JP2011068980A - Apparatus for depositing organic material and depositing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes of the substrate can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. <P>SOLUTION: The apparatus for depositing an organic material includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to a first direction from a place within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates, and a second transferring unit to rotate and transfer the organic material deposition source in a second direction in such a manner that the organic material deposition source is respectively located in the first or second substrate deposition area. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic deposition apparatus, and more particularly, to an organic deposition apparatus and a deposition method capable of performing a deposition process on a second substrate simultaneously with the transfer of the substrate to the first substrate and the execution of the alignment process in the same chamber.

  The organic light emitting display device is a self-luminous display device that has the advantages of not only a wide viewing angle, excellent contrast, but also a fast response speed. Has been.

  An organic light emitting device provided in an organic light emitting display device includes first and second electrodes (anode and cathode electrodes) facing each other and an intermediate layer formed between the electrodes. A layer can be provided, for example a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer or an electron injection layer.

  In the case of an organic electroluminescent element, such an intermediate layer is an organic thin film formed of an organic material.

  In manufacturing an organic electroluminescence device having the above-described configuration, an organic thin film or an electrode such as the hole injection layer, hole transport layer, light emitting layer, electron transport layer, or electron injection layer formed on a substrate is a deposition apparatus. It can be formed by a deposition method using.

  In general, the deposition method is realized by mounting a substrate in a vacuum chamber and then heating or heating a heating container containing a material to be deposited to evaporate or sublimate the material to be deposited. That is, a shadow mask having an opening of a pattern to be formed is aligned in front of the substrate, and an organic material is evaporated or sublimated on the substrate to deposit an organic thin film or the like on the substrate. .

  In order to perform such a deposition process, a process of transferring the substrate into the chamber and an alignment process of accurately positioning the shadow mask on the substrate must be performed first. In the case of the method, it is impossible to proceed the vapor deposition process at the time of transferring the substrate and aligning the mask. That is, since the substrate transfer and mask alignment process and the deposition process are performed separately, the tack time is increased.

  In addition, according to the conventional deposition apparatus and deposition method, the organic material must be continuously evaporated or sublimated through the deposition source even while the substrate is being transferred and the mask is being aligned. There is a disadvantage that material material is lost.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to enable a vapor deposition process for a second substrate simultaneously with a transfer and alignment process of the substrate to the first substrate in a chamber. Another object of the present invention is to provide an organic vapor deposition apparatus and vapor deposition method capable of maximizing material efficiency by reducing the loss of organic material consumed during the substrate transfer and alignment process and minimizing the tack time of the process.

  Another object of the present invention is to realize a direction in which a deposition source moves to perform deposition on each substrate and a direction in which a deposition source moves to deposit another substrate are different from each other, An object of the present invention is to provide an organic vapor deposition system having more process chambers in the same space than the conventional organic vapor deposition system by optimizing the size of the chamber and maximizing space utilization.

  In order to achieve the above object, an organic material deposition apparatus according to an embodiment of the present invention includes a chamber having an interior divided into a first substrate deposition region and a second substrate deposition region, and the first or second substrate deposition region. And the organic material deposition source for spraying organic particles onto the first substrate or the second substrate, and the organic material deposition source in the first direction so that the organic material deposition source is located in the first or second substrate deposition region, respectively. And a first moving means for rotating and moving.

  Further, the apparatus further includes second moving means for reciprocally moving the organic vapor deposition source in the second direction within the first or second substrate vapor deposition region.

  In addition, the first substrate align unit aligns the first substrate transferred from the outside located in the first substrate deposition region, and the second substrate transferred from the outside located in the second substrate deposition region. And a second substrate alignment part.

  In addition, the first substrate deposition region and the second substrate deposition region are arranged adjacent to each other in a second direction intersecting the first direction, and the organic deposition source is realized by a linear deposition source.

  Further, the chamber body is realized as a polygonal cylinder in which the length of the first surface adjacent to the first moving means is longer than the length of the second surface corresponding to the first surface, The second surface is a surface on which the substrate is transferred and transported.

  The organic deposition method according to the embodiment of the present invention includes a step of transferring a first substrate to a first substrate deposition region in a chamber and performing an alignment process on the transferred first substrate, and the first substrate. After the alignment is completed, a deposition source moves in the first substrate deposition region to perform a deposition process of the first substrate, and a deposition process of the first substrate is performed. The deposition source is transferred to a second substrate deposition region in the chamber, an alignment process is performed on the transferred second substrate, and after the deposition on the first substrate and the alignment on the second substrate are completed. A step of rotating in a first direction to be positioned in a second substrate deposition region, and a step of performing a deposition process of the second substrate by moving the deposition source in the second substrate deposition region.

  The method further includes the step of performing the deposition process on the second substrate and simultaneously transferring another first substrate to the first substrate deposition region in the chamber and performing the alignment process.

