JP2011129165A - Touch panel sensor, laminate for creating touch panel sensor, and method for manufacturing the touch panel sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a touch panel sensor of high reliability while reducing the area of a non-active area. <P>SOLUTION: The touch panel sensor 30 includes a transparent base film 32, a transparent conductor 40 provided on one surface 32a of the base film, and an extraction conductor 43 provided on a part of the transparent conductor separated from the base film. The part of the transparent conductor is formed in a linear shape. The extraction conductor is linearly extended on the part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a touch panel sensor, a laminate (blanks) for producing a touch panel sensor, and a method for manufacturing the touch panel sensor.

  Today, touch panel devices are widely used as input means. The touch panel device includes a touch panel sensor, a control circuit that detects a contact position on the touch panel sensor, wiring, and an FPC (flexible printed circuit board). In many cases, the touch panel device is used together with the display device as an input means for various devices including a display device such as a liquid crystal display or a plasma display (for example, a ticket vending machine, an ATM device, a mobile phone, a game machine). ing. In such a device, the touch panel sensor is disposed on the display surface of the display device, thereby enabling the touch panel device to perform a very direct input to the display device. The area | region which faces the display area of the display apparatus among touch panel sensors is transparent, This area | region of a touch panel sensor comes to comprise the active area which can detect a contact position (approach position).

  The touch panel device can be classified into various types based on the principle of detecting a contact position (approach position) on the touch panel sensor. In recent years, capacitive touch panel devices have attracted attention because they are optically bright, have good design properties, have a simple structure, and are superior in function. In a capacitively coupled touch panel device, a strange capacitance is newly generated when an external conductor (typically a finger) whose position is to be detected contacts (approaches) the touch sensor via a dielectric. The position of the object on the touch panel sensor is detected using the change in capacitance. The capacitive coupling method includes a surface type and a projection type. The projection type is attracting attention because it is suitable for multi-touch recognition (multi-point recognition) (for example, Patent Document 1).

  A projected capacitively coupled touch panel sensor includes a dielectric and first and second sensor electrodes formed in different patterns on both sides of the dielectric. Typically, each of the first sensor electrode and the second sensor electrode has conductors arranged in a lattice pattern, and is generated when an external conductor (typically a finger) contacts or approaches the touch panel sensor. The position of the conductor is detected based on an electromagnetic change or a change in capacitance.

  Such a projected capacitive coupling type touch panel sensor generally includes a first base film on which a first sensor electrode is formed and a second base film on which a second sensor electrode is formed. It is produced by bonding with an adhesive layer (for example, Patent Document 2). In the manufactured touch panel sensor, the first sensor electrode and the second sensor electrode are connected to an external control circuit via an extraction wiring (extraction conductor) formed outside the active area of the base film. Is done. When the touch panel device is used together with a display device, the first sensor electrode and the second sensor electrode are formed from a transparent conductive material having a low conductivity (electric conductivity). On the other hand, the extraction wiring arranged outside the active area does not need to be transparent, and is generally formed by printing a metal material having high conductivity on the base film by screen printing. .

Special table 2007-533044 gazette JP-A-4-264613

  By the way, in recent years, for the purpose of improving the design and the purpose of expanding the display area of the display device, it is required to reduce the area called a frame area surrounding the display area. Accordingly, there is a demand for reducing the inactive area other than the active area of the touch panel sensor. This demand can be satisfied if the extraction wiring can be formed in the inactive area with sufficiently high definition. However, with various currently used manufacturing methods (for example, the above-described screen printing), it is not possible to form the extraction wiring in the inactive area with sufficiently high definition.

  In addition, a base film made of a thin film material is deformed by being bent during use. Due to such deformation, the transparent conductor and the extraction conductor may be physically separated from each other, and conduction between the sensor electrode and the extraction wiring may be interrupted.

  The present invention has been made in consideration of such points, and an object thereof is to provide a highly reliable touch panel sensor with a small inactive area. Moreover, an object of this invention is to provide the laminated body for producing such a touch panel sensor, and the manufacturing method of such a touch panel sensor.

  The touch panel sensor according to the present invention includes a transparent base film, a transparent conductor provided on one side of the base film, and a part of the transparent conductor spaced from the base film. And a part of the transparent conductor is formed in a linear shape, and the extraction conductor extends linearly on the part.

  In the touch panel sensor according to the present invention, the extraction conductor may be formed in the same pattern as the partial pattern of the transparent conductor.

  Moreover, the touchscreen sensor by this invention WHEREIN: The said extraction conductor may be formed from the material which has a higher electrical conductivity than the material which makes the said transparent conductor.

  Furthermore, in the touch panel sensor according to the present invention, the extraction conductor may have a light shielding property.

  Furthermore, in the touch panel sensor according to the present invention, the extraction conductor includes an intermediate layer provided on a part of the transparent conductor and spaced apart from the base film, and a highly conductive layer provided on the intermediate layer. May be included. In this case, the highly conductive layer is formed of a material having a higher conductivity than the material forming the transparent conductor and the intermediate layer, and the intermediate layer has an adhesive force with the transparent conductor. It is made of a material larger than the highly conductive layer.

  Furthermore, in the touch panel sensor according to the present invention, the highly conductive layer may be formed of a silver alloy, and the intermediate layer may be formed of a MoNb alloy.

  Furthermore, in the touch panel sensor according to the present invention, the base film includes an active area corresponding to a region where a touch position can be detected, and an inactive area adjacent to the active area, and the take-out conductor is the It may be arranged in an inactive area. In such a touch panel sensor according to the present invention, the transparent conductor is disposed in the active area of the base film and the inactive area of the base film connected to the sensor section. And the extraction conductor may be disposed on the terminal portion of the transparent conductor.

  The method for manufacturing a touch panel sensor according to the present invention includes a transparent base film, a transparent conductive layer provided on one side of the base film, and a coated conductive layer provided on the transparent conductive layer. , A step of forming a photosensitive layer having photosensitivity on the surface of the laminated conductive layer side of the laminate, a step of exposing the photosensitive layer, a step of developing and patterning the photosensitive layer, and a patterning Etching the coated conductive layer using the photosensitive layer as a mask to pattern the coated conductive layer, and etching the transparent conductive layer using the patterned photosensitive layer and the patterned coated conductive layer as a mask. A step of patterning the transparent conductive layer; a step of removing the patterned photosensitive layer; and Forming a photosensitive layer; exposing the additional photosensitive layer; developing and patterning the additional photosensitive layer; and etching the patterned coated conductive layer using the patterned additional photosensitive layer as a mask. And removing a part of the patterned coated conductive layer and removing the further patterned photosensitive layer.

  In the method for manufacturing a touch panel sensor according to the present invention, the covering conductive layer may be formed of a material having a higher conductivity than a material forming the transparent conductive layer.

  The method for manufacturing a touch panel sensor according to the present invention further includes a step of proceeding crystallization of the amorphous transparent conductive layer by performing an annealing process, and the step of proceeding crystallization of the transparent conductive layer includes the step of: It may be performed after the step of patterning the transparent conductive layer and before the step of removing a part of the patterned covered conductive layer. In such a method for manufacturing a touch panel sensor according to the present invention, the covering conductive layer may contain silver as a main component.

  Furthermore, in the method for manufacturing a touch panel sensor according to the present invention, the covering conductive layer may include an intermediate layer provided on the transparent conductive layer and a highly conductive layer provided on the intermediate layer. In this case, the highly conductive layer is formed of a material having a higher conductivity than the material forming the transparent conductor and the intermediate layer, and the intermediate layer has an adhesive force with the transparent conductor. It is made of a material larger than the highly conductive layer.

  Furthermore, in the method for manufacturing a touch panel sensor according to the present invention, the highly conductive layer may be formed of a silver alloy, and the intermediate layer may be formed of a MoNb alloy.

  Furthermore, in the step of patterning the coated conductive layer of the method for manufacturing a touch panel sensor according to the present invention, an alignment mark is formed on the coated conductive layer, and in the step of exposing the further photosensitive layer, the alignment conductive layer is formed on the coated conductive layer. A mask for exposing the further photosensitive layer may be positioned with reference to the alignment mark.

  The laminate according to the present invention is a laminate used for producing a touch panel sensor, and includes a transparent base film, a transparent conductive layer provided on a surface on one side of the base film, And a coated conductive layer provided on the transparent conductive layer.

  In the laminate according to the present invention, the covering conductive layer may be formed of a material having a higher conductivity than a material forming the transparent conductive layer.

  Moreover, the laminated body by this invention WHEREIN: The said covering conductive layer may contain the intermediate | middle layer provided on the said transparent conductive layer, and the highly conductive layer provided on the said intermediate | middle layer. In this case, the highly conductive layer is formed of a material having a higher conductivity than the material forming the transparent conductor and the intermediate layer, and the intermediate layer has an adhesive force with the transparent conductor. It is made of a material larger than the highly conductive layer.

  Furthermore, in the laminate according to the present invention, the highly conductive layer may be formed of a silver alloy, and the intermediate layer may be formed of a MoNb alloy.

FIG. 1 is a diagram for explaining an embodiment according to the present invention, and schematically shows a touch panel device together with a display device. 2 is a cross-sectional view showing the touch panel sensor of the touch panel device of FIG. 1 together with a display device. The cross section shown in FIG. 2 generally corresponds to the cross section taken along the line II-II in FIG. FIG. 3A is a top view showing a touch panel sensor of the touch panel device. 3B is a cross-sectional view taken along line III-III in FIG. 3A. FIG. 4A and FIG. 4B are diagrams showing specific examples of the base film included in the touch panel sensor. FIG. 5A is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5B is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5C is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5D is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5E is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5F is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5G is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5H is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5I is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5J is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5K is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 5L is a diagram for explaining a method of manufacturing the touch panel sensor of FIG. 3. FIG. 6 is a flowchart for explaining a method of manufacturing the touch panel sensor of FIG. FIG. 7 is a diagram for explaining the progress of etching in the step shown in FIG. 5F. FIG. 8A is a diagram corresponding to FIG. 5I (a) and is a diagram for explaining a modification of the manufacturing method of the touch panel sensor. FIG. 8B is a diagram corresponding to FIG. 5J (a) and is a diagram for explaining a modification of the method for manufacturing the touch panel sensor. FIGS. 9A and 9B are diagrams corresponding to FIGS. 5C (a) and 5C (b), respectively, for explaining a modification of the method for manufacturing the touch panel sensor. . FIG. 10 is a view corresponding to FIG. 3 and illustrating a modified example of the transparent conductor. FIG. 11 is a cross-sectional view corresponding to FIG. 3B and showing a conventional touch panel sensor. FIG. 12A is a diagram corresponding to FIG. 3B in the first embodiment, and is a cross-sectional view showing the first extraction conductor in the second embodiment of the present invention, and FIG. ) Is a cross-sectional view showing a second take-out conductor in the second embodiment of the present invention. It is sectional drawing which shows the laminated body in the 2nd Embodiment of this invention.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

  In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

  Further, in the present case, the terms “sheet”, “film”, and “plate” are not distinguished from each other based only on the difference in names. Therefore, for example, a “sheet” is a concept that includes members and portions that can also be called films, plates, and the like.

  FIGS. 1-6 is a figure for demonstrating one Embodiment by this invention. 1 schematically shows the touch panel device together with the display device, FIG. 2 is a cross-sectional view showing the touch panel device of FIG. 1 together with the display device, and FIGS. 3A and 3B show the touch panel sensor of the touch panel device. FIG. 4 is a top view and a cross-sectional view, and FIG. 4 is a diagram for explaining a specific example of a touch panel sensor. 5A to 5L are diagrams for explaining a manufacturing method for manufacturing the touch panel sensor of FIG. 3. FIG. 6 is a flowchart for explaining a method of manufacturing the touch panel sensor of FIG.

