JP2008134975A - Input device and its manufacturing method - Google Patents

Input device and its manufacturing method Download PDF

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Publication number
JP2008134975A
JP2008134975A JP2006322335A JP2006322335A JP2008134975A JP 2008134975 A JP2008134975 A JP 2008134975A JP 2006322335 A JP2006322335 A JP 2006322335A JP 2006322335 A JP2006322335 A JP 2006322335A JP 2008134975 A JP2008134975 A JP 2008134975A
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Japan
Prior art keywords
connection terminal
electrode
formed
substrate
external connection
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Pending
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JP2006322335A
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Japanese (ja)
Inventor
Mutsumi Abe
睦 阿部
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Optrex Corp
オプトレックス株式会社
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Priority to JP2006322335A priority Critical patent/JP2008134975A/en
Publication of JP2008134975A publication Critical patent/JP2008134975A/en
Application status is Pending legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an input device favorably connecting one connection substrate on which a connection terminal is formed on one side. <P>SOLUTION: This input device comprises an X-electrode 31 formed on a first side of a transparent substrate 30, an X-external connection terminal 37 formed on the first side of the transparent substrate 30 and connected to the X-electrode 31, an insulating layer 33 formed so as to cover the X-electrode 31, a Y-electrode 32 formed on the insulating layer 33, an electrode substrate 13 having a Y-external connection terminal 39 formed on the first side of the transparent substrate 30 and connected to the Y-electrode 32, and a connection substrate 15 having an X-connection terminal connected to the X-external connection terminal 37 and a Y-connection terminal connected to the Y-external connection terminal 39 on one side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an input device and a method for manufacturing the same, for example, a capacitance type input device that detects a position where a finger or the like is in contact based on a change in capacitance between a conductor and an electrode, and a method for manufacturing the same. About.

  In recent years, a capacitive touch panel that performs an input operation such as selecting a desired function by directly touching a user's finger has been put into practical use (see, for example, Patent Document 1). A capacitive touch panel that is an input device generally includes a pair of electrodes arranged at intervals, and the pair of electrodes generated when a user's finger approaches the pair of electrodes. The input by the user is recognized by detecting the change in the capacitance between them.

  This capacitive touch panel includes, for example, an electrode substrate in which a plurality of X electrodes and Y electrodes made of a transparent conductive film for detecting a contact position are provided on both surfaces of a transparent substrate made of glass or the like, and an electrode It is comprised from the cover bonded together by the transparent adhesive material to the contact surface side of the board | substrate. The surface of the cover becomes an operation surface with which a finger contacts during operation. Further, the X electrode and the Y electrode respectively provided on both surfaces of the electrode substrate are formed so as to cross each other.

In the input device configured as described above, when the user's finger is brought into contact with an arbitrary position on the surface of the cover placed on the electrode substrate, the electric lines of force go around from the X electrode to the Y electrode. Is absorbed by the user's finger, and the lines of electric force absorbed by the Y electrode are reduced to change the capacitance. Based on the current output value of the electrode substrate that changes in accordance with the capacitance change, the coordinate position where the finger is brought into contact is detected.
JP-A-8-147092

  FIG. 7 shows a configuration of an electrode substrate used for a conventional touch panel. As shown in FIG. 7, an X electrode 101 and a Y electrode 102 are formed on the front and back surfaces of the substrate 100, respectively. A connection wiring routed to one side of the substrate 100 is connected to the X electrode 101 formed on the surface of the substrate 100, and an external connection terminal 103 is formed at an end of the connection wiring. On the other hand, the Y electrode 102 formed on the back surface of the substrate 100 is connected to a connection wiring routed to a side different from the side where the external connection terminal 103 is formed, and an external connection is provided at the end of the connection wiring. A terminal 104 is formed.

