JP2011077551A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate fixation of a wavelength conversion material, and to further reduce color dispersion for every light emitting device, in a light emitting device by light emission of an LED. <P>SOLUTION: This light emitting device 1 is composed by combining an LED light emission part formed by mounting an LED chip 2 on a mounting board 4 with a wavelength conversion part 3 containing a phosphor. This light emitting device 1 is manufactured by combining the LED light emission part with the wavelength conversion part 3, thereafter measuring color tone of light emitted based on the light emission of the LED chip 2 in front of the wavelength conversion part 3, and adjusting color tone of light emitted from the light emitting device 1 by changing intensity balance of color mixture. The intensity balance of the color mixture is adjusted by the arrangement position of the wavelength conversion part having a wedge-like cross-sectional surface having a changing effective thickness and stuck and fixed to the upper surface of the mounting board. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting device that emits light from an LED.

  In recent years, LED (Light Emitting Diode) chips that emit blue light and LED chips that emit ultraviolet light have been developed using gallium nitride compound semiconductors. By combining such LED chips with various wavelength conversion materials such as fluorescent pigments and fluorescent dyes, light emitting devices that emit light of a color different from the emission color of LED chips or white light have been developed. . The LED light emitting device has advantages such as small size, light weight, and power saving, and is currently widely used as a light source for display, an alternative to a small light bulb, a light source for a liquid crystal panel, and the like.

  As a method of forming a wavelength conversion portion in which a wavelength conversion material is fixed in the light emitting device as described above, a method of filling a placement portion of an LED chip with a wavelength conversion material contained in a resin is generally performed. However, the steps of the method of forming the wavelength conversion part by filling are complicated and there are problems that it is difficult to control the amount of resin dripping, so there is a problem that the color variation and light amount variation are large for each light emitting device. Therefore, a light emitting device is known in which an LED chip is disposed in a recess of a mounting substrate, a wavelength conversion unit including a wavelength conversion material is formed as a separate member, and the wavelength conversion unit is disposed so as to cover the recess of the mounting substrate. (For example, refer to Patent Document 1).

  By the way, since the LED chip itself has variations in light emission luminance and light emission wavelength, for example, in a light emitting device that emits white light in which a wavelength conversion material is combined with such an LED chip, the color tone varies for each light emitting device. There is. In order to solve this problem, first, LED chips are ranked based on the emission luminance and emission wavelength of direct light from the LED chip, and on the other hand, the combination conditions of the wavelength conversion material and the luminance adjusting dimming material are determined. A plurality of different covering members are formed. Thereafter, a manufacturing method is known in which a light emitting device is manufactured by combining LED chips that have been ranked with a covering member having a predetermined combination condition corresponding to the rank (see, for example, Patent Document 2).

JP 2001-345482 A JP 2004-119743 A

  However, in the method of manufacturing a light emitting device as described in Patent Document 1 described above, the manufacturing process is simplified by using the wavelength conversion unit as a separate member. There is still a need for improvement. Moreover, in the manufacturing method of the light-emitting device as shown in Patent Document 2 described above, although the covering members corresponding to the LED chips ranked in advance are combined, the color variation for each light-emitting device is completely achieved by the combination. It is hard to say that it will be resolved, and there is still room for improvement.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems, and to provide a light emitting device that emits light from an LED, in which the wavelength conversion material can be easily fixed and the color variation of each light emitting device is further reduced.

  In order to achieve the above object, a light-emitting device of the present invention is a light-emitting device that is a combination of an LED light-emitting unit and a wavelength conversion unit containing a phosphor, and the color tone of light emitted from the light-emitting device is a mixed color. In the light-emitting device adjusted by the intensity balance, the LED light-emitting portion is connected to the mounting substrate having a recess whose opening is widened on the upper surface side, the LED chip mounted on the bottom surface of the recess, and the side surface from the lower surface of the mounting substrate. And an electrode electrically connected to the LED chip extending to the bottom surface of the recess, and the wavelength conversion unit has a wedge-shaped cross section, and is adhesively fixed to the upper surface of the mounting substrate. The effective thickness of the wavelength conversion part facing the LED light emitting part changes with respect to the relative position change.

  In this light-emitting device, a plurality of the wavelength conversion units can be provided.

  According to the light emitting device of the present invention, the wavelength balance is fixed and the intensity balance of the color mixture is provided by the configuration including the wavelength conversion unit that has a wedge-shaped cross section whose effective thickness varies and is fixed to the upper surface of the mounting substrate. Adjustment is easy, and color variations among the light emitting devices are further reduced.

(A) is a perspective view of the light-emitting device manufactured by the manufacturing method used as the premise of this invention, (b) is sectional drawing of the light-emitting device. The flowchart of a manufacturing method same as the above. The perspective view which shows the color tone measurement of the light from the light-emitting device in a manufacturing method same as the above. The flowchart regarding the color tone adjustment in a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the other example of a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing in the middle of manufacture of the light-emitting device which concerns on one Embodiment of this invention. Sectional drawing in the middle of manufacture of the light-emitting device which concerns on other embodiment of this invention. Sectional drawing of the light-emitting device explaining the further another example of the manufacturing method used as the premise of this invention. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. (A) is a top view of the wavelength conversion part explaining the further another example of a manufacturing method same as the above, (b) is a top view of the LED light emission part which uses the same wavelength conversion part, (c) is X1-X1 of (b). FIG. (A) is sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above, (b) is a perspective view of the light-emitting device of (a). (A) is sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above, (b) is a perspective view of the light-emitting device of (a). The top view of the light-emitting device which fractured | ruptured and showed the wavelength conversion part explaining the further another example of a manufacturing method same as the above. The top view of the wiring board which mounts the light-emitting device explaining the further another example of a manufacturing method same as the above. The top view of the light-emitting device which fractured | ruptured and showed the wavelength conversion part explaining the further another example of a manufacturing method same as the above. The top view of the wiring board which mounts the light-emitting device shown in FIG. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device of the state mounted in the wiring board explaining the further another example of a manufacturing method same as the above. X2-X2 sectional view taken on the line of FIG. Sectional drawing of the light-emitting device of the state mounted in the wiring board explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device of the state mounted in the wiring board explaining the further another example of a manufacturing method same as the above. Sectional drawing of the light-emitting device of the state mounted in the wiring board explaining the further another example of a manufacturing method same as the above. (A) is a perspective view of the lighting fixture using the light-emitting device which concerns on this invention, (b) is a top view of the state except the housing | casing of the lighting fixture.

