的に通じるように積層して部品１４２領域の軟性回路基板が堅固に補強されるようにするため、部品１４２実装面の堅固さを維持しながら軟性回路基板のグラウンド体積を増加させてグラウンド部分の抵抗値がさらに小さくなって軟性回路基板を通じる信号の強さが弱化されない効果がある。 As shown in FIG. 1e, the component 142 is mounted in the region of the component 142 on the flexible circuit board while being electrically connected to the upper gold plating layer 122 through the solder 140.
In the present invention, the conductive tape 130 and the conductive metal 132 are laminated in such a manner that the conductive tape 130 and the conductive metal 132 are electrically connected to the ground in the region of the component 142 on the opposite surface of the flexible circuit board of the component 142 mounted on the flexible circuit board. In order to firmly reinforce the flexible circuit board in the 142 region, the ground volume of the flexible circuit board is increased while maintaining the rigidity of the mounting surface of the component 142, and the resistance value of the ground portion is further reduced, so that the soft circuit There is an effect that the strength of the signal passing through the substrate is not weakened.

また、軟性回路基板のグラウンド体積が大きいため、グラウンドに電磁気波が浸透できなくて軟性回路基板を通じる信号にノイズが誘発されない長所もある。
以上で本発明に対する技術思想を添付図面と共に叙述したが、これは本発明の望ましい実施例を例示的に説明したものであって本発明を限定するのではない。また、この技術分野の通常の知識を有する者であれば誰でも本発明の技術思想の範疇を離脱しない範囲内で多様な変形及び模倣が可能であることは明白な事実である。 In addition, since the ground volume of the flexible circuit board is large, an electromagnetic wave cannot penetrate into the ground, and noise is not induced in a signal passing through the flexible circuit board.
The technical concept of the present invention has been described with reference to the accompanying drawings. However, this is merely illustrative of a preferred embodiment of the present invention and does not limit the present invention. Further, it is obvious that any person having ordinary knowledge in this technical field can make various modifications and imitations without departing from the scope of the technical idea of the present invention.

１００…下部カバーレイ、１０２…下部銅箔、１０４…絶縁体、１０６…上部銅箔、１０８…銅めっき層、１１０…上部カバーレイ、１２０…下部金めっき層、１２２…上部金めっき層、１３０…伝導性テープ、１３２…伝導性金属、１４０…半田、１４２…部品。   DESCRIPTION OF SYMBOLS 100 ... Lower coverlay, 102 ... Lower copper foil, 104 ... Insulator, 106 ... Upper copper foil, 108 ... Copper plating layer, 110 ... Upper coverlay, 120 ... Lower gold plating layer, 122 ... Upper gold plating layer, 130 ... conductive tape, 132 ... conductive metal, 140 ... solder, 142 ... component.

Claims (6)