  The touch panel device 20 shown in FIGS. 1 to 3B is configured as a projection-type capacitive coupling method, and is configured to be able to detect a contact position of an external conductor (for example, a human finger) to the touch panel device. . In addition, when the detection sensitivity of the capacitively coupled touch panel device 20 is excellent, it is possible to detect which region of the touch panel device the external conductor is approaching just by approaching the external conductor. Can do. Along with such a phenomenon, the “contact position” used here is a concept including an approach position that is not actually in contact but can be detected.

  As shown in FIGS. 1 and 2, the touch panel device 20 is used in combination with a display device (for example, a liquid crystal display device) 15 and constitutes an input / output device 10. The illustrated display device 15 is configured as a flat panel display. The display device 15 includes a display panel 16 having a display surface 16 a and a display control unit 17 connected to the display panel 16. The display panel 16 includes a display area A1 that can display an image, and a non-display area (also referred to as a frame area) A2 that is disposed outside the display area A1 so as to surround the display area A1. . The display control unit 17 processes information regarding the video to be displayed, and drives the display panel 16 based on the video information. The display panel 16 displays a predetermined image on the display surface 16a according to a control signal from the display control unit 17. That is, the display device 15 plays a role as an output device that outputs information such as characters and drawings as video.

  On the other hand, the touch panel device 20 includes a touch panel sensor 30 disposed on the display surface 16 a of the display device 15 and a detection control unit 25 connected to the touch panel sensor 30. As shown in FIG. 2, the touch panel sensor 30 is bonded to the display surface 16 a of the display device 15 via an adhesive layer 19. As described above, the touch panel device 20 is configured as a projected capacitively coupled touch panel device, and plays a role as an input device for inputting information.

  Further, as shown in FIG. 2, the touch panel device 20 further includes a protective cover 12 having translucency that functions as a dielectric on the viewer side of the touch panel sensor 30, that is, the side opposite to the display device 15. Have. The protective cover 12 is bonded onto the touch panel sensor 30 via the adhesive layer 14. The protective cover 12 functions as an input surface (touch surface, contact surface) to the touch panel device 20. That is, information can be input from the outside to the touch panel device 20 by bringing a conductor such as a human finger 5 into contact with the protective cover 12. The protective cover 12 forms the most observer side of the input / output device 10, and also functions as a cover for protecting the touch panel device 20 and the display device 15 from the outside in the input / output device 10.

  In addition, as the adhesive layers 14 and 19 described above, layers made of materials having various adhesive properties can be used. In this specification, “adhesion (layer)” is used as a concept including adhesion (layer).

  The detection control unit 25 of the touch panel device 20 is connected to the touch panel sensor 30 and processes information input via the protective cover 12. Specifically, the detection control unit 25 can specify the contact position of the conductor 5 with the protective cover 12 when the conductor (typically a human finger) 5 is in contact with the protective cover 12. The circuit (detection circuit) comprised in this is included. Further, the detection control unit 25 is connected to the display control unit 17 of the display device 15 and can transmit the processed input information to the display control unit 17. At this time, the display control unit 17 can create video information based on the input information and display a video corresponding to the input information on the display panel 16.

  Note that the terms “capacitive coupling” and “projection type” capacitive coupling have the same meaning as that used in the technical field of touch panels, and are used in this case. The “capacitive coupling” method is also referred to as “capacitance” method or “capacitance coupling” method in the technical field of touch panels. It is treated as a term synonymous with “capacitive coupling” method. A typical capacitively coupled touch panel device includes a conductor layer, and an external conductor (typically a human finger) comes into contact with the touch panel, whereby the external conductor and the conductor layer of the touch panel device are contacted. A capacitor (capacitance) is formed between the two. Based on the change in the electrical state accompanying the formation of the capacitor, the position coordinates of the position where the external conductor is in contact on the touch panel are specified. The “projection type” capacitive coupling method is also referred to as “projection type” capacitive coupling method in the technical field of touch panel, and in this case, the term is synonymous with this “projection type” capacitive coupling method. handle. The “projection type” capacitive coupling method typically includes sensor electrodes arranged in a lattice pattern, and can be contrasted with a “surface type” capacitive coupling method having film-like electrodes.

  2 and 3, the touch panel sensor 30 is provided in a predetermined pattern on the base film 32 and the surface 32a on one side (observer side) of the base film 32. It has the 1st transparent conductor 40, and the 2nd transparent conductor 45 provided with the predetermined pattern on the surface 32b of the other side (the display apparatus 15 side) of the base film 32. FIG. Further, as shown in FIG. 3, the touch panel sensor 30 includes a first take-out conductor 43 provided on a part of the first transparent conductor 40 and a first part provided on a part of the second transparent conductor 45. And a take-out conductor 48.

  The base film 32 functions as a dielectric in the touch panel sensor 20 and can be composed of, for example, a PET film (polyethylene terephthalate film). As shown in FIG. 3, the base film 32 includes an active area Aa1 corresponding to a region where the touch position can be detected, and an inactive area Aa2 adjacent to the active area Aa1. As shown in FIG. 1, the active area Aa1 of the touch panel sensor 30 occupies an area facing the display area A1 of the display device 15. On the other hand, the non-active area Aa2 is formed in a frame shape so as to surround the rectangular active area Aa1 from the four sides. The inactive area Aa2 is formed in a region facing the non-display region A2 of the display device 15.

  On the active area Aa1 of the base film 32, a sensor electrode 37a capable of forming capacitive coupling with the outer conductor 5 is provided. On the other hand, an extraction wiring 37b connected to the sensor electrode 37a is provided on the inactive area Aa2 of the base film 32. The lead-out wiring 37b is electrically connected to the sensor electrode 37a at one end and electrically connected to the detection circuit of the detection control unit 25 configured to detect the contact position of the external conductor with the display surface 12 at the other end. It is connected. In the present embodiment, as shown in FIG. 3, only a part of the first transparent conductor 40 and the second transparent conductor 45 is disposed on the active area Aa1 of the base film 32, and this first A sensor electrode 37 a is formed by a part of the transparent conductor 40 and the second transparent conductor 45. The base film 32, the first transparent conductor 40, and the second transparent conductor 45 have translucency, and the observer observes the image displayed on the display device 15 through these. Can do.

In the present embodiment, the base film 32 is formed by a film as a single body. Here, “single body” means that two or more cannot be separated. Therefore, the film as a single body does not include a joined body of a plurality of films joined through an adhesive layer. On the other hand, a base film including a film main body and a functional film formed on one surface or both surfaces of the film main body so as not to be separated (but can be removed) by sputtering, for example, It corresponds to the film which consists of a single body here.
FIG. 4A and FIG. 4B show an example of a base film composed of a functional film and a film body.

  In the example shown in FIG. 4A, the base film 32 includes a film main body 33 made of resin (for example, PET), and an index matching film 34 formed on one or both surfaces of the film main body 33. Have. The index matching film 34 includes a plurality of high refractive index films 34a and low refractive index films 34b arranged alternately. According to this index matching film 34, even if the refractive index of the film body 33 of the base film 32 and the transparent conductors 40 and 45 are greatly different, the transparent conductors 40 and 45 on the base film 32 are provided. It is possible to prevent the reflectivity from changing greatly between the region where the light is provided and the region where the light is not provided.

  In the example shown in FIG. 4B, the base film 32 includes a film body 33 made of a resin (for example, PET) and a low refractive index film 35 formed on one or both surfaces of the film body 33. And have. According to the low refractive index film 35, the transparent conductors 40, 45 on the base film 32 are formed even if the film body 33 of the base film 32 and the transparent conductors 40, 45 are greatly different in refractive index. It is possible to prevent the spectral characteristics of the transmittance from greatly changing between the provided region and the non-provided region, and to realize uniform transmittance in each wavelength region.

  Next, the first transparent conductor 40 and the second transparent conductor 45 will be further described in detail.

  The first transparent conductor 40 and the second transparent conductor 45 are formed of a conductive material (for example, ITO (indium tin oxide)) so as to detect the contact position of the outer conductor 5 to the protective cover 12. It is electrically connected to the detection circuit of the detection control unit 25 configured as described above. The first transparent conductor 40 is connected to a large number of first sensor parts (first sensor conductors, sensor electrodes) 41 arranged in the active area Aa1 of the base film 32, and the first sensor parts 41, respectively. A plurality of first terminal portions (first terminal conductors) 42 disposed in the inactive area Aa2 of the material film 32. Similarly, the second transparent conductor 45 is provided in each of the second sensor units (second sensor conductors, sensor electrodes) 46 arranged in the active area Aa1 of the base film 32 and each second sensor unit 46. A plurality of second terminal portions (second terminal conductors) 47 that are connected and arranged in the inactive area Aa2 of the base film 32.

  The first sensor portion 41 of the first transparent conductor 40 is arranged in a predetermined pattern on the surface 32 a on one side (observer side) of the base film 32. In addition, the second sensor unit 46 of the second transparent conductor 45 is formed on the surface 32b of the other side of the base film 32 (the display device 15 side) of the first sensor unit 41 of the first transparent conductor 40. They are arranged in a predetermined pattern different from the pattern. More specifically, as shown in FIG. 3, the first sensor portion 41 of the first transparent conductor 40 is configured as a linear conductor arranged in one direction along the film surface of the base film 32. Has been. In addition, the second sensor unit 46 of the second transparent conductor 45 is configured as a linear conductor arranged side by side in the other direction along the film surface of the base film 32 intersecting with the one direction. In the present embodiment, one direction that is the arrangement direction of the first sensor portions 41 and the other direction that is the arrangement direction of the second sensor portions 46 are orthogonal to each other on the film surface of the base film 32.

  As shown in FIG. 3, each of the linear conductors forming the first sensor portion 41 extends linearly in a direction intersecting with the arrangement direction (the one direction). Similarly, each of the linear conductors forming the second sensor unit 46 extends linearly in a direction intersecting with the arrangement direction (the other direction). In particular, in the illustrated example, the first sensor unit 41 extends linearly along a direction (the other direction) orthogonal to the arrangement direction (the one direction), and the second sensor unit 46 is arranged in the arrangement direction. It extends linearly along a direction (the one direction) orthogonal to (the other direction).

In the present embodiment, each first sensor portion 41 includes a line portion 41a extending linearly and a bulging portion 41b bulging from the line portion 41a. In the example illustrated, the line portion 41 a extends linearly along a direction that intersects the arrangement direction of the first sensor portions 41.
The bulging portion 41 b is a portion that bulges from the line portion 41 a along the film surface of the base film 32. Therefore, the width of each first sensor portion 41 is thicker at the portion where the bulging portion 41b is provided. As shown in FIG. 3, in the present embodiment, each first sensor portion 41 has an outer contour that is substantially square in plan view at the bulging portion 41b.

The second sensor unit 46 included in the second transparent conductor 45 is configured similarly to the first sensor unit 41 included in the first transparent conductor 40. That is, each second sensor 46 included in the second transparent conductor 45 has a linearly extending line portion 46a and a bulging portion 46b bulging from the line portion 46a. In the illustrated example, the line portion 46 a extends linearly along a direction that intersects with the arrangement direction of the second sensor portions 46. The bulging portion 46 b is a portion that bulges from the line portion 46 a along the film surface of the base film 32. Therefore, the width of each second sensor portion 46 is thicker at the portion where the bulging portion 46b is provided.
As shown in FIG. 3, in the present embodiment, each second sensor portion 46 has an outer contour that is substantially square in plan view at the bulging portion 46 b.

  As shown in FIG. 3, when observed from the normal direction of the film surface of the base film 32 (that is, in plan view), each first sensor unit 41 included in the first transparent conductor 40 is 2 crosses a large number of second sensor portions 46 included in the transparent conductor 45. As shown in FIG. 3, the bulging portion 41 b of the first transparent conductor 40 is disposed on the first sensor portion 41 between the intersections of two adjacent second sensor portions 46. Similarly, when observed from the normal direction of the film surface of the base film 32, each second sensor unit 46 included in the second transparent conductor 45 includes a large number of first sensors included in the first transparent conductor 40. Crosses the part 41. The bulging portion 46 b of the second transparent conductor 45 is also disposed on the second sensor portion 46 between the intersections of two adjacent first sensor portions 41. Furthermore, in this Embodiment, the bulging part 41b of the 1st sensor part 41 contained in the 1st transparent conductor 40 and the bulging part 46b of the 2nd sensor part 46 contained in the 2nd transparent conductor 45 are The base film 32 is disposed so as not to overlap when observed from the normal direction of the film surface. That is, when observed from the normal direction of the film surface of the base film 32, the first sensor unit 41 included in the first transparent conductor 40 and the second sensor unit 46 included in the second transparent conductor 45 are: They intersect only at the line portions 41 a and 46 a of the sensor portions 41 and 46.

