JP2011114315A - Liquid immersion member, lithography apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid immersion member that can control generation of poor exposure. <P>SOLUTION: The immersion member is arranged at least part of a circumference of an optical path of exposure light radiated to an object, and includes: a first surface which holds a liquid in a space with the object and forms a liquid immersion space so that the optical path may be filled with the liquid; a first air inlet which is arranged on the outside of the first surface about a radiation direction to an optical path, and supplies gas to a first space which the first surface faces by a first flow rate; and a second air inlet which supplies gas to at least part of a circumference of the gas supplied from the first air inlet by a second flow rate quicker than that of the first flow rate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a liquid immersion member, an exposure apparatus, an exposure method, and a device manufacturing method.

  As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.

US Patent Application Publication No. 2005/259234

  In an immersion exposure apparatus, when an immersion space is formed on an object such as a substrate, for example, when moving the object at a high speed or moving a long distance, the liquid flows out or the liquid is placed on the object. (Film, droplets, etc.) may remain. As a result, an exposure failure may occur or a defective device may occur.

  An object of an aspect of the present invention is to provide a liquid immersion member, an exposure apparatus, and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, the liquid is placed in at least a part of the periphery of the optical path of the exposure light irradiated on the object, and the liquid is held between the object and the liquid so that the optical path is filled with the liquid. A first surface that forms a space, a first air supply port that is disposed outside the first surface with respect to the radiation direction with respect to the optical path, and that supplies gas at a first flow rate to the first space facing the first surface; A liquid immersion member is provided that includes a second air supply port that supplies a gas at a second flow rate faster than the first flow rate to at least a part of the periphery of the gas supplied from the air supply port.

  According to the second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the liquid immersion member of the first aspect.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the second aspect and developing the exposed substrate.

  According to a fourth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein the optical path of the exposure light between the exit surface of the optical member and the surface of the substrate is filled with the liquid. Forming the immersion space in this manner, exposing the substrate with the exposure light from the exit surface through the liquid in the immersion space, and entering the liquid interface in the immersion space from the outside in the radial direction with respect to the optical path. There is provided an exposure method including supplying a gas at a first flow rate and supplying a gas at a second flow rate higher than the first flow rate to at least a part of the periphery of the gas supplied at the first flow rate. The

  According to a fifth aspect of the present invention, there is provided a device manufacturing method comprising exposing a substrate using the exposure method of the fourth aspect and developing the exposed substrate.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a sectional side view which shows an example of the liquid immersion member which concerns on 1st Embodiment. It is the top view which looked at the liquid immersion member concerning a 1st embodiment from the lower part. FIG. 3 is a side sectional view showing a part of the liquid immersion member according to the first embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. FIG. 6 is a diagram illustrating an example of the operation of the liquid immersion member according to the first embodiment. FIG. 6 is a diagram illustrating an example of the operation of the liquid immersion member according to the first embodiment. FIG. 6 is a side sectional view showing a part of a liquid immersion member according to a second embodiment. It is the top view which looked at the liquid immersion member concerning a 3rd embodiment from the lower part. It is the top view which looked at the liquid immersion member concerning a 3rd embodiment from the lower part. It is the top view which looked at the liquid immersion member concerning a 3rd embodiment from the lower part. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

    Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the exposure apparatus EX is a liquid that forms the immersion space LS by holding the liquid LQ with the substrate P so that the optical path K of the exposure light EL irradiated to the substrate P is filled with the liquid LQ. An immersion member 10 is provided. The immersion space is a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

    In FIG. 1, an exposure apparatus EX includes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and an illumination system IL that illuminates the mask M with exposure light EL. A projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P, a liquid immersion member 10 capable of forming the liquid immersion space LS, and a space CP including at least the optical path of the exposure light EL A chamber apparatus CH that adjusts the environment (at least one of temperature, humidity, pressure, and cleanliness) and a control apparatus 3 that controls the operation of the entire exposure apparatus EX.

    The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

    The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

    The mask stage 1 is movable on the guide surface 4G of the base member 4 including the illumination region IR while holding the mask M. The mask stage 1 is movable in six directions on the guide surface 4G, that is, the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions by the operation of the drive system. In the present embodiment, the drive system capable of moving the mask stage 1 includes a flat motor as disclosed in, for example, US Pat. No. 6,452,292. The planar motor includes a stator disposed on the base member 4 and a mover disposed on the mask stage 1.

    The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

    The substrate stage 2 is movable on the guide surface 5G of the base member 5 including the projection region PR while holding the substrate P. In the present embodiment, the substrate stage 2 holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel. The substrate stage 2 is movable in six directions on the guide surface 5G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system. In the present embodiment, the drive system capable of moving the substrate stage 2 includes a flat motor as disclosed in, for example, US Pat. No. 6,452,292. The planar motor includes a stator disposed on the base member 5 and a mover disposed on the substrate stage 2.

    In the present embodiment, the positions of the mask stage 1 and the substrate stage 2 are measured by an interferometer system 6 including laser interferometer units 6A and 6B. When performing exposure of the substrate P or when performing predetermined measurement, the control device 3 determines the mask stage 1 (mask M) and the substrate stage 2 (substrate P) based on the measurement result of the interferometer system 6. The position control is executed.

    The liquid immersion member 10 can form the liquid immersion space LS by holding the liquid LQ with the object so that the optical path K of the exposure light EL irradiated to the object arranged in the projection region PR is filled with the liquid LQ. It is. In the present embodiment, the liquid immersion member 10 is disposed in the vicinity of the terminal optical element 7 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL.

    The last optical element 7 has an exit surface 8 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, in the immersion space LS, the optical path K of the exposure light EL emitted from the emission surface 8 is filled with the liquid LQ between the terminal optical element 7 and the object arranged in the projection region PR. It is formed. In the present embodiment, the object that can be arranged in the projection region PR is an object that can move relative to the projection region PR on the image plane side (exit surface 8 side) of the projection optical system PL, and the substrate stage 2 and the substrate stage. 2 is included.

    In the present embodiment, the emission surface 8 faces the −Z direction. In the present embodiment, the emission surface 8 is substantially parallel to the XY plane. The exposure light EL emitted from the emission surface 8 travels in the −Z direction. That is, in the present embodiment, the traveling direction of the exposure light EL is the −Z direction. The exit surface 8 facing the -Z direction may be a convex surface protruding in the -Z direction or a concave surface.

    In the present embodiment, the liquid immersion member 10 has a lower surface 9 on which an object disposed in the projection region PR can face. The lower surface 9 faces the −Z direction. In the exposure of the substrate P, the surface of the substrate P faces at least a part of the lower surface 9 of the liquid immersion member 10. By holding the liquid LQ between the emission surface 8 and the lower surface 9 on one side and the surface (upper surface) of the object on the other side, the optical path K of the exposure light EL between the emission surface 8 and the object is liquid. An immersion space LS is formed so as to be filled with LQ.

    In the present embodiment, in the exposure of the substrate P, the immersion space LS is formed so that a partial region of the surface of the substrate P including the projection region PR is covered with the liquid LQ. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 9 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

    2 is a side sectional view showing an example of the liquid immersion member 10 according to the present embodiment, FIG. 3 is a plan view of the liquid immersion member 10 viewed from below, and FIG. 4 is an enlarged view of a part of FIG. It is. In the following description, the case where the substrate P is disposed at a position facing the emission surface 8 and the lower surface 9 will be described as an example, but other objects such as the substrate stage 2 may be disposed.