  Hereinafter, light-emitting devices according to embodiments of the present invention will be described with reference to the drawings. Note that the light-emitting devices shown in FIGS. 1 to 6 and FIGS. 9 to 29 are light-emitting devices on which the present invention is based. 1A and 1B show a light-emitting device 1 manufactured by a manufacturing method, which is a premise of the present invention. The light emitting device 1 is configured by combining an LED light emitting unit formed by mounting an LED chip 2 on a mounting substrate 4 that is a light emitting device main body, and a wavelength conversion unit 3 containing a phosphor. The mounting substrate 4 is a substantially rectangular parallelepiped substrate formed of ceramics, for example, and includes a recess 41 for mounting the LED chip 2 on one surface (upper surface) of the approximately rectangular parallelepiped mounting substrate 4. An electrode 42 extending from the lower surface of the rectangular parallelepiped via the side surface is provided. The LED chip 2 is, for example, a blue LED that emits blue light. The LED chip 2 is, for example, flip-chip mounted on the bottom surface of the recess 41 of the mounting substrate 4, and the electrode 42 and the electrode (not shown) of the LED chip 2 are electrically connected. Yes. The material of the mounting substrate 4 is not particularly limited to ceramics. The LED chip 2 is, for example, a gallium nitride blue LED having a dominant wavelength of 460 nm to 465 nm.

  The wavelength conversion unit 3 includes, for example, a region including a phosphor that absorbs light emitted from the blue LED as described above to generate yellow light (hereinafter, phosphor region portion 31) and a region that does not include the phosphor (hereinafter, phosphor). , And a transparent region portion 30). The wavelength conversion unit 3 is a substantially flat plate and is disposed on the upper surface of the LED light emitting unit, that is, the upper surface of the mounting substrate 4 in parallel with the light emitting surface of the LED chip. The transparent region portion 30 is formed over the entire area in the thickness direction of the wavelength conversion portion 3. The wavelength conversion unit 3 having such a configuration can be easily formed using a sheet-like member. The configuration of the wavelength conversion unit 3 is not limited to this configuration.

  In the light emitting device 1 described above, a part of the blue light generated by the LED chip 2 is absorbed by the phosphor in the phosphor region portion 31 and converted into yellow light and emitted from the light emitting device 1 to the outside. The other part passes through the phosphor region part 31 without being absorbed by the phosphor, or passes through the transparent region part 30 and is emitted from the light emitting device 1 to the outside as blue light. Since the blue light and the yellow light emitted from the light emitting device 1 have a complementary color relationship, the light from the light emitting device 1 is recognized as white light by mixing these lights with an appropriate intensity balance. The Adjustment of the intensity balance of the color mixture is performed by adjusting the ratio of the phosphor region portion 31 and the transparent region portion 30 of the wavelength conversion unit 3.

  The manufacturing process of the above-described light emitting device 1 will be further described with reference to the flowchart shown in FIG. 2 and FIG. FIG. 3 shows how the color tone of light from the light emitting device 1 is measured. As shown in FIG. 2, the light emitting device 1 is manufactured first by manufacturing the LED chip 2, the wavelength conversion unit 3, and the mounting substrate 4 (S1). Then, the LED light emitting part is produced by mounting the LED chip 2 on the mounting substrate 4 (S2). For example, flip chip mounting is used for mounting the LED chip 2, and ultrasonic bonding, solder bonding, bonding with silver paste, or the like is used for electrical bonding between the electrode of the LED chip 2 and the electrode 42 of the mounting substrate 4. be able to.

  Next, the LED light emitting unit formed by electrically connecting the LED chip 2 to the mounting substrate 4 is a pre-adjustment light emitting device before color tone adjustment combined with the wavelength conversion unit 3 (S3). In the light emitting device 1 before adjustment, the wavelength conversion unit 3 is placed on the upper surface of the mounting substrate 4 so as to cover the opening of the recess 41 of the mounting substrate 4. A boundary portion between the phosphor region portion 31 and the transparent region portion 30 of the wavelength conversion portion 3 is an arbitrary position within the opening surface of the recess 41. The wavelength conversion unit 3 covers the LED chip 2 and is arranged so that the inclined surface of the recess 41 can be confirmed from the transparent region unit 30.

  In this arrangement state, the sheet-like wavelength converter 3 is held by a chuck attached to a slidable arm (not shown) as shown in FIG. Accordingly, the sheet-like wavelength conversion unit 3 is slidable in the direction indicated by the arrow a so that the ratio of the phosphor region 31 and the transparent region 30 in the opening region of the recess 41 of the mounting substrate 4 can be adjusted. ing. In addition, the sheet-like wavelength conversion unit 3 is formed to be larger than the area of the upper surface of the mounting substrate 4 so as to cope with this slide.

  As shown in FIG. 3, the pre-adjustment light emitting device 1 emits light from the LED chip 2 by the electric power supplied through the electrode 42, and light emitted from the pre-adjustment light emitting device 1 based on the emitted light. Is measured by the measuring device D provided in front of the wavelength converter 3 (S4). The color tone of light emitted from the pre-adjustment light emitting device 1 is expressed by chromaticity coordinates, and based on the chromaticity coordinates, it is determined whether the color tone of light emission is a predetermined color tone (S5).

  When the color tone is not the predetermined color tone (NO in S5), the wavelength conversion unit 3 is slid in any direction of the arrow a based on the difference between the measured value in the chromaticity coordinates and the reference value corresponding to the predetermined color tone. Then, the color tone of the light emitting device 1 is adjusted (S6). While the LED chip is emitting light, measurement of color tone (S4), determination of color tone (S5), adjustment of color tone by sliding the wavelength conversion unit 3 (S6), measurement color tone (chromaticity coordinates) is a predetermined color tone ( Repeat until it is within a predetermined range of (chromaticity coordinates).

  When the relationship between the slide width of the wavelength conversion unit 3 and the amount of change in chromaticity coordinates is set in advance and the slide width corresponding to the difference between the initially measured value and the reference is slid, measurement by the measuring device D is performed. Can be set as short as one time, and the adjustment time can be shortened. Moreover, the measurement of the light emission characteristic of light emission from the light-emitting device 1 should just be measurement values, such as a light beam, a brightness | luminance, and visibility efficiency, for example, and the relationship with a chromaticity coordinate can be determined.

  In step S5 described above, when the measured chromaticity coordinates are within a predetermined reference and the measured color tone is determined to be a predetermined color tone (YES in S5), the pre-adjustment light emitting device 1 emits light in the final state. A finishing process is performed as the apparatus 1 (S7). In this finishing step, the outer dimensions of the wavelength conversion unit 3 are cut so as to be the same as the outer dimensions of the upper surface of the mounting substrate 4. The cutting of the outer shape is performed by moving from the mounting substrate 4 to another location.

  On the upper surface of the mounting substrate 4, for example, an adhesive member such as silicon resin or epoxy resin is applied or dropped. The application range of the adhesive member is, for example, the peripheral edge of the upper surface of the mounting substrate 4 so that the wavelength conversion unit 3 can be fixed. Next, the above-described cut wavelength conversion unit 3 is moved to a predetermined position on the mounting substrate 4 by using a suction nozzle or the like, and is placed to cure the adhesive member. Thereby, the wavelength conversion unit 3 is bonded and fixed to the LED light emitting unit (the upper surface of the mounting substrate 4), and the light emitting device 1 shown in FIG. 1A is completed.

