JP2011032434A - Sheet-like epoxy resin composition for sealing electronic parts, and electronic parts device assembly obtained from the composition, and electronic parts device - Google Patents
Sheet-like epoxy resin composition for sealing electronic parts, and electronic parts device assembly obtained from the composition, and electronic parts device Download PDFInfo
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- JP2011032434A JP2011032434A JP2009182519A JP2009182519A JP2011032434A JP 2011032434 A JP2011032434 A JP 2011032434A JP 2009182519 A JP2009182519 A JP 2009182519A JP 2009182519 A JP2009182519 A JP 2009182519A JP 2011032434 A JP2011032434 A JP 2011032434A
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 112
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 111
- 239000000203 mixture Substances 0.000 title claims abstract description 70
- 238000007789 sealing Methods 0.000 title claims abstract description 51
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 34
- 125000004036 acetal group Chemical group 0.000 claims abstract description 20
- -1 imidazole compound Chemical class 0.000 claims abstract description 20
- 239000005011 phenolic resin Substances 0.000 claims abstract description 15
- 229920001971 elastomer Polymers 0.000 claims abstract description 12
- 239000000806 elastomer Substances 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 239000002966 varnish Substances 0.000 description 8
- 239000005350 fused silica glass Substances 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 229920006243 acrylic copolymer Polymers 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 5
- 238000011049 filling Methods 0.000 description 5
- 229920006267 polyester film Polymers 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- 0 *c1c(*)nc(-c2ccccc2)[n]1 Chemical compound *c1c(*)nc(-c2ccccc2)[n]1 0.000 description 1
- LFMQNMXVVXHZCC-UHFFFAOYSA-N 1,3-benzothiazol-2-yl n,n-diethylcarbamodithioate Chemical compound C1=CC=C2SC(SC(=S)N(CC)CC)=NC2=C1 LFMQNMXVVXHZCC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LYZFSSDDDMVLSX-UHFFFAOYSA-N 4-(2-aminoethyl)-6-(2-undecyl-1H-imidazol-5-yl)-1,3,5-triazin-2-amine Chemical compound NCCC1=NC(=NC(=N1)N)C=1N=C(NC1)CCCCCCCCCCC LYZFSSDDDMVLSX-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
Abstract
Description
本発明は、大面積を反りなく樹脂封止することができる電子部品封止用シート状エポキシ樹脂組成物に関する。 The present invention relates to a sheet-like epoxy resin composition for encapsulating electronic components that can encapsulate a large area without warping.
半導体素子、コンデンサおよびセンサーデバイス等の電子部品の封止は、粉末状エポキシ樹脂組成物によるトランスファー封止や液状エポキシ樹脂組成物によるポッティング等によって行われているが、より簡便に樹脂封止するために、基板上に搭載した複数個の電子部品を、シート状エポキシ樹脂組成物を用いて一度に樹脂封止することが提案されている（特許文献１，２）。 Electronic parts such as semiconductor elements, capacitors and sensor devices are sealed by transfer sealing with a powdered epoxy resin composition or potting with a liquid epoxy resin composition. In addition, it has been proposed to seal a plurality of electronic components mounted on a substrate at once using a sheet-like epoxy resin composition (Patent Documents 1 and 2).
しかし、上記シート状エポキシ樹脂組成物は、製造効率をより高めるためのさらなる封止面積の大面積化に十分に対応できるものではなく、基板に反りが生じる可能性がある。この反りは、搬送トラブルの要因となる。 However, the said sheet-like epoxy resin composition cannot fully respond to the enlargement of the further sealing area for improving manufacturing efficiency more, and a curvature may arise in a board | substrate. This warpage becomes a cause of a conveyance trouble.
また、上記シート状エポキシ樹脂組成物は、ポッティング用の液状エポキシ樹脂組成物と比べて溶融粘度が高くなるため、電子部品と基板の間の狭いギャップに樹脂組成物が充填されにくい。ギャップに未充填部分があると、後に行われるリフロー時のクラックの要因となる。 Moreover, since the said sheet-like epoxy resin composition becomes high melt viscosity compared with the liquid epoxy resin composition for potting, it is hard to fill a resin composition in the narrow gap between an electronic component and a board | substrate. If there is an unfilled portion in the gap, it causes cracks during reflow performed later.
