JP2011035045A - Manufacturing method of adhesive sheet, and manufacturing method of multilayer wiring board for mounting semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an adhesive sheet for multilayer wiring board for mounting semiconductor element, which can cleanly and efficiently manufacture the adhesive sheet having a hole and cavity, with which conductive paste used for bonding a base wiring board and a perforated wiring board having cavity for mounting semiconductor element is filled, and to provide a manufacturing method of the multilayer wiring board for mounting the semiconductor element, which uses the adhesive sheet obtained by the method. <P>SOLUTION: The manufacturing method of the adhesive sheet performs (1) a process for preparing a sheet-like adhesion material, (2) a process for performing cavity work on the sheet-like adhesion material, (3) a process for bonding a releasing film to at least one side of the sheet-like adhesion material, (4) a process for forming a conductive paste filling hole in the sheet-like adhesion material and (5) a process for filling the conductive paste filling hole with the conductive paste in this order. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for producing an adhesive sheet and a method for producing a multilayer wiring board for mounting a semiconductor element.

2. Description of the Related Art Generally, a semiconductor element mounting package called a cavity specification BGA (Ball Grid Array) or a cavity specification PGA (Pin Grid Array) is a multilayer wiring board 10 having a cavity 12 for mounting a semiconductor element. (See FIG. 6).
Conventionally, a multilayer wiring board having such a cavity has been used by a method of scraping an inner layer pattern after lamination. When the inner layer pattern is shaved with a blade, the inner layer copper foil thickness of 70 to 100 μm is required to absorb the vertical position error of the cutting device and the thickness variation of the multilayer wiring board. In recent years, it is difficult to form a 120 to 80 μm pitch pattern that can cope with the increasing flip chip mounting. In addition, since the cutting process cannot be performed by stacking a plurality of multilayer wiring boards, it is a process by one piece, so that the working efficiency is poor and the cutting tool to be used generally has an outer shape. The use of a cutting-only cutting tool that is more expensive than the cutting tool used at the time of cutting is expensive.

  In order to cope with such a problem, a multilayer wiring board having a cavity has a cavity provided on a base wiring board having a connection terminal, and the perforated wiring board having the connection terminal is electrically connected to a sheet-like adhesive material. A method has been proposed in which an adhesive paste obtained by providing a conductive paste and a cavity is stacked, sandwiched between metal plates, and heated and pressed (see, for example, Patent Documents 1 and 2).

  As a method for producing a multilayer wiring board having a cavity when using such an adhesive sheet, methods shown in FIGS. 3 to 6 have been proposed. As shown in FIG. 3, the release film 4 is bonded to at least one surface of the sheet-like adhesive material 1, and then a conductive paste filling hole 5 is formed at a predetermined position, and the conductive paste 6 is filled. , To produce an adhesive sheet. After the release film 4 on the predetermined surface of the adhesive sheet is peeled off and bonded to the substrate before the cavity is punched, the cavity is punched between the adhesive sheet and the substrate using means such as a router. Apply. Thereafter, the base wiring board 8 is aligned using means such as pin lamination, and heated and pressed by means such as a press to manufacture (see FIG. 5).

  Alternatively, as shown in FIG. 4, the release film 4 is bonded to at least one surface of the sheet-like adhesive material 1, and then the conductive paste filling hole 5 and the cavity 2 are formed at predetermined positions. Thereafter, the printing plate 11 masking the cavity 2 is prepared and used so that the conductive paste does not adhere to the cavity, and the conductive paste 6 is filled into the through hole 5. Thereafter, as shown in FIG. 6, an adhesive sheet 30 is placed between the perforated wiring board 9 and the base wiring board 8 in which the cavity is perforated so as to be in a predetermined position, and alignment is performed using means such as pin lamination. And heating and pressurizing by means such as a press (see FIG. 6).

JP 2004-253774 A JP 2006-156432 A

  However, regarding the manufacturing method of the conductive paste used for manufacturing the multilayer wiring board having the cavity and the adhesive sheet having the cavity, the foreign matter generated at the time of drilling the cavity adheres to the conductive paste and causes poor conduction. There was a problem and a problem that work efficiency was low because it was necessary to prepare and use a printing plate when filling with conductive paste.

  The present invention solves the above problems, and when a perforated wiring board having a base wiring board and a cavity for mounting a semiconductor element is formed into a multilayer wiring board for mounting a semiconductor element using an adhesive sheet, the present invention is clean. And the manufacturing method of the said adhesive sheet which has the hole and cavity which were filled with the electrically conductive paste which makes it possible to manufacture efficiently, and the multilayer wiring board for semiconductor element mounting using the adhesive sheet obtained by the said manufacturing method The manufacturing method of this is provided.