    The liquid immersion member 10 is disposed in at least a part of the periphery of the optical path K of the exposure light EL irradiated to the substrate P, and holds the liquid LQ with the substrate P so that the optical path K is filled with the liquid LQ. Gas is supplied at a first flow velocity V1 to the first surface 11 that forms the immersion space LS and the first space SP1 that is disposed outside the first surface 11 with respect to the radiation direction with respect to the optical path K and faces the first surface 11. A first air supply port 21, and a second air supply port 22 that supplies gas to at least a part of the periphery of the gas supplied from the first air supply port 21 at a second flow velocity V2 that is faster than the first flow velocity V1. It has.

  In the present embodiment, the liquid immersion member 10 includes a second surface 12 that is disposed on at least a part of the periphery of the first surface 11. Further, in the present embodiment, the liquid immersion member 10 includes a gap 30 at least at a part around the first surface 11. In the present embodiment, an opening 31 at the lower end of the gap 30 is disposed between the first surface 11 and the second surface 12. The opening 31 (gap portion 30) is disposed between the first surface 11 and the first air inlet 21 and the second air inlet 22.

  In the present embodiment, the liquid immersion member 10 includes a first member 101 at least partially disposed around the optical path K, and a second member disposed at least partially around the first member 101 via a gap. 102. In the present embodiment, the first member 101 is disposed away from the terminal optical element 7. The second member 102 is disposed away from the first member 101. In the present embodiment, the gap 30 includes a space between the first member 101 and the second member 102.

  In the present embodiment, the first surface 11 is disposed on the first member 101. The second surface 12 is disposed on the second member 102. Further, the first air supply port 21 and the second air supply port 22 are arranged in the second member 102.

  In the present embodiment, the first member 101 and the second member 102 are annular members. At least a part of the first member 101 is disposed so as to surround the terminal optical element 7. At least a part of the second member 102 is disposed so as to surround the first member 101. In the present embodiment, the first surface 11 is disposed around the optical path K. The second surface 12 is disposed around the optical path K and the first surface 11.

  The first surface 11 faces the −Z direction. The surface of the substrate P can face the first surface 11. In the present embodiment, the first surface 11 is substantially parallel to the XY plane. Note that at least a part of the first surface 11 may be a curved surface. Further, at least a part of the first surface 11 may be non-parallel to the XY plane. The second surface 12 faces the −Z direction. The surface of the substrate P can be opposed to the second surface 12. In the present embodiment, at least a part of the second surface 12 is substantially parallel to the XY plane. Note that the second surface 12 may be non-parallel to the XY plane. In the present embodiment, the lower surface 9 of the liquid immersion member 10 includes a first surface 11 and a second surface 12.

  In the present embodiment, the first surface 11 and at least a part of the second surface 12 are arranged at substantially the same position in the Z-axis direction. That is, the first surface 11 and at least a part of the second surface 12 are arranged in the same plane. Note that the distance between the first surface 11 and the surface of the substrate P may be different from the distance between the second surface 12 and the surface of the substrate P.

  In the present embodiment, the outer shape of the first surface 11 in the XY plane is a circle. The outer shape of the second surface 12 in the XY plane is also circular. The outer shape of the first surface 11 may be a shape other than a circle such as a rectangle. Further, the outer shape of the second surface 12 may be a shape other than a circle such as a rectangle. Further, the first surface 11 may be disposed at a part of the periphery of the optical path K. Moreover, the 2nd surface 12 may be arrange | positioned in a part of circumference | surroundings of the optical path K (1st surface 11).

  Further, the liquid immersion member 10 includes a supply port 41 that supplies the liquid LQ to the optical path K of the exposure light EL, and a recovery port 42 that recovers at least a part of the liquid LQ on the substrate P. In the present embodiment, the supply port 41 is disposed at a predetermined position of the first member 101 so as to face the optical path K. In the present embodiment, a plurality of supply ports 41 are arranged around the optical path K. The collection port 42 is disposed at a predetermined position of the first member 101 so as to face the substrate P.

  In the present embodiment, the liquid immersion member 10 includes a porous member 43 that is disposed in the recovery port 42 and has a plurality of holes 43H (openings or pores) through which the liquid LQ can flow. In the present embodiment, the porous member 43 is a plate-like member. The porous member 43 may be a mesh filter that is a porous member in which a large number of small holes are formed in a mesh shape. The porous member 43 has an upper surface 43A and a lower surface 43B facing the opposite direction of the upper surface 43A. The hole 43H of the porous member 43 is formed so as to connect the upper surface 43A and the lower surface 43B. The surface of the substrate P can face the lower surface 43 </ b> B of the porous member 43 disposed in the recovery port 42. In the present embodiment, the liquid LQ on the substrate P is collected through the hole 43H of the porous member 43. In the present embodiment, the lower end of the hole 43H functions as a recovery port that recovers at least a part of the liquid LQ of the substrate P.

  The liquid immersion member 10 has an opening 32 at a position facing the emission surface 8. The exposure light EL emitted from the emission surface 8 can pass through the opening 32. The first surface 11 is disposed around the opening 32. In the present embodiment, the first surface 11 is disposed around the optical path K of the exposure light EL emitted from the emission surface 8. The first surface 11 may be disposed at a part of the periphery of the optical path K. The exposure light EL emitted from the emission surface 8 can pass through the opening 32 and irradiate the substrate P.

  In the present embodiment, the first surface 11 is disposed on the outer surface of the flat surface 18 disposed at least partially around the optical path K and the flat surface 18 with respect to the radiation direction with respect to the optical path K, and the lower end of the hole 43H is disposed. The lower surface 43B of the porous member 43 and the flat surface 19 disposed outside the lower surface 43B in the radiation direction with respect to the optical path K are included. The first surface 11 holds the liquid LQ between the surface of the substrate P and the immersion space so that the optical path K of the exposure light EL between the emission surface 8 and the surface of the substrate P is filled with the liquid LQ. LS can be formed.

  In the present embodiment, the flat surface 18 is disposed around the opening 32. Around the flat surface 18, the lower surface 43 </ b> B of the porous member 43 disposed in the recovery port 42 is disposed. A flat surface 19 is disposed around the lower surface 43.

  In the present embodiment, the outer shape of the flat surface 18 in the XY plane is a circle. The outer shape of the lower surface 43B in the XY plane is also circular. The outer shape of the flat surface 19 in the XY plane is also circular. Note that the outer shape of the flat surface 18 may be a shape other than a circle, such as a quadrangle or an octagon. Further, at least one of the outer shape of the lower surface 43B and the outer shape of the flat surface 19 may be a shape other than a circle, such as a quadrangle or an octagon. Further, the outer shape of the flat surface 18, the outer shape of the lower surface 43B, and the outer shape of the flat surface 19 may be different.

  In the present embodiment, the recovery operation of the liquid LQ from the recovery port 42 is executed in parallel with the supply operation of the liquid LQ from the supply port 41, thereby exposing light between the emission surface 8 and the substrate P. The immersion space LS is formed so that the EL optical path K is filled with the liquid LQ. In the present embodiment, the interface LG of the liquid LQ in the immersion space LS between the immersion member 10 and the substrate P is between the first surface 11 of the immersion member 10 (first member 101) and the surface of the substrate P. Arranged between. In other words, the interface LG is disposed in the first space SP1.

  The second surface 12 is disposed around the first surface 11 such that an opening 31 is formed between the second surface 12 and the outer edge of the first surface 11 (flat surface 19). The opening 31 at the lower end of the gap portion 30 is disposed between the outer edge of the first surface 11 (flat surface 19) and the inner edge of the second surface 12. In the present embodiment, the shape of the opening 31 in the XY plane is annular. A plurality of openings 31 may be arranged around the optical path K at a predetermined interval. At least a part of the surface of the substrate P arranged in the projection region PR faces the opening 31.