  In addition, an organic vapor deposition apparatus according to another embodiment of the present invention includes a chamber having an interior divided into a first substrate vapor deposition region, a standby region, and a second substrate vapor deposition region, and an external located at the first substrate vapor deposition region. A first substrate alignment unit that aligns the first substrate transferred from the first substrate, a second substrate alignment unit that aligns the second substrate transferred from the outside located in the second substrate deposition region, and the first substrate or It comprises at least one organic vapor deposition source for injecting organic particles onto the second substrate, and transfer means for moving the organic vapor deposition source in the first direction.

  Furthermore, a vapor deposition source storage unit that stores the organic vapor deposition source is further included, and an angle limiting plate is formed on an upper outer wall of the vapor deposition source storage unit.

  The first substrate deposition region, the standby region, and the second substrate deposition region are arranged in a line in the first direction.

  Furthermore, in the organic deposition method according to another embodiment of the present invention, after the first substrate or the second substrate is transferred into the chamber, the organic deposition source is placed on the standby area of the chamber before the alignment process is completed. After the step of positioning and the alignment process for the first substrate is completed, the organic deposition source located on the standby region of the chamber moves to the first substrate deposition region where the first substrate is located to move the first substrate. And after the deposition process for the first substrate is completed, the organic deposition source is again moved to a waiting area of the chamber, and the alignment process for the second substrate is completed. An organic deposition source located on a standby region of the chamber moves to a second substrate deposition region where the second substrate is located, and deposition is performed on the second substrate.

  In addition, the alignment process is performed on the first substrate and the alignment process is performed on the second substrate, or the deposition process is performed on the second substrate and the alignment process is performed on the first substrate. The method further includes a step.

  Further, the method further includes transferring the first substrate or the second substrate after the deposition to the outside and transferring the other first substrate or the second substrate into the chamber.

  In addition, an organic material deposition system according to an embodiment of the present invention is introduced into the organic material deposition apparatus through a plurality of organic material deposition apparatuses, a transfer chamber commonly connecting the plurality of organic material deposition apparatuses, and the transfer chamber. A load rack chamber that performs loading and / or unloading of the substrate, wherein the plurality of organic material deposition apparatuses performs deposition on at least two substrates, and deposits on any one of the at least two substrates. A first organic material deposition apparatus for transferring and aligning the remaining substrates is included.

  Further, the plurality of organic material vapor deposition devices include a second organic material vapor deposition device that sequentially performs transfer, alignment, and vapor deposition processes on one substrate.

  According to the present invention, the substrate transfer and alignment process can be performed on the second substrate simultaneously with the transfer and alignment process of the substrate to the first substrate in the same process chamber. This reduces the loss of organic material that is sometimes consumed, maximizes material efficiency, and minimizes process tack time.

  In addition, it is possible to perform a vapor deposition process on two substrates using a single vapor deposition source in the process chamber, and thus, it is possible to optimize a vapor deposition line.

  Furthermore, by optimizing the size of the process chamber and maximizing space utilization, it is possible to provide more process chambers in the same space than in the past, and perform deposition processes on a plurality of substrates in parallel. There is an advantage that the productivity can be maximized by proceeding.

It is sectional drawing which shows roughly the structure of the organic substance vapor deposition apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 1st Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 1st Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 1st Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 1st Embodiment of this invention. It is sectional drawing which shows schematically the structure of the organic substance vapor deposition apparatus which concerns on 2nd Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 2nd Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 2nd Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 2nd Embodiment of this invention. It is a figure which shows the organic substance vapor deposition method which concerns on 2nd Embodiment of this invention. 1 is a block diagram schematically showing an organic vapor deposition system including an organic vapor deposition apparatus according to an embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of an organic material vapor deposition apparatus according to the first embodiment of the present invention.

  Referring to FIG. 1, an organic material deposition apparatus according to a first embodiment of the present invention includes a chamber 100 having an interior divided into a first substrate deposition region, a standby region, and a second substrate deposition region, and the first substrate deposition. A first substrate align unit 200 that aligns the first substrate 110 transferred from the outside located in the region, and a second substrate that aligns the second substrate 110 ′ transferred from the outside located in the second substrate deposition region. A substrate alignment unit 210; at least one organic deposition source 300 for injecting organic particles onto the first substrate 110 or the second substrate 110 ′; a deposition source storage unit 400 storing the organic deposition source 300; The moving source 500 is configured to move the vapor deposition source storage unit in a first direction (for example, a horizontal direction).

  At this time, the first substrate deposition region, the standby region, and the second substrate deposition region are arranged in a line in the first direction as shown in the figure.

  Here, the interior of the chamber 100 is maintained in a vacuum state by a vacuum pump (not shown).