The present invention includes (1) a step of preparing a sheet-like adhesive material, (2) a step of subjecting the sheet-like adhesive material to cavity processing, and (3) a release film attached to at least one surface of the sheet-like adhesive material. Manufacturing an adhesive sheet in which the steps of combining, (4) forming a conductive paste filling hole in the sheet-like adhesive material, and (5) filling the conductive paste filling hole with a conductive paste are performed in this order. Regarding the method.
Moreover, this invention relates to the manufacturing method of the said adhesive sheet which forms the hole for electroconductive paste filling in a process (4) by laser beam irradiation.
The present invention also relates to the method for manufacturing the adhesive sheet, wherein in the step (2), in addition to the cavity processing, alignment hole processing is performed, and the cavity processing and the alignment hole processing are performed simultaneously.
Moreover, this invention relates to the manufacturing method of the said adhesive sheet which performs filling of an electrically conductive paste by the whole surface printing to the said sheet-like adhesive material in a process (5).
In the present invention, a base wiring board and a perforated wiring board having a cavity for mounting a semiconductor element are overlapped via a bonding sheet having a cavity and a hole filled with a conductive paste, and heated and pressed. The present invention relates to a method for manufacturing a multilayer wiring board for mounting a semiconductor element, comprising a step of integrating, and a method for manufacturing a multilayer wiring board for mounting a semiconductor element using the adhesive sheet manufactured by the manufacturing method.

  According to the present invention, an adhesive sheet having holes and cavities filled with a conductive paste used for bonding a base wiring board and a perforated wiring board having cavities for mounting semiconductor elements is manufactured cleanly and efficiently. Is possible.

It is sectional drawing which shows the manufacturing process of the adhesive sheet for the multilayer wiring boards for semiconductor element mounting of this invention. It is sectional drawing which shows the manufacturing process of the multilayer wiring board for semiconductor element mounting which becomes one Example of this invention. It is sectional drawing which shows the manufacturing process of the conventional adhesive sheet for multilayer wiring boards for a semiconductor element mounting. It is sectional drawing which shows the manufacturing process of the conventional adhesive sheet for multilayer wiring boards for a semiconductor element mounting. It is sectional drawing which shows the manufacturing process of the conventional multilayer wiring board for semiconductor element mounting. It is sectional drawing which shows the manufacturing process of the conventional multilayer wiring board for semiconductor element mounting. The top view (a) which shows the board | substrate for evaluation of the connection between conductors of the Example of this invention, and a comparative example, the top view (b) which shows the multilayer wiring board for semiconductor element mounting, and the multilayer for semiconductor element mounting of the top view (b) It is AA sectional drawing (c) of a wiring board.

Hereinafter, the manufacturing method of the adhesive sheet which has the hole and cavity which were filled with the electrically conductive paste in embodiment of this invention is demonstrated based on FIG. In addition, one of the characteristics of the manufacturing method of the adhesive sheet of the present invention is that the cavity drilling and the conductive paste filling hole drilling are performed in separate steps. Then, after the cavity is drilled, the mold release film 4 is pasted before the conductive paste filling hole is drilled.
First, a sheet-like adhesive material 1 as shown in FIG. As the sheet-like adhesive material 1, an epoxy or polyimide-based adhesive for multilayered adhesion can be used. As such an adhesive, for example, a woven fabric or a nonwoven fabric is impregnated with a thermosetting resin composition, A material obtained by applying a thermosetting resin composition onto a semi-cured prepreg heated or dried, or a polyethylene terephthalate film, and heating and drying to form a film can be used. As the thermosetting resin composition, an epoxy resin, a phenol resin, a polyimide resin, a bismaleimide resin, or the like can be used. As the woven or non-woven fabric, glass cloth, glass paper, amide cloth, amide paper, or the like can be used.

  The sheet-like adhesive material may be an elastomer material. The elastomer material as the sheet-like adhesive material is preferable because it can absorb the distortion caused by the difference in dimensional behavior of the plurality of wiring boards, and can suppress the warpage of the bonded wiring boards. In particular, when the materials and thicknesses of a plurality of wiring boards to be bonded are different, the dimensional behavior of the wiring boards at the time of manufacture and use is different, so an elastomer material is used as a sheet-like adhesive material used for bonding a plurality of wiring boards. It is effective to use. As such a sheet-like adhesive material, for example, AS-2600W (manufactured by Hitachi Chemical Co., Ltd., product name) can be used.