  The first air supply port 21 supplies gas to the first space SP1 between the first surface 11 and the substrate P. In the present embodiment, at least a part of the first air supply port 21 is disposed on the second surface 12. The first air supply port 21 is disposed on the −Z side with respect to the first surface 11. Note that the first air inlet 21 and the first surface 11 may be disposed at substantially the same position (height) in the Z-axis direction.

  The first air supply port 21 supplies gas to the second space SP2 between the second surface 12 and the surface of the substrate P. At least a part of the gas supplied from the first air supply port 21 to the second space SP2 flows between the second surface 12 and the surface of the substrate P, and is supplied to the first space SP1.

  In the present embodiment, the first air inlet 21 is disposed at least at a part around the optical path K. In the present embodiment, the first air supply port 21 is a slit-like opening arranged so as to surround the optical path K. In the XY plane, the first air supply port 21 is annular. In the present embodiment, the first air supply port 21 has an annular shape. In the present embodiment, the outer shape of the flat surface 18 in the XY plane is circular, and the first air supply port 21 is arranged in an annular shape so as to surround the circular flat surface 18. Note that the outer shape of the flat surface 18 in the XY plane and the shape of the first air supply port 21 may be different. For example, the outer shape of the flat surface 18 in the XY plane may be a polygon such as an octagon, and the first air supply port 21 may be annular.

  Note that a plurality of the first air supply ports 21 may be arranged around the first space SP1 at a predetermined interval.

  The first air supply port 21 is an opening disposed at the lower end of the air supply channel 21 </ b> R formed inside the second member 102. The supply air flow path 21R is inclined inward to the −Z side in the radial direction with respect to the optical path K. At least a part of the first air supply port 21 faces inward with respect to the radiation direction with respect to the optical path K. The first air supply port 21 supplies gas toward the inside in the radiation direction with respect to the optical path K. In the present embodiment, the first air supply port 21 supplies gas to the −Z side inward with respect to the radiation direction with respect to the optical path K. The first air supply port 21 supplies gas from the outside of the first space SP1 toward the inside in the radiation direction with respect to the optical path K. At least a part of the gas supplied from the first air supply port 21 flows inward in the radiation direction with respect to the optical path K, and is supplied to the first space SP1.

  The second air supply port 22 is disposed on the + Z side farther from the substrate P than the first air supply port 21 with respect to the normal direction (Z-axis direction) of the surface of the substrate P. In the present embodiment, the second air supply port 22 is disposed so as to face the gap 30. The second air supply port 22 is disposed at a predetermined position of the second member 102 so as to face the gap 30. In the present embodiment, the second air supply port 22 is disposed on the + Z side with respect to the first surface 11.

  The second air inlet 22 faces inward with respect to the radiation direction with respect to the optical path K. The second air supply port 22 supplies gas toward the inside in the radiation direction with respect to the optical path K. The second air supply port 22 supplies gas to the gap portion 30. In the present embodiment, the second air supply port 22 supplies gas toward the + Z side inward with respect to the radiation direction with respect to the optical path K.

  In the present embodiment, the second air supply port 22 is disposed so as to surround the optical path K (first member 101). The second air supply port 22 is a slit-shaped opening arranged so as to surround the optical path K (first member 101).

  Note that a plurality of the second air supply ports 22 may be arranged around the first member 101 at a predetermined interval.

  In the present embodiment, the liquid immersion member 10 is disposed at least partly around the first surface 11, and at least part of the gas supplied from the first air inlet 21 and the second air inlet 22 is + Z side. And a third surface 13 for guiding.

  In the present embodiment, the third surface 13 is disposed around the first surface 11. At least a part of the third surface 13 faces in the opposite direction of the first surface 11. At least a part of the third surface 13 is inclined inward to the + Z side with respect to the radiation direction with respect to the optical path K. In other words, at least a part of the third surface 13 is inclined outward in the −Z side with respect to the radiation direction with respect to the optical path K.

  In the present embodiment, the second surface 12 is disposed so as to surround the optical path K, and is connected to the first region 12A substantially parallel to the XY plane and the inner edge of the first region 12A so as to surround the optical path K. 2 region 12B. The second region 12B is inclined inward to the + Z side with respect to the radiation direction with respect to the optical path K. At least a part of the third surface 13 and the second region 12B face each other. The second region 12B guides at least part of the gas supplied from the first air supply port 21 to the + Z side.

  In the present embodiment, an opening 23 facing inward with respect to the radiation direction with respect to the optical path K is disposed between the inner edge of the second region 12B and the surface of the substrate P. At least part of the gas supplied from the first air supply port 21 to the second space SP <b> 2 flows between the second surface 12 and the surface of the substrate P and is supplied to the opening 23. The opening 23 supplies at least a part of the gas from the first air supply port 21 toward the first space SP1. The first air supply port 21 supplies gas from the outside of the first space SP1 to the inside in the radial direction with respect to the optical path K through the opening 23. At least a part of the gas supplied from the first air supply port 21 flows from the outside of the first space SP1 through the opening 23 toward the inside in the radiation direction with respect to the optical path K, and is supplied to the first space SP1. The At least a part of the gas from the opening 23 flows substantially parallel to the XY plane and is supplied to the first space SP1.

  Further, at least a part of the gas supplied from the first air supply port 21 flows into the gap 30 through the opening 23. At least part of the gas supplied from the first air supply port 21 is guided by the third surface 13 and the second region 12 </ b> B and flows into the gap portion 30.

  Further, the liquid immersion member 10 includes a fourth surface 14 that faces the third surface 13 with a gap therebetween. The fourth surface 14 is disposed on the second member 102. At least a part of the fourth surface 14 is inclined inward to the + Z side with respect to the radiation direction with respect to the optical path K. In the present embodiment, the third surface 13 and the fourth surface 14 are substantially parallel. The third surface 13 and the fourth surface 14 may be nonparallel.

  In addition, the liquid immersion member 10 includes a fifth surface 15 that is disposed on the second member 102 and at least a portion thereof faces the fourth surface 14. At least a part of the fifth surface 15 faces in the direction opposite to the third surface 13.

  In the present embodiment, the second air supply port 22 is defined by the fourth surface 14 and the fifth surface 15. The second air supply port 22 includes an opening between the fourth surface 14 and the inner edge of the fifth surface 15.

  In the present embodiment, at least a part of the fifth surface 15 is inclined inward toward the + Z side with respect to the radiation direction with respect to the optical path K. The second air supply port 22 defined by the fourth surface 14 and the fifth surface 15 supplies gas toward the + Z side toward the inside in the radiation direction with respect to the optical path K.

  In the present embodiment, the second member 102 includes an air supply port 24 that supplies gas to the gap between the fourth surface 14 and the fifth surface 15. At least a part of the gas supplied to the gap from the air supply port 24 flows between the fourth surface 14 and the fifth surface 15 and is supplied to the second air supply port 22. The second air supply port 22 supplies the gas from the air supply port 24 to the gap 30.

  In addition, the liquid immersion member 10 includes a gas recovery port 25 disposed in the gap 30. The gas recovery port 25 recovers at least a part of the gas in the gap 30. In the present embodiment, the gas recovery port 25 is disposed in the second member 102. The gas recovery port 25 may be disposed in the first member 101 or may be disposed in a third member different from the first member 101 and the second member 102.

  Further, the liquid immersion member 10 has an opening 33 at the upper end of the gap 30. The opening 30 opens the gap 30 to the atmosphere. The atmosphere is a gas surrounding the liquid immersion member 10. In the present embodiment, the opening 33 is disposed above the gas recovery port 25 (+ Z side).