  In order to supply a power supply voltage, a display signal, and the like from the outside, connection boards 105 and 106 mounted with a drive circuit and the like are connected to the external connection terminals 103 and 104, respectively. Normally, in the substrate 100 having electrodes formed on both sides, the connection substrate 105 is connected to the external connection terminal 103 formed on one surface, and then the connection substrate 106 is connected to the external connection terminal 104 on the other surface. For this reason, there is a problem that the process of connecting the connection substrate to the substrate 100 takes time and productivity is lowered. Further, since it is necessary to connect the connection substrates 105 and 106 one on each side of the substrate 100, the cost increases.

  In order to make the two connection boards into one, a connection terminal is provided at a predetermined position on both sides of one connection board, and connected to the external connection terminals 103 and 104 formed on both sides of the board 100, respectively. It is also possible to take However, in this case, after connecting the connection substrate to one surface, when connecting to the other surface, the connection substrate is pulled to the back surface side of the substrate 100, and the connection reliability may be reduced. There is.

  The present invention has been made against the background of such circumstances, and an object of the present invention is to provide an input device that can satisfactorily connect one connection board having a connection terminal formed on one surface thereof, and the input device. It is to provide a manufacturing method.

  An input device according to a first aspect of the present invention includes a first electrode formed on a first surface of a substrate, and a first external formed on the first surface side of the substrate and connected to the first electrode. A connection terminal, an insulating layer formed to cover the first electrode, a second electrode formed on the insulating layer, and formed on the first surface side of the substrate and connected to the second electrode An electrode substrate having a second external connection terminal, a first connection terminal connected to the first external connection terminal, and a second connection terminal connected to the second external connection terminal on one surface side. And a connection board having the same. Thereby, the connection board | substrate with which the connection terminal was formed in one surface can be connected favorably.

  The input device according to a second aspect of the present invention is the above input device, further comprising a connection pad formed on the first external connection terminal and extending the first external connection terminal to the insulating layer. The first connection terminal is electrically connected to the first external connection terminal via the connection pad. Thereby, the difference of each height of the connection part connected with a connection board | substrate can be decreased, and the reliability of a connection with a connection board | substrate can be improved.

  The input device according to a third aspect of the present invention is the above input device, wherein the second external connection terminal is formed on the insulating layer. Thereby, the height of the first external connection terminal and the second external connection terminal can be made uniform, and the reliability of connection with the connection substrate can be improved.

  The input device according to a fourth aspect of the present invention is the above input device, wherein the insulating layer is not formed on the first external connection terminal. As a result, it is possible to prevent a decrease in the connection reliability of the connection substrate due to the peeling between the first electrode and the insulating layer and between the second electrode and the insulating layer.

  The input device according to a fifth aspect of the present invention is the above input device, wherein the insulating layer is made of a resist material used when forming the first electrode or the second electrode. Thereby, the increase in manufacturing cost can be suppressed.

  The input device according to a sixth aspect of the present invention is the above input device, wherein the first external connection terminal and the second external connection terminal are formed on the same side of the substrate. Thereby, narrowing of a frame area | region is realizable.

  In the input device manufacturing method according to the seventh aspect of the present invention, a first conductive film is formed on a first surface of a substrate, the first conductive film is patterned, and a first electrode and a first external connection terminal are formed. Forming an insulating layer on the first electrode, forming a second conductive film on the insulating layer, and patterning the second conductive film to form a second electrode and a second external connection terminal Then, a connection board having a first connection terminal connected to the first external connection terminal and a second connection terminal connected to the second external connection terminal on the same surface is connected to the board. Thereby, the connection board | substrate with which the connection terminal was formed in one surface can be connected favorably.

  An input device manufacturing method according to an eighth aspect of the present invention is the above manufacturing method, wherein the second electrode and the second external connection terminal are formed simultaneously with the first external connection terminal on the first external connection terminal. A connection pad is formed to extend the connection terminal over the insulating layer. Thereby, the difference in height between the connection portions connected to the connection substrate can be reduced, and the connection reliability of the connection substrate can be improved.