  In the case of the embodiment shown in FIG. 1, two organic material vapor deposition sources 300 are accommodated in the vapor deposition source accommodating part 400, and an angle limiting plate 410 is formed on the upper outer wall of the vapor deposition source accommodating part 400. Through this, the radiation direction of the organic matter ejected from the organic matter deposition source 300 is limited.

  Further, the moving unit 500 plays a role of moving the deposition source storage unit 400 in the first direction (horizontal direction). First, the deposition source storage unit 400 is positioned in a standby area of the chamber 100. If the alignment of the first substrate 110 is completed by the first substrate alignment unit 200, the deposition source storage unit 400 is moved to the first substrate deposition region to perform the deposition process of the first substrate 110. Like that.

  Thereafter, when the second substrate alignment unit 210 completes the alignment of the second substrate 110 ′, the deposition source storage unit 400 is moved to the second substrate deposition region to perform the deposition process of the second substrate 110 ′. .

  That is, the second substrate 110 ′ is transferred and aligned while the deposition process is performed on the first substrate 110, and conversely, the first substrate 110 is transferred while the deposition process is performed on the second substrate 110 ′. Since the alignment process is performed, the tack time of the process can be greatly shortened, and the loss of organic material consumed during the substrate transfer and alignment process can be reduced as compared with the conventional method, thereby maximizing the material efficiency.

  The moving means 500 is preferably realized so that the moving speed of the organic vapor deposition source 300 can be adjusted according to process conditions so that the moving means 500 can be used in the chamber 100 maintained in a vacuum. (Not shown) and a motor (not shown) for rotating the ball screw, and a guide (not shown) for guiding the deposition source storage unit 400 may be included. However, this is only one embodiment, and as another embodiment, a linear motor (not shown) can be used to drive at a constant speed.

  In addition, a shadow mask 120 that determines the shape of the organic material to be deposited is installed in front of the first and second substrates 110 and 110 ′, that is, between the organic material deposition source 300 and the substrate.

  Accordingly, the organic material evaporated by the organic material deposition source 300 is deposited on the substrates 110 and 110 ′ through the shadow mask 120 to form an organic film having a predetermined shape on the substrate.

  On the other hand, the organic vapor deposition source 300 accommodates an organic substance to be deposited on the substrates 110 and 110 ′ in the chamber 200, heats and evaporates the accommodated organic substance, and then sprays the organic substance on the substrate to eject the organic substance. The organic deposition source 300 may be realized by a linear deposition source or a point deposition source.

  However, in the case of the above-mentioned point deposition source, it is difficult to deposit organic matter on a large area, and a plurality of point deposition sources must be arranged for large area deposition. There is a disadvantage that it is difficult to control. Therefore, in the embodiment of the present invention, the organic deposition source 300 is preferably realized by a linear deposition source.

  2A to 2D are views illustrating an organic material deposition method according to the first embodiment of the present invention, which illustrates a deposition method using the organic material deposition apparatus illustrated in FIG.

  First, as shown in FIG. 2A, after the first substrate 110 or the second substrate 110 ′ is transferred into the chamber 100, the deposition source storage unit that stores the organic deposition source 300 before the alignment process is completed. 400 is located on a waiting area which is a central part of the chamber 100.

  Even if it is located on the standby region, the organic matter is continuously ejected from the organic matter deposition source 300. However, the angle limiting plate 410 provided on the upper outer wall of the deposition source storage unit 400 causes the organic matter to be ejected from the organic matter deposition source 300. The organic substance to be sprayed is not deposited on the first substrate 110 or the second substrate 110 ′ where the alignment process is not completed.

  That is, in the embodiment of the present invention, the angle limiting plate 410 is provided on the upper outer wall of the deposition source storage unit 400, so that the barrier film provided in the conventional deposition apparatus can be removed.

  Here, the barrier film is provided in a conventional deposition apparatus, and when an alignment process of the substrate is performed, the barrier film is disposed between the substrate and the deposition source in order to prevent organic substances from being deposited on the substrate. Is formed.

  Thereafter, when the alignment of the first substrate 110 is completed by the first substrate alignment unit 200, the deposition source storage unit 400 located on the standby region of the chamber 100 is moved by the moving unit 500 to the first as shown in FIG. The substrate 110 is moved to a first substrate deposition region where the substrate 110 is located, and thus a deposition process is performed in the first substrate deposition region.

  However, in the case of the embodiment of the present invention, the second substrate 110 ′ is transferred during the vapor deposition process on the first substrate 110, and the transferred second substrate 110 ′ is aligned by the second substrate alignment unit 210. A process is performed.

  At this time, the substrate is transferred into the chamber 100 by a robot arm (not shown) provided in a transfer chamber (not shown) connected to the chamber 100 in a cluster type deposition system. The transfer chamber and the robot arm are shown in the deposition system of FIG.

  That is, a vapor deposition process is performed on the first substrate 110, and a transfer and alignment process is performed on the second substrate 110 '.