  In addition, after mounting the LED chip 2 on the mounting substrate 4, an adhesive member is applied to the upper surface of the mounting substrate 4, and the wavelength conversion unit 3 is installed at a position away from the upper surface of the mounting substrate 4 so that the adhesive member does not touch. Then, measure the chromaticity coordinates and make it within the standard. And in this state, you may make it mount on a mounting substrate as it is, and make it adhere | attach. In this case, after the adhesive member is cured, the wavelength conversion unit 3 protruding from the mounting substrate 4 is cut.

  Next, an overview of various methods for adjusting the color tone of the light emitting device will be described with reference to the flowchart of FIG. As shown in FIG. 4, the color tone of the light emitted from the light emitting device 1 according to the present invention is mixed by adjusting the phosphor density distribution in the wavelength conversion unit 3 or arranging the optical filter in the wavelength conversion unit 3. The intensity balance can be changed (S61). Moreover, the light emission wavelength of the LED chip 2 can be changed by adjusting the current and temperature of the LED chip 2 (S62). In addition, the temperature of the wavelength converter 3 can be adjusted to change the wavelength of the light emitted after being wavelength-converted by the phosphor of the wavelength converter 3 (S63). At least one of these three steps can further reduce the color tone variation due to the manufacturing variation of the LED chip 2 and the wavelength conversion unit 3, and adjust the color tone of the light emitting device that has been a defective product to a non-defective range, Reduce defective products and improve yield.

  The light emitting device 1 shown in FIGS. 1A and 1B and FIG. 3 adjusts the color mixing balance by sliding the wavelength conversion unit 3 having the phosphor region portion 31 and the transparent region portion 30. This is to adjust the color tone. In the following, another example of adjusting the color tone of light will be described.

  The light emitting device 1 shown in FIG. 5 includes a wavelength conversion unit 3 composed of two phosphor sheets 3A and 3B formed by alternately arranging phosphor region portions 31 and transparent region portions 30. The phosphor sheet 3 </ b> B is cut to the same size as the upper surface of the mounting substrate 4. The phosphor sheet 3A is longer than the mounting substrate 4 by a portion attached to the chuck portion (not shown) of the device arm and a portion corresponding to the slide adjustment width so that the phosphor sheet 3A can slide in the direction of the arrow a before the color tone adjustment. ing.

  In the initial process of manufacturing the light emitting device 1, the LED chip 2 is electrically joined to the mounting substrate 4, and then the phosphor sheet 3 </ b> B is bonded to the mounting substrate 4 with an adhesive member and fixed. In the next step of adjusting the light emission characteristics, the phosphor sheet 3A larger than the mounting substrate 4 is attached to the chuck portion of the apparatus arm in a state in which it can slide in the direction of arrow a. Then, the phosphor sheet 3A is installed so that the transparent region portion 30 of the phosphor sheet 3A is positioned on the transparent region portion 30 of the phosphor sheet 3B.

  A voltage is applied to the electrode 42 of the mounting substrate 4 to cause the LED chip 2 to emit light, and chromaticity coordinates are measured by the measuring device D as the light emission characteristics. The phosphor sheet 3A is slid according to the difference between the measured chromaticity coordinates and the reference. The slide is repeated until the chromaticity coordinates are within the standard, and when the standard is within the standard, the measurement and the tone adjustment are finished. At the position of the phosphor sheet 3A at the end of the color tone adjustment, the phosphor sheet 3A is adsorbed by an adsorption nozzle (not shown), the chuck portion of the apparatus arm holding the phosphor sheet 3A is opened, and the phosphor sheet 3A Are cut according to the outer shape of the upper surface of the mounting substrate 4.

  Next, an adhesive member is applied to the peripheral portion of the phosphor sheet 3B already fixed to the mounting substrate 4, and the phosphor sheet 3A is placed thereon to cure the adhesive member. When placing the phosphor sheet 3A, a positioning jig is brought into contact with one of the end faces of the mounting substrate 4, and the phosphor sheet 3A is placed in contact with the positioning jig. The position of the phosphor sheet 3A is easily reproduced at the position at the time of slide adjustment.

  The phosphor sheet 3A has the same horizontal width as that of the phosphor sheet 3B, and is slid in a state where the horizontal width is aligned. After adjusting the color tone, the phosphor sheets 3A and 3B are bonded to the side surface where the positions of the phosphor sheets 3A and 3B are aligned with each other. The member may be applied and cured. In this case, what is necessary is just to cut the other side part of 3 A of fluorescent substance sheets after making it harden | cure. In the light emitting device 1 manufactured in this way, the ratio of the light from the LED chip 2 irradiating each region of the transparent region portion 30 and the phosphor region portion 31 of the phosphor sheets 3A and 3B is adjusted. In other words, by adjusting the overlapping portion of the phosphor region portion 31 of the phosphor sheet 3A and the transparent region portion 30 of the phosphor sheet 3B, the intensity balance of the color mixture as the light emitting device 1 is adjusted, and highly accurate color tone adjustment is performed. ing.

  This light-emitting device 1 uses the light emission of the LED chip 2 and the wavelength conversion unit 3 as compared to the light-emitting device 1 shown in FIG. 1 that adjusts the color tone by the wavelength conversion unit 3 made of a single phosphor sheet. It is possible to smoothly adjust the intensity balance with the wavelength-converted light emission.

  The light-emitting device 1 shown in FIG. 6 uses a phosphor sheet 3A formed by alternately arranging phosphor region portions 31 and transparent region portions 30, and fluorescence using a phosphor different from the phosphor in the phosphor region portion 31. And a phosphor sheet 3B formed by alternately arranging body region portions 32 and transparent region portions 30. That is, the light emitting device 1 includes a wavelength conversion unit 3 configured using different phosphors. By using the wavelength conversion unit 3 composed of such a combination of the phosphor sheets 3A and 3B, the emission color of the LED chip 2, the emission color of the phosphor in the phosphor region 31, and the phosphor in the phosphor region 32 It is possible to mix three colors of emitted colors. As a result, at the time of color tone adjustment, the chromaticity coordinates can be changed in a curved line, adjustment along the black body locus is possible, and multi-coloring is also facilitated.

  7 and 8 show cross sections during the manufacture of the light emitting device according to an embodiment of the present invention. The light emitting device 1 illustrated in FIG. 7 includes a wavelength conversion unit 3 configured using a phosphor sheet 3A having a phosphor region 31 having a tapered (wedge shape) cross section. The wavelength conversion unit 3 is disposed on the upper surface of the mounting substrate 4 on which the LED chip 2 is mounted, and the color tone is adjusted by sliding the wavelength conversion unit 3 while measuring the color tone. The procedure for sliding and bonding and fixing the wavelength conversion unit 3 is the same as the procedure described with reference to FIG.

  The light emitting device 1 illustrated in FIG. 8 includes a wavelength conversion unit 3 configured using two phosphor sheets 3A and 3B each having a phosphor region 31 having a tapered cross section. The color tone can be adjusted by sliding the other phosphor sheet 3 </ b> B in a state where the one phosphor sheet 3 </ b> A is arranged and fixed on the upper surface of the mounting substrate 4. Other procedures for manufacturing the light emitting device 1 are the same as those described with reference to FIG.