  An input device manufacturing method according to a ninth aspect of the present invention is the above manufacturing method, wherein the insulating layer is formed using a resist material. Thereby, the increase in manufacturing cost can be suppressed.

  According to the present invention, it is possible to provide an input device that can satisfactorily connect one connection board having a connection terminal formed on one surface, and a method for manufacturing the same.

  Hereinafter, embodiments to which the present invention can be applied will be described. The following description explains the embodiment of the present invention, and the present invention is not limited to the following embodiment.

  An embodiment of the present invention will be described with reference to FIG. FIG. 1 is a diagram illustrating an example of the configuration of the input device according to the first embodiment. As shown in FIG. 1, the input device according to the present embodiment includes a display element 20 and a touch panel 10 arranged on the viewing side of the display element 20. The touch panel 10 includes a cover 11, an adhesive layer 12, and an electrode substrate 13 in order from the viewing side. The display element 20 and the touch panel 10 are bonded together by the adhesive layer 14. In the present embodiment, the display element 20 is, for example, a liquid crystal display element, and includes a polarizing plate 26, a counter substrate 24, a TFT array substrate 23, a polarizing plate 25, and a backlight unit 22 in order from the viewing side. Yes.

  First, the configuration of the display element 20 will be described. Here, an active matrix liquid crystal display element will be described as an example of a display element. Of course, the display element 20 is not limited to an active matrix liquid crystal display element, and may be a passive matrix liquid crystal display element. Furthermore, the display element 20 is not limited to a liquid crystal display element, and may be another display element such as an organic EL display element.

  The display element 20 performs image display based on the input display signal. The display element 20 includes a liquid crystal display panel 21 and a backlight unit 22. The liquid crystal display panel 21 has a configuration in which liquid crystal (not shown) is sealed between the counter substrate 24 and the TFT array substrate 23. The counter substrate 24 and the TFT array substrate 23 are made of a transparent glass substrate, for example.

  A plurality of scanning lines are formed on the TFT array substrate 23 at regular intervals. A plurality of signal lines are formed at regular intervals on the scanning lines. The scanning line and the signal line are arranged so as to intersect with each other through an insulating film. A thin film transistor (TFT) as a switching element is formed in the vicinity of the intersection of the scanning line and the signal line. A display signal is supplied from the signal line to the pixel electrode via the TFT. The pixel electrode is formed of a transparent conductive film such as ITO (Indium Tin Oxide), for example. The display area 27 of the liquid crystal display panel 21 is composed of a plurality of pixels arranged in a matrix. The display area 27 is usually formed in a rectangular shape. Further, the liquid crystal display panel 21 is provided with a frame area 28 provided so as to surround the display area 27.

  On the counter substrate 24, for example, a color filter including a black matrix (BM) and R, G, and B colored layers is formed. Each colored layer is formed between BMs and corresponds to a pixel. A counter electrode made of a transparent conductive film such as ITO is formed on the colored layer and BM. Such a TFT array substrate 23 and the counter substrate 24 are bonded to each other through a sealing material (not shown).

  Further, a drive circuit (not shown) is connected to the frame region 28 of the liquid crystal display panel 21. The drive circuit outputs various control signals, scan voltages, display voltages, and the like necessary for image display based on display signals input from the outside. The drive circuit may be mounted on the end of the TFT array substrate 23 by COG (Chip On Glass). The alignment state of the liquid crystal changes depending on the voltage between the pixel electrode and the counter electrode. Thereby, the amount of light transmitted through the liquid crystal display panel 21 is adjusted, and display can be performed.