  Next, when the deposition process for the first substrate 110 is completed, the deposition source storage unit 400 is moved again to the standby region of the chamber 100 by the moving unit 500 as shown in FIG. One substrate 110 is transferred to the outside, and another first substrate is transferred into the chamber.

  At this time, the transfer of the substrate is realized by a robot arm (not shown) provided in the transfer chamber (not shown) described above.

  Thereafter, when the alignment with respect to the second substrate 110 ′ is completed, the second substrate 110 ′ is positioned by the moving unit 500 in the vapor deposition source storage unit 400 located on the standby region of the chamber 100 as shown in FIG. 2D. Accordingly, the second substrate deposition region is moved to perform the deposition process in the second substrate deposition region.

  However, in the embodiment of the present invention, the first substrate alignment unit 200 aligns the first substrate 110 newly transferred into the chamber 100 at the same time as performing the deposition process on the second substrate 110 ′. A process is performed.

  Thereafter, when the deposition process for the second substrate 110 ′ is completed, the deposition source storage unit 400 is moved again to the standby region of the chamber 100 by the moving unit 500 as shown in FIG. 2A, and the deposition is completed. The two substrates 110 ′ are transferred to the outside, and another second substrate is transferred into the chamber.

  According to the vapor deposition method according to the embodiment of the present invention, the vapor deposition process for the second substrate 110 ′ can be performed simultaneously with the transfer of the substrate to the first substrate 110 and the execution of the alignment process in the same chamber. As a result, the loss of organic material consumed during the substrate transfer and alignment process can be reduced, the material efficiency can be maximized, and the process tack time can be minimized.

  However, in the embodiment of FIGS. 1 and 2, the direction in which the deposition source 300 moves in the first or second substrate deposition region to perform deposition on each substrate in the chamber 100 and other substrates are deposited. In order to achieve this, the deposition source 300 moves in the same direction from the first substrate deposition region to the second substrate deposition region (or from the second substrate deposition region to the first substrate deposition region). There is a problem that it must be very large in the width of the film, that is, in the direction in which the vapor deposition proceeds (first direction).

  That is, when the deposition source 300 moves to deposit the second substrate 110 ′ after the deposition on the first substrate 110 is completed, the deposition source 300 is moved in the first direction (horizontal direction) in the same direction as the deposition direction. Therefore, in order to perform vapor deposition on the first substrate 110 and the second substrate 110 ′, it has to be about twice or more larger in the first direction (horizontal direction) than the existing chamber.

  Therefore, in another embodiment of the present invention, the direction in which the deposition source moves to perform deposition on each substrate is different from the direction in which the deposition source moves to deposit other substrates. The above problem is sought to be solved by optimizing the size of the chamber.

  FIG. 3 is a cross-sectional view schematically showing a configuration of an organic material vapor deposition apparatus according to the second embodiment of the present invention.

  However, since the same shadow mask and vapor deposition source are used as compared with the first embodiment shown in FIG. 1, detailed description thereof will be omitted, and for convenience, the same components will be denoted by the same reference numerals. Is attached.

  Referring to FIG. 3, the organic material deposition apparatus according to the second embodiment of the present invention includes a chamber 100 having an interior divided into a first substrate deposition region A and a second substrate deposition region B, and the first substrate deposition region. A first substrate aligning unit 200 for aligning the first substrate 110 transferred from the outside and positioned at the second substrate, and a second substrate for aligning the second substrate 110 ′ transferred from the outside located in the second substrate deposition region. An alignment unit 210; at least one organic deposition source 300 for injecting organic particles onto the first substrate 110 or the second substrate 110 ′; a deposition source storage unit 400 storing the organic deposition source 300; First moving means 510 that rotates and moves the organic vapor deposition source in the first direction so that the organic vapor deposition source 300 is positioned in the first or second substrate vapor deposition region, and the vapor deposition source storage unit 40. The formed and a second moving means 520 for moving in the second direction, respectively in the first or second substrate deposition area.

  Here, the interior of the chamber 100 is maintained in a vacuum state by a vacuum pump (not shown).

  In addition, the transfer and transfer of the substrate into the chamber 100 is realized by a robot arm (not shown) provided in a transfer chamber (not shown) connected to the chamber 100 in a cluster type deposition system. The transfer chamber and the robot arm are shown in the deposition system of FIG.

  At this time, the first substrate deposition region A and the second substrate deposition region B are arranged in parallel adjacent to each other in the second direction as shown in the figure, and the substrate deposition performed in each deposition region A, B. Is performed by the second moving unit 520 reciprocatingly moving the deposition source storage unit 400 storing the deposition source 300 in the second direction.

  When the deposition of the first substrate 110 is completed in the first substrate deposition area A, the deposition source storage unit 400 is rotated in the first direction by the first moving unit 510 and is positioned in the second substrate deposition area B. Then, the second moving unit 520 reciprocates in the second direction to deposit the second substrate 110 ′.