  Next, as shown in FIG. 1B, a cavity 2 and an alignment hole 3 are formed in the sheet-like adhesive material 1 with predetermined dimensions from the cavity. There are no particular restrictions on the drilling positions of the alignment holes 3, but it is desirable to drill at the four corners of the sheet-like adhesive material 1 because the position detection accuracy can be improved when the paste filling through holes 5 are drilled later. For the drilling of the cavity 2 and the alignment hole 3, means such as a mold, a router, a drill, and a carbon dioxide laser can be used. Although there is no particular limitation, the use of a carbon dioxide laser is clean and efficient. This is desirable because it can be processed. In addition, the cavity 2 and the alignment hole 3 may be drilled separately. However, if the same facilities are used together, the positional accuracy between the cavity 2 and the conductive paste 6 for electrical connection can be improved. This is desirable because it can be improved. Further, it is desirable to clean the surface of the sheet-like adhesive material 1 and the inside of the hole using means such as an adhesive roll or air blow after the cavity 2 and the alignment hole 3 are drilled. This cleaning can prevent foreign matters from being mixed between the adhesive sheet 7 and the wiring board.

Next, as shown in FIG. 1 (c), at least one surface of the sheet-like adhesive material 1 in which the alignment hole 3 is formed with a predetermined dimension from the cavity 2 and the cavity 2 is pressed or laminated. The releasable film 4 is stuck using a means. The thickness of the releasable film 4 to be used is desirably 10 μm or more and 50 μm or less. It is more desirable to select an appropriate thickness of the releasable film 4 according to the thickness of the sheet-like adhesive material 1 to be used and the diameter of the conductive paste filling hole 5. When the thickness is less than 10 μm, the protruding height of the conductive paste 6 from the sheet-like adhesive material 1 after the release film 4 is peeled is low, and the conductive paste 6 when bonding a plurality of wiring boards together. There is a possibility that the electrical connection between the wiring boards becomes unstable. When the thickness exceeds 50 μm, when the release film 4 is peeled off, a part of the conductive paste 6 to be filled in the next step is taken together with the release film 4, and a plurality of wiring boards are formed. There is a possibility that the conductive paste 6 is not sufficiently compressed at the time of bonding, and the electrical connection between the wiring boards becomes unstable. Such a releasable film is not particularly limited as long as a through-hole can be formed. Specifically, a polyethylene terephthalate film can be exemplified. Moreover, as a commercial item, the fine peel 500NC (product name made from Reiko Co., Ltd.) etc. which apply | coated the mold release agent to the polyethylene terephthalate film can be used, for example.
In addition, as for a release film, it is desirable to affix on both surfaces of a sheet-like adhesive material. By having the release film on both sides, protrusions of the conductive paste are formed on both sides of the sheet-like adhesive material, thereby further stabilizing the electrical connection between the wiring boards.

  Next, as shown in FIG.1 (d), the hole 5 for electrically conductive paste filling is formed in the sheet-like adhesive material 1 which bonded the release film 4 to the at least single side | surface. The formation of the through hole 5 is not particularly limited, but means such as laser light irradiation, mold (punch hole processing), router processing, drilling, etc. can be used. The laser light irradiation is preferably performed from the side on which the release film 4 is attached with a carbon dioxide gas laser. Further, since the through hole 5 needs to be drilled to a predetermined size with respect to the position of the cavity 2, it is desirable to drill with reference to the alignment hole 3 drilled simultaneously with the cavity 2. A method for detecting the position of the alignment hole 3 includes a method of calculating a perforation position of the sheet-like adhesive material 1 on which the release film 4 is bonded using a CCD camera and illumination. In addition, after the through-hole 5 is drilled, it is desirable to clean the surface of the sheet-like adhesive material 1 to which the release film 4 is attached and the inside of the through-hole 5 using means such as an adhesive roll or air blow. By this cleaning, it is possible to prevent foreign matter from adhering to and mixing in the conductive paste 6 to be performed in a later step, and to prevent conduction problems between the wiring boards.

  Next, as shown in FIG.1 (e), the conductive paste 6 is filled in the through-hole 5 formed in the sheet-like adhesive material 1 which bonded the release film 4 at least on one side. The filling of the conductive paste 6 can be performed by screen printing or the like with the surface on which the release film 4 is attached facing up. Since the releasable film 4 has the role of a mask film, the entire surface can be printed, and it is not necessary to prepare and use a plate, which is efficient. In addition, it is desirable to use the base wiring board and the perforated wiring board as soon as possible after the conductive paste 6 is filled. However, when the conductive paste 6 is used at an interval, the conductive paste 6 is filled. It is preferable to further provide a film for protecting the formed portion on the surface of the releasable film 4 because foreign matters can be prevented from being mixed therein.