  Polarizing plates 25 and 26 are attached to the outer surfaces of the TFT array substrate 23 and the counter substrate 24, respectively. Thereby, the liquid crystal display panel 21 is formed. Specifically, a polarizing plate 25 is bonded to the surface of the TFT array substrate 23 on the non-viewing side. A polarizing plate 26 is bonded to the surface on the viewing side of the counter substrate 24. The polarizing plate 26 and the polarizing plate 25 each have an absorption axis in a predetermined direction. Therefore, the light passing through the polarizing plate 26 or the polarizing plate 25 becomes linearly polarized light. Thus, the display element 20 includes the liquid crystal display panel 21 having a general configuration.

  A backlight unit 22 is provided on the back side of the liquid crystal display panel 21. The backlight unit 22 irradiates the liquid crystal display panel 21 with planar light from the non-viewing side of the liquid crystal display panel 21. As the backlight unit 22, for example, a unit having a general configuration including a light source, a light guide plate, a prism sheet, and the like is used.

  Next, the configuration of the touch panel 10 disposed on the viewing side of the display element 20 will be described. As described above, the touch panel 10 is a capacitive type. As shown in FIG. 1, the touch panel 10 includes a cover 11, an adhesive layer 12, an electrode substrate 13, a connection substrate 15, and the like.

  As shown in FIG. 1, a cover 11 is attached to the viewing side of the electrode substrate 13 with an adhesive layer 12. The cover 11 is made of, for example, a plastic plate having a thickness of 0.8 mm. An adhesive layer 12 is provided between the cover 11 and the electrode substrate 13. Note that the surface of the cover 11 serves as an operation surface with which a position indicator such as a finger contacts during operation.

  The adhesive layer 12 is, for example, a double-sided adhesive tape or an adhesive, and bonds the cover 11 and the electrode substrate 13 together. The adhesive layer 12 is formed of, for example, a transparent resin material having a thickness of 175 μm. The adhesive layer 12 is disposed on substantially the entire display area 27.

  One end of the electrode substrate 13 is connected to a connection substrate 15 such as a single FPC (Flexible Printed Circuit). The connection substrate 15 is attached to the surface on the viewing side of the electrode substrate 13. Input / output of signals to / from the electrode substrate 13 is performed by the connection substrate 15.

  The touch panel 10 thus formed is attached to the viewing side of the display element 20, that is, the display surface side by an adhesive layer 14. The adhesive layer 14 is, for example, a double-sided adhesive tape or an adhesive, and bonds the display element 20 and the electrode substrate 13 together. The adhesive layer 14 is formed of, for example, a transparent resin material having a thickness of 125 μm. The adhesive layer 14 is also disposed on substantially the entire display area 27.

  Here, the operation of the touch panel 10 will be described. A first electrode and a second electrode are formed on the first surface side of the transparent substrate 30, and a fixed capacitance is formed at each intersection of the X electrode 31 that is the first electrode and the Y electrode 32 that is the second electrode. . When the user brings a finger or the like closer to the X electrode 31 in the effective area 34 from above the cover 11, the parasitic capacitance between the fingertip and the X electrode 31 and the parasitic capacitance of the human body are connected in parallel to the fixed capacitance. It becomes. As a result, the value of the combined capacitance changes, and the voltage of the electrodes at both ends of the fixed capacitance changes. By detecting this change in voltage with a detection circuit, the contacted position can be detected. When the user approaches an arbitrary position in the effective area 34 while the display element 20 is performing a predetermined display, processing based on the display is executed.

  Here, the configuration of the electrode substrate 13 will be described in detail with reference to FIGS. FIG. 2 is a diagram showing a configuration of the electrode substrate 13 used in the present embodiment. 3 is a cross-sectional view taken along line XX in FIG. 2, and FIG. 4 is a cross-sectional view taken along line YY in FIG. As shown in FIG. 2, the electrode substrate 13 has a transparent substrate 30. As the transparent substrate 30, a glass substrate or a film substrate made of plastic such as PET can be used.