  As described above, the first transparent conductor 40 has the first terminal portion 42 connected to such a first sensor portion 41. One or two first terminal portions 42 are provided for each of the first sensor portions 41 according to the contact position detection method. Each first terminal portion 42 extends linearly from the end portion of the corresponding first sensor portion 41. Similarly, the second transparent conductor 45 has a second terminal portion 47 connected to the second sensor portion 46. One or two second terminal portions 47 are provided for each of the second sensor portions 46 in accordance with the contact position detection method. Each second terminal portion 47 extends linearly from the end of the corresponding second sensor portion 46. As shown in FIG. 3, in the present embodiment, the first terminal portion 42 is integrally formed from the same material as the first sensor portion 41, and the second terminal portion 47 is the same material as the first sensor portion 46. Is formed integrally.

  Next, the first extraction conductor 43 and the second extraction conductor 48 will be described in detail. As described above, the first extraction conductor 43 is disposed on a portion of the first transparent conductor 40, and the second extraction conductor 48 is disposed on a portion of the first transparent conductor 45. . More specifically, the first extraction conductor 43 is disposed on a portion of the first terminal portion 42 of the first transparent conductor 40, and the second extraction conductor 48 is the second transparent conductor 45. It is disposed on a part of the second terminal portion 47. That is, the first extraction conductor 43 is disposed in the inactive area Aa2 on the surface 32a on one side of the base film 32, and the second extraction conductor 48 is on the other side of the base film 32. The surface 32b is disposed in the inactive area Aa2.

  As shown in FIG. 3A, the first terminal portion 42 of the first transparent conductor 40 and the second terminal portion 47 of the second transparent conductor 45 are formed in a linear shape. And the 1st extraction conductor 43 is a line with the same pattern as the said part on parts other than the part of the connection part to the 1st sensor part 41 among the 1st terminal parts 42 formed in the linear form. It extends in a shape. Similarly, the second extraction conductor 48 is linear in the same pattern as the portion on the portion of the second terminal portion 47 formed in a linear shape other than the vicinity of the connection portion to the second sensor portion 46. It extends to.

  Further, as shown in FIG. 3B, the first extraction conductor 43 is disposed on the first transparent conductor 40 so as to be separated from the base film 32. That is, the first extraction conductor 43 is not in contact with the base film 32. As a result, the portion of the first transparent conductor 40 that is covered by the first extraction conductor 43 is exposed laterally between the base film 32 and the first extraction conductor 43. In particular, in the present embodiment, the width of the first extraction conductor 43 is the same as the width of the portion of the first terminal portion 42 of the first transparent conductor 40 covered by the first extraction conductor 43 or It is a little narrower.

  Similarly, although not shown, the second extraction conductor 48 is configured in the same manner as the first extraction conductor 43. That is, the second extraction conductor 48 is disposed on the second transparent conductor 45 so as to be separated from the base film 32 and is not in contact with the base film 32. As a result, the portion of the second transparent conductor 45 covered by the second extraction conductor 48 is exposed to the side between the base film 32 and the second extraction conductor 48. In particular, in the present embodiment, the width of the second extraction conductor 48 is the same as the width of the second terminal portion 47 portion of the second transparent conductor 45 covered by the second extraction conductor 48 or It is a little narrower.

  The first extraction conductor 43 includes an extraction wiring 37 b for connecting the sensor electrode 37 a including the first sensor unit 41 of the first transparent conductor 40 to the detection control unit 25, and the first terminal of the first transparent conductor 40. This is configured together with the part 42. In addition, the second extraction conductor 48 includes an extraction wiring 37 b for connecting the sensor electrode 37 a including the second sensor unit 46 of the second transparent conductor 45 to the detection control unit 25, and the second extraction conductor 48 of the second transparent conductor 45. The two-terminal portion 47 is used. Since the first extraction conductor 43 and the second extraction conductor 48 are arranged in the non-active area Aa2, it is not necessary to be formed from a light-transmitting material, and has high conductivity. It can be formed from a material. In the present embodiment, the first extraction conductor 43 and the second extraction conductor 48 have higher electrical conductivity (electrical conductivity) than the material forming the first transparent conductor 40 and the second transparent conductor 45. Formed from material. Specifically, the first extraction conductor is made of a metal material such as aluminum, molybdenum, silver, chromium, copper, etc., which has light shielding properties and has a much higher conductivity than a transparent conductor such as ITO. 43 and the second extraction conductor 48 can be formed.

  In the touch panel sensor 30 having such a configuration, the extraction wiring 37b including the extraction conductors 43 and 48 and the terminal portions 42 and 47 of the transparent conductors 40 and 45 is connected to the detection control unit 25 via an external connection wiring (not shown). Connected to. According to the touch panel sensor 30 having such a configuration, even when the touch panel sensor 30 is deformed due to bending or the like, the extraction conductors 43 and 48 and the transparent conductor 40 are described as described below. , 45 terminal portions 42 and 47 are kept connected to each other, and stable conduction can be ensured between the sensor electrode 37a and the detection control portion 25.

  The extraction conductors 43 and 48 made of metal or the like having high conductivity have a certain degree of adhesion to the transparent conductors 40 and 45, but are lower than the base film 32 made of resin or glass. Has only adhesion. Therefore, for example, as shown in FIG. 11, when the high conductivity conductor is in contact with a base material made of resin, glass or the like, this contact position forms the starting point of peeling, and the base material as shown by a two-dot chain line. When the is deformed, the high conductivity conductor is easily peeled off from the substrate. In particular, when the high-conductivity conductor covers the entire transparent conductor, the rigidity of the high-conductivity conductor and the transparent conductor as a whole increases, and deforms following the deformation of the substrate. It becomes difficult. Also from this point, when the base material is deformed, the high conductivity conductor is easily peeled off from the base material.

  On the other hand, according to the present embodiment, since the extraction conductors 43 and 48 are separated from the base film 32, the base point of the separation of the extraction conductors 43 and 48 from the base film 32 cannot be formed. Further, the extraction conductive layers 43 and 48 are merely placed on the transparent conductors 40 and 45, and do not cover the transparent conductors 40 and 45 from the side. Therefore, the transparent conductors 40 and 45 are easily deformed following the deformation of the base film 32, and the transparent conductors 40 and 45 are also difficult to peel from the base film 32. Thus, according to the touch panel sensor 30 of the present embodiment, even if the touch panel sensor 30 is deformed due to bending or the like, the extraction conductors 43 and 48 and the terminal portions 42 and 47 of the transparent conductors 40 and 45 are mutually connected. The connected state is maintained, and stable conduction can be ensured between the sensor electrode 37a and the detection control unit 25.

  Further, as shown in FIG. 3B, in the touch panel sensor 30 configured as described above, the extraction conductors 43 and 48 are merely disposed on the terminal portions 42 and 47 of the transparent conductors 40 and 45, respectively. It does not extend to the side of the terminal portions 42 and 47 of the transparent conductors 40 and 45. Accordingly, the overall line width of the extraction wiring 37b including the extraction conductors 43 and 48 and the terminal portions 42 and 47 of the transparent conductors 40 and 45 can be reduced. As a result, the extraction wires 37b having the same conductivity can be arranged at a shorter pitch, and the arrangement space of the extraction wires 37b, that is, the area of the inactive area Aa2 can be reduced.

  Next, a method of manufacturing the touch panel sensor 30 configured as described above according to the flowchart shown in FIG. 6 will be described with reference to FIGS. 5A to 5L. In each of FIGS. 5A to 5L, FIG. 5A shows the touch panel sensor (laminated body) being manufactured in a cross section corresponding to the cross section along line VV in FIG. 3A. Moreover, in each figure of FIG. 5A-FIG. 5L, a figure (b) is a top view which shows the touch panel sensor (laminated body) in preparation from one side (the upper side in the paper surface of each figure (a)).

  First, as shown in FIGS. 6 and 5A, a laminate (also referred to as blanks) 50 as a base material for manufacturing the touch panel sensor 30 is prepared (step S1). By performing processing (processing) such as film formation and patterning on the laminated body 50, the touch panel sensor 30 can be obtained.

  As shown in FIG. 5A (a), the laminate 50 prepared in the present embodiment includes a transparent base film 32 and a first transparent laminated on a surface 32a on one side of the base film 32. The conductive layer 52a, the second transparent conductive layer 52b that is laminated on the surface 32b on the other side of the base film 32, and the first transparent conductive layer 54a that is laminated on the first transparent conductive layer 52a. And a second covered conductive layer 54b laminated on the second transparent conductive layer 52b.

  As described above, a resin film such as a PET film can be used as the base film 32. Also, as shown in FIGS. 4A and 4B, a resin film main body 33 such as PET, and functional films 34 and 35 formed on one or both surfaces of the film main body 33. A base film 32 having the following may be used.

  As will be described later, the first transparent conductive layer 52a and the second transparent conductive layer 52b are patterned to form a first transparent conductor 40 and a second transparent conductor 45 having translucency, respectively. . Therefore, the first transparent conductive layer 52a and the second transparent conductive layer 52b are formed of a material having translucency and conductivity. As a specific example, the first transparent conductive layer 52a and the second transparent conductive layer 52b can be configured as ITO films formed on the surfaces 32a and 32b of the base film 32 by sputtering.

  Further, as will be described later, the first covered conductive layer 54a and the second covered conductive layer 54b are patterned to form first extraction conductors 43 and 48 having high conductivity, respectively. Therefore, the first covered conductive layer 54a and the second covered conductive layer 54b are preferably formed from a material having a higher conductivity than the material forming the transparent conductive layers 52a and 52b.

  In addition, the first coated conductive layer 54a and the second coated conductive layer 54b are layers having a light shielding property against light used for exposure of photosensitive layers 56a and 56b described later, that is, layers having a property of not transmitting the exposure light. It is. However, in the present embodiment, not only the exposure light of the photosensitive layers 56a and 56b but also a layer having a light shielding property against light in other wavelength regions, more specifically, visible light that can be included in natural light. It is formed as a layer having a light shielding property against ultraviolet rays, infrared rays and the like. If such a layer is used as the covering conductive layers 54a and 54b, it can be expected to more reliably shield the exposure light.

  Various materials are known as materials for the first covering conductive layer 54a and the second covering conductive layer 54b. In consideration of cost and ease of processing, aluminum, molybdenum, silver, Metals such as chromium and copper can be used. The light shielding layer 54 made of metal can be formed on the surface of one side of the first conductive layer 52a (the side opposite to the base film 32) by sputtering.

  In addition, the sheet-like laminated body 50 may be prepared, or the elongate web-like laminated body 50, for example, the laminated body 50 wound up by the roll, may be prepared. However, in consideration of production efficiency, a laminate 50 prepared in a different place and wound around a roll is prepared, and the web-like laminate 50 is supplied by rewinding the roll laminate 50. It is preferable that the steps described below are performed on the web-like laminate 50 to which the following steps are supplied. Or the said base film 32 is drawn | fed out from the roll which wound up the base film 32, or the intermediate laminated body which consists of the base film 32 and the 1st and 2nd transparent conductive layers 52a and 52b is wound up. The intermediate laminate is drawn out from the rolled roll, the laminate 50 is produced from the base film 32 or the intermediate laminate, and each process described below for the produced laminate 50 includes the following steps. It is also preferable that it is applied.

