JP2011107023A - 電気的試験用プローブ、それを用いた電気的接続装置、及びプローブの製造方法 - Google Patents
電気的試験用プローブ、それを用いた電気的接続装置、及びプローブの製造方法 Download PDFInfo
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- JP2011107023A JP2011107023A JP2009263904A JP2009263904A JP2011107023A JP 2011107023 A JP2011107023 A JP 2011107023A JP 2009263904 A JP2009263904 A JP 2009263904A JP 2009263904 A JP2009263904 A JP 2009263904A JP 2011107023 A JP2011107023 A JP 2011107023A
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- probe
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】 電気的試験用プローブは、ニッケル・ボロン合金で形成された針本体部と、該針本体部から下方へ突出しかつ該針本体部と異なる導電性材料で形成された針先部とを備える。前記ニッケル・ボロン合金の結晶サイズは最大で50nmであり、前記ボロンの含有量は0.02以上、0.20wt%以下である。
【選択図】図1
Description
12 半導体ウエーハ
14 チャックトップ
16 電気的接続装置
20 補強部材
22 配線基板
24 プローブ基板
26 プローブ
28 取り付けリング
30 セラミック基板
32 多層シート
34 フット部
36 アーム部
38 台座部
40 針先部
42 針先
44 導電性材料
機械的特性:NiプローブA≦Ni・MnプローブC<Ni・BプローブD<Ni・PプローブB
電気的特性:Ni・PプローブB<Ni・BプローブD<Ni・MnプローブC≦Ni・プローブA
機械的特性:NiプローブA<Ni・PプローB≒Ni・BプローブD
電気的特性:Ni・PプローブB<NiプローブB<Ni・BプローブD
Claims (8)
- ニッケル・ボロン合金で形成された針本体部と、該針本体部から下方へ突出しかつ該針本体部と異なる導電性材料で形成された針先部とを備え、
前記ニッケル・ボロン合金の結晶サイズは最大で50nmであり、前記ボロンの含有量は0.02wt%以上、0.20wt%以下である、電気的試験用プローブ。 - 前記針本体部は、基板に取り付けられるフット部と、該フット部の下端から横方向へ延びるアーム部と、該アーム部の先端部から下方に突出する台座部とを備え、前記針先部は前記台座部の下端から突出している、請求項1に記載のプローブ。
- 複数の取付部を下面に備える基板と、前記基板に片持ち梁状に取り付けられた複数のプローブとを含み、
前記プローブは、請求項1及び2のいずれか1項に記載のものであり、また針主体部において前記取付部に取り付けられている、電気的試験用電気的接続装置。 - ニッケル・ボロン合金製の針本体部と、該針本体部から下方へ突出しかつ該針本体部と異なる導電性材料製の針先部とを含む堆積物を堆積技術により製作し、
製作された堆積物に焼鈍処理を行うことを含み、
ニッケル・ボロンの結晶サイズは最大で50nm、前記ボロンの含有量は0.02以上、0.20wt%以下である、電気的試験用プローブの製造方法。 - 前記焼鈍処理は、前記堆積物を200°C以上及び400°C未満の温度で加熱することを含む、請求項4に記載の製造方法。
- 前記焼鈍処理は、さらに、前記堆積物を200°C以上及び400°C未満の温度で、1時間から2時間の間加熱することを含む、請求項4に記載の製造方法。
- さらに、前記焼鈍処理の後、常温まで自然冷却することを含む、請求項5及び6のいずれか1項に記載の製造方法。
- 前記焼鈍処理及び前記自然冷却は恒温槽で行う、請求項7に記載の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009263904A JP5597385B2 (ja) | 2009-11-19 | 2009-11-19 | 電気的試験用プローブ、それを用いた電気的接続装置、及びプローブの製造方法 |
KR1020100106866A KR101153288B1 (ko) | 2009-11-19 | 2010-10-29 | 전기적 시험용 프로브, 그것을 이용한 전기적 접속장치 및 프로브의 제조방법 |
US12/939,879 US8671567B2 (en) | 2009-11-19 | 2010-11-04 | Method for manufacturing a probe for an electrical test |
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JP2009263904A JP5597385B2 (ja) | 2009-11-19 | 2009-11-19 | 電気的試験用プローブ、それを用いた電気的接続装置、及びプローブの製造方法 |
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JP2011107023A true JP2011107023A (ja) | 2011-06-02 |
JP5597385B2 JP5597385B2 (ja) | 2014-10-01 |
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JP2009263904A Active JP5597385B2 (ja) | 2009-11-19 | 2009-11-19 | 電気的試験用プローブ、それを用いた電気的接続装置、及びプローブの製造方法 |
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US (1) | US8671567B2 (ja) |