  Similarly, when the deposition of the second substrate 110 ′ is completed in the second substrate deposition region B, the deposition source storage unit 400 is rotated and moved in the first direction by the first moving unit 510 to the first substrate deposition region A. After that, the first substrate 110 newly deposited by performing reciprocation in the second direction by the second moving unit 520 is deposited.

  The first and second moving units 510 and 520 may be realized so that the moving speed of the organic deposition source 300 can be adjusted according to process conditions so that the first and second moving units 510 and 520 can be used in the chamber 100 maintained in a vacuum. This includes a bundling portion 512, 522 to be bound to each substrate, a ball screw (not shown), and a motor (not shown) for rotating the ball screw, for guiding the deposition source storage portion 400. A guide (not shown) may be included and configured. However, this is only one embodiment, and as another embodiment, a linear motor (not shown) can be used to drive at a constant speed.

  In the embodiment described with reference to FIGS. 1 and 2, the direction in which the deposition source moves to perform deposition on each substrate in the chamber is the same as the direction in which the deposition source moves to deposit another substrate. For this reason, the spatial width of the chamber must be about twice or more larger than that of the existing chamber in the direction in which vapor deposition proceeds, but in the embodiment shown in FIG. By realizing the direction in which the vapor deposition source moves to perform (second direction) and the direction in which the vapor deposition source 300 moves to deposit another substrate (first direction) are different from each other, the chamber 100 is realized. The deposition process for the second substrate 110 ′ can be performed simultaneously with the transfer and alignment process of the substrate to the first substrate 110 in the same chamber without having to greatly expand the space.

  However, for this purpose, in the embodiment shown in FIG. 3, the length L1 of the first surface 102 is set to the first length so that the first moving means 510 can rotate in the first direction as shown in the main body of the chamber 100. This is realized by a polygonal cylinder longer than the length L2 of the second surface 104 corresponding to the surface 102, thereby minimizing the expansion of the width of the chamber 100.

  In the embodiment of FIG. 3, the main body of the chamber 100 is shown as a rectangular cylinder, but this is one embodiment, and the first surface 102 is bent and realized as a pentagonal cylinder. You can also.

  At this time, the first surface 102 is a surface adjacent to the first moving means 510, and the second surface 104 is a surface facing the first surface 102, and is a surface on which the substrate is transferred and transported. . However, the second surface 104 is provided with an opening (not shown) so that the substrate can be transferred and transported.

  Hereinafter, the vapor deposition method using the organic vapor deposition apparatus shown in FIG. 3 will be described in more detail with reference to FIGS. 4A to 4D.

  Referring to FIG. 4A, first, the first substrate 110 is transferred into the chamber 100 through an opening (not shown) provided in the second surface 104 of the chamber 100, and aligned by the first substrate aligning unit 200. When the process is performed and then the alignment with respect to the first substrate 110 is completed, the deposition source storage unit 400 is moved to the second position in the first substrate deposition region A by the second moving unit 520 located in the first substrate deposition region A. By reciprocating in the direction, the deposition process of the first substrate 110 is performed.

  In addition, during the vapor deposition process for the first substrate 110, the second substrate 110 ′ is transferred into the chamber 100 through an opening (not shown) provided in the second surface 104, as shown in FIG. 4B. As described above, the alignment process is performed by the second substrate alignment unit 210.

  At this time, the first substrate alignment unit 200 and the second substrate alignment unit 210 are located in the first substrate deposition region A and the second substrate deposition region B, respectively. Since it is as shown, detailed description is omitted.

  That is, in the embodiment of the present invention, the first substrate 110 is deposited, and at the same time, a transfer and alignment process for the second substrate 110 ′ is performed in the same chamber 100.

  Next, when the deposition on the first substrate 110 and the alignment on the second substrate 110 ′ are completed, the deposition source storage unit 400 is rotated and moved in the first direction by the first moving unit 510, as shown in FIG. 4C. Thus, the second substrate deposition region B is located.

  However, at the same time, the first substrate 110 that has been deposited is transferred to the outside, and the other first substrate 110 is transferred into the chamber 100.

  In an embodiment of the present invention, the deposition source storage unit 400 on which the organic deposition source 300 is mounted by the first moving unit 510 is rotated from the first substrate deposition region A to the second substrate deposition region B. Thus, the width of the chamber can be dramatically reduced as compared with the embodiment shown in FIGS.

  That is, as shown in the drawing, in the embodiment of the present invention, the chamber 100 has a length L1 of the first surface 102 longer than a length L2 of the second surface 104 so that the second moving means can rotate. Realized with a polygonal cylindrical body maximizes space utilization.

  After the deposition source storage unit 400 is located in the second substrate deposition region B, the second moving unit 520 located in the second substrate deposition region B is used in the second substrate deposition region B as shown in FIG. 4D. By reciprocating in two directions, the deposition process of the second substrate 110 ′ is performed.