  Next, as shown in FIG. 6 and FIG. 5B, the first photosensitive layer 56 a is formed on the surface 50 a on one side of the multilayer body 50, and the second photosensitive layer 56 is formed on the surface 50 b on the other side of the multilayer body 50. The layer 56b is formed (step S2). The first photosensitive layer 56a and the second photosensitive layer 56b have photosensitivity to light in a specific wavelength range, for example, ultraviolet rays. Specifically, the photosensitive layers 56a and 56b can be formed by coating a photosensitive material on the surface of the laminate 50 using a coater.

  Thereafter, as shown in FIGS. 6 and 5C, the first photosensitive layer 56a and the second photosensitive layer 56b are simultaneously exposed (step S3).

  Specifically, first, as shown in FIG. 5C (a), the first mask 58a is disposed on the first photosensitive layer 56a, and the second mask 58b is disposed on the second photosensitive layer 56b. The first mask 58a has a predetermined pattern corresponding to the pattern of the first transparent conductor 40 to be formed, and the second mask 58b has a predetermined pattern corresponding to the pattern of the second transparent conductor 45 to be formed. It has the pattern of. The pattern of the first mask 58a and the pattern of the second mask 58b are different from each other.

  The positioning of the first mask 58a and the second mask 58b can be performed with reference to the alignment mark 59a provided on each of the first mask 58a and the second mask 58b. According to such a method, it is possible to position the first mask 58a and the second mask 58b with respect to each other with extremely high accuracy, for example, on the order of microns, and very easily (and therefore in a short time). Become.

  Next, as shown in FIG. 5C (a), in this state, exposure light (for example, ultraviolet rays) corresponding to the photosensitive characteristics of the first photosensitive layer 58a and the second photosensitive layer 58b is passed through the masks 58a and 58b. The photosensitive layers 56a and 56b are irradiated. As a result, the first photosensitive layer 56a and the second photosensitive layer 56b are simultaneously exposed in different patterns.

  In the illustrated example, the first photosensitive layer 56a and the second photosensitive layer 56b are positive photosensitive layers. Therefore, the first photosensitive layer 56a is irradiated with exposure light in a pattern corresponding to the pattern of the portion removed by etching to form the first transparent conductor 40, and the second photosensitive layer 56b is irradiated with the second transparent conductive layer. In order to form the body 45, exposure light is irradiated in a pattern corresponding to the pattern of the portion removed by etching. As shown in FIG. 5C (a), the exposure light applied to the first photosensitive layer 56a passes through the first photosensitive layer 56a, is applied to the laminate (blanks) 50, and is applied to the second photosensitive layer 56b. The exposure light passes through the second photosensitive layer 56b and is applied to the stacked body 50.

  However, the laminated body 50 includes a first covered conductive layer 54a and a second covered conductive layer 54b that shield exposure light. Therefore, the light from the exposure light source that has passed through the first photosensitive layer 56a is blocked by the first coated conductive layer 54a and does not reach the second photosensitive layer 56b. Similarly, the exposure light source that has passed through the second photosensitive layer 56b. Is blocked by the second covering conductive layer 54b and does not reach the first photosensitive layer 56a. That is, since the exposure light irradiated in a predetermined pattern for exposing the first photosensitive layer 56a is shielded by the first coated conductive layer 54a, the exposure light of the predetermined pattern is irradiated on the second photosensitive layer 56b. Never happen. Similarly, since the exposure light irradiated in a predetermined pattern for exposing the second photosensitive layer 56b is shielded by the second coated conductive layer 54b, the exposure light of the predetermined pattern is applied to the first photosensitive layer 56a. It will never be done. As a result, in the exposure step S3, the first photosensitive layer 56a and the second photosensitive layer 56b can be simultaneously exposed with a desired pattern with high accuracy.

  Next, as shown in FIGS. 6 and 5D, the exposed first photosensitive layer 56a and second exposed layer 56b are developed (step S4). Specifically, a developer corresponding to the first photosensitive layer 56a and the second photosensitive layer 56b is prepared, and the first photosensitive layer 56a and the second photosensitive layer 56b are developed using this developer. As a result, as shown in FIG. 5D, portions of the first photosensitive layer 56a and the second photosensitive layer 56b irradiated with light from the exposure light source without being shielded by the first mask 58a and the second mask 58b. Are removed, and the first photosensitive layer 56a and the second photosensitive layer 56b are patterned into a predetermined pattern.

  Thereafter, as shown in FIGS. 6 and 5E, the first covered conductive layer 54a is etched using the patterned first photosensitive layer 56a as a mask, and the second covered conductive layer is used using the patterned second photosensitive layer 56b as a mask. 54b is etched (step S5). By this etching, the first coated conductive layer 54a and the second coated conductive layer 54b are patterned in substantially the same pattern as the patterns of the first photosensitive layer 56a and the second photosensitive layer 56b, respectively. For example, when the coated conductive layers 54a and 54b are made of aluminum or molybdenum, phosphoric acid acetic acid (water) formed by mixing phosphoric acid, nitric acid, acetic acid, and water in a ratio of 5: 5: 5: 1 is used as an etching solution. Can be used. Further, when the coated conductive layers 54a and 54b are made of silver, phosphoric acid acetic acid (water) in which phosphoric acid, nitric acid, acetic acid, and water are mixed at a ratio of 4: 1: 4: 4 is used as an etching solution. Can do. Further, when the coated conductive layers 54a and 54b are made of chromium, an etching solution in which cerium ammonium nitrate, perchloric acid, and water are mixed at a ratio of 17: 4: 70 can be used.

  Next, as shown in FIGS. 6 and 5F, the first transparent conductive layer 52a is etched using the patterned first photosensitive layer 56a and the first covered conductive layer 54a as a mask, and the patterned second photosensitive layer is used. The second transparent conductive layer 52b is etched using the 56b and the second covered conductive layer 54b as a mask (step S6). For example, by using ferric chloride as an etching solution, the first transparent conductive layer 52a made of ITO is patterned into a pattern substantially the same as the pattern of the first photosensitive layer 56a and the first covered conductive layer 54a. The second transparent conductive layer 52b made of is patterned in substantially the same pattern as the patterns of the second photosensitive layer 56b and the second covered conductive layer 54b. That is, both the first transparent conductive layer 52a and the second transparent conductive layer 52b are simultaneously etched.

  Thereafter, as shown in FIGS. 6 and 5G, the first photosensitive layer 56a that is patterned and remains on the first coated conductive layer 54a, and the patterned and remains on the second coated conductive layer 54b. The second photosensitive layer 56b is removed (step S7). For example, by using an alkaline solution such as 2% potassium hydroxide, the remaining first photosensitive layer 56a is removed, the patterned first coated conductive layer 54a is exposed, and the remaining second photosensitive layer 56a is exposed. The layer 56b is removed, and the patterned second covered conductive layer 54b is exposed.

  Next, as shown in FIGS. 6 and 5H, a third photosensitive layer 56c is formed as a further photosensitive layer on the patterned first covered conductive layer 54a, and on the patterned second covered conductive layer 54b. A fourth photosensitive layer 56d is formed as a further photosensitive layer (step S8). In the illustrated example, the third photosensitive layer 56c is formed so as to cover the touch panel sensor 30 (stacked body 50) being manufactured from one side, and the touch panel sensor 30 (stacked body 50) being manufactured is covered from the other side. Thus, the fourth photosensitive layer 56d is formed. Similar to the first photosensitive layer 56a and the second photosensitive layer 56b, the third photosensitive layer 56c and the fourth photosensitive layer 56d have photosensitivity to light in a specific wavelength region, for example, ultraviolet rays. Similarly to the first photosensitive layer 56a and the second photosensitive layer 56b, the third photosensitive layer 56c and the fourth photosensitive layer 56d are formed by coating a photosensitive material on the surface of the laminated body 50 using a coater. Can be done.

  Thereafter, as shown in FIGS. 6 and 5I, the third photosensitive layer 56c and the fourth photosensitive layer 56d are simultaneously exposed (step S9).

  In this step, first, as shown in FIG. 5I (a), the third mask 58c is disposed on the third photosensitive layer 56c, and the fourth mask 58d is disposed on the fourth photosensitive layer 56d. The third mask 58c has a predetermined pattern corresponding to a portion of the patterned first covering conductive layer 54a to be removed to form the first extraction conductor 43, and the third mask 58c In the patterned second covering conductive layer 54b, the second covering conductive layer 54b has a predetermined pattern corresponding to a portion to be removed to form the second extraction conductor 48. In the illustrated example, the third mask 58c has a pattern formed corresponding to the active area Aa1, more specifically, a light-transmitting region formed slightly larger than the active area Aa1. In the illustrated example, the fourth mask 58d has the same pattern as the third mask 58c.

  The positioning of the third mask 58c is performed by, for example, forming an alignment mark for positioning when patterning the first covering conductive layer 54a described above, and using the alignment mark formed from the first covering conductive layer 54a. It can be implemented as a reference. According to this method, the third mask 58c can be positioned with high accuracy with respect to the patterns of the first covering conductive layer 54a and the first transparent conductive layer 52a. In addition, the same positioning method can be employed for positioning the fourth mask 58d, whereby the fourth mask 58d can be accurately formed with respect to the pattern of the second covering conductive layer 54b and the second transparent conductive layer 52b. Can be positioned.

Next, as shown in FIG. 5I (a), in the state where the third mask 58c and the fourth mask 58d are arranged, exposure light corresponding to the photosensitive characteristics of the third photosensitive layer 58c and the fourth photosensitive layer 58d (for example, UV light is irradiated to the photosensitive layers 56c and 56d through the masks 58c and 58d. As a result, the third photosensitive layer 56c and the fourth photosensitive layer 56d are simultaneously exposed in the same pattern.
In the illustrated example, the first photosensitive layer 56a and the second photosensitive layer 56b are positive photosensitive layers. The third mask 58c and the fourth mask 58d have a light transmitting region including a region facing the active area Aa1. Accordingly, the third photosensitive layer 56c and the fourth photosensitive layer 56d are irradiated with the exposure light on the area facing the active area Aa1 and the periphery thereof. As shown in FIG. 5I (a), the pattern of light from the exposure light source applied to the third photosensitive layer 56c is the same as the pattern of exposure light applied to the fourth photosensitive layer 56d.
Therefore, the third photosensitive layer 56c and the fourth photosensitive layer 56d can be simultaneously exposed with a predetermined pattern with high accuracy.

  Next, as shown in FIGS. 6 and 5J, the exposed third photosensitive layer 56c and the fourth photosensitive layer 56d are developed (step S10). Specifically, a developer corresponding to the third photosensitive layer 56c and the fourth photosensitive layer 56d is prepared, and the third photosensitive layer 56c and the fourth photosensitive layer 56d are developed using this developer. Thereby, as shown in FIG. 5J, portions of the third photosensitive layer 56c and the fourth photosensitive layer 56d that have been exposed to the exposure light without being shielded by the third mask 58c and the fourth mask 58d are removed. The That is, of the third photosensitive layer 56c and the fourth photosensitive layer 56d, the region facing the active area Aa1 and the surrounding region are removed, and the third photosensitive layer 56c and the fourth photosensitive layer 56d are moved to the inactive area Aa2. It remains only in the facing area.

  Thereafter, as shown in FIGS. 6 and 5K, the patterned first coated conductive layer 54a is etched using the patterned third photosensitive layer 56c as a mask, and is patterned using the patterned fourth photosensitive layer 56d as a mask. The second covered conductive layer 54b is etched (step S11). In this step, the etching solution is erodible with respect to the coated conductive layers 54a and 54b and does not have erosion with respect to the transparent conductive layers 52a and 52b or with respect to the transparent conductive layers 52a and 52b. An etchant having a weak erodibility is used. This is because the pattern of the transparent conductive layers 52a and 52b exposed by removing the covering conductive layers 54a and 54b is not impaired. That is, the etching solution used in this step S11 is selected so that a desired layer (covered conductive layers 54a and 54b) can be selectively etched. As a specific example, the above-described phosphoric acid acetic acid (water) or cerium nitrate-based etching solution has etching properties with respect to the coated conductive layers 54a and 54b made of a predetermined metal, but the transparent conductive layer 52a made of ITO or the like. Since it has no etching property with respect to 52b, it can be suitably used in this step.