As the conductive paste 6, a paste obtained by blending a binder resin, a curing agent, metal powder, or the like can be used.
In other words, the binder resin is based on bisphenol-based, phenol novolak-based, alkylphenol novolak-based, biphenol-based, naphthol-based, resorcinol-based and other phenol-based epoxy resins, aliphatic, cycloaliphatic, unsaturated aliphatic skeletons, etc. Modified epoxy compounds, polyfunctional glycidylamine type epoxy resins, and the like can be used.
Further, as the curing agent, imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 2-undecylimidazole, 2-phenyl-4-methyl Imidazole, bis (2-ethyl-4-methyl-imidazole), 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1-cyanoethyl-2-ethyl-4 -Methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-heptadecylimidazole, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 1-cyanoethyl- 2 Phenyl-4,5-di (2-cyanoethoxy) methylimidazole or and triazine addition type imidazole, and the like can be used these those epoxy adduct of.
In addition, as the metal powder, copper, nickel, silver, gold, platinum and the like as a main component, and on the surface, metal plating, silver, gold, platinum coated copper, nickel, resin powder, etc., A combination of two or more of these can be used.

  Next, as shown in FIG. 1 (f), after filling with the conductive paste 6, by removing the release film 4 attached to the surface of the sheet-like adhesive material 1, The adhesive sheet 7 having a shape in which the conductive paste protrudes from the surface of the sheet-like adhesive material 1 by the thickness of the release film 4 can be obtained without attaching the conductive paste 6.

A method for manufacturing a multilayer wiring board for mounting semiconductor elements according to the present invention will be described with reference to FIG. As shown in FIG. 2A, the adhesive sheet 7 of the present invention is disposed between the base wiring board 8 and the perforated wiring board 9. The base wiring board 8 and the perforated wiring board 9 are arranged so that the surfaces of the base wiring board 8 and the perforated wiring board 9 having the connecting conductors face the adhesive sheet 7 side. After each wiring board and the adhesive sheet 7 are arranged in this way, a multilayer for mounting a semiconductor element having a cavity 12 as shown in FIG. 2B is obtained by heating and pressurizing using means such as a press. The wiring board 10 can be manufactured. Moreover, the conditions of heating and pressurizing such as a press are not particularly limited, and can be produced under general conditions.
The base wiring board and the perforated wiring board to be used can be manufactured by a general wiring board manufacturing process, and the cavity of the perforated wiring board is usually formed using means such as a router.

Hereinafter, the present invention will be described in detail by way of examples. In addition, this invention is not restrict | limited to a following example.
Example 1
[Preparation of adhesive sheet]
As shown in FIG. 1A, AS-2600W (product name, manufactured by Hitachi Chemical Co., Ltd.), which is a sheet-like adhesive material 1 having a thickness of 50 μm, a width of 518 mm, and a length of 340 mm, is a laser processing machine.・ Using MARK-30L (product name, manufactured by Hitachi Via Mechanics Co., Ltd.), drill the cavity 2 so that it has almost the same dimensions as the hole in the perforated wiring board, and then from the four corners of the sheet-like adhesive material An alignment hole 3 having a diameter of 0.15 mm was drilled at a position 10 mm inward. Next, the foreign material adhering to the sheet-like adhesive material was removed with a cleaning device, Techniclean TC-630 (product name, manufactured by Audio Technica Co., Ltd.), and the sheet-like adhesive material with a cavity (see FIG. 1B) was used. Produced.

  Next, fine peel 500NC (product name, Reiko Co., Ltd., product name), which is a releasable film 4 having a thickness of 21 μm, a width of 520 mm, and a length of 350 mm, is applied to both sides of the washed sheet-like adhesive material with a cavity. MVLP-500 (manufactured by Meiki Seisakusho Co., Ltd., product name), pressure bonding under the conditions of a temperature of 60 ° C., a pressure of 0.5 MPa, and a time of 30 seconds, melting and pasting the surface resin component of the adhesive material, A sheet-like adhesive material with a releasable film (see FIG. 1C) was produced.

  Next, using a laser processing machine H · MARK-30L (manufactured by Hitachi Via Mechanics Co., Ltd., product name), the previously drilled alignment hole is recognized as an alignment mark. The through-hole 5 was formed in the position where the diameter of the releasable film perforated on the laser light irradiation surface was 0.15 mm. Subsequently, the foreign material adhering to the surface of the sheet-like adhesive material and the inside of the hole was removed with Technic Clean TC-630 (manufactured by Audio-Technica Co., Ltd., product name) as a cleaning device, and the sheet-like adhesive material with through holes (FIG. 1 (d) )).

  Next, as shown in FIG. 1 (e), the entire surface of the conductive paste 6 containing copper and epoxy resin as a main component is printed with the laser light irradiation surface at the time of forming the through hole facing up, and the inside of the through hole is formed. Was filled with a conductive paste. After filling, the releasable film 4 attached to the surface of the adhesive material was removed, and the adhesive sheet 7 shown in FIG.