  Note that the opening 33 may not be disposed at the upper end of the gap 30. The opening 33 is a position different from the opening 31 and can be arranged at any position as long as the gap 30 can be opened to the atmosphere.

  In the present embodiment, the space around the liquid immersion member 10 is an atmospheric space. That is, in the present embodiment, the gap 30 is open to the atmosphere via the opening 33. In the present embodiment, the space around the liquid immersion member 10 is at least a part of the space CP formed by the chamber device CH. The environment of the space CP (at least one of pressure, temperature, humidity, and cleanness) is controlled by the chamber device CH. In the present embodiment, the chamber device CH adjusts the environment of the space CP to the atmospheric space. Note that the space CP may not be adjusted to the atmospheric space. For example, the space CP may be adjusted to a pressure lower than the atmospheric pressure.

  As described above, in the present embodiment, the first air supply port 21 supplies gas at the first flow velocity V1. The second air supply port 22 supplies gas at a second flow velocity V2 that is faster (higher) than the first flow velocity V1. In the present embodiment, the second flow velocity V2 is about three times the first flow velocity V1.

  With respect to the Z-axis direction, the opening 23 and the second air supply port 22 are close to each other. In the present embodiment, the gas supply operation from the second air supply port 22 is executed in parallel with the gas supply operation from the first air supply port 21. At least a part of the gas supplied from the first air supply port 21 is supplied to the first space SP1 through the opening 23. In addition, at least a part of the gas supplied from the first air supply port 21 flows to the + Z side by the action of the gas supplied from the second air supply port 22. In the present embodiment, at least a part of the gas supplied from the first air supply port 21 flows into the gap 30 by the action of the gas supplied from the second air supply port 22.

  In the present embodiment, the gas supply operation from the second air supply port 22 is executed in parallel with the gas supply operation from the first air supply port 21, thereby supplying the gas from the second air supply port 22. The performed gas acts on the gas supplied from the first air supply port 21, and the flow direction of at least part of the gas supplied from the first air supply port 21 is adjusted. That is, the flowing direction of at least a part of the gas supplied from the first air supply port 21 is changed by the action of the viscosity of the gas supplied from the second air supply port 22. Further, the flow rate of at least part of the gas supplied from the first air supply port 21 is also adjusted by the action (viscous action) of the gas supplied from the second air supply port 22. In the present embodiment, part of the gas supplied from the first air supply port 21 flows into the first space SP <b> 1 due to the action of the gas supplied from the second air supply port 22, and part of the air gap 30. Flow into.

  Moreover, in this embodiment, since the 3rd surface 13 is arrange | positioned in the position which at least one of the 1st air supply port 21 and the 2nd air supply port 22 faces, it supplied from the 2nd air supply port 22 Part of the gas supplied from the first air supply port 21 that has flowed into the gap 30 by the action of the gas is guided to the third surface 13. The gas guided by the third surface 13 flows in the + Z direction in the gap 30.

  Thus, in the present embodiment, at least a part of the gas supplied from the first air supply port 21 flows to the + Z side by the action of the gas supplied from the second air supply port 22.

  At least a part of the gas in the gap 30 is recovered from the gas recovery port 25. Therefore, for example, the pressure in the gap 30 is increased, and at least a part of the gas in the gap 30 is suppressed from flowing into the first space SP1.

  At least a part of the gas supplied from the first air supply port 21 is supplied to the first space SP1. As described above, the interface LG of the liquid LQ in the immersion space LS is disposed in the first space SP1. At least a part of the gas from the first air supply port 21 is supplied to the interface LG of the liquid LQ. The position of the interface LG is controlled by the gas force, and the liquid LQ in the immersion space LS is prevented from flowing out of the first space SP1.

  In the present embodiment, the second member 102 is moved by the driving device 60. The driving device 60 includes a predetermined actuator such as a voice coil motor, and can move the second member 102 at least in the Z-axis direction. In the present embodiment, the driving device 60 moves the second member 102 in six directions including the X axis, Y axis, Z axis, θX, θY, and θZ directions.

  In the present embodiment, the supply port 41 is connected to the liquid supply device via the flow path 41R. The liquid supply device can deliver clean and temperature-adjusted liquid LQ. At least a part of the channel 41 </ b> R is formed inside the first member 101. The supply port 41 supplies the liquid LQ between the emission surface 8 and the sixth surface 16 of the first member 101. The sixth surface 16 faces the direction opposite to the first surface 11 and is arranged around the opening 32. The liquid LQ supplied between the emission surface 8 and the sixth surface 16 is supplied to the first space SP1 through the opening 32.

  The recovery port 42 is connected to the liquid recovery device via the flow path 42R. The liquid recovery apparatus can connect the recovery port 42 to the vacuum system, and can suck the liquid LQ through the recovery port 42. At least a part of the flow path 42 </ b> R is formed inside the first member 101. The recovery port 42 (porous member 43) can recover at least a part of the liquid LQ on the substrate P.

  In the present embodiment, the flat surface 18 is lyophilic with respect to the liquid LQ. In the present embodiment, the contact angle of the flat surface 18 with respect to the liquid LQ is smaller than 90 degrees. The lower surface 43B is also lyophilic with respect to the liquid LQ.

  In the present embodiment, the flat surface 19 is liquid repellent with respect to the liquid LQ. In the present embodiment, the contact angle of the flat surface 19 with respect to the liquid LQ is greater than 90 degrees. In the present embodiment, the contact angle of the flat surface 19 with the liquid LQ is greater than 110 degrees. Accordingly, the liquid LQ in the immersion space LS is suppressed from flowing out of the first space SP1. The flat surface 19 may be lyophilic with respect to the liquid LQ.

  In the present embodiment, the first air supply port 21 is connected to the first gas supply device via the flow path 21R. The first gas supply device can deliver a clean and temperature-adjusted gas. At least a part of the channel 21 </ b> R is formed inside the second member 102. The first air supply port 21 supplies gas to the second space SP2 between the second surface 12 and the surface of the substrate P. At least a part of the gas supplied from the first air supply port 21 to the second space SP2 flows inward in the radiation direction with respect to the optical path K between the second surface 12 and the surface of the substrate P, and passes through the opening 23. Via the first space SP1.

  In the present embodiment, the air supply port 24 is connected to the second gas supply device via the flow path 24R. The second gas supply device can deliver a clean and temperature-adjusted gas. At least a part of the flow path 24 </ b> R is formed inside the second member 102. The air supply port 24 supplies gas to the space between the fourth surface 14 and the fifth surface 15. At least a part of the gas supplied from the air supply port 24 flows inward in the radial direction with respect to the optical path K between the fourth surface 14 and the fifth surface 15 and is supplied to the second air supply port 22. . The second air supply port 22 supplies gas toward the inside in the radiation direction with respect to the optical path K.

  In the present embodiment, at least one of the first air supply port 21 and the second air supply port 22 supplies gas humidified with the liquid LQ. Thereby, vaporization of the liquid LQ in the immersion space LS can be suppressed, and occurrence of a temperature change due to heat of vaporization can be suppressed. In addition, both the 1st supply port 21 and the 2nd supply port 22 may supply the humidified gas, and either one may supply the humidified gas. Further, the humidity of the gas supplied from the first air supply port 21 and the humidity of the gas supplied from the second air supply port 22 may be different.

  In the present embodiment, the gas supplied from at least one of the first air supply port 21 and the second air supply port 22 is the same liquid as the liquid LQ supplied to the optical path K (water in the present embodiment). However, the liquid LQ may be humidified by a different type of liquid.

  In the present embodiment, the gas humidified with the liquid LQ refers to a gas having a humidity higher than the target humidity when the chamber device CH adjusts the environment (humidity) of the space CP.

    Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  The control device 3 supplies the liquid LQ from the supply port 41 so that the optical path K of the exposure light EL between the exit surface 8 of the last optical element 7 and the surface of the substrate P is filled with the liquid LQ. In parallel with the supply of the liquid LQ from the port 41, the liquid LQ is recovered from the recovery port. Thereby, the immersion space LS is formed so that the optical path K of the exposure light EL is filled with the liquid LQ. The interface LG of the liquid LQ in the immersion space LS is formed between the first surface 11 and the surface of the substrate P.

  Further, the control device 3 supplies gas from the first air supply port 21 at the first flow velocity V1, and in parallel with the supply of gas from the first air supply port 21, the control device 3 supplies the gas from the second air supply port 22. Gas is supplied at two flow rates V2. At least a part of the gas supplied from the first air supply port 21 flows into the first space SP1 and is supplied to the interface LG of the liquid LQ in the immersion space LS. At least a part of the gas supplied from the first air supply port 21 is supplied to the interface LG of the liquid LQ from the outside in the radiation direction with respect to the optical path K. Further, the gas from the second air supply port 22 is supplied at a second flow rate V2 to at least a part of the periphery of the gas supplied from the first air supply port 21 at the first flow rate V1. Since the gas supplied from the second air supply port 22 acts on the gas supplied from the first air supply port 21, at least a part of the gas supplied from the first air supply port 21 flows to the + Z side, It flows into the gap 30.

  The control device 3 emits the exposure light EL from the illumination system IL and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is emitted from the emission surface 8 of the projection optical system PL. Thereby, the substrate P is exposed with the exposure light EL from the emission surface 8 via the liquid LQ in the immersion space LS between the emission surface 8 and the surface of the substrate P, and an image of the pattern of the mask M is applied to the substrate P. Projected.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the exposure of the substrate P, the control device 3 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P are in a predetermined plane in the XY plane that intersects the optical path K (optical axis AX) of the exposure light EL. Move in the scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 3 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  In at least part of the exposure of the substrate P, the recovery operation of the liquid LQ from the recovery port 42 is performed in parallel with the supply operation of the liquid LQ from the supply port 41. Thereby, the immersion space LS is formed so that the optical path K of the exposure light EL is filled with the liquid LQ.

  In at least part of the exposure of the substrate P, the gas supply operation from the first air supply port 21 and the gas supply operation from the second air supply port 22 are executed in parallel. Thereby, for example, even if the substrate P moves in the XY plane with respect to the last optical element 7 and the liquid immersion member 10 in the state where the liquid immersion space LS is formed, the gas from the first space SP1 is caused by the force of gas. The outflow of the liquid LQ can be suppressed.

  In the present embodiment, by causing the gas supplied from the second air supply port 22 to act on the gas supplied from the first air supply port 21, the flow velocity and flow rate of the gas around the interface LG in the first space SP1. And a gas state including at least one of pressures is adjusted. Thereby, for example, gas can be prevented from entering the liquid LQ in the immersion space LS via the interface LG and generating bubbles. Further, by adjusting the gas state, it is possible to suppress the outflow of the liquid LQ while suppressing the generation of bubbles.

  FIG. 5 is a schematic diagram showing an example of an exposure operation according to the present embodiment. FIG. 5 shows a plan view of the substrate P held on the substrate stage 2. As shown in FIG. 5, on the substrate P, a plurality of shot areas S (S1 to S21) which are exposure target areas are set in a matrix. As shown in FIG. 5, in the present embodiment, the projection region PR has a slit shape whose longitudinal direction is the X-axis direction.

  In at least a part of the exposure processing of the substrate P, the control device 3 is configured so that the immersion space LS is formed between the terminal optical element 7 and the immersion member 10 and the substrate P (substrate stage 2). (Substrate stage 2) is moved in the XY plane. In the present embodiment, the control device 5 moves the substrate stage 2 so that the projection region PR (terminal optical element 11) and the substrate P relatively move along a movement locus indicated by an arrow R1 in FIG. While moving, exposure light EL is emitted from the last optical element 7 to sequentially expose each of the shot areas S1 to S21 on the substrate P.

  For example, when exposing a certain shot area S (for example, the first shot area S1), the control device 3 controls the substrate stage 2 to place the substrate P in the Y-axis direction with respect to the projection area PR (terminal optical element 7). Move to. After the exposure of the shot area S (first shot area S1) is completed, the controller 3 exposes the exposure light EL from the last optical element 7 in order to expose the next shot area (for example, the second shot area S2). The substrate stage 2 is controlled so that the projection region PR is positioned at the exposure start position of the next shot region S in a state where the injection of the substrate P is stopped, and the substrate P is placed in the XY plane with respect to the terminal optical element 7. Move in a predetermined direction.

    Further, for example, the substrate stage 2 may move so that the projection region PR (terminal optical element 7) and the substrate P move relatively along the movement locus indicated by the arrow R2 in FIG.

    In the following description, moving the substrate P in the Y-axis direction with respect to the last optical element 7 in order to expose the shot area S will be appropriately referred to as scan movement. Further, after the exposure for a certain shot area is completed, the substrate P is placed on the last optical element 7 so that the projection area PR is arranged at the exposure start position of the next shot area in order to expose the next shot area. The movement of (substrate stage 2) is appropriately referred to as step movement. Further, for example, as in the movement locus R2, the substrate P (substrate stage) with respect to the terminal optical element 7 in a state where the substrate P is opposed to the terminal optical element 7 and the liquid immersion member 10 other than the scanning movement and the step movement. The movement of 2) is appropriately referred to as long distance movement.

    During the scan movement for exposing the shot region S, the exposure light EL is emitted from the last optical element 7, and the projection region PR (substrate P) is irradiated with the exposure light EL.

    On the other hand, during the step movement and the long distance movement, the emission of the exposure light EL from the last optical element 7 is stopped, and the exposure light EL is not irradiated onto the projection region PR (substrate P).

  In the present embodiment, the long distance movement includes a movement distance in which the substrate P (substrate stage 2) moves from the first position to the second position in the XY plane is longer than a predetermined value. In the present embodiment, the predetermined value includes, for example, the size of the shot area S in the Y-axis direction. The predetermined value may be, for example, the sum of the dimensions of the two shot areas S or the sum of the dimensions of the three shot areas S. Further, the predetermined value may be a value that is larger than the size of one shot region S and smaller than the sum of the sizes of two shot regions S, for example. Further, the predetermined value may be, for example, a distance from the exposure start position of the shot area S to the exposure end position when one shot area S is exposed. Further, the predetermined value may be the diameter of the substrate P. The predetermined value can be arbitrarily set.

  FIG. 6 is a schematic diagram illustrating a state in which gas is supplied from the first air supply port 21 and the second air supply port 22. In the present embodiment, the position of the last optical element 7 is fixed. Further, the position of the first member 101 is also fixed. As a result, the distance between the exit surface 8 included in the terminal optical element 7 and the first surface 11 included in the first member 101 and the surface of the substrate P (object) is maintained at a size that can satisfactorily hold the liquid LQ. In the present embodiment, the distance between the first surface 11 and the surface of the substrate P is adjusted to the first dimension W1.

  In the present embodiment, when gas is supplied from the first air supply port 21 and the second air supply port 22, the control device 3 controls the drive device 60 so that the second member 102 with respect to the first member 101. Is placed at a predetermined position. The control device 3 adjusts the position of the second member 102 so that the distance between the second surface 12 (first region 12A) of the second member 102 and the surface of the substrate P becomes the second dimension W2. In the present embodiment, when gas is supplied from the first air supply port 21 and the second air supply port 22, the control device 3 has substantially the same position of the first surface 11 and the second surface 12 in the Z-axis direction. In other words, the position of the second member 102 is adjusted by controlling the driving device 60 so that the first dimension W1 and the second dimension W2 are substantially the same. Thereby, the gas from the 1st air supply port 21 is favorably supplied to the interface LG of the liquid LQ.