  In addition, at the same time as the deposition process is performed on the second substrate 110 ′, another first substrate 110 transferred into the chamber 100 is aligned by the first substrate alignment unit 200 located in the first substrate deposition region A. Done.

  That is, in the embodiment of the present invention, the second substrate 110 ′ is deposited, and at the same time, a transfer and alignment process for the first substrate 110 is performed in the same chamber.

  Thereafter, when the deposition process for the second substrate 110 'is completed, the processes of FIGS. 4A to 4D are repeated to perform deposition or alignment for each substrate.

  FIG. 5 is a block diagram showing an embodiment of an organic matter vapor deposition system provided with an organic matter vapor deposition apparatus according to an embodiment of the present invention.

  However, the organic vapor deposition system shown in FIG. 5 is an example in which the organic vapor deposition apparatus shown in FIG. 3 is provided in a process chamber, and in the case of the embodiment of FIG. By realizing a long polygonal cylindrical shape and maximizing space utilization, more process chambers can be provided in the same space as compared with a conventional organic deposition system.

  Referring to FIG. 5, an organic material deposition system 10 according to an embodiment of the present invention includes a plurality of process chambers 100 as an organic material deposition apparatus that performs an organic material deposition process, and a transfer chamber that commonly connects the plurality of process chambers. 20 and a cluster type (Cluster Type) including load rack chambers 30 and 32 for loading and / or unloading substrates 110, 110 ′, and 110 ″ to be introduced into the process chamber through the transfer chamber. Consists of.

  The transfer chamber 20 may further include a shadow mask unit 40 provided with a shadow mask used during the deposition process in the process chamber 100.

  The process chamber 100 is an organic material deposition apparatus, and is a place where an organic material deposition process is performed. The process chambers 100a and 100b perform a deposition process on at least two substrates, and perform a deposition process on one substrate. The process chambers 100c and 100d are configured.

  That is, in the case of the embodiment of FIG. 5, the first and second process chambers 100a and 100b perform a vapor deposition process on two substrates, the vapor deposition process is performed on one substrate, and the remaining substrates are formed. On the other hand, it is realized that the transporting and aligning process is performed simultaneously with the vapor deposition process.

  At this time, the first and second process chambers 100a and 100b are realized in the second embodiment of the organic deposition apparatus described with reference to FIGS.

  In addition, the third and fourth process chambers 100c and 100d sequentially perform alignment and deposition processes on one substrate, respectively.

  That is, in the cluster type vapor deposition system according to the embodiment of the present invention, the first and second process chambers 100a and 100b are realized by polygonal cylinders having different lengths on the first and second surfaces. Since the third and fourth process chambers 100c and 100d are further provided, the deposition yield can be greatly improved as compared with the existing organic deposition system.

  Each of the process chambers 100 may deposit a separate organic material on the substrate, or may deposit the same organic material on the substrate.

  As an example, in the embodiment shown in FIG. 5, the first organic material is deposited in the first process chamber 100a and the third process chamber 100c, and the second organic material is deposited in the second process chamber 100b and the fourth process chamber 100d.

  Accordingly, the substrate on which the first organic material deposition is completed through the first process chamber 100a is transferred to the second process chamber 100b to further deposit the second organic material. Similarly, the first organic material deposition is performed through the third process chamber 100c. After the substrate is completed, the substrate is transferred to the fourth process chamber 100d to further deposit the second organic material.

  The transfer chamber 20 is connected to the process chamber 100, the load rack chambers 30 and 32, and the shadow mask unit 40 through the respective side wall regions. At this time, a through-hole 24 for entering and exiting the substrate is provided in each side wall region.

  That is, the transfer chamber 20 includes a main body 22 having a transfer space for transferring a substrate, and a pair of robot arms 26 and 26 ′ provided in the main body. The substrate is transferred to the process chamber 100, and the substrate on which vapor deposition is performed through the process chamber 100 is transferred to and transferred to another process chamber 100 or the load rack chamber 32. At this time, as described above, the load rack chamber plays a role of loading and / or unloading the substrates 110, 110 ′, and 110 ″ that are put into the process chamber.

  In the embodiment of the present invention, the process chamber 100 includes at least two robot arms 26 and 26 ′ provided in the transfer chamber main body 22 and simultaneously performs a deposition process on at least two substrates. On the other hand, the second substrate can be transferred to the process chamber 100 during the vapor deposition process for the first substrate.

  The operation of the organic deposition system according to the embodiment of the present invention having the above configuration will be briefly described as follows.

  First, if a plurality of substrates are transferred from an external transfer device (not shown) to the first load rack chamber 30, the transferred substrates are loaded in the first load rack chamber 30.