上部カバーレイ（１１０）及び下部カバーレイ（１００）の間に信号線がパターニングされた軟性回路基板上の部品領域に部品が実装された構造であって、
前記部品が前記信号線の上側表面に電気的に連結される領域の前記上部カバーレイ（１１０）がオープンされ、前記上部カバーレイ（１１０）がオープンされた領域の前記信号線の上側表面に上部金めっき層（１２２）及び半田（１４０）が順に積層され、前記部品が前記半田（１４０）に電気的に連結され、
前記部品領域のうちグラウンド領域の前記下部カバーレイ（１００）がオープンされ、前記下部カバーレイ（１００）がオープンされた領域の前記信号線の下側表面に下部金めっき層（１２０）が形成され、前記部品領域の前記下部カバーレイ（１００）及び前記下部金めっき層（１２０）の下側表面に伝導性テープ（１３０）及び伝導性金属（１３２）が順に積層されたことを特徴とする軟性回路基板の部品実装構造。 A component is mounted on a component region on a flexible circuit board on which signal lines are patterned between an upper cover lay (110) and a lower cover lay (100),
The upper cover lay (110) in an area where the component is electrically connected to the upper surface of the signal line is opened, and the upper cover lay (110) is opened on the upper surface of the signal line in the area where the upper cover lay (110) is opened. A gold plating layer (122) and a solder (140) are sequentially laminated, and the component is electrically connected to the solder (140);
The lower cover lay (100) in the ground area of the component area is opened, and a lower gold plating layer (120) is formed on the lower surface of the signal line in the area where the lower cover lay (100) is opened. A conductive tape (130) and a conductive metal (132) are sequentially laminated on the lower surface of the lower coverlay (100) and the lower gold plating layer (120) in the component region. Circuit board component mounting structure. 前記信号線は下部銅箔（１０２）、絶縁体（１０４）、及び上部銅箔（１０６）が順に積層され、前記積層された下部銅箔（１０２）、絶縁体（１０４）、及び上部銅箔（１０６）の上側、下側、左側、右側表面に銅めっき層（１０８）が形成されたことを特徴とする請求項１に記載の軟性回路基板の部品実装構造。 The signal line is formed by sequentially laminating a lower copper foil (102), an insulator (104), and an upper copper foil (106), and the laminated lower copper foil (102), insulator (104), and upper copper foil. The component mounting structure for a flexible circuit board according to claim 1, wherein copper plating layers (108) are formed on upper, lower, left, and right surfaces of (106). 前記伝導性金属（１３２）はステンレス鋼であることを特徴とする請求項１又は２に記載の軟性回路基板の部品実装構造。 The component mounting structure for a flexible circuit board according to claim 1 or 2, wherein the conductive metal (132) is stainless steel. 上部カバーレイ（１１０）及び下部カバーレイ（１００）の間に信号線がパターニングされた軟性回路基板上の部品領域に部品を実装する方法であって、
前記部品が前記信号線の上側表面に電気的に連結される領域の前記上部カバーレイ（１１０）及び前記部品領域のうちグラウンド領域の前記下部カバーレイ（１００）をオープンする第１工程、
前記上部カバーレイ（１１０）がオープンされた領域の前記信号線の上側表面に上部金めっき層（１２２）を形成し、前記下部カバーレイ（１００）がオープンされた領域の前記信号線の下側表面に下部金めっき層（１２０）を形成する第２工程、
前記部品領域の前記下部カバーレイ（１００）及び前記下部金めっき層（１２０）の下側表面に伝導性テープ（１３０）及び伝導性金属（１３２）を順に積層する第３工程、及び
前記部品を前記上部金めっき層（１２２）に半田（１４０）を通じて電気的に連結しながら前記軟性回路基板上の部品領域に実装する第４工程を含むことを特徴とする軟性回路基板の部品実装方法。 A method of mounting a component in a component region on a flexible circuit board in which signal lines are patterned between an upper coverlay (110) and a lower coverlay (100),
A first step of opening the upper cover lay (110) in a region where the component is electrically connected to the upper surface of the signal line and the lower cover lay (100) in a ground region of the component region;
An upper gold plating layer (122) is formed on the upper surface of the signal line in the area where the upper cover lay (110) is opened, and the lower side of the signal line in the area where the lower cover lay (100) is opened. A second step of forming a lower gold plating layer (120) on the surface;
A third step of sequentially laminating a conductive tape (130) and a conductive metal (132) on the lower surface of the lower cover lay (100) and the lower gold plating layer (120) in the component region; and A component mounting method for a flexible circuit board, comprising: a fourth step of mounting the upper gold plating layer (122) on a component region on the flexible circuit board while being electrically connected to the upper gold plating layer (122) through solder (140). 前記信号線は下部銅箔（１０２）、絶縁体（１０４）、及び上部銅箔（１０６）が順に積層され、前記積層された下部銅箔（１０２）、絶縁体（１０４）、及び上部銅箔（１０６）の上側、下側、左側、右側表面に銅めっき層（１０８）が形成されたことを特徴とする請求項４に記載の軟性回路基板の部品実装方法。 The signal line is formed by sequentially laminating a lower copper foil (102), an insulator (104), and an upper copper foil (106), and the laminated lower copper foil (102), insulator (104), and upper copper foil. The component mounting method for a flexible circuit board according to claim 4, wherein a copper plating layer (108) is formed on the upper, lower, left and right surfaces of (106). 前記伝導性金属（１３２）はステンレス鋼であることを特徴とする請求項４又は５に記載の軟性回路基板の部品実装方法。 The component mounting method for a flexible circuit board according to claim 4 or 5, wherein the conductive metal (132) is stainless steel.
JP2010240909A 2009-12-17 2010-10-27 Mounting structure and mounting method of parts on flexible printed circuit board Pending JP2011129886A (en)

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