  In the present embodiment, the control device 3 adjusts the gas supply conditions of the first and second air supply ports 21 and 22 according to the movement conditions of the substrate P (substrate stage 2). The moving condition of the substrate P (substrate stage 2) includes a moving distance by which the substrate P (substrate stage 2) moves from the first position to the second position in the XY plane. That is, the moving distance includes the linear moving distance when the substrate P (substrate stage 2) moves linearly from the first position to the second position. The moving condition includes the moving speed of the substrate P (substrate stage 2) in the XY plane. The movement condition includes an acceleration when the substrate P (substrate stage 2) moves in the XY plane.

  In the present embodiment, when the moving distance of the substrate P (substrate stage 2) is longer than a predetermined value, the control device 3 supplies gas from the first and second air supply ports 21 and 22, and the predetermined value Is shorter, the supply of gas from the first and second air supply ports 21 and 22 is stopped. That is, the control device 3 supplies gas from the first and second air supply ports 21 and 22 during the long-distance movement of the substrate P (substrate stage 2). On the other hand, the control device 3 stops the supply of gas from the first and second air supply ports 21 and 22 when the substrate P (substrate stage 2) does not move for a long distance.

  As shown in FIG. 7, in the present embodiment, the control device 3 stops the supply of gas from the first air supply port 21 and the second air supply port 22, for example, during scanning movement. In addition, when the supply of gas from the first air supply port 21 and the second air supply port 22 is stopped, the control device 3 determines that the distance between the second surface 12 and the surface of the substrate P is from the second dimension W2. The position of the second member 102 is adjusted by controlling the driving device 60 so that the third dimension W3 becomes larger. That is, the controller 3 determines that the distance between the second surface 12 and the surface of the substrate P when the supply of gas from the first air supply port 21 and the second air supply port 22 is stopped is the first air supply port. The second member 102 is moved using the driving device 60 so as to be larger than the distance between the second surface 12 and the surface of the substrate P when the gas is supplied from the gas supply port 21 and the second air supply port 22.

  On the other hand, the control device 3 supplies gas from the first air supply port 21 and the second air supply port 22 during the long-distance movement. As illustrated in FIG. 6, the control device 3 adjusts the position of the second member 102 so that the distance between the second surface 12 of the second member 102 and the surface of the substrate P becomes the second dimension W2. Thus, gas is supplied from the first air inlet 21 and the second air inlet 22.

  The long distance movement is a movement condition in which the liquid LQ easily flows out, for example, as compared with the scan movement. Therefore, the outflow of the liquid LQ during the long distance movement can be suppressed by supplying the gas from the first and second air supply ports 21 and 22 during the long distance movement.

  Further, the scan movement is a movement condition in which the liquid LQ hardly flows out, for example, compared to the long distance movement. In the scan movement in which the movement distance is shorter than the long distance movement, the outflow of the liquid LQ is suppressed even if the supply of gas from the first air supply port 21 and the second air supply port 22 is stopped. Since no gas is supplied to the interface LG of the liquid LQ, for example, the vaporization of the liquid LQ can be suppressed, and the occurrence of a temperature change due to the heat of vaporization can be suppressed. Moreover, it is possible to suppress the generation of bubbles in the liquid LQ by stopping the supply of the gas to the liquid LQ during the scan movement (during the exposure light EL irradiation).

  As described above, the predetermined value can be arbitrarily set. The predetermined value is a value (movement distance) that is likely to cause the liquid LQ to flow out when the gas supply from the first and second air supply ports 21 and 22 is stopped. In the present embodiment, the predetermined value is determined in advance by, for example, experiments or simulations. By supplying gas from the first and second air supply ports 21 and 22 when the moving distance is longer than a predetermined value, the outflow of the liquid LQ can be suppressed.

  Even when the movement distance of the substrate P (substrate stage 2) is shorter than a predetermined value, the gas supply from the first and second air supply ports 21 and 22 may be executed. For example, gas may be supplied from the first and second air supply ports 21 and 22 during the scan movement. When the moving distance of the substrate P (substrate stage 2) is shorter than a predetermined value, the control device 3 determines the gas supply amount per unit time supplied from the first and second air supply ports 21 and 22 as the substrate P. When the moving distance of the (substrate stage 2) is longer than a predetermined value, the gas supply amount per unit time supplied from the first and second air supply ports 21 and 22 can be reduced. Thereby, the vaporization of the liquid LQ and the generation of bubbles in the liquid LQ can be suppressed.

  For example, the gas supply conditions from the first and second air supply ports 21 and 22 may be adjusted according to the moving speed of the substrate P (substrate stage 2). When the substrate P (substrate stage 2) moves at a high speed in the state where the immersion space LS is formed, the possibility that the liquid LQ flows out is higher than when the substrate P moves at a low speed. Accordingly, when the substrate P (substrate stage 2) moves at a high speed, gas is supplied from the first and second air supply ports 21 and 22, and when the substrate P moves at a low speed, the first and second air supply ports 21 and 22 are supplied. May be stopped (or the gas supply amount is reduced). Further, the gas supply conditions from the first and second air supply ports 21 and 22 may be adjusted according to the acceleration of the substrate P (substrate stage 2).

  In step movement, gas may be supplied from the first air supply port 21 and the second air supply port 22, or supply of gas from the first air supply port 21 and the second air supply port 22 is stopped. May be. When gas is supplied from the first air supply port 21 and the second air supply port 22, the distance between the second surface 12 and the surface of the substrate P is adjusted to the second dimension W2, and the first air supply port 21 and the first air supply port 21 When the supply of gas from the two air supply ports 22 is stopped, the distance between the second surface 12 and the surface of the substrate P is adjusted to the third dimension W3.

  For example, when the substrate P moves in the + Y direction, gas is supplied from the first air supply port 21 and the second air supply port 22 existing in the front (+ Y side) in the movement direction of the substrate P, and the rear (− The supply of gas from the first air supply port 21 and the second air supply port 22 existing on the Y side) may be stopped, or the first air supply port 21 and the second air supply existing on both the front and rear sides may be stopped. Gas may be supplied from the vent 22. Of course, the gas may be supplied from all of the first air supply port 21 and the second air supply port 22 arranged around the optical path K.

  As described above, in the present embodiment, when the gas supply from the first and second air supply ports 21 and 22 is stopped, the distance between the second surface 12 and the surface of the substrate P is the third dimension. The position of the second member 102 is adjusted to be W3. By increasing the distance between the second surface 12 and the surface of the substrate P when the supply of gas from the first air supply port 21 and the second air supply port 22 is stopped, for example, the liquid LQ from the first space SP1. Even if the liquid flows out, the phenomenon that the liquid LQ stays between the second surface 12 and the surface of the substrate P (so-called bridge phenomenon) can be suppressed.

  In the present embodiment, the distance between the second surface 12 and the surface of the substrate P is changed in accordance with the gas supply conditions from the first and second air supply ports 21 and 22, but it is constant. But you can.

  As described above, according to the present embodiment, since the first air supply port 21 and the second air supply port 22 are provided, for example, when the substrate P is moved at a high speed or when a long distance is moved. However, the outflow and the residue of the liquid LQ can be suppressed. Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 8 is a side sectional view showing a part of the liquid immersion member 10B according to the second embodiment. The characteristic part of the second embodiment is that the liquid immersion member 10 </ b> B has a gas recovery port 70 disposed outside the first air supply port 21 in the radial direction with respect to the optical path K.