[Production of base wiring board]
MCL-E-679FG (product name, manufactured by Hitachi Chemical Co., Ltd.), which is a 0.1 mm thick epoxy resin glass cloth copper clad laminate with a 12 μm thick copper foil laminated to MARK-20 (Hitachi) By Via Mechanics Co., Ltd., product name), a through hole 23 having a diameter of 0.2 mm is opened, and then the cleaning process of the hole is performed by immersing in a sodium permanganate aqueous solution heated to 50 ° C. for 15 minutes. Immerse in electrolytic copper plating L-59 (manufactured by Hitachi Chemical Co., Ltd., product name), copper sulfate 10 g / L, EDTA 40 g / L, formalin 10 ml / L, pH 12.2 at a temperature of 70 ° C. for 8 hours. Then, copper plating of 15 μm was performed on the copper foil surface and the inner wall of the hole.

  Next, PHP-900IR-1 (manufactured by Yamaei Chemical Co., Ltd., product name), which is a permanent hole-filling ink, is filled inside the hole, and then a UV-curable etching resist dry film H-9025K (Hitachi) is formed on the substrate surface. Kasei Kogyo Co., Ltd., product name) is pressure-bonded with a laminator under the conditions of pressure 0.2 MPa, temperature 110 ° C., speed 1.5 m / min, then a negative mask is bonded to the surface, and a circuit pattern is formed by ultraviolet irradiation. After developing a 1% by weight sodium carbonate aqueous solution by spray spraying to form an etching resist, the copper part without the etching resist is spray sprayed to form a chloride consisting of ferric chloride, hydrochloric acid, and sulfuric acid / hydrogen peroxide. Etching is performed with ferric etchant under the conditions of pressure 0.1 MPa and speed 4.3 m / min. The amount% aqueous solution of sodium hydroxide was sprayed to remove the etching resist, and a first circuit board to form a wiring pattern 21.

  Next, HIST-7300 (manufactured by Hitachi Chemical Co., Ltd., product name) is used for the first circuit board, and the adhesion pretreatment is performed by roughening the copper surface at a spray pressure of 0.1 MPa and a speed of 4.0 m / min. Next, dry film FZ-2500G for UV-curable solder resist FZ-2500G (product name, manufactured by Hitachi Chemical Co., Ltd.) 25 μm was used, using MVLP-500 (product name, manufactured by Meiki Seisakusho Co., Ltd.), which is a vacuum laminator. Pressure bonding is performed under the conditions of 80 ° C., pressure 0.4 MPa, time 30 seconds, and then a negative mask is bonded to the surface, irradiated with ultraviolet light 400 mJ, and further sprayed with a 1.5 mass% sodium carbonate aqueous solution for development. Then, further curing was performed by irradiation with ultraviolet light 1J, and after drying at 160 ° C. for 60 minutes, an insulating resist 24 was formed, and HIST-7300 (Hitachi) The base wiring board shown in FIG. 2 (a) was obtained by performing chemical roughening for multilayered adhesion on the copper surface at a spray pressure of 0.1 MPa and a speed of 4.0 m / min. 8 was produced.

[Preparation of perforated wiring board]
MCL-E-679FG (product name, manufactured by Hitachi Chemical Co., Ltd.), a 0.6 mm thick epoxy resin glass cloth copper clad laminate with 12 μm thick copper foil laminated to MARK-20 (Hitachi) By Via Mechanics Co., Ltd., product name), a through hole 23 having a diameter of 0.2 mm is opened, and then the cleaning process of the hole is performed by immersing in a sodium permanganate aqueous solution heated to 50 ° C. for 15 minutes. Immerse in electrolytic copper plating L-59 (manufactured by Hitachi Chemical Co., Ltd., product name), copper sulfate 10 g / L, EDTA 40 g / L, formalin 10 ml / L, pH 12.2 at a temperature of 70 ° C. for 8 hours. Then, copper plating of 15 μm was performed on the copper foil surface and the inner wall of the hole.

  Next, PHP-900IR-1 (manufactured by Yamaei Chemical Co., Ltd., product name), which is a permanent hole-filling ink, is filled inside the hole, and then a UV-curable etching resist dry film H-9025K (Hitachi) is formed on the substrate surface. Kasei Kogyo Co., Ltd., product name) is pressure-bonded with a laminator under the conditions of pressure 0.2 MPa, temperature 110 ° C., speed 1.5 m / min, then a negative mask is bonded to the surface, and a circuit pattern is formed by ultraviolet irradiation. After developing a 1% by weight sodium carbonate aqueous solution by spray spraying to form an etching resist, the copper part without the etching resist is spray sprayed to form a chloride consisting of ferric chloride, hydrochloric acid, and sulfuric acid / hydrogen peroxide. Etching is performed with ferric etchant under the conditions of pressure 0.1 MPa and speed 4.3 m / min. The amount% aqueous solution of sodium hydroxide was sprayed to remove the etching resist, and a second circuit board to form a wiring pattern 21.

