JP2011110598A5 - - Google Patents

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Publication number
JP2011110598A5
JP2011110598A5 JP2009271384A JP2009271384A JP2011110598A5 JP 2011110598 A5 JP2011110598 A5 JP 2011110598A5 JP 2009271384 A JP2009271384 A JP 2009271384A JP 2009271384 A JP2009271384 A JP 2009271384A JP 2011110598 A5 JP2011110598 A5 JP 2011110598A5
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JP
Japan
Prior art keywords
hole
laser
irradiating
laser beam
workpiece
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Pending
Application number
JP2009271384A
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English (en)
Japanese (ja)
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JP2011110598A (ja
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Publication date
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Priority to JP2009271384A priority Critical patent/JP2011110598A/ja
Priority claimed from JP2009271384A external-priority patent/JP2011110598A/ja
Publication of JP2011110598A publication Critical patent/JP2011110598A/ja
Publication of JP2011110598A5 publication Critical patent/JP2011110598A5/ja
Pending legal-status Critical Current

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JP2009271384A 2009-11-30 2009-11-30 レーザ加工方法およびレーザ加工装置 Pending JP2011110598A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009271384A JP2011110598A (ja) 2009-11-30 2009-11-30 レーザ加工方法およびレーザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009271384A JP2011110598A (ja) 2009-11-30 2009-11-30 レーザ加工方法およびレーザ加工装置

Publications (2)

Publication Number Publication Date
JP2011110598A JP2011110598A (ja) 2011-06-09
JP2011110598A5 true JP2011110598A5 (ru) 2012-12-20

Family

ID=44233354

Family Applications (1)

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JP2009271384A Pending JP2011110598A (ja) 2009-11-30 2009-11-30 レーザ加工方法およびレーザ加工装置

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JP (1) JP2011110598A (ru)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5189684B1 (ja) 2012-03-07 2013-04-24 三菱重工業株式会社 加工装置、加工ユニット及び加工方法
DE102012210768A1 (de) * 2012-06-25 2014-01-02 Voith Patent Gmbh Verfahren zur Einbringung von Durchgangsbohrungen mit Hilfe von Laserstrahlen in ein flächig ausgebildetes Substrat, insbesondere eine bandförmige Folie
JP5364856B1 (ja) 2013-02-27 2013-12-11 三菱重工業株式会社 加工装置、加工方法
JP6071641B2 (ja) 2013-02-27 2017-02-01 三菱重工業株式会社 加工装置、加工方法
JP5908009B2 (ja) * 2013-08-20 2016-04-26 三菱重工業株式会社 レーザ加工方法及びレーザ加工装置
CN104759764B (zh) * 2015-03-28 2018-02-02 大族激光科技产业集团股份有限公司 一种玻璃的激光钻孔方法
CN105392284A (zh) * 2015-10-22 2016-03-09 北大方正集团有限公司 一种电路板上盲孔的制备方法以及电路板
WO2019146110A1 (ja) 2018-01-29 2019-08-01 三菱電機株式会社 レーザ加工方法
CN111215754A (zh) * 2020-02-26 2020-06-02 武汉铱科赛科技有限公司 一种非均匀绝缘介质的刻蚀方法、系统、装置与设备
CN113210893B (zh) * 2021-05-20 2022-08-30 武汉锐科光纤激光技术股份有限公司 一种复合激光打孔方法及激光打孔装置
CN116652390B (zh) * 2023-07-28 2023-10-20 中国人民解放军空军工程大学 一种航空复合材料结构原位修理激光去除打磨方法及装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JP2005342749A (ja) * 2004-06-01 2005-12-15 Hitachi Via Mechanics Ltd レーザ加工方法
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP5030512B2 (ja) * 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 レーザ加工方法
JP4489782B2 (ja) * 2007-01-11 2010-06-23 住友重機械工業株式会社 レーザ加工方法
JP4937011B2 (ja) * 2007-06-26 2012-05-23 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP5133033B2 (ja) * 2007-11-26 2013-01-30 日立ビアメカニクス株式会社 レーザ加工装置

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