  In the light emitting device 1 shown in FIG. 7 and FIG. 8 described above, the thickness distribution with respect to the spatial distribution of the light emitted from the LED chip 2 is changed by changing the thickness distribution of the phosphor sheets 3A and 3B viewed from the LED chip 2. The positional relationship has been changed. Thereby, the ratio of the light from the LED chip 2 and the light from the wavelength conversion unit 3 including the phosphor can be changed, so that the intensity balance of the color mixture as the light emitting device 1 can be easily adjusted. It is possible to reduce the color variation for each light emitting device with higher accuracy than in the example.

  Further, in the light emitting device 1 shown in FIG. 8, different phosphors may be used for the phosphor sheet 3B and the phosphor sheet 3A. As a result, similar to the light emitting device 1 shown in FIG. 6, three colors can be mixed, and when adjusting the color tone, the chromaticity coordinates can be changed in a curved manner, and adjustment along the black body locus is possible. In addition, it is easy to increase the number of colors.

  Hereinafter, the light emitting device shown in FIGS. 9 to 29 is a light emitting device which is a premise of the present invention. The light emitting device 1 shown in FIG. 9 and FIG. 10 includes a wavelength conversion unit 3 configured using a phosphor sheet having a transparent portion including a cutting removal portion 33 on the surface of a phosphor region portion 31 containing a phosphor. Yes. In the manufacturing process of the light emitting device 1, the LED chip 2 is electrically bonded to the mounting substrate 4 in the initial process. Thereafter, the wavelength conversion unit 3 is disposed on the mounting substrate 4, a voltage is applied to the electrode 42 of the mounting substrate 4, the LED chip 2 is caused to emit light, and chromaticity coordinates are measured by the measuring device D as the light emission characteristics. Then, according to the difference between the chromaticity coordinates of the measurement result and the reference, a part of the wavelength conversion unit 3 is cut based on a predetermined relationship between the cutting area of the wavelength conversion unit 3 and the chromaticity coordinates. The cutting removal part 33 is formed. This cutting is performed using a cutting blade or the like. Further, it is possible to evaporate and remove using laser light instead of machining.

  The wavelength conversion unit 3 on which the cutting removal unit 33 has been formed is placed on the mounting substrate 4 again, and the formation of the cutting removal unit 33 is repeated until the chromaticity coordinates are within the reference. Finish the color adjustment. After the chromaticity coordinates are within the reference, the wavelength conversion unit 3 is bonded and fixed in the same procedure as in the description of the light emitting device 1 in FIG.

  The wavelength conversion unit 3 shown in FIGS. 9 and 10 is different in that the cutting removal unit 33 is formed on the inner surface side in the former, and is formed on the surface side in the latter. As shown in FIG. 10, when the cutting removal portion 33 is formed on the surface side, the cutting removal portion can be formed with the wavelength conversion portion 3 placed on the surface of the mounting substrate 4. In this case, processing using a laser beam is suitable for forming the cutting removal portion 33 in terms of processing accuracy and processing efficiency. Further, the color tone measurement result and the formation condition of the cutting removal part 33 are determined in advance, and the color tone is adjusted without repeating the formation of the cutting removal part 33 and the color tone measurement by forming based on the conditions. Can do.

  A light emitting device 13 shown in FIG. 11 includes a wavelength conversion unit 3 configured by providing a phosphor sheet thickness increasing portion 3C on the upper surface of a phosphor sheet 3A containing a phosphor disposed on the upper surface of the mounting substrate 4. . In the state where the phosphor sheet 3A is arranged and fixed on the upper surface of the mounting substrate 4, the intensity balance of the color mixture of the light emitting device 1 is measured, and the thickness of the phosphor sheet is increased based on a predetermined condition, Adjust the color tone. A voltage is applied to the electrode 42 of the mounting substrate 4 to cause the LED chip 2 to emit light. The increasing part 3C is formed by applying a resin containing the same phosphor as the phosphor contained in the phosphor sheet 3A on the phosphor sheet 3A so that the chromaticity coordinates are within the standard.

  In addition to the application method, the method of forming the increased portion 3C includes a method of immersing a phosphor sheet in a resin containing a phosphor and a method of spraying a resin containing a phosphor. After increasing the thickness of the phosphor sheet by any method, the measurement as the light-emitting device 1 is performed again to confirm that the intensity balance of the desired color mixture is obtained. Other procedures for manufacturing the light emitting device 1 are the same as those described with reference to FIG.

  The light emitting device 1 shown in FIG. 12 includes a wavelength conversion unit 3 configured by adding an appropriate amount of a phosphor particle material 35 to a depression 34. The wavelength conversion unit 3 measures the intensity balance of the color mixture of the light emitting device 1 in a state where the phosphor sheet 3A containing the phosphor having the depression 34 provided on the upper surface is arranged and fixed on the upper surface of the mounting substrate 4. The hollow part 34 is made of an appropriate amount of phosphor particles 35. That is, the color tone is adjusted according to the amount of the phosphor particle material 35.

  The phosphor particle material 35 is formed by containing a phosphor in an epoxy resin, a silicon resin, or the like. The diameter of the phosphor particle material 35 is made smaller than the size of the recess 34 of the phosphor sheet 3A. Also, a plurality of types of phosphor particle materials 35 having different diameters are prepared. A voltage is applied to the electrode 42 of the mounting substrate 4 to cause the LED chip 2 to emit light, and the chromaticity coordinates are measured. Based on the difference between the measured chromaticity coordinate and the reference value, and the relationship between the chromaticity coordinate determined in advance and the diameter and quantity of the phosphor particle material 35, the phosphor particle material 35 is removed from the depression of the phosphor sheet 3A. 34. The depression 34 is filled with silicon resin or epoxy resin as an adhesive member in advance. The phosphor particle material 35 is put into the depression 34 and the chromaticity coordinates are adjusted, and then the chromaticity coordinates are confirmed. Until the chromaticity coordinates fall within the standard, the arrangement of the phosphor particle material 35 in the recess 34 and the confirmation of the chromaticity coordinates are repeated. Other procedures for manufacturing the light emitting device 1 are the same as those described with reference to FIG.

  When the chromaticity coordinates are within the reference, the adhesive member in the recess 34 is cured. By the manufacturing method as described above, variations in color tone of the light emitting device 1 can be reduced. Further, this method is different from the method of adjusting the phosphor sheet by sliding the phosphor sheet as in the light emitting device 1 shown in FIG. 3, and the excess phosphor sheet previously provided for sliding is scraped and discarded. Is unnecessary. That is, it is sufficient to use a phosphor sheet that matches the outer surface dimensions of the mounting substrate 4, and the material cost can be reduced.