  In FIG. 8, the liquid immersion member 10B includes a first member 101B on which the first surface 11 is disposed, and a second member 102B on which the second surface 12B is disposed. The second member 102B is moved by the driving device 60B. The first air inlet 21 and the second air inlet 22 are arranged in the second member 102B. At least one of the first air inlet 21 and the second air inlet 22 supplies gas humidified by the liquid LQ.

  The first air supply port 21 is disposed on the second surface 12B. The gas recovery port 70 is disposed on the second surface 12B. The gas recovery port 70 is disposed outside the first air supply port 21 with respect to the radial direction with respect to the optical path K on the second surface 12B. The first air supply port 21 supplies gas to the second space SP2 between the second surface 12B and the surface of the substrate P. The gas recovery port 70 recovers at least a part of the gas supplied from the first air supply port 21. Thereby, the gas supplied from the first air supply port 21 to the second space SP2 is suppressed from flowing out to the outside of the second space SP2. For example, when the gas humidified with the liquid LQ is supplied from the first air supply port 21, the gas recovery port 70 suppresses the humidified gas from flowing out of the second space SP2.

  In the present embodiment, the first member 101B has a protruding portion 150 that extends outward in the radial direction with respect to the optical path K. In the present embodiment, the gap 30B between the first member 101B and the second member 102B is between the lower surface of the overhanging portion 150 and the upper surface of the second member 102B facing the lower surface of the overhanging portion 150. Including space. In the present embodiment, the gas recovery port 25B capable of recovering at least part of the gas in the gap 30B is disposed on the upper surface of the second member 102B. Thereby, the humidified gas supplied to the space 30B from at least one of the first air supply port 21 and the second air supply port 22 is suppressed from flowing out of the space 30B.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 9 is a plan view of the liquid immersion member 10C according to the third embodiment as viewed from below. A characteristic part of the third embodiment different from the first and second embodiments described above is that the hole 431H (the hole 431H of the hole 431H) of the porous member 431 functioning as a recovery port for recovering at least a part of the liquid LQ on the substrate P. The lower end is a slit opening that is long in the radial direction with respect to the optical path K. The dimension of the hole 431H in the radiation direction with respect to the optical path K is sufficiently larger than the dimension of the hole 431H in the circumferential direction.

  As shown in FIG. 9, the liquid immersion member 10C includes a first member 101C and a second member 102C. The first member 101C has a recovery port 42C. A porous member 431 is disposed in the recovery port 42C. The porous member 431 has a hole 431H that can collect the liquid LQ on the substrate P.

  In the present embodiment, a plurality of holes 431H are arranged around the optical path K. In the present embodiment, the sizes of the plurality of holes 431H are substantially the same. For example, the dimensions of the plurality of holes 431H may be different with respect to the radiation direction with respect to the optical path K, and the dimensions of the plurality of holes 431H may be different with respect to the circumferential direction of the optical path K. The hole 431H may be disposed in a part of the periphery of the optical path K.

  In the present embodiment, the first surface 11 </ b> C has a flat surface 18 </ b> C disposed on at least a part of the periphery of the optical path K. The lower surface 431B of the porous member 431 having the hole 431H is disposed outside the flat surface 18C with respect to the optical path K. Further, the first surface 11C has a flat surface 19C disposed outside the lower surface 431B (hole 431H) in the radiation direction with respect to the optical path K.

  In the present embodiment, the flat surface 18C has a circular outer shape. In the present embodiment, the outer surface of the lower surface 431B is circular. The outer shape of the flat surface 19C is a circle.

  In the present embodiment, the dimension L43 of the hole 431H (lower surface 431B) is larger than the dimension L18 of the flat surface 18C with respect to the radiation direction with respect to the optical path K. Regarding the radiation direction with respect to the optical path K, the dimension L43 of the hole 431H (lower surface 431B) is larger than the dimension L19 of the flat surface 19C. The dimension L43 is greater than the distance between the optical axis AX and the outer shape of the flat surface 18C (the distance between the optical axis AX and the lower surface 431B). In addition, regarding the radiation direction with respect to the optical path K, the dimension L43 may be smaller than the dimension L19 of the flat surface 19C.

  As described above, also in this embodiment, the liquid LQ can be favorably recovered by the hole (recovery port) 431H. In the present embodiment, since the hole 431H is a slit opening that is long in the radial direction with respect to the optical path K, for example, foreign matter is suppressed from adhering to the hole 431H (around the hole 431H).

  Note that the outer shape of the flat surface 18D may be an octagon as in the liquid immersion member 10D shown in FIG. Further, as shown in FIG. 10, the outer shape of the lower surface 431Bd may be an octagon. The outer shape of the flat surface 18D is not limited to an octagon, and may be an arbitrary polygon such as a triangle, a quadrangle, a pentagon, a hexagon, a heptagon, or the like. Further, the flat surface 18D may be an ellipse. In the example shown in FIG. 10, the dimensions of the plurality of holes 431Hd differ with respect to the radiation direction with respect to the optical path K.

  In addition, like the liquid immersion member 10E shown in FIG. 11, the dimension of the hole 431He may be smaller than the dimension of the flat surface 18E with respect to the radiation direction with respect to the optical path K. Further, regarding the radiation direction with respect to the optical path K, the dimension of the hole 431He may be smaller than the dimension of the flat surface 19E. In addition, regarding the radiation direction with respect to the optical path K, the size of the hole 431He may be larger than the size of the flat surface 19E.

  In the first to third embodiments described above, at least one of the first air inlet 21 and the second air inlet 22 supplies the gas humidified with the liquid LQ. However, the humidified gas Need not be supplied. For example, the first and second air supply ports 21 and 22 may supply a gas having substantially the same humidity as the target humidity when the chamber device CH adjusts the environment (humidity) of the space CP, or a low humidity. Gas may be supplied.

  In each of the above-described embodiments, for example, a temperature adjustment device that adjusts the temperature of the liquid immersion member (10 or the like) may be provided. For example, a temperature adjustment mechanism such as a Peltier element may be disposed so as to contact the outer surface of the liquid immersion member, and the temperature of the liquid immersion member may be adjusted by the temperature adjustment mechanism. Alternatively, the liquid immersion member is formed with a flow path different from the flow paths (41R, 42R) through which the liquid LQ flows, and the temperature adjusting fluid (gas, liquid) is allowed to flow through the flow path. You may adjust the temperature of a member. Moreover, you may spray the gas for temperature adjustment on the outer surface of a liquid immersion member. By adjusting the temperature of the liquid immersion member in contact with the liquid LQ in the liquid immersion space LS with the temperature adjustment device, a temperature change of the liquid immersion member due to vaporization of the liquid LQ can be suppressed.

  In each of the above-described embodiments, for example, a temperature adjusting device that adjusts the temperature of the substrate stage 2 that can form the immersion space LS by holding the liquid LQ with the immersion member may be provided. For example, a temperature adjustment mechanism that can adjust the temperature of the substrate stage 2 such as a Peltier element may be disposed on the substrate stage 2. Further, a flow path through which a temperature adjusting fluid (gas, liquid) flows may be formed inside the substrate stage 2. Further, a temperature adjusting gas may be blown onto the substrate stage 2. By adjusting the temperature of the substrate stage 2 in contact with the liquid LQ in the immersion space LS with the temperature adjustment device, a temperature change of the substrate stage 2 due to the vaporization of the liquid LQ can be suppressed.