  By the etching in this step S11, at least a portion of the patterned first covered conductive layer 54a disposed at a position facing the active area Aa1 is removed. Similarly, at least a portion of the patterned second covered conductive layer 54b disposed at a position facing the active area Aa1 is removed. As a result, as shown in FIG. 5K (b), only the base film 32 and the transparent conductive layers 52a and 52b remain in the active area Aa1, and the active area Aa1 has translucency over the entire area. To have.

  In this manner, the first transparent conductive layer 52a is exposed by removing the portion of the first coated conductive layer 54a that is not covered by the third photosensitive layer 56c. The exposed first transparent conductive layer 52a is located in and around the region facing the active area Aa1. The first transparent conductive layer 52a located in a region facing the active area Aa1 has a predetermined pattern, forms the first sensor portion 41 of the first transparent conductor 40, and is exposed to the inactive area Aa2. The conductive layer 52 a has a predetermined pattern and forms a part of the first terminal portion 42 of the first transparent conductor 40.

  Similarly, the second transparent conductive layer 52b is exposed by removing a portion of the second coated conductive layer 54b that is not covered by the fourth photosensitive layer 56d. The exposed second transparent conductive layer 52b is located in and around the region facing the active area Aa1. The second transparent conductive layer 52b located in the region facing the active area Aa1 has a predetermined pattern, forms the second sensor portion 46 of the second transparent conductor 45, and is exposed to the non-active area Aa2. The conductive layer 52 b has a predetermined pattern and forms a part of the second terminal portion 47 of the second transparent conductor 45.

  Next, as shown in FIGS. 6 and 5L, the third photosensitive layer 56c that has been patterned and remains on the first coated conductive layer 54a, and the patterned and remaining on the second coated conductive layer 54b. The fourth photosensitive layer 56b is removed (step S12). For example, by using the above-described alkaline solution, the remaining third photosensitive layer 56c is removed, the patterned first coated conductive layer 54a is exposed, and the remaining fourth photosensitive layer 56d is removed. Then, the patterned second covering conductive layer 54b is exposed.

  The exposed first covering conductive layer 54 a has a predetermined pattern and forms the first extraction conductor 43. Between the formed first extraction conductor 43 and the base film 32, the first terminal portion 42 of the first transparent conductor 40 made of the first transparent conductive layer 52a is formed. As described above and as shown in FIG. 3B, the first extraction conductor 43 formed in this manner is spaced from the base film 32 and positioned on the first terminal portion 42. For this reason, the first terminal portion 42 is exposed laterally between the first extraction conductor 43 and the base film 32.

Similarly, the exposed second covering conductive layer 54 b has a predetermined pattern and forms the second extraction conductor 48. Between the formed second extraction conductor 48 and the base film 32, the second terminal portion 47 of the second transparent conductor 45 made of the second transparent conductive layer 52b is formed.
The second extraction conductor 48 formed in this manner is spaced from the base film 32 and positioned on the second terminal portion 47. For this reason, the second terminal portion 47 is exposed laterally between the second extraction conductor 48 and the base film 32.

  The touch panel sensor 30 having the above-described configuration can be obtained as described above.

  As described above, the base material 32, the laminated body 50, or the base material such as the intermediate laminated body made up of the base film 32 and the first and second transparent conductive layers 52a and 52b is web-shaped and rolls. In the case of being prepared in a state of being wound up, the web-shaped base material may be fed out from the roll, and the above-described steps may be performed on the fed-out base material. In this case, a large number of touch panel sensors 30 are formed in a state of being connected to each other through the base film 32. The web-shaped touch panel sensor 30 thus manufactured may be wound on a roll while being overlapped with a protective slip sheet for convenience of handling (conveyance, shipping, etc.). The touch panel sensor 30 wound on the roll can be fed out from the roll and cut into sheets as needed.

  In addition, when winding the web-shaped touch panel sensor 30 on a roll, the web-shaped touch panel sensor 30 may be wound by placing a slip sheet on both sides, or only one side of the web-shaped touch panel sensor 30 may be wound. An interleaving paper may be arranged and wound up.

  According to the manufacturing method described above, the first photosensitive layer 56a and the second photosensitive layer 56b are exposed simultaneously. In the double-sided simultaneous exposure process of the photosensitive layer, as shown in FIG. 5C (a), the first mask 58a and the second mask 58a and the second mask 58b are provided by providing the alignment marks 59a respectively. It is possible to position the masks 58b with respect to each other with extremely high accuracy, for example, on the order of microns, and very easily (and therefore in a short time). As a result, in the touch panel sensor 30, both the first transparent conductor 40 and the second transparent conductor 45 are positioned on the base film 32 with high accuracy and efficiency.

  On the other hand, when the first photosensitive layer 56a and the second photosensitive layer 56b are sequentially exposed one by one, the first transparent conductor 40 and the second transparent conductor 45 can be manufactured accurately and easily. Can not. In order to manufacture both the first transparent conductor 40 and the second transparent conductor 45 with high accuracy, one of the first transparent conductor 40 and the second transparent conductor 45 is formed on the base film 32 together with the alignment mark. Thereafter, the mask used for forming the other of the first transparent conductor 40 and the second transparent conductor 45 is positioned with respect to the alignment mark formed on the base film 32. That is, at least the exposure process and the development process need to be performed separately for each of the first photosensitive layer 56a and the second photosensitive layer 56b. For this reason, the first transparent conductor 40 and the second transparent conductor 45 cannot be efficiently and easily formed in a short time.

  Further, without using the alignment mark, for example, the first transparent conductor 40 and the second transparent conductor 45 are exposed while positioning the first mask 58a and the second mask 58b with reference to the end of the base film 32. Is also possible. According to this method, the exposure process and the development process for the first photosensitive layer 56a and the second photosensitive layer 56b can be performed simultaneously. However, the positioning accuracy of the first transparent conductor 40 and the second transparent conductor 45 depends on the outer shape accuracy of the base film 32. Generally, according to this method, the positioning accuracy of the first transparent conductor 40 and the second transparent conductor 45 can be expected only in units of several tens of microns at the maximum.

  From these things, according to the manufacturing method of this Embodiment demonstrated above, the 1st transparent conductor 40 and the 2nd transparent conductor 45 can be positioned easily and accurately with respect to each other. Specifically, according to the present embodiment, when the touch panel sensor 30 is viewed from the top, that is, when the touch panel sensor 30 is observed from the normal direction, the bulging portion having a substantially square shape of the first sensor portion 41. The gap G (also referred to as a pattern gap, see FIG. 3A) parallel to each other between 41b and the bulging portion 46b having a substantially square shape of the second sensor portion 46 is stably set to 100 μm or less. I was able to. On the other hand, in the conventional method of bonding two films, the pattern gap G is 200 μm or more. As a result, according to the present embodiment, when the touch panel sensor 30 is observed from the normal direction to the entire area of the active area Aa1 where the contact (approach) position can be detected, the first sensor unit 41 and the second sensor The percentage of the region where at least one of the portions 46 is arranged can be 95% or more in percentage.

  Further, the lead-out wiring 37b includes not only the terminal portions 42 and 47 of the transparent conductors 40 and 45 with low conductivity but also lead-out conductors 43 and 48 with high conductivity. Accordingly, the line width of the extraction wiring 37b can be reduced, and the arrangement space of the extraction wiring 37b, that is, the area of the inactive area Aa2 can be reduced.

  In particular, according to the above-described method, the extraction conductors 43 and 48 are arranged on the terminal portions 42 and 47 of the transparent conductors 40 and 45 as shown in FIG. It can be prevented from extending to the side of the terminal portions 42 and 47 of the transparent conductors 40 and 45. On the other hand, for example, when the conductive conductors 43 and 48 are formed from the high conductivity material on the terminal portions 42 and 47 of the transparent conductors 40 and 45 by screen printing which has been frequently used in the past, as shown in FIG. In addition, the transparent conductors 40 and 45 extend from the sides of the terminal portions 42 and 47 to the base film 32 and spread. Compared to such a conventional extraction wiring, according to the extraction wiring 37b of the present embodiment, when the extraction conductor is formed using the same amount of high conductivity material, the conductivity of the extraction wiring 37b is kept the same. However, the line width can be greatly reduced.

  In addition, since the extraction conductors 43 and 48 and the terminal portions 42 and 47 of the transparent conductors 40 and 45 according to the present embodiment are formed by a photolithography technique, compared with a conventional method by screen printing or the like, It can be formed with a desired shape at a desired position with extremely high accuracy. Furthermore, according to the present embodiment, unlike the conventional extraction wiring shown in FIG. 11, the high conductivity extraction conductors 43 and 48 cover the transparent conductors 40 and 45 to the sides of the terminal portions 42 and 47, respectively. Therefore, the possibility of electromigration can be reduced. For these reasons, the arrangement pitch of the extraction wirings 37b can be significantly shortened, whereby the arrangement space of the extraction wirings 37b, that is, the area of the inactive area Aa2 can be reduced.

  By the way, according to the manufacturing method of the present embodiment described above, not only the terminal portions 42 and 47 of the transparent conductors 40 and 45 are not covered from the side by the extraction conductors 43 and 48, As shown in FIG. 3B, the widths of the extraction conductors 43 and 48 are narrower than the widths of the terminal portions 42 and 47 of the transparent conductors 40 and 45 covered by the extraction conductors 43 and 48. It can also be. That is, when viewed from the normal direction of the film surface of the base film 32, the extraction conductors 43 and 48 are disposed only on the transparent conductors 40 and 45. In other words, the extraction conductors 43 and 48 are The transparent conductors 40 and 45 can be disposed only in the region where the terminal portions 42 and 47 of the transparent conductors 40 and 45 are disposed. According to such a configuration, it is possible to further stabilize the conduction between the sensor electrode 37a and the detection control unit 25 described above. In addition, since the possibility of electromigration can be further reduced, the arrangement pitch of the extraction wirings 37b can be further shortened, and the area of the inactive area Aa2 can be reduced.

  Hereinafter, when the extraction wiring 37b is formed by the manufacturing method described above, the widths of the extraction conductors 43 and 48 of the extraction wiring 37b are the terminals of the transparent conductors 40 and 45 covered by the extraction conductors 43 and 48, respectively. The estimation mechanism that becomes narrower than the width of the portions 42 and 47 will be described mainly with reference to FIG. 7, but the present invention is not limited to this estimation mechanism.

  In the conventional method of manufacturing a touch panel sensor by bonding two films, when a transparent conductor terminal is formed on a film using photolithography technology, the transparent conductive layer that forms a transparent conductor is formed. The photosensitive layer is directly disposed on the substrate. On the other hand, according to the present embodiment, the coated conductive layers 54a and 54b are arranged on the transparent conductive layers 52a and 52b that form the transparent conductors 40 and 45. Generally, a photosensitive layer (resist layer) has high erosion resistance with respect to an etching solution (for example, ferric chloride) for etching a transparent conductive layer. However, the coated conductive layers 54a and 54b made of metal or the like can be etched with an etchant for the transparent conductive layers 52a and 52b such as ITO.

  Therefore, as shown in FIG. 7, when the transparent conductive layers 52a and 52b are etched in the vertical direction (normal direction of the base film) in the step S6 of etching the transparent conductive layers 52a and 52b, the coated conductive layer 54a and 54b can be etched in the lateral direction (direction along the sheet surface of the base film 32) from the side not covered by the photosensitive layers 56a and 56b. On the other hand, since the photosensitive layer has high erosion resistance with respect to the etching solution used in this step S6, it is not greatly etched in the lateral direction. For the reasons described above, according to the touch panel sensor 30 manufactured by the manufacturing method of the present embodiment, the width of the extraction conductors 43 and 48 is set to be the transparent conductor covered with the extraction conductors 43 and 48. It becomes possible to make narrower than the width | variety of the part of the terminal parts 42 and 47 of 40,45.

