JP2011100840A5 - - Google Patents

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Publication number
JP2011100840A5
JP2011100840A5 JP2009254244A JP2009254244A JP2011100840A5 JP 2011100840 A5 JP2011100840 A5 JP 2011100840A5 JP 2009254244 A JP2009254244 A JP 2009254244A JP 2009254244 A JP2009254244 A JP 2009254244A JP 2011100840 A5 JP2011100840 A5 JP 2011100840A5
Authority
JP
Japan
Prior art keywords
substrate
atmospheric pressure
adjustment mechanism
exposure
pressure adjustment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2009254244A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011100840A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009254244A priority Critical patent/JP2011100840A/ja
Priority claimed from JP2009254244A external-priority patent/JP2011100840A/ja
Priority to US12/938,992 priority patent/US20110102755A1/en
Publication of JP2011100840A publication Critical patent/JP2011100840A/ja
Publication of JP2011100840A5 publication Critical patent/JP2011100840A5/ja
Abandoned legal-status Critical Current

Links

JP2009254244A 2009-11-05 2009-11-05 半導体装置の製造方法および露光装置 Abandoned JP2011100840A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009254244A JP2011100840A (ja) 2009-11-05 2009-11-05 半導体装置の製造方法および露光装置
US12/938,992 US20110102755A1 (en) 2009-11-05 2010-11-03 Method of manufacturing semiconductor devices and exposure apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009254244A JP2011100840A (ja) 2009-11-05 2009-11-05 半導体装置の製造方法および露光装置

Publications (2)

Publication Number Publication Date
JP2011100840A JP2011100840A (ja) 2011-05-19
JP2011100840A5 true JP2011100840A5 (enExample) 2012-04-26

Family

ID=43925100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009254244A Abandoned JP2011100840A (ja) 2009-11-05 2009-11-05 半導体装置の製造方法および露光装置

Country Status (2)

Country Link
US (1) US20110102755A1 (enExample)
JP (1) JP2011100840A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2758981B1 (en) 2011-09-19 2020-06-17 ASML Netherlands B.V. Method and apparatus for predicting a growth rate of deposited contaminants
JP2014067910A (ja) * 2012-09-26 2014-04-17 Tokyo Electron Ltd 塗布膜形成装置、塗布膜形成方法、塗布、現像装置、塗布、現像方法及び記憶媒体
JP6419581B2 (ja) 2015-01-08 2018-11-07 株式会社東芝 半導体装置の製造装置及び半導体装置の製造装置の管理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420098B1 (en) * 2000-07-12 2002-07-16 Motorola, Inc. Method and system for manufacturing semiconductor devices on a wafer
JP2006222284A (ja) * 2005-02-10 2006-08-24 Toshiba Corp パターン形成方法、及び半導体装置の製造方法
JP2009111186A (ja) * 2007-10-30 2009-05-21 Toshiba Corp 基板処理方法、基板搬送方法および基板搬送装置
JP2010182732A (ja) * 2009-02-03 2010-08-19 Toshiba Corp 半導体装置の製造方法

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