  The first surface of the transparent substrate 30 may be a viewing side surface or a non-viewing side surface. Here, the surface on the opposite side of the transparent substrate 30 is defined as the first surface. A plurality of X electrodes 31 extending in parallel with each other in the horizontal direction are formed on the first surface on the viewing side of the transparent substrate 30. A plurality of Y electrodes 32 extending in parallel to each other in the vertical direction are formed on the first surface of the electrode substrate 13 that is the same as the surface on which the X electrodes 31 are formed so as to intersect the X electrodes 31. ing. Therefore, as shown in FIG. 2, the Y electrode 32 and the X electrode 31 are formed on the electrode substrate 13 so as to cross each other.

  As shown in FIGS. 3 and 4, an insulating layer 33 is formed between the X electrode 31 and the Y electrode 32. Therefore, the X electrode 31 and the Y electrode 32 are disposed so as to be orthogonal to each other with the insulating layer 33 interposed therebetween. That is, the X electrode 31 is formed on the transparent substrate 30, and the insulating layer 33 is formed on the X electrode 31 so as to cover the X electrode 31. A Y electrode 32 is formed on the insulating layer 33.

  A region where the X electrode 31 and the Y electrode 32 are formed becomes an effective area 34. This effective area 34 corresponds to the display area 27. Therefore, the effective area 34 is formed in the same rectangular shape as the display area 27 of the display element 20. A frame-shaped area outside the effective area 34 becomes a non-effective area 35.

  The X electrode 31 and the Y electrode 32 formed in the effective area 34 are made of, for example, ITO. Further, the conductive film is not limited to ITO, but may be other transparent conductive films such as IZO and ITZO. Therefore, the effective area 34 of the touch panel 10 is transparent, and the content displayed on the display element 20 can be confirmed via the touch panel 10 from the viewing side.

As the insulating layer 33, a resist material made of a photosensitive resin having a thickness of about several hundred μm can be used. In the present embodiment, as the insulating layer 33, as will be described later, the same resist material as that used when forming the X electrode 31 or the Y electrode 32 is used. Thereby, the increase in manufacturing cost can be suppressed. An inorganic insulating material such as SiO 2 may be used as long as the insulation between the X electrode 31 and the Y electrode 32 can be secured.

  As shown in FIG. 2, a plurality of X electrodes 31 are formed at regular intervals on the first surface on the viewing side of the transparent substrate 30. In the ineffective area 35, an X connection wiring 36 connected to the X electrode 31 is provided. The X connection wiring 36 is connected to the X electrode 31. Here, since six X electrodes 31 are connected, six X connection wirings 36 are formed. The numbers of the X electrodes 31 and the X connection wirings 36 are not limited to this.

  The X connection wiring 36 is connected to the X electrode 31 at the right end of the effective area 34 in FIG. The X connection wiring 36 extends to the right end of the electrode substrate 13. For example, the X connection wiring 36 is formed of the same transparent conductive film as the X electrode 32. Further, an X external connection terminal 37 that is a first external connection terminal is formed at an end of the X connection wiring 36.

  On the other hand, a plurality of Y electrodes 32 are formed at regular intervals on the same first surface of the transparent substrate 30 as the surface on which the X electrodes 31 are formed. In the non-effective area 35, a Y connection wiring 38 connected to the Y electrode 32 is formed. The Y connection wiring 38 is connected to the Y electrode 32. Here, since six Y electrodes 32 are connected, six Y connection wirings 38 are formed. The number of Y electrodes 32 and Y connection wirings 38 is not limited to this.

  The Y connection wiring 38 is connected to the Y electrode 32 at the lower end of the effective area 34. The Y connection wiring 38 extends from the lower end of the effective area 34 to the lower end of the transparent substrate 30. The Y connection wiring 38 is configured by the same transparent conductive film as the Y electrode 32, for example. That is, the Y connection wiring 38 extends from the Y electrode 32. A Y external connection terminal 39 as a second external connection terminal is formed at the end of the Y connection wiring 38. The Y external connection terminal 39 is formed at the end of a side different from the side where the X external connection terminal 37 of the transparent substrate 30 is formed.