  An example of an adjustment device capable of adjusting the temperature of the liquid immersion member, the substrate stage, and the like is disclosed in, for example, US Patent Application Publication No. 2006/0033892, which is incorporated herein by reference. Part.

  In each of the above-described embodiments, the first air supply port 21 and the second air supply port 22 are arranged in the Z-axis direction. For example, the first air supply port 21 and the second air supply port 22 may be arranged around the optical path K at a predetermined interval. This also allows the gas supplied from the second air supply port 22 to act on the gas supplied from the first air supply port 21.

  In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 7 of the projection optical system PL is filled with the liquid LQ. For example, this is disclosed in WO 2004/019128. As described above, it is possible to employ a projection optical system PL in which the optical path on the incident side (object plane side) of the last optical element 7 is also filled with the liquid LQ.

  In each of the above-described embodiments, water is used as the liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, as the liquid LQ, a fluorine-based liquid such as hydrofluoroether (HFE), perfluorinated polyether (PFPE), or fomblin oil can be used. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

    As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

    As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

    Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

    Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

    Further, the exposure apparatus EX is a twin stage type having a plurality of substrate stages as disclosed in, for example, US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. The exposure apparatus may be used.

    In addition, the exposure apparatus EX has a substrate stage for holding a substrate and a reference mark as disclosed in, for example, US Pat. No. 6,897,963 and US Patent Application Publication No. 2007/0127006. An exposure apparatus including a reference member and / or various photoelectric sensors and a measurement stage that does not hold the substrate to be exposed may be used. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

    The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

    In each of the above-described embodiments, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage You may use the encoder system which detects this.

    In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

    In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

    Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

    The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

    As shown in FIG. 12, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

    Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

DESCRIPTION OF SYMBOLS 1 ... Mask stage, 2 ... Substrate stage, 3 ... Control apparatus, 10 ... Liquid immersion member, 11 ... 1st surface, 12 ... 2nd surface, 13 ... 3rd surface, 21 ... 1st air supply port, 22 ... 1st 2 air supply port, 25 ... gas recovery port, 30 ... gap, 41 ... supply port, 42 ... recovery port, 43 ... porous member, 60 ... driving device, 70 ... gas recovery port, 101 ... first member, 102 ... Second member, EL ... exposure light, EX ... exposure device, K ... optical path, LQ ... liquid, LS ... immersion space, P ... substrate

Claims (31)

A first surface disposed at least part of the periphery of the optical path of the exposure light irradiated to the object, and holding the liquid between the object and forming an immersion space so that the optical path is filled with the liquid; ,
A first air supply port that is disposed outside the first surface with respect to a radiation direction with respect to the optical path and supplies gas at a first flow rate to a first space facing the first surface;
A liquid immersion member, comprising: a second air supply port that supplies gas to at least a part of the periphery of the gas supplied from the first air supply port at a second flow rate faster than the first flow rate.   The gas supplied from the second air supply port acts on the gas supplied from the first air supply port, and at least part of the flow velocity and the flowing direction of the gas supplied from the first air supply port The liquid immersion member according to claim 1, wherein one of the liquid immersion members is adjusted. A second surface disposed on at least a part of the periphery of the first surface;
The liquid immersion member according to claim 1, wherein at least a part of the first air supply port is disposed on the second surface. A gap is provided in at least a part of the periphery of the first surface;
The liquid immersion member according to claim 1, wherein at least part of the gas supplied from the first air supply port flows into the gap.   The liquid immersion member according to claim 4, wherein the second air supply port is disposed so as to face the gap.   The liquid immersion member according to claim 4, further comprising a first gas recovery port disposed in the gap. A first member on which the first surface is disposed, and a second member disposed on at least a part of the periphery of the first member with a gap between which the first and second air supply ports are disposed. Including
The liquid immersion member according to any one of claims 4 to 6, wherein the gap includes a space between the first member and the second member.   The liquid immersion member according to claim 7, wherein the second member is moved by a driving device. The second member has a second surface to which the object can face,
The distance between the second surface and the surface of the object when the supply of gas from the first and second supply ports is stopped is when the gas is supplied from the first and second supply ports. The liquid immersion member according to claim 8, wherein the second member is moved by the driving device so as to be larger than a distance between the second surface of the object and the surface of the object. In a state where the immersion space is formed, the object is moved in a predetermined plane substantially parallel to the first surface,
The liquid immersion member according to claim 1, wherein a gas supply condition of the first and second air supply ports is adjusted according to a movement condition of the object.   The liquid immersion member according to claim 10, wherein the movement condition includes a movement distance in which the object moves from a first position to a second position in the predetermined plane.   When the moving distance is longer than a predetermined value, gas is supplied from the first and second air supply ports, and when the moving distance is shorter than the predetermined value, supply of gas from the first and second air supply ports is stopped. The liquid immersion member according to claim 11.   The liquid immersion member according to claim 10, wherein the moving condition includes a moving speed of the object.   The liquid according to any one of claims 1 to 13, wherein the second air supply port is disposed on a first side farther from the object than the first air supply port with respect to a normal direction of a surface of the object. Immersion member.   The liquid immersion member according to claim 14, wherein at least a part of the gas supplied from the first air supply port flows to the first side by the action of the gas supplied from the second air supply port.   The liquid immersion member according to claim 14 or 15, wherein the second air supply port supplies gas to the first side inward in the radial direction.   17. A third surface that is disposed on at least a part of the periphery of the first surface and guides at least a part of the gas supplied from the first and second air supply ports to the first side. The liquid immersion member according to claim 1.   The liquid immersion member according to any one of claims 1 to 17, further comprising a second gas recovery port disposed outside the first air supply port with respect to a radial direction with respect to the optical path.   The liquid immersion member according to any one of claims 1 to 18, wherein at least one of the first air supply port and the second air supply port supplies a gas humidified with a liquid.   The liquid immersion member according to any one of claims 1 to 19, further comprising a liquid recovery port that recovers at least a part of the liquid on the object. A porous member disposed at the liquid recovery port and having a plurality of holes through which the liquid can flow;
The liquid immersion member according to claim 20, wherein the first surface includes a surface of the porous member.   The liquid immersion member according to claim 20 or 21, wherein the liquid recovery port includes a slit opening that is long in a radial direction with respect to the optical path.   The liquid immersion member according to claim 22, wherein a plurality of the liquid recovery ports are arranged around the optical path. The first surface has a first flat region disposed at least at a part of the periphery of the optical path,
The liquid immersion member according to any one of claims 20 to 23, wherein the liquid recovery port is disposed outside the first flat region with respect to a radial direction with respect to the optical path.   25. The liquid immersion member according to claim 24, wherein a dimension of the liquid recovery port is smaller than a dimension of the first flat region with respect to a radiation direction with respect to the optical path.   The liquid immersion member according to any one of claims 20 to 25, wherein the first surface includes a second flat region disposed outside the liquid recovery port with respect to a radial direction with respect to the optical path.   The liquid immersion member according to any one of claims 1 to 26, further comprising a liquid supply port that supplies the liquid to the optical path. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the liquid immersion member according to any one of claims 1 to 27. Exposing the substrate using the exposure apparatus according to claim 28;
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Forming an immersion space so that the optical path of the exposure light between the exit surface of the optical member and the surface of the substrate is filled with the liquid;
Exposing the substrate with the exposure light from the exit surface through the liquid in the immersion space;
Supplying gas at a first flow rate from the outside to the liquid interface of the immersion space in the radial direction with respect to the optical path;
Supplying a gas at a second flow rate higher than the first flow rate to at least a part of the periphery of the gas supplied at the first flow rate. Exposing the substrate using the exposure method of claim 30;
Developing the exposed substrate. A device manufacturing method.

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