  The light emitting device 1 shown in FIG. 13 includes a wavelength conversion unit 3 having a phosphor sheet 3A containing a phosphor disposed and fixed on the upper surface of a mounting substrate 4, and an optical filter 6 disposed on the upper surface. That is, the optical filter 6 is formed on the phosphor sheet 3A and absorbs at least a part of light emitted from the LED chip 2 or light emitted from the phosphor in the phosphor sheet 3A. The external dimensions of the phosphor sheet 3 </ b> A and the optical filter 6 can be the same as the external dimensions of the upper surface of the mounting substrate 4. The color tone of the light emitting device 1 is adjusted by measuring the color tone and forming a removal portion 61 formed by removing a part of the optical filter 6 with the phosphor sheet 3A and the optical filter 6 placed on the mounting substrate 4. Is called. While measuring the chromaticity coordinates and color rendering properties of the light emitting device 1, the removal unit 61 is formed in the optical filter 6 using, for example, laser light until the intensity balance of a desired color mixture is achieved. Here, the removal of the optical filter 6 is not necessarily performed continuously, and may be performed according to a condition determined in advance based on the measurement result. Other procedures for manufacturing the light emitting device 1 are the same as those described with reference to FIG.

  Moreover, it can also be set as the manufacturing method which makes the optical filter 6 separable from 3 A of fluorescent substance sheets. In this case, when forming the removal portion 61 of the optical filter 6, after measuring the color tone, the optical filter 6 is once removed from the phosphor sheet 3A, and a part of the optical filter 6 is removed by laser light in another place. The optical filter 6 can be returned to the phosphor sheet 3A again.

  The light emitting device 1 shown in FIG. 14 includes a wavelength conversion unit 3 including a phosphor sheet 3A containing a phosphor fixed on the upper surface of a mounting substrate 4 and a resin mass 36 containing the phosphor provided on the upper surface. Yes. The color tone of the light-emitting device 1 is adjusted by potting a phosphor-containing resin on the phosphor sheet 3A based on the measurement of the color tone and the measurement result with the phosphor sheet 3A placed on the mounting substrate 4. This is done by forming a mass 36. While measuring the intensity balance of the color mixture of the light emitting device 1, the potting of the phosphor-containing resin is performed until the intensity balance of the desired color mixture is achieved. Here, the potting does not necessarily have to be performed continuously, and may be performed according to a condition determined in advance based on the measurement result. Other procedures for manufacturing the light emitting device 1 are the same as those described with reference to FIG.

  The light emitting device 1 shown in FIG. 15 includes a wavelength conversion unit 3 configured by a phosphor sheet 3A containing a phosphor fixed on the upper surface of a mounting substrate 4 and a phosphor particle material 37 provided on the upper surface. . The adjustment of the color tone of the light emitting device 1 is performed by measuring the color tone in a state where the phosphor sheet 3A is placed on the mounting substrate 4 and adjusting the quantity of the phosphor particles 37 arranged on the phosphor sheet 3A based on the measurement result. To do. Other procedures for manufacturing the light emitting device 1 are the same as those described with reference to FIG.

  The light emitting device 1 shown in FIGS. 16 (a), (b), and (c) includes a disk-shaped transparent region portion 30 and a quadrangular phosphor region portion 31 that is arranged so that the center coincides with the approximate center thereof. The wavelength converter 3 is provided. The recess 41 of the mounting substrate 4 has an inverted trapezoidal cross section, and the opening of the inverted trapezoidal recess 41 and the upper surface of the mounting substrate 4 are connected via a circular stepped portion 40. Then, the disc-shaped transparent region portion 30 is rotatably fitted to the circular step portion 40 and disposed.

  The phosphor region portion 31 may be disposed so as to substantially coincide with the opening of the concave portion 41 of the mounting substrate 4, and is not limited to a quadrangle, and may have a shape such as a triangle, a star shape, or an ellipse. The color tone of the light emitting device 1 is adjusted by measuring the color tone and rotating the transparent region 30 based on the measurement result in a state where the transparent region 30 of the wavelength conversion unit 3 is placed on the stepped portion 40 of the mounting substrate 4. . Along with the rotation of the transparent region portion 30, the phosphor region portion 31 thereon rotates, and the surface distribution of the light from the LED chip 2 and the surface distribution of the phosphor contained in the phosphor region portion 31 in the opening surface of the recess 41 are as follows. By changing the relative positional relationship, the intensity balance of the color mixture can be changed.

  The mounting and rotation of the wavelength conversion unit 3 on the mounting substrate 4 can be performed by sucking the transparent region 30 using, for example, a suction nozzle. The suction nozzle is translucent and does not affect the measurement of the color tone when the LED chip 2 emits light. Other procedures for manufacturing the light emitting device 1 are the same as those described with reference to FIG.

  The light emitting device 1 shown in FIGS. 17A and 17B has a wavelength conversion composed of a phosphor region portion 31 and a transparent region portion 30 similar to the wavelength converting portion 3 of the light emitting device 1 shown in FIG. Part 3 is provided. On the mounting substrate 4 of the light emitting device 1, the movable portion 7 for light shielding can be moved forward and backward between the transparent region portion 30 not including the phosphor of the wavelength conversion portion 3 and the LED chip 2 mounted on the bottom surface of the concave portion 41. A notch 71 for insertion is formed. The color tone of the light emitting device 1 is adjusted by adjusting the advancing / retreating position of the movable portion 7 to increase or decrease the amount of light passing from the LED chip 2 to the transparent region portion 30, and changing the intensity balance of the color mixture. In a state where the tip of the movable part 7 is inserted inside from the inner wall surface of the recess 41, the amount of light passing through the transparent region part 30 is reduced, and in a state where the tip of the movable part 7 is drawn outside the inner wall surface, The inner wall surface of the recess 41 is expanded, and the amount of light passing through the transparent region 30 is increased.

  A manufacturing process of the light emitting device 1 will be described. After mounting the LED chip 2 on the mounting substrate 4, the wavelength conversion unit 3 is bonded and fixed to the upper surface of the mounting substrate 4 using an adhesive member such as silicon resin or epoxy resin. The transparent region part 30 of the wavelength conversion part 3 is arranged so that a part of the opening surface of the concave part 41 on which the LED chip 2 is mounted. A voltage is applied to the electrode 42 of the mounting substrate 4 to cause the LED chip 2 to emit light, and the chromaticity coordinates of the emitted light are measured by a measuring device. The movable portion 7 has its end held by a device arm (not shown) and is disposed in a notch portion 71 provided on the upper side surface of the mounting substrate 4 so as to be slidable inward and outward.

  As a result of measuring the light emission of the light emitting device 1, if the chromaticity coordinates of the light emission are not within the reference, the movable part 7 is slid. As a result, the amount of direct light that is emitted from the LED chip 2 passes through the transparent region 30 is adjusted, and the ratio between the light emitted from the LED chip 2 and the light that has been wavelength-converted by the phosphor in the phosphor region 31 is changed. The chromaticity coordinates of the light emission of the light emitting device 1 are changed to adjust the color tone of the light emission. The movable part 7 is slid until the chromaticity coordinates are within the reference, and in a state where the chromaticity coordinates are within the reference, an adhesive member is applied to the contact portion between the movable part 7 and the mounting substrate 4 to fix them together. After fixing the movable part 7, the surplus part of the movable part 7 protruding from the outer wall of the mounting substrate 4 is removed by cutting with laser light or a blade.