JP (1) | JP5597385B2 (ja) |
KR (1) | KR101153288B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013246116A (ja) * | 2012-05-29 | 2013-12-09 | Micronics Japan Co Ltd | 通電試験用プローブ |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5109064B2 (ja) * | 2006-04-21 | 2012-12-26 | 独立行政法人産業技術総合研究所 | コンタクトプローブ、及びその作製方法 |
ITMI20110352A1 (it) * | 2011-03-07 | 2012-09-08 | Technoprobe Spa | Testa di misura per un' apparecchiatura di test di dispositivi elettronici |
JP2013101043A (ja) * | 2011-11-08 | 2013-05-23 | Renesas Electronics Corp | 半導体装置の製造方法 |
US20150008950A1 (en) * | 2011-12-31 | 2015-01-08 | Roy E. Swart | Manufacturing advanced test probes |
KR101632619B1 (ko) * | 2014-11-11 | 2016-06-23 | 한국기계연구원 | 프로브 핀 및 이의 제조방법 |
JP6221031B1 (ja) | 2016-12-16 | 2017-11-01 | 日本電産リード株式会社 | コンタクトプローブ及び電気接続治具 |
JP7005939B2 (ja) * | 2017-05-25 | 2022-01-24 | 日本電産リード株式会社 | コンタクトプローブ |
TWI713939B (zh) * | 2017-12-18 | 2020-12-21 | 義大利商探針科技公司 | 用於測試電子裝置的測試頭的接觸探針 |
Citations (2)
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JP2008190885A (ja) * | 2007-02-01 | 2008-08-21 | Micronics Japan Co Ltd | 通電試験用プローブおよびその製造方法 |
JP2009094080A (ja) * | 2005-03-16 | 2009-04-30 | Alps Electric Co Ltd | 接触子の製造方法、ならびに前記接触子を用いた接続装置の製造方法 |
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US3045334A (en) * | 1958-10-01 | 1962-07-24 | Du Pont | Alloy and composite metal plate |
US4079156A (en) * | 1975-03-07 | 1978-03-14 | Uop Inc. | Conductive metal pigments |
US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
JP2745744B2 (ja) | 1989-12-06 | 1998-04-28 | 日産自動車株式会社 | 自動車用空調制御装置 |
JP2002226974A (ja) * | 2000-11-28 | 2002-08-14 | Ebara Corp | 無電解Ni−Bめっき液、電子デバイス装置及びその製造方法 |
KR20040045452A (ko) | 2001-09-24 | 2004-06-01 | 리카 일렉트로닉스 인터내셔널, 인크. | 전기 테스트 프로브 및 그 제조 방법 |
JP2008145238A (ja) | 2006-12-08 | 2008-06-26 | Micronics Japan Co Ltd | 電気接続器及びこれを用いた電気的接続装置 |
JP5113392B2 (ja) | 2007-01-22 | 2013-01-09 | 株式会社日本マイクロニクス | プローブおよびそれを用いた電気的接続装置 |
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Patent Citations (2)
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JP2009094080A (ja) * | 2005-03-16 | 2009-04-30 | Alps Electric Co Ltd | 接触子の製造方法、ならびに前記接触子を用いた接続装置の製造方法 |
JP2008190885A (ja) * | 2007-02-01 | 2008-08-21 | Micronics Japan Co Ltd | 通電試験用プローブおよびその製造方法 |
Cited By (1)
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JP2013246116A (ja) * | 2012-05-29 | 2013-12-09 | Micronics Japan Co Ltd | 通電試験用プローブ |
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KR20110055390A (ko) | 2011-05-25 |
US20110115515A1 (en) | 2011-05-19 |
KR101153288B1 (ko) | 2012-06-07 |
US8671567B2 (en) | 2014-03-18 |
JP5597385B2 (ja) | 2014-10-01 |
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