  When the loading of the substrate is completed, a door (not shown) of the first load rack chamber 30 is closed to bring the first load rack chamber 30 into a vacuum state, and then the first robot arm 26 of the transfer chamber 20 is moved. The first substrate 110 among the substrates is transferred to the first process chamber 100a through the transfer chamber.

  However, the process in the first process chamber 100a and the second process chamber 100b is the same as the deposition process of the organic deposition apparatus described with reference to FIGS. 3 and 4, and the process will be briefly described as follows.

  The first substrate 110 transferred to the first process chamber 100a is aligned in the first process chamber 100a. When the alignment is completed, a deposition process is performed on the first substrate 110. That is, the first organic material is deposited on the first substrate 110.

  Further, the first substrate 110 is drawn into the first process chamber 100a, and the second substrate 110 ′ among the plurality of substrates loaded in the first load rack chamber 30 is transferred by the second robot arm 26 ′. During the vapor deposition process for the first substrate 110, the first process chamber 100a is transferred to the first process chamber 100a.

  That is, if the deposition process is performed on the first substrate 110 through the first process chamber 100a, the first process chamber 100a simultaneously transfers and aligns the second substrate 110 ′, and then aligns. If completed, a vapor deposition process is performed on the second substrate 110 ′.

  In addition, the first substrate 110 that has been deposited during the alignment process for the second substrate 110 'is transferred to the second process chamber 100b by the first robot arm 26'. Accordingly, the first substrate 110 is aligned in the second process chamber 100b. When the alignment is completed, an additional deposition process is performed on the first substrate 110. That is, the second organic material is deposited on the first substrate 110.

  In addition, after the first substrate 110 is drawn into the second process chamber 100b, the second substrate 110 ′, which has been deposited in the first process chamber 100a, is subsequently transferred by the second robot arm 26 ′, During the vapor deposition process for one substrate 110, the second process chamber 100b is drawn.

  That is, the deposition process for the first substrate 110 is performed through the second process chamber 100b, and the transfer and alignment for the second substrate 110 'is performed in the second process chamber 100b.

  Accordingly, when the deposition process for the first and second organic substances on the first substrate 110 and the second substrate 110 ′ is completed, the first substrate 110 and the second substrate 110 ′ are continuously moved by the robot arm to the second load rack. It is transferred to the chamber 32 and unloaded.

  Thereafter, the first or second robot arm 26, 26 ′ transfers the third substrate 110 ″ among the substrates loaded in the first load rack chamber 30 to the third process chamber 100 c through the transfer chamber 20. The third substrate 110 ″ is aligned in the third process chamber 100c, and when the alignment is completed, a deposition process is performed on the third substrate 110 ″. That is, a first organic material is deposited on the third substrate 110 ″. The

  In addition, when the deposition process for the third substrate 110 ″ is completed, the robot arm transfers the third substrate 110 ″ to the fourth process chamber 100d, whereby the third substrate 110 ″ is transferred to the fourth process chamber 100d. If the alignment is completed, an additional deposition process is performed on the third substrate 110 ″. That is, the second organic material is deposited on the third substrate 110 ″.

  Thereafter, when the deposition process for the first and second organic substances on the third substrate 110 ″ is completed, the third substrate 110 ″ is transferred to the second load rack chamber 32 by the robot arm and unloaded.

  At this time, the deposition process for the third substrate 110 ″, that is, the deposition process performed in the third and fourth deposition chambers 100c and 100d is performed simultaneously with the deposition process for the first substrate 110 and the second substrate 110 ′. You can also

  As a result, according to the organic vapor deposition system 10 according to the embodiment of the present invention, the vapor deposition process for the three substrates proceeds in parallel, thereby eliminating the waiting time in each process chamber and increasing or maximizing the productivity. There is an advantage that can be made.

  As described above, the most preferred embodiment of the present invention has been described. However, the present invention is not limited to the above description, and is described in the claims or disclosed in the specification. It goes without saying that various modifications and changes can be made by those skilled in the art based on the gist, and such modifications and changes are included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Chamber 110 1st board | substrate 200 align part 110 '2nd board | substrate 210 align part 300 organic substance vapor deposition source 400 vapor deposition source accommodating part 500 moving means

Claims (20)