  According to the color tone adjustment method using the movable portion 7 as described above, the wavelength conversion portion 3 can be fixed to the mounting substrate 4 in a state in which the size of the wavelength conversion portion 3 is adjusted to the outer dimensions of the mounting substrate 4. The material loss of the body sheet can be reduced. In addition, it is preferable to arrange the transparent region portion 30 of the wavelength conversion unit 3 so that the color tone of light emission of the light emitting device 1 can be adjusted by sliding the movable unit 7 in the pulling direction. According to such an arrangement, it is possible to avoid the disadvantage that the light emission of the LED chip 2 is unnecessarily shielded to reduce the light emission efficiency.

  Further, instead of using the notch portion 71 and the movable portion 7 in the light emitting device 1 described above, a metal layer is provided on the upper surface of the transparent region portion 30, and the color balance is achieved by partially removing the metal layer. It can also be changed. In this case, laser light can be used to remove the metal layer.

  The light emitting device 1 shown in FIGS. 18 (a) and 18 (b) has a wavelength conversion composed of a phosphor region portion 31 and a transparent region portion 30 similar to the wavelength converting portion 3 of the light emitting device 1 shown in FIG. Part 3 is provided. The color tone of the light emitting device 1 is adjusted by reducing the amount of light emitted from the LED chip 2 to the side and passing through the transparent region 30 by the through holes 72 provided in the side wall of the mounting substrate 4.

  A manufacturing process of the light emitting device 1 will be described. After mounting the LED chip 2 on the mounting substrate 4, the wavelength conversion unit 3 is bonded and fixed to the upper surface of the mounting substrate 4 with an adhesive member. The transparent region part 30 of the wavelength conversion part 3 is arranged so that a part of the opening surface of the concave part 41 on which the LED chip 2 is mounted. A voltage is applied to the electrode 42 of the mounting substrate 4 to cause the LED chip 2 to emit light, and the chromaticity coordinates of the emitted light are measured by a measuring device.

  As a result of measuring the light emission of the light emitting device 1, when the chromaticity coordinates of the light emission are not within the reference, a through hole 72 is opened on the side surface of the mounting substrate toward the LED chip mounting recess, and the light from the LED chip 2 is externally transmitted. In this state, the chromaticity coordinates are measured again. If the chromaticity coordinates are not within the reference, the through hole 72 is opened again. The through-hole 72 is opened at a location different from the location previously opened. In addition, the position of the through-hole 72 is set to one place, and it can also be adjusted to increase the amount of light leakage by gradually increasing the hole diameter instead. Further, in order to easily open the through hole 72 in the mounting substrate 4, the mounting substrate 4 made of a resin such as epoxy may be used. For the formation of the through hole 72, it is simple and preferable to use a laser beam. When laser light is used, the diameter of the through hole 72 can be adjusted by increasing the output of the laser light.

  A light emitting device 1 shown in FIG. 19 includes a wavelength conversion unit 3 made of a phosphor sheet containing a phosphor, and includes electrodes 42 that supply current to the LED chip 2 mounted on the bottom surface of the recess 41 of the mounting substrate 4. A resistor R inserted in series with the wiring pattern is provided. The color tone of the light emitting device 1 is adjusted by changing the resistance value of the resistor R and changing the amount of current supplied to the LED chip 2. This is based on the principle that when the current flowing through the LED chip 2 increases, for example, the emission wavelength of the LED chip 2 decreases. By adjusting the current using the resistor R, the emission wavelength of the LED chip 2 can be set to a predetermined constant value, and the color variation for each light emitting device 1 can be reduced with higher accuracy than in the past.

  The resistor R is a resistor that is provided in advance on a chip resistor or a mounting substrate, and the resistance value of which can be changed. Regardless of which resistor R is used, in a state where the wavelength conversion unit 3 is disposed on the upper surface of the mounting substrate 4, the color tone of light emission of the light emitting device 1 is measured, and a predetermined applied voltage is obtained so as to obtain a predetermined color tone. Is adjusted by changing the resistance value of the resistor R.

  When the above-described resistor R is made of a thin film or the like previously provided on the mounting substrate 4, the resistance value can be increased by removing a part of the thin film forming the resistor R using a laser beam or the like. it can. In the case of a resistor configured by connecting chip resistors in parallel, the resistance value can be increased by disconnecting the parallel resistors. The resistance value of the resistor R is reduced by, for example, directly connecting a part of the resistor R using a conductive paste or the like.

  The light emitting device 1 shown in FIG. 20 is mounted on the wiring substrate 5 with the wavelength conversion unit 3 made of a phosphor sheet containing a phosphor on the upper surface of the mounting substrate 4. The wiring board 5 includes a wiring pattern 53 that supplies a current to the light emitting device 1, and the wiring pattern 53 is provided with a resistor R that is inserted in series. The color tone of the light emitting device 1 is adjusted by mounting the light emitting device 1 on the wiring board 5 and changing the amount of current supplied to the LED chip 2 by changing the resistance value of the resistor R on the wiring board 5. . As described above, this is based on the principle that when the current flowing through the LED chip 2 increases, for example, the emission wavelength of the LED chip 2 decreases.

  As the resistor R, a chip resistor, a resistor having a lead wire, a resistance value variable resistor, a thin film pattern resistor formed on the wiring substrate 5 or the like can be used. Regardless of which resistor R is used, in a state where the wavelength conversion unit 3 is disposed on the upper surface of the mounting substrate 4, the color tone of light emission of the light emitting device 1 is measured, and a predetermined applied voltage is obtained so as to obtain a predetermined color tone. Is adjusted by changing the resistance value of the resistor R.

  The light emitting device 1 shown in FIGS. 21 and 22 is mounted on a wiring board 5 with a wavelength conversion unit 3 made of a phosphor sheet containing a phosphor. The mounting substrate 4 of the light emitting device 1 is a rectangular parallelepiped having a bottom surface, and electrodes 42 for electrical connection to the wiring pattern 53 provided on the wiring substrate 5 are connected from each side surface of the mounting substrate 4 to the upper surface and the lower surface. It is formed by a pattern. The electrode 42 is provided on each side surface of the mounting substrate 4 in pairs for current inflow and current outflow. One pair of these electrode pairs 42 is electrically connected to the electrode of the LED chip 2 mounted on the bottom surface of the recess 41 of the mounting substrate 4. The other three pairs of electrodes 42 are dummy electrodes having only a function of fixing the light emitting device 1 to the wiring board 5 with solder.