  As shown in FIG. 3, the insulating layer 33 is not formed on the X external connection terminal 37 formed on the transparent substrate 30. That is, the insulating layer 33 is formed on the X electrode 31 and the X connection wiring 36. On the X external connection terminal 37, a connection pad 40 is formed to draw the X external connection terminal 37 over the insulating layer 33. The connection pad 40 is formed of the same material as the Y electrode 32 and the Y connection wiring 38. Thus, since the connection pad 40 is directly formed on the X external connection terminal 37, peeling between the X external connection terminal 37 and the connection pad 40 can be suppressed. On the other hand, as shown in FIG. 4, the Y external connection terminal 39 is formed on the insulating layer 33.

  It is also possible to form the insulating layer 33 on the X external connection terminal 37. In this case, a contact hole is provided in the insulating layer 33 so that the X external connection terminal 37 in the lower layer of the insulating layer 33 and the connection pad 40 in the upper layer can be made conductive.

  In addition, one connection substrate 15 is connected to the electrode substrate 13. An X connection terminal (not shown) connected to the X external connection terminal 37 and a Y connection terminal (not shown) connected to the Y external connection terminal 39 are formed on the surface of the connection substrate 15 on the side opposite to the visual recognition side. Yes. That is, the X connection terminal and the Y connection terminal are formed on the same surface of the connection substrate 15. As shown in FIG. 2, in the present embodiment, the connection substrate 15 has an L-shape. An X connection terminal is formed on the side corresponding to the right end of the transparent substrate 30 of the connection substrate 15, and a Y connection terminal is formed on the side corresponding to the lower end of the transparent substrate 30.

  As described above, the connection pad 40 is formed on the X external connection terminal 37. The X connection terminals of the connection board 15 are arranged to face the connection pads 40. The X connection terminal of the connection board 15 is connected to the X external connection terminal 37 through the connection pad 40. Further, the Y connection terminal of the connection board 15 is formed to face the Y external connection terminal 39. The X external connection terminal 37 and the X connection terminal of the connection board 15, and the Y external connection terminal 39 and the Y connection terminal of the connection board 15 are made of ACF (Anisotropic Conductive Film) as widely used conventionally. It is connected by thermocompression bonding.

  Thus, the X external connection terminal 37 and the Y external connection terminal 39 can be formed on the same surface of the transparent substrate 30. For this reason, it is not necessary to connect one connection board to each of the X external connection terminal 37 and the Y external connection terminal 39, thereby improving the productivity and reducing the cost. Moreover, since the connection board | substrate 15 in which the 1st connection terminal and the 2nd connection terminal were formed in the same surface can be used, the cost of the connection board | substrate 15 itself can also be reduced.

  Conventionally, after connecting a connection board to an external connection terminal formed on one side, the connection board is connected to an external connection terminal on the other side. For this reason, if the connection board with the connection terminals provided on both sides is connected, the connection board is pulled to the other side when connecting to the other side after connecting to one side. There was a possibility that the property would be lowered. However, according to the present invention, since the first connection terminal and the second connection terminal of the connection substrate 15 can be formed on the same surface, the previously connected portion is pulled at the time of the subsequent connection, and the connection reliability is increased. It is possible to solve the problem that the performance decreases.

  In addition, each connection portion (connection pad 40, Y external connection terminal 39) connected to the connection substrate 15 is formed on the insulating layer 33. For this reason, the difference of the height of each connection part can be made small, and the reliability of a connection can be improved. If the difference in height between the X external connection terminal 37 and the Y external connection terminal 39 does not cause a problem when the connection board 15 is connected, the connection pad 40 may not be provided. That is, the X external connection terminal 37 and the connection substrate 15 can be connected.