A chamber having an interior divided into a first substrate deposition region and a second substrate deposition region;
An organic vapor deposition source that moves within the first or second substrate vapor deposition region and injects organic particles onto the first substrate or the second substrate;
An organic vapor deposition apparatus comprising: a first moving unit configured to rotate and move the organic vapor deposition source in a first direction so that the organic vapor deposition source is positioned in the first or second substrate vapor deposition region.   The organic vapor deposition apparatus according to claim 1, further comprising second moving means for reciprocating the organic vapor deposition source in the second direction in the first or second substrate vapor deposition region. A first substrate alignment unit for aligning the first substrate transferred from the outside located in the first substrate deposition region;
The organic vapor deposition apparatus according to claim 1, further comprising a second substrate alignment unit that aligns the second substrate transferred from the outside and located in the second substrate vapor deposition region.   2. The organic deposition apparatus according to claim 1, wherein the first substrate deposition area and the second substrate deposition area are arranged adjacent to each other in a second direction intersecting the first direction.   The organic deposition apparatus according to claim 1, wherein the organic deposition source is a linear deposition source.   The main body of the chamber is realized as a polygonal cylinder having a length of a first surface adjacent to the first moving means longer than a length of a second surface corresponding to the first surface. The organic vapor deposition apparatus according to claim 1.   The organic material deposition apparatus according to claim 6, wherein the second surface of the chamber body is a surface on which a substrate is transferred and conveyed. A first substrate is transferred to a first substrate deposition region in a chamber, and an alignment process is performed on the transferred first substrate;
After the alignment with respect to the first substrate is completed, a deposition source is moved in the first substrate deposition region to perform a deposition process of the first substrate;
The second substrate is transferred to a second substrate deposition region in the chamber at the same time as the first substrate deposition process is performed, and an alignment process is performed on the transferred second substrate;
After the deposition on the first substrate and the alignment on the second substrate are completed, the deposition source is rotated in the first direction and positioned in the second substrate deposition region;
A step of performing a deposition process of the second substrate by moving the deposition source in the second substrate deposition region;
An organic matter vapor deposition method comprising:   The method of claim 8, further comprising the step of simultaneously performing the deposition process on the second substrate and transferring another first substrate to the first substrate deposition region in the chamber and performing an alignment process. Organic deposition method. A chamber having an interior divided into a first substrate deposition region, a standby region, and a second substrate deposition region;
A first substrate alignment unit for aligning the first substrate transferred from the outside located in the first substrate deposition region;
A second substrate aligning part for aligning the second substrate transferred from the outside located in the second substrate deposition region;
At least one organic deposition source for injecting organic particles onto the first substrate or the second substrate;
Transfer means for moving the organic vapor deposition source in a first direction;
An organic material vapor deposition apparatus comprising:   The organic vapor deposition apparatus according to claim 10, further comprising a vapor deposition source storage unit that stores the organic vapor deposition source, wherein an angle limiting plate is formed on an upper outer wall of the vapor deposition source storage unit.   The organic deposition apparatus according to claim 10, wherein the first substrate deposition area, the standby area, and the second substrate deposition area are arranged in a line in the first direction. After the first substrate or the second substrate is transferred into the chamber and before the alignment process is completed, an organic deposition source is positioned on the standby region of the chamber;
After the alignment process for the first substrate is completed, the organic material deposition source located on the standby region of the chamber moves to the first substrate deposition region where the first substrate is located, and deposition is performed on the first substrate. Stages,
After the deposition process on the first substrate is completed, the organic deposition source is moved to the standby area of the chamber again;
After the alignment process for the second substrate is completed, the organic material deposition source located on the standby region of the chamber moves to the second substrate deposition region where the second substrate is located, and deposition on the second substrate is performed. Stages,
An organic material vapor deposition method comprising:   Performing an alignment process on the second substrate simultaneously with performing the deposition process on the first substrate, or performing an alignment process on the first substrate simultaneously with performing the deposition process on the second substrate. The organic material deposition method according to claim 13, further comprising:   The organic material of claim 13, further comprising a step of transporting the first or second substrate having been deposited to the outside and transporting the other first or second substrate into the chamber. Deposition method. A plurality of organic vapor deposition devices;
A transfer chamber for commonly connecting the plurality of organic vapor deposition devices;
A load rack chamber that performs loading and / or unloading of a substrate to be introduced into the organic material deposition apparatus through the transfer chamber;
The plurality of organic vapor deposition apparatuses perform vapor deposition on at least two substrates, perform vapor deposition on one of the at least two substrates, and simultaneously transfer and align the remaining substrates. An organic material vapor deposition system comprising:   The organic deposition system according to claim 16, wherein the plurality of organic deposition apparatuses include a second organic deposition apparatus that sequentially performs transfer, alignment, and deposition on a single substrate. The first organic matter vapor deposition apparatus includes:
A chamber having an interior divided into a first substrate deposition region and a second substrate deposition region;
An organic vapor deposition source that moves within the first or second substrate vapor deposition region and injects organic particles onto the first substrate or the second substrate;
First moving means for rotating the organic vapor deposition source in a first direction so that the organic vapor deposition source is located in the first or second substrate vapor deposition region, respectively.
The organic deposition system according to claim 16, comprising:   The main body of the chamber is realized as a polygonal cylinder having a length of a first surface adjacent to the first moving means that is longer than a length of a second surface facing the first surface. The organic vapor deposition system according to claim 18.   The organic deposition system according to claim 19, wherein the second surface of the chamber body is a surface on which a substrate is transferred and transported.

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