  Further, four pairs of wiring patterns 53 of the wiring substrate 5 are provided so as to be connected to the four pairs of electrodes 42 of the light emitting device 1, and one of the wiring patterns 53 forming a pair has resistances having different resistance values. The bodies R1 to R4 are inserted in series. As the resistors R1 to R4, a chip resistor, a resistor having a lead wire, a resistance variable resistor, a thin film pattern resistor formed on the wiring substrate 5, and the like can be used. It is not always necessary to mount all of the resistors R1 to R4. A resistor whose resistance value can be adjusted is mounted as the resistor R1, and current adjustment can be performed using the resistor R1.

  The color tone of the light emitting device 1 is adjusted by selecting a resistor on the wiring substrate 5 when the light emitting device 1 is mounted on the wiring substrate 5. As described above, this is based on the principle that when the current flowing through the LED chip 2 increases, for example, the emission wavelength of the LED chip 2 decreases. The color tone of light emitted from the light emitting device 1 is measured in advance, and the supply current value to the LED chip 2 that provides a desired color mixture intensity balance is determined based on the measurement result. Next, the direction of the light emitting device 1 is rotated so that the LED chip 2 is electrically connected to the wiring pattern 53 to which the resistor (for example, the resistor R1) from which the current value is obtained is connected. Is mounted on the wiring board 5 using solder or the like.

  The light emitting device 1 illustrated in FIG. 23 includes a wavelength conversion unit 3 including a heat insulating sheet 11 disposed on the upper surface of the mounting substrate 4 and a phosphor sheet 3A containing a phosphor disposed on the upper surface of the heat insulating sheet 11. Yes. The color tone of the light emitting device 1 is adjusted by stabilizing the light characteristics of the phosphor at a predetermined temperature by setting the temperature of the phosphor sheet 3A to a predetermined constant temperature. A manufacturing process of the light emitting device 1 will be described. After mounting the LED chip 2 on the mounting substrate 4, the phosphor sheet 3 </ b> A is placed on the upper surface of the mounting substrate 4, and a current is passed through the LED chip 2 through the electrode 42 of the mounting substrate 4 to emit light. Measure the chromaticity coordinates.

  The temperature of the phosphor sheet 3A is based on the difference between the measured chromaticity coordinates and the reference, and the relationship between the chromaticity coordinates confirmed in advance and the temperature in the recess 41 of the mounting substrate 4 when the LED chip 2 emits light. Is set to a predetermined temperature, the heat insulating sheet 11 is disposed under the phosphor sheet 3A. A plurality of types of heat insulating sheets 11 prepared in advance at predetermined thickness intervals are prepared in advance, and the heat insulating sheet 11 having a predetermined thickness is appropriately selected and used in accordance with the measured light emission characteristics of the light emitting device 1. The selected heat insulating sheet 11 is bonded to the mounting substrate 4 with an adhesive member such as silicon resin or epoxy resin, and the phosphor sheet 3A is also bonded onto the heat insulating sheet 11 in the same manner.

  Note that one type of heat insulating sheet 11 having a maximum adjustable thickness is prepared, and the heat insulating sheet 11 may be processed and used so as to have a required thickness in accordance with the measured light emission characteristics. Alternatively, the heat insulating sheet 11 may be bonded to the phosphor sheet 3A, and the heat insulating sheet 11 may be cut and thinned according to the measured light emission characteristics.

  The light-emitting device 1 shown in FIG. 24 includes a wavelength conversion unit 3 made of a phosphor sheet containing a phosphor, and the wavelength conversion unit 3 uses the adhesive member 12 so that the temperature can be adjusted. Fixed to. As described above, the color tone of the light emitting device 1 is adjusted by setting the temperature of the wavelength conversion unit 3 to a predetermined constant temperature and stabilizing the light characteristics of the phosphor at a predetermined temperature. A manufacturing process of the light emitting device 1 will be described. After mounting the LED chip 2 on the mounting substrate 4, the chromaticity coordinates, which are the light emission characteristics of the light emitting device 1, are measured as described above. Furthermore, in order to set the temperature of the wavelength conversion unit 3 to the temperature obtained by the same method as described above, the wavelength conversion unit 3 is arranged and fixed at a position separated from the upper surface of the mounting substrate 4 by a predetermined distance. The distance between the upper surface of the mounting substrate 4 and the wavelength conversion unit 3 is ensured by, for example, applying a highly adhesive adhesive member 12 to the peripheral portion of the upper surface of the mounting substrate 4.

  The light emitting device 1 shown in FIGS. 25 and 26 includes a wavelength conversion unit 3 made of a phosphor sheet containing a phosphor, and is mounted on the wiring board 5. The color tone of the light emitting device 1 is adjusted by adjusting the temperature of the LED chip 2 and stabilizing the wavelength of light emitted by the LED chip 2 at a predetermined temperature. In order to adjust the temperature of the LED chip 2, a temperature adjusting member is provided between the lower surface of the mounting substrate 4 on which the LED chip 2 of the light emitting device 1 is mounted and the wiring substrate 5 on which the light emitting device 1 is mounted. Thereby, the temperature of the LED chip 2 can be changed to make the light emission wavelength of the LED chip 2 constant, and the color variation for each light emitting device can be reduced with higher accuracy than in the past.

  Here, a structure for mutual joining of the light emitting device 1 and the wiring board 5 will be described. The light emitting device 1 is mounted on the wiring board 5 to dissipate the heat of the LED chip 2 from the electrode 42 that wraps around the lower surface of the mounting substrate 4 for supplying current to the LED chip 2 and the lower surface of the mounting substrate 4. The heat radiation land 43 is provided. The wiring substrate 5 has a structure in which an insulating layer 52 is provided on a base substrate 50 made of metal, for example, copper, and a wiring pattern 53 is formed on the insulating layer 52. Moreover, the area | region where the light-emitting device 1 of the base substrate 50 is mounted becomes the convex part 51 which protruded rather than the other part. The convex portion 51 is not provided with the insulating layer 52, and has a structure in which, for example, solder 54 is joined to the heat radiation land 43 on the lower surface of the light emitting device 1 to dissipate heat.

  A manufacturing process of the light emitting device 1 will be described. The light emission characteristics of the light emitting device 1 are measured in advance. Next, the light emitting device 1 is mounted on the wiring board 5. During this mounting, the thermal resistance between the mounting substrate 4 and the wiring substrate 5 is adjusted by adjusting the heat conduction area or volume between the heat radiation land 43 of the mounting substrate 4 and the convex portion 51 of the wiring substrate 5. The temperature of the LED chip 2 is adjusted to change the light emission characteristics of the light emitting device 1.

  As a means for changing the above-described thermal resistance, a spacer 13 is interposed between the mounting substrate 4 and the wiring substrate 5. With the spacer 13 interposed, the heat radiation land 43 of the mounting substrate 4 and the heat radiation convex portion 51 of the wiring substrate 5 are thermally bonded by the solder 54. The spacer 13 is placed on the convex portion 51 before the solder paste is printed or applied to the wiring board 5. The spacer 13 has a thickness that does not affect the printing mask during solder printing. The light emitting device 1 is mounted on the wiring substrate 5 to which the solder paste is applied. For example, using a reflow furnace, the electrode 42 of the light emitting device and the wiring pattern 53 of the wiring substrate 5 and the heat radiation land 43 and the wiring of the light emitting device 1 are used. The heat radiating convex portions 51 of the substrate 5 are joined to each other by solder 54.