  Using HIST-7300 (manufactured by Hitachi Chemical Co., Ltd., product name) for the second circuit board, pre-bonding treatment is performed by roughening the copper surface at a spray pressure of 0.1 MPa and a speed of 4.0 m / min. Next, an ultraviolet curing solder resist dry film FZ-2500G (product name, manufactured by Hitachi Chemical Co., Ltd., 25 μm) was used at a temperature of 80 ° C. using a vacuum laminator MVLP-500 (product name, manufactured by Meiki Seisakusho Co., Ltd.). Then, pressure bonding is performed under the conditions of pressure 0.4 MPa, time 30 seconds, and then a negative mask is bonded to the surface, irradiated with ultraviolet light 400 mJ, and further sprayed and developed with a 1.5% by mass sodium carbonate aqueous solution, Further curing is performed by irradiation with ultraviolet light 1 J, and after drying at 160 ° C. for 60 minutes, an insulating resist 24 is formed, and HIST-7300 (Hitachi Chemical Industries) Formula company made, using the product name), was multi-layered adhesive for chemical roughening of the copper surface with a spray pressure 0.1MPa, speed 4.0m / min.

  In order to form a cavity in the second circuit board that has been subjected to the chemical roughening for multi-layer adhesion, MARK-10 (manufactured by Hitachi Via Mechanics Co., Ltd., product name) is used to form a cavity. Then, a holed wiring board 9 as shown in FIG. 2 (a) was prepared by punching with a size of 4.0 mm × 6.7 mm.

[Fabrication of multilayer wiring boards for mounting semiconductor devices]
The adhesive sheet 7 produced by the above method is disposed between the base wiring board 8 and the perforated wiring board 9 so as to be in a predetermined position, and is brought into a state as shown in FIG. 2A, and is aligned by a pin lamination method. And sandwiched between 1 mm thick metal plate DP-2 (product name, manufactured by Taika Kogyo Co., Ltd.), 5 layers are stacked, and a cushion board R-225RX ( 2), and heated and pressurized for 140 minutes in a vacuum at a temperature of 200 ° C. and a pressure of 5 MPa, cooled and taken out, and has a cavity 12 as shown in FIG. A multilayer wiring board 10 for mounting semiconductor elements was produced.

(Comparative Example 1)
[Preparation of Comparative Adhesive Sheet A]
As shown in FIG. 3A, the thickness is 21 μm on both surfaces of AS-2600W (product name, manufactured by Hitachi Chemical Co., Ltd.), which is a sheet-like adhesive material 1 having a thickness of 50 μm, a width of 518 mm, and a length of 340 mm. Using MVLP-500 (product name, manufactured by Meiki Seisakusho Co., Ltd.), which is a vacuum laminator, fine peel 500NC (product name, manufactured by Reiko Co., Ltd.), which is a releasable film 4 having a width of 520 mm and a length of 350 mm, Crimping is performed under conditions of a temperature of 60 ° C., a pressure of 0.5 MPa, and a time of 30 seconds, and the surface resin component of the adhesive material is melted and pasted to produce a sheet-like adhesive material with a release film (see FIG. 3B). did.

  Next, using a laser processing machine H • MARK-30L (manufactured by Hitachi Via Mechanics Co., Ltd., product name), a condition that the diameter of the releasable film perforated on the laser light irradiation surface is 0.15 mm in diameter at a predetermined position The through-hole 5 was formed by. Next, foreign material adhering to the surface of the sheet-like adhesive material and the inside of the hole was removed by a cleaning device, Techniclean TC-630 (product name, manufactured by Audio Technica Co., Ltd.), and a sheet-like adhesive material with a through hole (FIG. 3 (c) )).

  Next, as shown in FIG. 3 (d), with the laser light irradiation surface at the time of forming the through hole facing upward, the conductive paste 6 mainly composed of copper and epoxy resin is printed, and the inside of the through hole is printed. Filled with conductive paste. After filling, the releasable film 4 attached to the surface of the adhesive material was removed only on one side to produce a comparative adhesive sheet A20 shown in FIG.