  Here, with reference to FIG. 5, the manufacturing method of the above-mentioned two-layer type input device will be described. FIG. 5 is a flowchart for explaining the manufacturing method of the input device according to the present embodiment. First, the X electrode 31 is formed on the transparent substrate 30 (step S1). Specifically, a transparent conductive film is formed over the entire surface of the transparent substrate 30, and the conductive film is patterned using a resist material. Thereby, the X electrode 31, the X connection wiring 36, and the X external connection terminal 37 are formed on the transparent substrate 30. Then, the resist material used for forming the X electrode 31 and the like is removed using an organic solvent or the like.

  Next, the insulating layer 33 is formed on the X electrode and the X connection wiring 36 (step S2). Specifically, the insulating layer 33 is formed by applying the resist material used when forming the previous X electrode 31. Further, the insulating layer 33 is not formed on the X external connection terminal 37.

  Thereafter, the Y electrode 32 is formed on the insulating layer 33 (step S3). Specifically, a transparent conductive film is formed over the entire surface of the insulating layer 33, and the conductive film is patterned using a resist material. As a result, the Y electrode 32, the Y connection wiring 38, and the Y external connection terminal 39 are formed on the insulating layer 33. At the same time, the connection pad 40 is formed on the X external connection terminal 37. That is, the connection pad 40 is formed of the same material as the Y electrode 32 and the like.

  Then, the resist material used for forming the Y electrode 32 and the like is removed using an organic solvent or the like. At this time, the insulating layer 33 formed between the X electrode 31 and the Y electrode 32 is not removed because the Y electrode 32 and the like are formed in the upper layer. Therefore, the insulating layer 33 is formed below the region where the Y electrode 32 and the Y connection wiring 38 are formed. Thus, the X external connection terminal 37 and the Y external connection terminal 39 are formed on one surface side of the transparent substrate 30.

  Thereafter, the connection substrate 15 is connected on the transparent substrate 30 (step S4). As described above, the X external connection terminal 37 and the Y external connection terminal 39 are formed on the same surface of the transparent substrate 30. For this reason, the connection substrate 15 in which the X connection terminal and the Y connection terminal are formed on one surface can be used. Specifically, the X connection terminal of the connection substrate 15 is disposed via the ACF so as to face the X external connection terminal 37 formed on the transparent substrate 30. Further, the Y connection terminal of the connection substrate 15 is arranged via the ACF so as to face the Y external connection terminal 39 formed on the transparent substrate 30. And each connection part is thermocompression-bonded, for example using an L-shaped heater bar. Thereby, the connection substrate 15 is fixed to the transparent substrate 30, and the X external connection terminal 37 and the X connection terminal of the connection substrate 15 are electrically connected to each other, and the Y external connection terminal 39 and the Y connection terminal of the connection substrate 15 are electrically connected.

  Then, the cover 11 is bonded to the X electrode 31 and Y electrode formation surface side of the electrode substrate 13 with the adhesive layer 12 (step S5). Thereafter, the display device 20 and the touch panel 10 are bonded together by the adhesive layer 14 (step S6), thereby completing the input device. As described above, according to the present invention, it is possible to satisfactorily connect one connection substrate having a connection terminal on one surface to an electrode substrate having two layers of electrodes.

  In addition, as a formation position of an external connection terminal, it is not restricted to the above-mentioned example. For example, the Y external connection terminal 39 and the X external connection terminal 37 formed on the front surface and the back surface of the transparent substrate 30 may be formed on the same side of the transparent substrate 30. FIG. 6 shows another configuration of the electrode substrate 13 according to the embodiment. As shown in FIG. 6, the X connection wiring 36 is connected to the X electrode 31 at the right end or the left end of the effective area 34. The X connection wiring 36 extends from the right end or the left end of the effective area 34 to the lower side of the transparent substrate 30. An X external connection terminal 37 is formed at the end of the X connection wiring 36.