  The above-mentioned spacer 13 is made of a metal such as copper or iron having a hole in the center. Several types of spacers 13 having different hole diameters are prepared. The thermal conductivity of the spacer 13 is different from that of the solder 54. Therefore, by changing the spacer 13, the temperature during operation of the LED chip 2 can be changed. Even when the light emitting device 1 does not have a heat dissipation land, the light emission characteristics of the light emitting device 1 can be adjusted by adjusting the heat dissipation from the LED chip 2 by providing the spacer 13 in thermal contact with the lower surface of the mounting substrate 4. Can be adjusted.

  A light emitting device 1 shown in FIG. 27 includes a wavelength conversion unit 3 made of a phosphor sheet containing a phosphor and is mounted on a wiring board 5. As described above, the color tone of the light emitting device 1 is adjusted by changing the thermal resistance between the mounting substrate 4 and the wiring substrate 5 to adjust the temperature of the LED chip 2 and reducing the wavelength of light emitted by the LED chip 2 to a predetermined temperature. It is done by stabilizing it with. As a means for changing the thermal resistance, a void 14 caused by flux, air, or the like in the solder generated inside the solder 54 that joins the heat radiation land 43 of the mounting substrate 4 and the heat radiation convex portion 51 of the wiring board 5. Is used.

  The size of the above-mentioned void 14 can be adjusted by changing the soldering conditions (time and temperature). Therefore, the temperature of the LED chip 2 mounted on the mounting substrate 4 can be adjusted. As another method, the size and position of the void 14 can be adjusted by providing a notch in the heat radiation land 43. When a notch is provided at the center of the opposite sides of the heat radiation land 43, it is possible to specify the position of the void at the approximate center of the land surface separated by the notch, and the size of the void 14 is not notched. It becomes possible to make it smaller compared to.

  A light emitting device 1 shown in FIG. 28 includes a wavelength conversion unit 3 made of a phosphor sheet containing a phosphor and is mounted on a wiring board 5. As described above, the color tone of the light emitting device 1 is adjusted by changing the thermal resistance between the mounting substrate 4 and the wiring substrate 5 to adjust the temperature of the LED chip 2 and reducing the wavelength of light emitted by the LED chip 2 to a predetermined temperature. It is done by stabilizing it with. As a means for changing the thermal resistance, a protrusion 15 is provided on the lower surface of the mounting substrate 4, and by using this protrusion 15, the height of the solder for joining the heat dissipation land 43 and the heat dissipation protrusion 51 is adjusted. To do.

  When manufacturing the light emitting device 1, first, the light emitting characteristics of the light emitting device 1 are measured, and based on the relationship between the heat generation temperature and the light emitting characteristics of the LED chip 2 that has been confirmed in advance, a predetermined solder bonding area in the heat radiation land 43 Then, the protrusion 15 is shaved and the height thereof is adjusted. Next, the solder paste is printed on the wiring board, and the light emitting device 1 whose height is adjusted by shaving the protrusion 15 is placed on the wiring board 5 and soldered by a reflow furnace in the same manner as described above. .

  A light emitting device 1 shown in FIG. 29 includes a wavelength conversion unit 3 made of a phosphor sheet containing a phosphor, and is mounted on a wiring board 5. The color tone of the light emitting device 1 is adjusted by adjusting the temperature of the mounting substrate 4 and adjusting the temperature of the LED chip 2 and the wavelength conversion unit 3. As means for adjusting the temperature of the mounting substrate 4, a temperature adjusting material 16 such as a fin or a heat insulating material is provided around the mounting substrate 4. The temperature adjusting material 16 is made of heat radiating fins when the temperature is reduced, and is made of heat insulating material when the temperature is raised.

  In manufacturing the light-emitting device 1, first, the light-emitting device 1 is mounted on the wiring board 5 using a reflow furnace or the like, and the light-emitting device 1 is caused to emit light to measure the light emission characteristics. Based on the difference between the measured light emission characteristics and the reference, the temperature adjusting material 16 is attached around the light emitting device 1 in order to adjust the temperature in the recess 41 in which the LED chip 2 in the light emitting device 1 is mounted to a predetermined temperature. Thereby, the mounting substrate 4 is brought to a desired temperature, and the light emitting device 1 having a desired color mixture intensity balance is obtained.

  30 (a) and 30 (b) show the lighting fixture 10 formed by using the seven light emitting devices 1 shown in FIG. 7, for example, as described above. The luminaire 10 is formed so that the light emitting device 1 is mounted on the wiring board 5 and the light emitting device 1 is covered with a housing 17 and a translucent front panel 18. The light emitting devices 1 are connected to each other in parallel by the wiring pattern 53 on the wiring substrate 5 and supplied with current through the external electrode 53a. The lighting fixture 10 has the individual color variation of each light emitting device 1 further reduced than before, the color variation among the seven light emitting devices 1 is also reduced, and has a large diameter and a large output. It is possible to generate illumination light of various colors.

  The present invention is not limited to the above-described configuration, and various modifications can be made. The recess 41 for mounting the LED chip 2 is not limited to a circular opening or a rectangular opening, but may be an opening having any other shape. The mounting of the LED chip 2 is not limited to the flip chip mounting, but may be another mounting method such as a wire bonding method. Moreover, in the lighting fixture 10, the number of the light-emitting devices 1 is not restricted to seven, and the lighting fixture 10 can be comprised by arbitrary numbers. Moreover, although the example which obtains white light as the light-emitting device 1 is shown in the above, the manufacturing method of the light-emitting device 1 of this invention is applicable not only to white light but manufacture of the light-emitting device which emits colored light.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 LED chip 3 Wavelength conversion part 4 Mounting board (light-emitting device main body)
7 Movable part 10 Lighting fixture 30 Transparent area part 31, 32 Phosphor area part R Resistor

Claims (2)

In a light emitting device comprising a combination of an LED light emitting unit and a wavelength conversion unit containing a phosphor, the color tone of light emitted from the light emitting device is adjusted by the intensity balance of the color mixture,
The LED light emitting unit includes a mounting substrate having a recess with an opening extending on a flat top surface, an LED chip mounted on the bottom surface of the recess, and a bottom surface of the mounting substrate extending from the bottom surface to the bottom surface of the recess. And an electrode electrically connected to the LED chip,
The wavelength conversion unit has a wedge-shaped cross section, and is adhesively fixed to the upper surface of the mounting substrate, and the wavelength conversion unit of the wavelength conversion unit facing the LED light emission unit with respect to a relative position change with respect to the LED light emission unit. A light emitting device characterized in that an effective thickness changes.   The light emitting device according to claim 1, wherein a plurality of the wavelength conversion units are provided so as to overlap each other.

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