  Furthermore, when the first photosensitive layer 52a and the second photosensitive layer 52b are simultaneously exposed in different patterns, the light shielding layer (covered conductive layer) 54a used to avoid the influence of the exposure light patterns on each other. , 54b, conductors 43, 48 are produced. According to such a method, it is possible to reduce the material cost required for manufacturing the touch panel sensor 30. Furthermore, the production efficiency of the touch panel sensor 30 can be improved extremely effectively, and the production cost of the touch panel sensor 30 can be reduced accordingly. That is, the above-described excellent touch panel 30 (touch panel device 20) can be manufactured with high production efficiency and low manufacturing cost.

  The touch panel sensor 30 obtained as described above is bonded to the display device 15 via the adhesive layer 19 and the protective cover 12 is bonded to the touch panel sensor 30 via the adhesive layer 14, so that FIG. 1 and FIG. The input / output device 10 shown in FIG. Next, the operation when the input / output device 10 is used will be described.

  First, in such an input / output device 10, an observer can observe an image through the protective cover 12 and the touch panel sensor 30 by displaying the image on the display panel 16 of the display device 15.

  In the input / output device 10, the touch panel sensor 30 and the protective cover 12 constitute a part of the touch panel device 20, and the external conductor 5, typically a human finger 5, contacts (approaches) on the protective cover 12. While being able to detect, the position where the outer conductor 5 contacted (approached) on the protective cover 12 can be detected.

  Specifically, first, when an external conductor (for example, a human finger) 5 comes into contact with the protective cover 12, the external conductor 5 and an electrode portion located near the contact position of the external conductor 5 with the protective cover 12. The electric conductors 41 and 46 of 40 and 45 function as electrodes, and an electric field is formed. At this time, the protective cover 12, the base film 32, and the like positioned between the sensor portions 41 and 46 of the transparent conductors 40 and 45 constituting the sensor electrode 37a and the external conductor 5 function as a dielectric. That is, when the outer conductor 5 comes into contact with the protective cover 12, a capacitor having the sensor portions 41 and 46 and the outer conductor 5 as electrodes is formed.

  The detection circuit of the detection control unit 25 of the touch panel device 20 is connected to the sensor units 41 and 46, and can detect the capacitance between the sensor units 41 and 46 and the external conductor 5. Yes. Then, the detection control unit 25 detects a change in the capacitance between each of the sensor units 41 and 46 and the outer conductor 5, thereby determining which first sensor unit 41 the outer conductor 5 faces. In addition, it can be specified which second sensor portion 46 the outer conductor 5 faces.

  That is, the detection circuit of the detection control unit 25 faces the outer conductor 5 of the multiple first sensor units 41 included in the first transparent conductors 40 arranged in the one direction in the active area Aa1. By specifying the first sensor portion (linear conductor), the position of the outer conductor 5 on the coordinate axis extending in the one direction can be specified. Similarly, the detection circuit of the detection control unit 25 faces the outer conductor 5 of the multiple second sensor units 46 included in the second transparent conductor 45 arranged side by side in the other direction in the active area Aa1. By specifying the second sensor portion (linear conductor), the position of the outer conductor 5 on the coordinate axis extending in the other direction can be specified. In this way, by detecting the contact position of the external conductor 5 to the touch panel device 20 (protective cover 12) in two directions, the position coordinates of the contact position of the external conductor 5 to the surface of the touch panel device 20 can be obtained. It is possible to specify with high accuracy on the surface of the device 20. Note that various methods (principle) for detecting a contact position in a projected capacitively coupled touch panel are disclosed in various documents, and further description is omitted in this specification.

  In the touch panel sensor 30 manufactured according to the above-described manufacturing method, the sensor electrode 37a and the extraction wiring 37b are formed on both sides of the base film 32 as a single body. That is, a joined body of a plurality of films joined via an adhesive or the like is not used as a base film. As a result, the transmissivity of the touch panel sensor 30 as a whole can be improved. In addition, since the number of interfaces that can reflect ambient light (external light) such as illumination or image light can be reduced, the reflection of the ambient light is suppressed and the contrast of the image displayed on the display device 15 is improved. be able to. Accordingly, when the touch panel sensor 30 is disposed on the display surface 16 of the display device 10, it is possible to prevent the display image of the display device 10 from being greatly deteriorated. Furthermore, the total thickness of the touch panel sensor 30 and the input / output device 10 can be reduced.

  Further, as shown in FIG. 2, the first sensor portion 41 of the first transparent conductor 40 and the second sensor portion 46 of the second transparent conductor 45 constituting the sensor electrode 37a are the touch panel sensor 30 (protective cover 12). Are arranged at different positions along the normal direction. Specifically, the second sensor portion 46 of the second transparent conductor 45 is disposed at a position spaced apart from the protective cover 12 by the thickness of the base film 32 than the first sensor portion 41 of the first transparent conductor 40. Has been. However, as described above, the base film 32 in the present embodiment is configured as a single film. Further, the base film 32 is not required to have a special function such as a deep ultraviolet light shielding function, unlike the base film disclosed in the above-mentioned patent document (Japanese Patent Laid-Open No. 4-264613). That is, it can be composed of a single film having a small thickness. Therefore, when the outer conductor 5 comes into contact with the protective cover 12, a capacitor can be stably formed between the outer conductor 5 and the second sensor portion 46 of the second transparent conductor 45. Thereby, the contact position (touch position) of the outer conductor 5 to the protective cover 12 is not only determined by the first sensor unit 41 of the first transparent conductor 40 but also by the second sensor unit 46 of the second transparent conductor 45. However, it becomes possible to detect with high sensitivity and accuracy.

  Further, according to the present embodiment, as shown in FIG. 3, the first sensor portion 41 of the first transparent conductor 40 has the line portion 41 a and the bulging portion 41 b, and the second transparent conductor 45 The 2nd sensor part 46 has the line part 46a and the bulging part 46b. In each sensor part 41 and 46, the width | variety in the bulging parts 41b and 46b is very thick compared with the width | variety in the line parts 41a and 46a. As described above, the bulging portion 41b of the first sensor portion 41 included in the first transparent conductor 40 and the bulging portion 46b of the second sensor portion 46 included in the second transparent conductor 45 are: It arrange | positions so that it may not overlap, when it observes from the normal line direction of the film surface of the base film 32. FIG. For this reason, the external sensor 5 and the second sensor unit 46 of the second transparent conductor 45 have a wide area that allows the first sensor unit 41 of the first transparent conductor 40 to affect the detection accuracy of the contact position. There is no intervening between them. As a result, it is possible to prevent the capacitor from being effectively formed between the outer conductor 5 and the second sensor portion 46 of the second transparent conductor 45.

  Furthermore, as described above, the display control unit 17 of the display device 15 and the detection control unit 25 of the touch panel device 20 are connected. The detection control unit 25 can transmit information input when the outer conductor 5 contacts a predetermined position on the protective cover 12 to the display control unit 17. Based on the input information read by the detection control unit 25, the display control unit 17 can also display an image corresponding to the input information on the display panel 16 of the display device 15. In other words, the display function as the output unit and the touch position detection function as the input unit allow direct interaction of information between the user (operator) of the input / output device 10 and the input / output device 10. Exchange (for example, an instruction to the display device 10 by the user and execution of the instruction by the display device 10) can be realized.

  And as mentioned above, when the 1st transparent conductor 40 and the 2nd transparent conductor 45 are patterned on the base film 32 through the double-sided simultaneous exposure process (process S3) of the photosensitive layers 56a and 56b. The first sensor portions 41 of the first transparent conductor 40 and the second sensor portions 46 of the second transparent conductor 45 constituting the sensor electrode 37a are accurately positioned with respect to each other. As a result, both the first sensor portions 41 of the first transparent conductor 40 and the second sensor portions 46 of the second transparent conductor 45 can be accurately positioned with respect to the display device 15. In this case, the contact position of the outer conductor 5 with the protective cover 12 can be accurately detected with the display device 15 as a reference. As a result, the input corresponding to the video information displayed on the display device 15 can be detected with high resolution and high accuracy, whereby the user (operator) of the input / output device 10 and the input / output device 10 can be detected. Exchange of information in the form of dialogue between the two will be carried out very smoothly.

  According to the present embodiment as described above, the coated conductive layers 54a and 54b arranged on the transparent conductive layers 52a and 52b and patterned together with the transparent conductive layers 52a and 52b are used as a part of the extraction wiring 37b. . Specifically, the extraction conductors 43 and 48 composed of the covering conductive layers 54a and 54b patterned in the same pattern as the transparent conductive layers 52a and 52b and then partially removed are patterned transparent conductive layers 52a and 52a, The lead-out wiring 37b is formed together with the transparent conductors 40 and 45 made of 52b.

  The extraction wiring 37b manufactured by such a method can ensure high conductivity (electrical conductivity) by the extraction conductors 43 and 48. Further, unlike the conventional extraction wiring (see FIG. 11) produced by screen printing or the like, the extraction conductors 43 and 48 are disposed on the transparent conductive layers 52a and 52b, and are lateral to the transparent conductive layers 52a and 52b. It does not extend to. Thereby, the line width of the extraction wiring 37b can be significantly reduced. Furthermore, according to the above-described embodiment, unlike the conventional manufacturing method such as screen printing, the extraction conductor 37b is formed by using the photolithography technique, so that a desired pattern can be stably and accurately extracted. The wiring 37b can be manufactured. Thereby, the possibility of electromigration can be greatly reduced. From the above, according to the present embodiment, it becomes possible to form the extraction wirings 37b having a narrow line width side by side at a short pitch, and thereby, the area of the region necessary for arranging the extraction wirings 37b, That is, the area of the inactive area Aa2 can be significantly reduced.

  Further, the extraction conductors 43 and 48 are not in contact with the base film 32 that can exhibit only a low adhesion force, and are bonded only to the transparent conductors 40 and 45 that can exhibit a high adhesion force. For this reason, even if the touch panel sensor 30 is deformed during use, it is possible to make it difficult to form a starting point at which the extraction conductors 43 and 48 peel from the touch panel sensor 30. Further, the terminal portions 42 and 47 of the transparent conductors 40 and 45 are not covered to the side by the extraction conductors 43 and 48, and laterally between the base film 32 and the extraction conductors 43 and 48. Exposed. That is, the deformation of the terminal portions 42 and 47 by the extraction conductors 43 and 48 is weak, and the terminal portions 42 and 47 can be deformed following the deformation of the base film 32 when the touch panel sensor 30 is deformed. Become. Thus, the extraction conductors 43 and 48 are peeled off from the transparent conductors 40 and 45 or the base film 32, and the terminal portions 42 and 47 are peeled off from the base film 32 together with the extraction conductors 43 and 48. , Can be effectively suppressed. As a result, the reliability of the detection function of the touch panel sensor 30 can be greatly improved.

  Further, the coated conductive layers 54a and 54b used for forming the extraction conductors 43 and 48 are layers used as a light shielding layer in the double-sided simultaneous exposure step S3. According to such a manufacturing method, the touch panel sensor 30 having excellent performance as described above can be manufactured extremely efficiently and inexpensively.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, an example of modification will be described.

  For example, in the above-described embodiment, in the step of removing a part of the patterned coated conductive layers 54a and 54b, the active area Aa1 of the coated conductive layers 54a and 54b and the vicinity of the active area Aa1 surrounding the active area Aa1 Although the example in which the portion located in the region is removed has been shown, the present invention is not limited to this. From the viewpoint of removing the light-shielding coated conductive layers 54a and 54b in order to ensure the transparency of the active area Aa1, the part to be removed may be only the part located in the active area Aa1. it can. According to such an example, the area | region where the extraction conductors 43 and 48 are arrange | positioned can be expanded, ensuring the transparency in active area Aa1 of the touch panel sensor 30, and the electrical conductivity of the extraction wiring 37b can be improved. However, the above-described embodiment is superior from the viewpoint of allowing further variations in exposure accuracy and development accuracy of the photosensitive layers 56c and 56d and improving the reliability of the touch panel sensor 30. Of course, when changing the portions where the coated conductive layers 54a and 54b are removed, the patterns of the transmission regions of the third mask 58c and the fourth mask 58d described above must be changed.