  The X external connection terminal 37 is formed on the same first surface, and is formed at an end of one side of the electrode substrate 13 where the Y external connection terminal 39 is formed. The Y external connection terminal 39 is arranged so as not to overlap the X external connection terminal 37. That is, the X external connection terminal 37 is provided on the end side of the electrode substrate 13 where the Y external connection terminal 39 is formed, and is shifted from the region where the Y external connection terminal 39 is formed along the end side. . Here, the X external connection terminals 37 are formed at both ends of the region where the Y external connection terminals 39 are formed.

  Even in such a case, the insulating layer 33 is formed between the X electrode 31 and the Y electrode 32 as described above. Thus, by forming the Y external connection terminal 39 and the X external connection terminal 37 on the same side of the transparent substrate 30, an increase in the ineffective area 35 in which the external connection terminals are formed can be prevented. For this reason, the number of panels to be taken from the mother substrate can be increased, and the productivity can be improved.

It is a figure which shows an example of a structure of the liquid crystal display device which concerns on embodiment. It is a figure which shows an example of a structure of the electrode substrate which concerns on embodiment. It is XX sectional drawing of FIG. It is YY sectional drawing of FIG. It is a flowchart which shows the manufacturing method of the liquid crystal display device which concerns on embodiment. It is a figure which shows the other example of a structure of the electrode substrate which concerns on embodiment. It is a figure which shows the structure of the conventional electrode substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Touch panel 11 Cover 12, 14 Adhesive layer 13 Electrode substrate 15 Connection substrate 21 Liquid crystal display panel 22 Backlight unit 23 TFT array substrate 24 Opposite substrate 25, 26 Polarizing plate 30 Transparent substrate 31 X electrode 32 Y electrode 33 Insulating layer 34 Effective area 35 Non-effective area 36 X connection wiring 37 X external connection terminal 38 Y connection wiring 39 Y external connection terminal 40 connection pad

Claims (9)

  1. A first electrode formed on the first surface of the substrate;
    A first external connection terminal formed on the first surface side of the substrate and connected to the first electrode;
    An insulating layer formed to cover the first electrode;
    A second electrode formed on the insulating layer;
    A second external connection terminal formed on the first surface side of the substrate and connected to the second electrode;
    An electrode substrate having
    An input device comprising: a connection board having a first connection terminal connected to the first external connection terminal and a second connection terminal connected to the second external connection terminal on one surface side.
  2. A connection pad formed on the first external connection terminal and extending the first external connection terminal to the insulating layer;
    The input device according to claim 1, wherein the first connection terminal is electrically connected to the first external connection terminal via the connection pad.
  3.   The input device according to claim 1, wherein the second external connection terminal is formed on the insulating layer.
  4.   The input device according to claim 1, wherein the insulating layer is not formed on the first external connection terminal.
  5.   The input device according to claim 1, wherein the insulating layer is made of a resist material that is used when the first electrode or the second electrode is formed.
  6.   The input device according to claim 1, wherein the first external connection terminal and the second external connection terminal are formed on the same side of the substrate.
  7. Forming a first conductive film on the first surface of the substrate;
    Patterning the first conductive film to form a first electrode and a first external connection terminal;
    Forming an insulating layer on the first electrode;
    Forming a second conductive film on the insulating layer;
    Patterning the second conductive film to form a second electrode and a second external connection terminal;
    A method for manufacturing an input device, wherein a connection board having a first connection terminal connected to the first external connection terminal and a second connection terminal connected to the second external connection terminal on the same surface is connected to the board.
  8.   The connection pad which extends the said 1st external connection terminal on the said insulating layer is formed on the said 1st external connection terminal simultaneously with forming the said 2nd electrode and the said 2nd external connection terminal. Method for manufacturing the input device.
  9.   The method for manufacturing an input device according to claim 7, wherein the insulating layer is formed using a resist material.
JP2006322335A 2006-11-29 2006-11-29 Input device and its manufacturing method Pending JP2008134975A (en)

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