[Preparation of perforated wiring board]
As shown in FIGS. 5A to 5C, the base wiring board 8 manufactured by the same method as in Example 1 and the comparative adhesive sheet A are aligned by the pin lamination method and overlapped. Then, after temporarily releasing the release film 4 on the surface of the comparative adhesive sheet A side, using a vacuum laminator MVLP-500 (product name, manufactured by Meiki Seisakusho Co., Ltd.), a temperature of 70 ° C., a pressure of 0. In order to form a cavity using MARK-10 (manufactured by Hitachi Via Mechanics Co., Ltd.) which is an NC router machine, crimping is performed under conditions of 5 MPa and time 30 seconds, and 4.0 mm × 6 in a predetermined position. A perforated wiring board 35 with a comparative adhesive sheet was prepared by perforating 7 mm.

[Fabrication of multilayer wiring boards for mounting semiconductor devices]
The perforated wiring board 35 with the comparative adhesive sheet produced by the above method and the base wiring board 8 are arranged so that the comparative adhesive sheet A side is in contact with the base wiring board 8 and is in a predetermined position. (D) It is in a state as shown in FIG. 1, alignment is performed by a pin lamination method, sandwiched by a metal plate DP-2 having a thickness of 1 mm (product name, manufactured by Taika Kogyo Co., Ltd.), this is superposed in five stages, and the initial temperature Inserted through a cushion board R-225RX (product name, manufactured by Kinyo Co., Ltd.) between hot plates of a 30 ° C. heating press, heated and pressurized in vacuum at a temperature of 200 ° C. and a pressure of 5 MPa for 140 minutes, after cooling The semiconductor device mounting multilayer wiring board 10 having the cavity 12 as shown in FIG.

(Comparative Example 2)
[Preparation of Comparative Adhesive Sheet B]
As shown in FIG. 4A, the thickness is 21 μm on both sides of AS-2600W (product name) manufactured by Hitachi Chemical Co., Ltd., which is a sheet-like adhesive material 1 having a thickness of 50 μm, a width of 518 mm, and a length of 340 mm. Using MVLP-500 (product name, manufactured by Meiki Seisakusho Co., Ltd.), which is a vacuum laminator, fine peel 500NC (product name, manufactured by Reiko Co., Ltd.), which is a releasable film 4 having a width of 520 mm and a length of 350 mm, Crimping is performed under conditions of a temperature of 60 ° C., a pressure of 0.5 MPa, and a time of 30 seconds, and the surface resin component of the adhesive material is melted and pasted to produce a sheet-like adhesive material with a release film (see FIG. 4B). did.

  Next, using a laser processing machine H • MARK-30L (manufactured by Hitachi Via Mechanics Co., Ltd., product name), the cavity 2 is drilled so as to have almost the same size as the hole of the perforated wiring board, Using H / MARK-30L (product name, manufactured by Hitachi Via Mechanics Co., Ltd.), which is a laser processing machine, under the condition that the diameter of the releasable film perforated on the laser light irradiation surface is 0.15 mm in diameter at a predetermined position. A through hole 5 was formed. Subsequently, the foreign material adhering to the surface of the sheet-like adhesive material and inside the holes was removed with a cleaning device, Techniclean TC-630 (product name, manufactured by Audio Technica Co., Ltd.), and the sheet-like adhesive material with through holes (FIG. 4 (c) )).

  Next, as shown in FIG. 4D, the conductive paste 6 containing copper and epoxy resin as main components is printed using the printing plate 11 with the laser light irradiation surface at the time of forming the through hole facing up. The conductive paste was filled only in the through holes. After filling, the release film 4 attached to the surface of the adhesive material was removed, and a comparative adhesive sheet B30 shown in FIG.

[Fabrication of multilayer wiring boards for mounting semiconductor devices]
The comparative adhesive sheet B30 produced by the above method is placed between the base wiring board 8 and the perforated wiring board 9 so as to be in a predetermined position, and is brought into a state as shown in FIG. , And sandwiched between 1 mm thick metal plate DP-2 (product name, manufactured by Taika Kogyo Co., Ltd.), stacked in five layers, and cushion board R between the hot plates of a heating press with an initial temperature of 30 ° C. -225RX (manufactured by Kinyo Co., Ltd., product name), heated and pressurized in vacuum for 140 minutes under conditions of a temperature of 200 ° C. and a pressure of 5 MPa, taken out after cooling, and a cavity as shown in FIG. The multilayer wiring board 10 for mounting a semiconductor element having 12 was produced.

(Evaluation method for connection between conductors)
As shown in FIG. 7 (a), the evaluation of the connection state between conductors can be performed on a substrate 40 having a size of 518 mm × 340 mm, and 64 × 12 multilayer wiring boards 10 for mounting semiconductor elements as shown in FIG. 7 (b) can be produced. The resistance between conductors between the external connection terminal A13 provided on the perforated wiring board side and the external connection terminal B14 provided on the base wiring board side as shown in FIG. Measured with RESISTANCE HITESTER (product name, manufactured by Hioki Electric Co., Ltd.), 10 mΩ or more was regarded as poor connection.
FIG. 7C is a cross-sectional view taken along the line AA of the multilayer wiring board for mounting a semiconductor element in FIG.