  Further, in the above-described embodiment, in the step of developing and patterning the further photosensitive layers 56c and 56d, an example is shown in which the photosensitive layers 56c and 56d are patterned in a frame shape surrounding the active area Aa1 from the four sides. Not limited to this. For example, the photosensitive layers 56c and 56d are exposed (see FIG. 8A) and developed (see FIG. 8B) in a pattern corresponding to the pattern that should remain on the transparent conductive layers 52a and 52b (transparent conductors 40 and 45). Also good. As shown in FIG. 8A, also in such a modified example, the coated conductive materials 54a and 54b having light shielding properties shield light from an exposure light source irradiated in a predetermined pattern from different sides. Accordingly, the third photosensitive layer 56c and the fourth photosensitive layer 56d can be simultaneously exposed on both sides with high accuracy in different patterns. However, the above-described embodiment is superior from the viewpoint of allowing further variations in exposure accuracy and development accuracy of the photosensitive layers 56c and 56d and improving the reliability of the touch panel sensor 30. In the modification shown in FIGS. 8A and 8B, the configuration of other parts can be configured in the same manner as in the above-described embodiment. 8A and 8B, parts that can be configured in the same manner as the above-described embodiment are given the same reference numerals, and redundant descriptions are omitted.

  Moreover, in embodiment mentioned above, although an example of the manufacturing method of the touch panel sensor 30 was demonstrated, it is not restricted to this example. For example, a step of annealing the transparent conductive layers 52a and 52b to advance crystallization (microcrystallization) of the transparent conductive layers 52a and 52b may be provided in the middle.

  Usually, a transparent conductive layer such as ITO is crystallized by appropriately adjusting the temperature during film formation by sputtering or the like. That is, generally, the transparent conductive layers 52a and 52b included in the laminate (blanks) for manufacturing the touch panel sensor 30 have already been crystallized and have good chemical resistance. . However, on the other hand, it is also possible to form a transparent conductive layer in an amorphous state and perform annealing treatment at a temperature of about 140 ° after the film formation to crystallize the transparent conductive layer (also called microcrystallization). is there.

  The step of annealing the transparent conductive layers 52a and 52b is after the step S6 of patterning the transparent conductive layers 52a and 52b described above, and more than the step S11 of removing a part of the patterned coated conductive layers 54a and 54b. Prior to this, for example, it is preferably performed between the step S10 of developing the further photosensitive layers 58c and 58d and the step S11 of removing a part of the coated conductive layers 54a and 54b. For example, when the chemical resistance of the coated conductive layers 54a and 54b is weak and the patterned conductive conductive layers 54a and 54b may be etched in the step S6 of patterning the transparent conductive layers 52a and 52b, It is effective to add an annealing step.

  Specifically, in step S6 of patterning the transparent conductive layers 52a and 52b, the amorphous transparent conductive layers 52a and 52b having low chemical resistance are etched with an etchant having a low erosion property, such as oxalic acid. By using an etching solution having a weak erosion property, the covering conductive layers 54a and 54b made of a material having a low chemical resistance (for example, silver) are disposed in the lateral direction between the transparent conductive layers 52a and 52b and the photosensitive layers 56a and 56b ( That is, erosion in the direction along the sheet surface of the base film 32 can be prevented. As a result, the transparent conductive layers 52a and 52b can be patterned with extremely high accuracy. Then, before the step S11 of removing a part of the coated conductive layers 54a and 54b, the chemical resistance of the transparent conductive layers 52a and 52b is increased by annealing, thereby removing a part of the coated conductive layers 54a and 54b. At this time, it is possible to effectively prevent the pattern of the transparent conductive layers 52a and 52b patterned into a desired shape from being damaged.

Furthermore, in the above-described embodiment, in the laminated body (blanks) 50 as a base material used for manufacturing the touch panel sensor 30, the first covering conductive layer 54a is formed on the first transparent conductive layer 52a, Although the example in which the two covered conductive layers 54a are formed on the second transparent conductive layer 52b is shown, the present invention is not limited to this. The covering conductive layer may be formed only on one of the first transparent conductive layer 52a and the second transparent conductive layer 52b.
In the example shown in FIG. 9A and FIG. 9B, the first covering conductive layer 54a described above is omitted. That is, the laminated body (blanks) 50 as a base material is formed on the base film 32, the first and second transparent conductors 52a and 52b disposed on the base film 32, and the second transparent conductor 52b. And a second covering conductive layer 54b disposed. FIG. 9A and FIG. 9B correspond to FIG. 5C (a) and FIG. 5C (b), respectively, and a first photosensitive layer 56a disposed on the first transparent conductor 56a; The process S3 which exposes both surfaces simultaneously with the 2nd photosensitive layer 56b arrange | positioned on the 2nd coating conductive layer 54b is shown. As shown in FIG. 9A, the exposure light for exposing the first photosensitive layer 56a in a predetermined pattern is shielded by the second coated conductive layer 54b and is not irradiated to the second photosensitive layer 56b. The exposure light for exposing the second photosensitive layer 56b with a predetermined pattern is shielded by the second coated conductive layer 54b and is not irradiated to the first photosensitive layer 56a. As a result, similar to the above-described embodiment, the coated conductive layers 54a and 54b can be simultaneously exposed on both sides with different patterns with high accuracy. Moreover, the transparent conductors 40 and 45 and the 2nd extraction conductor similar to embodiment mentioned above can be obtained. In addition, since the covering conductive layer 54b is not formed on the first transparent conductive layer 52a, the first extraction conductor 43 is not formed on the first transparent conductor 40 in the illustrated example.

  Furthermore, in embodiment mentioned above, although the laminated body (blanks) 50 showed the example by which the transparent conductive layers 52a and 52b and the covering conductive layers 54a and 54b were each provided in the both sides of the base film 32, this was shown. Not limited to. The transparent conductive layer and the coated conductive layer may be provided only on one surface of the base film 32. In this case, the extraction wiring 37b of the above-described embodiment can be obtained on one surface of the base film 32. In this modification, the exposure light can be irradiated from only one side of the stacked body 50 in the above-described step S3 of exposing the photosensitive layer. In this modification, the coated conductive layer can be made of a material that does not have a light shielding property.

  Further, in the above-described embodiment, the first sensor portion 41 of the first transparent conductor 40 has the line portion 41a and the bulging portion 41b, and the second sensor portion 46 of the second transparent conductor 45 is the line portion. The example which has 46a and the bulging part 46b was shown. Further, in the above-described embodiment, the example in which the bulging portions 41b and 46b are formed in a substantially square shape in plan view is shown. However, the present invention is not limited thereto, and as an example, the bulging portions 41b and 46b may have a quadrangular shape such as a rhombus other than a square, a polygonal shape, a circular shape, or the like in plan view. Moreover, the sensor parts 41 and 46 may not have the bulging parts 41b and 46b but may have a linear outline.

  Further, in the above-described embodiment, the example in which the first sensor unit 41 of the first transparent conductor 40 and the second sensor unit 46 of the second transparent conductor 45 are configured in the same manner has been described. Not limited to. For example, as shown in FIG. 10, the line width w <b> 2 of the second sensor unit 46 of the second transparent conductor 45 of the first transparent conductor 40 disposed closer to the protective cover 12 (observer side surface). You may make it thicker than the line width w1 of the 1st sensor part 41. FIG. According to such an example, when the outer conductor 5 comes into contact with the protective cover 12, the second sensor portion of the second transparent conductor 45 disposed at a position relatively far from the protective cover 12 (observer side surface). The capacitor can be formed stably between the outer conductor 46 and the outer conductor 5. Further, the outer conductor 5 in contact with the protective cover 12 is compared with the capacitance of the capacitor formed between the outer conductor 5 in contact with the protective cover 12 and the first sensor portion 41 of the first transparent conductor 40. And the second sensor portion 46 of the second transparent conductor 45 can be prevented from lowering the capacitance of the capacitor. Thereby, the contact position (touch position) of the outer conductor 5 to the protective cover 12 is not only determined by the first sensor part 41 of the first transparent conductor 40 but also by the second sensor part 46 of the second transparent conductor 45. Thus, it becomes possible to detect with extremely high sensitivity and accuracy. In addition, in the modification shown in FIG. 10, about the structure of another part, it can comprise similarly to embodiment mentioned above. In FIG. 10, parts that can be configured in the same way as the above-described embodiment are given the same reference numerals, and redundant descriptions are omitted.

  In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. 12 (a) and 12 (b) and FIG. Here, FIG. 12A is a view corresponding to FIG. 3B in the first embodiment, and is a cross-sectional view showing the first extraction conductor in the second embodiment of the present invention. (B) is sectional drawing which shows the 2nd extraction conductor in the 2nd Embodiment of this invention. FIG. 13 is a cross-sectional view showing a laminated body according to the second embodiment of the present invention.

  The second embodiment shown in FIGS. 12A, 12B and 13 includes an intermediate layer in which the extraction conductor is provided on a part of the transparent conductor and spaced from the base film, and the intermediate layer. A high conductive layer formed on the transparent conductor and a material having a higher conductivity than the material forming the intermediate layer, and the intermediate layer is The first embodiment shown in FIG. 1 to FIG. 10 is different from the first embodiment shown in FIG. 1 to FIG. 10 only in that the thickness is smaller than the thickness of the highly conductive layer. Is almost the same. In the second embodiment shown in FIGS. 12A and 12B and FIG. 13, the same parts as those in the first embodiment shown in FIGS. To do.

Extraction Conductor As shown in FIG. 12A, in the present embodiment, the first extraction conductor 43 is a first provided separately from the base film 32 on a part of the first transparent conductor 40. An intermediate layer 61 and a first highly conductive layer 63 provided on the first intermediate layer 61 are included. Similarly, as shown in FIG. 12B, the second extraction conductor 48 includes a second intermediate layer 66 provided on a part of the second transparent conductor 45 and spaced from the base film 32, and And a second highly conductive layer 68 provided on the second intermediate layer 66. In addition, as shown to Fig.12 (a), the 1st protective layer 62 may be provided on the 1st highly conductive layer 63. FIG. Similarly, a second protective layer 67 may be provided on the second highly conductive layer 68 as shown in FIG.

  In the extraction conductors 43 and 48 in the present embodiment, the high conductive layers 63 and 68 are made of a material having higher conductivity (electrical conductivity) than the material forming the transparent conductors 40 and 45 and the intermediate layers 61 and 66. Is formed. Specifically, it has a light shielding property and has a much higher conductivity than the transparent conductors 40 and 45 such as ITO, for example, metals such as aluminum, molybdenum, palladium, silver, chromium, copper, or these An alloy formed by mixing two or more metals, for example, a silver alloy is used as a material. Among these, silver alloy has a smaller specific resistance than chromium generally used as a wiring material, and is preferable as a material for the highly conductive layers 63 and 68. As an example of such a silver alloy, an APC alloy containing silver, palladium, and copper can be given.

  By the way, the adhesion force between the highly conductive layers 63 and 68 made of silver alloy and the transparent conductors 40 and 45 made of a transparent conductor such as ITO is such that chromium, which is a general wiring material, and the transparent conductors 40, It is generally smaller than the adhesion force between 45. Therefore, when the highly conductive layers 63 and 68 made of a silver alloy are directly provided on the transparent conductors 40 and 45, the adhesion between the highly conductive layers 63 and 68 and the transparent conductors 40 and 45 becomes insufficient. Can be considered. In this case, it is conceivable that the high conductive layers 63 and 68 peel from the transparent conductors 40 and 45 when some sort of impact is applied to the extraction conductors 43 and 48. Therefore, when the extraction conductors 43 and 48 include high conductive layers 63 and 68 made of a silver alloy, the transparent conductors 40 and 45 and the high conductive layers 63 and 68 are interposed between the transparent conductors 40 and 45 and the high conductive layers 63 and 68. It is preferable to have a certain degree of adhesion to each of the conductive layers 63 and 68 and to interpose a conductive layer. In the present embodiment, intermediate layers 61 and 66 are interposed between the transparent conductors 40 and 45 and the highly conductive layers 63 and 68, and the material for forming the intermediate layers 61 and 66 is the intermediate layer 61. , 66 and the transparent conductors 40 and 45 are selected to be greater than the adhesion between the high conductive layers 63 and 68 and the transparent conductors 40 and 45. Further, the thickness of the intermediate layers 61 and 66 is smaller than the thickness of the highly conductive layers 63 and 68.

Intermediate Layer Next, the intermediate layers 61 and 66 will be described in more detail. First, the adhesion between the intermediate layers 61 and 66 will be described. The adhesion between the first intermediate layer 61 and the first transparent conductor 40 and the adhesion between the first intermediate layer 61 and the first high conductive layer 63 are the same as the first transparent conductor 40 and the first high conductor 63. It is larger than the adhesion force between the conductive layer 63. Similarly, the adhesive force between the second intermediate layer 66 and the second transparent conductor 45 and the adhesive force between the second intermediate layer 66 and the second highly conductive layer 68 are the same as those of the second transparent conductor 45 and The adhesion strength between the second highly conductive layer 68 is larger.
The “adhesion strength” is evaluated by, for example, a pull-off method described in JIS K5600-5-7.
For example, first, a tensile tester suitable for the method described in JIS K5600-5-7 is prepared. Next, a test plate having intermediate layers 61 and 66 provided on the transparent conductors 40 and 45 is prepared, and an adhesion force between the transparent conductors 40 and 45 and the intermediate layers 61 and 66 is obtained using a tensile tester. Measure (adhesion). In this case, the measured adhesion is A.
Next, a test plate having high conductive layers 63 and 68 provided on the intermediate layers 61 and 66 is prepared, and an adhesion force between the intermediate layers 61 and 66 and the high conductive layers 63 and 68 is obtained using a tensile tester. Measure (adhesion). The adhesion force measured in this case is B.
Next, a test plate in which high conductive layers 63 and 68 are provided on the transparent conductors 40 and 45 is prepared, and between the transparent conductors 40 and 45 and the high conductive layers 63 and 68 using a tensile tester. Measure the adhesion (adhesion). In this case, the measured adhesion is C.
In the present embodiment, the adhesive force A between the transparent conductors 40 and 45 and the intermediate layers 61 and 66 and the adhesive force B between the intermediate layers 61 and 66 and the highly conductive layers 63 and 68 are transparent. The adhesion force C between the conductors 40 and 45 and the highly conductive layers 63 and 68 is larger. That is, according to the present embodiment, the intermediate layers 61 and 66 are interposed between the transparent conductors 40 and 45 and the high conductive layers 63 and 68, so that the transparent conductors 40 and 45 and the high conductive layers 63 and 68 are interposed. The adhesion between the two can be improved.

  Next, the conductivity of the intermediate layers 61 and 66 will be described. In the extraction conductors 43 and 48, the role of conducting electrical signals is mainly played by the high conductive layers 63 and 68. For this reason, the intermediate layers 61 and 66 do not need to have conductivity superior to that of the high conductive layers 63 and 68, and are electrically connected between the transparent conductors 40 and 45 and the high conductive layers 63 and 68 with low resistance. What is necessary is just to have the electroconductivity of the grade to connect. For this reason, the specific resistance of the intermediate layers 61 and 66 is larger than the specific resistance of the high conductive layers 63 and 68. Preferably, the thickness of the intermediate layers 61 and 66 is smaller than the thickness of the high conductive layers 63 and 68, respectively, for example, when the thickness of the high conductive layers 63 and 68 is in the range of 50 to 250 nm. The thickness of the intermediate layers 61 and 66 is in the range of 3 to 8 nm. Thus, by reducing the thickness of the intermediate layers 61 and 66, the transparent conductors 40 and 45 and the high conductive layers 63 and 68 can be electrically connected with lower resistance, and the extraction conductor The entire thickness of 43 and 48 can be reduced.

  The material of the intermediate layers 61 and 66 is not particularly limited as long as the material has good adhesion to the transparent conductors 40 and 45 and the highly conductive layers 63 and 68. For example, a metal such as molybdenum (Mo) alloy is used. . Examples of the Mo alloy include MoNb, which is an alloy of Mo and niobium (Nb).

Next, the first protective layer 62 provided on the first highly conductive layer 63 and the second protective layer 67 provided on the second highly conductive layer 68 will be described in detail. The protective layers 62 and 67 are provided to prevent the highly conductive layers 63 and 68 from being oxidized, and are layers having oxidation resistance, water resistance, and the like. The material of the protective layers 62 and 67 is not particularly limited as long as the material has appropriate oxidation resistance. For example, a metal such as a Mo alloy is used. Examples of the Mo alloy include MoNb which is an alloy of Mo and Nb. The thickness of the protective layers 62 and 67 is in the range of 10 to 30 nm, for example.

Laminated body Next, with reference to FIG. 13, the laminated body 50 as a base material for manufacturing the touch-panel sensor 30 prepared in this Embodiment is shown. The laminated body 50 includes a transparent base film 32, a first transparent conductive layer 52 a laminated on the surface 32 a on one side of the base film 32, and a surface 32 b on the other side of the base film 32. A laminated second transparent conductive layer 52b having translucency, a first coated conductive layer 54a laminated on the first transparent conductive layer 52a, and a second coated conductive layer laminated on the second transparent conductive layer 52b 54b.

  Among these, as shown in FIG. 13, the covering conductive layers 54a and 54b are intermediate layers 61 and 66 provided on the transparent conductive layers 52a and 52b, and high conductive layers 63 and 66 provided on the intermediate layers 61 and 66, respectively. 68 and protective layers 62 and 67 provided on the highly conductive layers 63 and 68. By patterning such covered conductive layers 54a and 54b, the aforementioned extraction conductors 43 and 48 are formed.

  The touch panel sensor 30 is manufactured by performing processing (processing) such as film formation and patterning on the stacked body 50. In the present embodiment, when the highly conductive layers 63 and 68 are made of an APC alloy and the intermediate layers 61 and 66 and the protective layers 62 and 67 are made of MoNb, the highly conductive layers 63 and 68, the intermediate layers 61 and 66, and the protective layer are protected. Layers 62 and 67 can be etched with the same etchant, such as phosphorous nitric acid. For this reason, it is possible to perform patterning of the covering conductive layers 54a and 54b including the intermediate layers 61 and 66, the high conductive layers 63 and 68, and the protective layers 62 and 67 with a single etching solution. Other processing (processing) methods such as film formation and patterning are substantially the same as those in the first embodiment shown in FIGS. 1 to 10, and a detailed description thereof will be omitted.

  As described above, according to the present embodiment, the extraction conductors 43 and 48 include the intermediate layers 61 and 66 provided on a part of the transparent conductors 40 and 45 and spaced from the base film 32, and the first intermediate Highly conductive layers 63 and 68 provided on the layers 61 and 66 are included. Among these, the highly conductive layers 63 and 68 are made of a material having higher conductivity (electrical conductivity) than the material forming the transparent conductors 40 and 45 and the intermediate layers 61 and 66, for example, silver alloy, The intermediate layers 61 and 66 are made of a material that has a higher adhesive force between the transparent conductors 40 and 45 than the high conductive layers 63 and 68, such as a MoNb alloy. Therefore, the conductivity of the extraction conductors 43 and 48 can be increased as compared with the case where chromium or the like, which is a general wiring material, is used as the extraction conductor, and the extraction conductors 43 and 48 and the transparent conductor Appropriate adhesion between the bodies 40 and 45 can be realized.

DESCRIPTION OF SYMBOLS 10 Input / output device 15 Display device 20 Touch panel device 30 Touch panel sensor 32 Base film 32a surface (surface on one side)
32b surface (surface on the other side)
33 Film body 34 Functional membrane (index matching membrane)
34a High refractive index film 34b Low refractive index film 35 Functional film (low refractive index film)
37a sensor electrode 37b extraction wiring 40 first transparent conductor 41 first sensor portion 41a line portion 41b bulging portion 42 first terminal portion 43 first extraction conductor 45 second transparent conductor 46 second sensor portion 46a line portion 46b Swelling portion 47 Second terminal portion 48 Second extraction conductor 50 Laminate (blanks)
52a First transparent conductive layer 52b Second transparent conductive layer 54a First covering conductive layer (first light shielding conductive layer)
54b Second covering conductive layer (second light shielding conductive layer)
56a First photosensitive layer 56b Second photosensitive layer 56c Third photosensitive layer (further photosensitive layer)
56d Fourth photosensitive layer (further photosensitive layer)
58a First mask (first photomask)
58b Second mask (second photomask)
58c Third mask (third photomask)
58d Fourth mask (fourth photomask)
61 1st intermediate layer 62 1st protective layer 63 1st highly conductive layer 66 2nd intermediate layer 67 2nd protective layer 68 2nd highly conductive layer

Claims (11)

The coated conductive layer side of the laminate having a transparent substrate film, a transparent conductive layer provided on one surface of the substrate film, and a coated conductive layer provided on the transparent conductive layer Forming a photosensitive layer having photosensitivity on the surface of
Exposing the photosensitive layer;
Developing and patterning the photosensitive layer; and
Etching the coated conductive layer using the patterned photosensitive layer as a mask to pattern the coated conductive layer;
Etching the transparent conductive layer using the patterned photosensitive layer and the patterned coated conductive layer as a mask to pattern the transparent conductive layer;
Removing the patterned photosensitive layer;
Forming a further photosensitive layer on the patterned coated conductive layer;
Exposing the further photosensitive layer;
Developing and patterning the further photosensitive layer;
Etching the patterned coated conductive layer using the patterned additional photosensitive layer as a mask to remove a portion of the patterned coated conductive layer; and removing the patterned additional photosensitive layer; A method for manufacturing a touch panel sensor, comprising: 2. The method for manufacturing a touch panel sensor according to claim 1, wherein the covering conductive layer is formed of a material having a higher conductivity than a material forming the transparent conductive layer. A step of proceeding crystallization of the amorphous transparent conductive layer by performing an annealing treatment,
The step of promoting crystallization of the transparent conductive layer is performed after the step of patterning the transparent conductive layer and before the step of removing a part of the patterned covered conductive layer. The manufacturing method of the touch-panel sensor of Claim 1 or 2. The method for manufacturing a touch panel sensor according to claim 3, wherein the covering conductive layer contains silver as a main component. The covering conductive layer includes an intermediate layer provided on the transparent conductive layer, and a highly conductive layer provided on the intermediate layer,
The highly conductive layer is formed of a material having a higher conductivity than the material forming the transparent conductor and the intermediate layer,
The method for manufacturing a touch panel sensor according to claim 1, wherein the intermediate layer is made of a material that has a greater adhesion to the transparent conductor than the highly conductive layer. The highly conductive layer is made of a silver alloy,
The touch panel sensor manufacturing method according to claim 5, wherein the intermediate layer is formed of a MoNb alloy. In the step of patterning the coated conductive layer, an alignment mark is formed on the coated conductive layer,
7. The step of exposing the further photosensitive layer, wherein a mask for exposing the further photosensitive layer is positioned with reference to an alignment mark formed on the coated conductive layer. A method for manufacturing the touch panel sensor according to claim 1. A laminate used to produce a touch panel sensor,
A transparent base film,
A transparent conductive layer provided on one side of the base film;
And a covering conductive layer provided on the transparent conductive layer. The laminated body according to claim 8, wherein the covering conductive layer is formed of a material having a higher conductivity than a material forming the transparent conductive layer. The covering conductive layer includes an intermediate layer provided on the transparent conductive layer, and a highly conductive layer provided on the intermediate layer,
The highly conductive layer is formed of a material having a higher conductivity than the material forming the transparent conductor and the intermediate layer,
The laminate according to claim 8, wherein the intermediate layer is formed of a material that has a greater adhesion to the transparent conductor than the highly conductive layer. The highly conductive layer is made of a silver alloy,
The laminate according to claim 10, wherein the intermediate layer is made of a MoNb alloy.

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