The structure of the multilayer wiring board for mounting a semiconductor element includes a perforated wiring board having a through hole with a thickness of 0.6 mm and a copper plating diameter of 0.2 mm, and connecting terminals with a thickness of 27 μm × 1.5 mm × 1.0 mm on both sides. A conductive substrate having a thickness of 0.15 mm and a through-hole having a thickness of 0.1 mm and a copper plating and a base wiring board having a connection terminal of 27 μm × 1.5 mm × 1.0 mm on both sides and a thickness of 0.15 mm. It is bonded by an adhesive sheet provided with a paste. The conductive paste was arranged such that the distance from the cavity end face to the center of the conductive paste was 0.3 mm, and the distance between the centers of the through hole and the conductive paste was 0.75 mm.
Table 1 shows the connection failure occurrence rate of each of the 518 mm × 340 mm multi-layer wiring boards for mounting semiconductor devices produced in Example 1, Comparative Example 1, and Comparative Example 2.

The standard work time in the conductive paste filling operation performed in Example 1 is 5 minutes, while the standard work time in the conductive paste filling operation performed in Comparative Example 2 is The setup time was 25 minutes.
As shown in Table 1, there was no connection failure in the multilayer wiring board for mounting semiconductor elements produced in Example 1 and Comparative Example 2, whereas the multilayer wiring board for mounting semiconductor elements obtained in Comparative Example 1 The connection failure was 31 ppm. In Comparative Example 2, the production and use of the printing plate was required at the time of production of the adhesive sheet, and it took time to align the printing plate and the adhesive sheet at the time of filling with the conductive paste. On the other hand, in Example 1, it was confirmed that the entire surface could be printed without using a printing plate, and the work efficiency was high and it could be manufactured at a low cost.

  In Example 1, in the production of a multilayer wiring board for mounting a semiconductor element, by performing the cavity processing on the adhesive sheet and the perforated wiring board separately, the foreign substances are removed by cleaning after the cavity processing, which is a source of foreign substances, is performed. Is possible. However, in Comparative Example 1, since the cavity processing is performed after bonding the adhesive sheet and the perforated wiring board, foreign matter generated during the cavity processing adheres to the adhesive sheet and the perforated wiring board. In order to prevent damage to the conductive paste, it is difficult to clean. It was found that there was a difference in the disconnection rate (connection failure rate) depending on the presence or absence of cleaning after the cavity processing.

DESCRIPTION OF SYMBOLS 1 Sheet-like adhesive material 2 Cavity 3 Positioning hole 4 Release film 5 Conductive paste filling hole (through hole)
6 Conductive paste 7 Adhesive sheet 8 Base wiring board 9 Perforated wiring board 10 Multi-layer wiring board for mounting semiconductor elements 11 Printing plate 12 Cavity 13 External connection terminal A
14 External connection terminal B
20 Comparative adhesive sheet A
21 wiring pattern 22 insulating resin layer 23 through hole 24 insulating resist 30 comparative adhesive sheet B
35 Perforated wiring board 40 with adhesive sheet for comparison

Claims (5)

  (1) a step of preparing a sheet-like adhesive material, (2) a step of performing cavity processing on the sheet-like adhesive material, (3) a step of attaching a release film to at least one surface of the sheet-like adhesive material, 4) A step of forming a conductive paste filling hole in the sheet-like adhesive material, and (5) a step of filling the conductive paste filling hole with a conductive paste in this order. Production method.   The method for producing an adhesive sheet according to claim 1, wherein, in the step (4), the hole for filling the conductive paste is formed by laser light irradiation.   The manufacturing of the adhesive sheet according to claim 1 or 2, wherein in the step (2), in addition to the cavity processing, alignment hole processing is performed, and the cavity processing and the alignment hole processing are performed simultaneously. Method.   The process for producing an adhesive sheet according to any one of claims 1 to 3, wherein in the step (5), the conductive paste is filled by full-surface printing on the sheet-like adhesive material.   A step of stacking a base wiring board and a perforated wiring board having a cavity for mounting a semiconductor element through an adhesive sheet having a cavity and a hole filled with a conductive paste, and heating and pressing to integrate them. A method for manufacturing a multilayer wiring board for mounting a semiconductor element, comprising: using the adhesive sheet manufactured by the method for manufacturing an adhesive sheet according to any one of claims 1 to 4. Manufacturing method of multilayer wiring board for mounting.

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