本発明はこのような事情に鑑みなされたもので、大面積を封止しても封止後の基板の反りを低減し、さらには電子部品と基板の間のギャップへの充填性に優れた樹脂封止が可能となる電子部品封止用シート状エポキシ樹脂組成物の提供、およびそれにより得られる電子部品装置集合体ならびに電子部品装置の提供をその目的とする。 The present invention has been made in view of such circumstances, and even when a large area is sealed, the warping of the substrate after sealing is reduced, and further, the filling property to the gap between the electronic component and the substrate is excellent. It is an object of the present invention to provide a sheet-like epoxy resin composition for encapsulating electronic components that enables resin encapsulation, and to provide an electronic component device assembly and an electronic component device obtained thereby.
上記の問題を解決するために、本発明は、電子部品封止用シート状エポキシ樹脂組成物であって、下記Ａ〜Ｅ成分を含有し、かつＣ成分の含有量がシート状エポキシ樹脂組成物全体の１５〜３０重量％であることを特徴としている。
Ａ：アセタール基を含有するエポキシ樹脂
Ｂ：フェノール樹脂
Ｃ：エラストマー
Ｄ：無機質充填剤
Ｅ：イミダゾール化合物
In order to solve the above problems, the present invention is a sheet-like epoxy resin composition for encapsulating electronic components, which contains the following components A to E, and the content of the C component is a sheet-like epoxy resin composition It is characterized by 15 to 30% by weight of the whole.
A: Epoxy resin containing acetal group B: Phenol resin C: Elastomer D: Inorganic filler E: Imidazole compound
本発明の電子部品封止用シート状エポキシ樹脂組成物は、封止面積が大面積であっても基板の反りを抑えるとともに、電子部品と基板の間のギャップへの充填性に優れた樹脂封止が可能となる。 The sheet-like epoxy resin composition for sealing an electronic component of the present invention suppresses the warpage of the substrate even when the sealing area is large, and the resin sealing excellent in filling property in the gap between the electronic component and the substrate. Can be stopped.
また、イミダゾール化合物（Ｅ成分）として下記の式（１）で表される化合物を用いると、上記のような樹脂封止が可能となるだけでなく、さらに保存安定性に優れた電子部品封止用シート状エポキシ樹脂組成物とすることができる。 Moreover, when the compound represented by the following formula (1) is used as the imidazole compound (E component), not only the resin sealing as described above is possible, but also the electronic component sealing excellent in storage stability. It can be set as a sheet-like epoxy resin composition.
つぎに、本発明の実施の形態について詳しく説明する。 Next, embodiments of the present invention will be described in detail.
本発明の電子部品封止用シート状エポキシ樹脂組成物は、下記Ａ〜Ｅ成分を含有し、かつＣ成分の含有量をシート状エポキシ樹脂組成物全体の１５〜３０重量％としたものである。
Ａ：アセタール基を含有するエポキシ樹脂
Ｂ：フェノール樹脂
Ｃ：エラストマー
Ｄ：無機質充填剤
Ｅ：イミダゾール化合物
アセタール基を含有するエポキシ樹脂（Ａ成分）は、アセタール基を含有するエポキシ樹脂であれば特に限定されるものではない。例えば、変性ビスフェノールＡ型エポキシ樹脂、変性ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂およびフェノキシ樹脂等の各種のエポキシ樹脂にアセタール基を導入したものを用いることができる。これらエポキシ樹脂は単独で用いてもよいし２種以上併用してもよい。中でも、液体状で取り扱いが容易であるという観点から、アセタール基を有する変性ビスフェノールＡ型エポキシ樹脂を用いることが好ましい。なお、アセタール基を含有するエポキシ樹脂（Ａ成分）とアセタール基を含有しないエポキシ樹脂を併用してもよい。
The sheet-like epoxy resin composition for sealing electronic parts of the present invention contains the following components A to E, and the content of the component C is 15 to 30% by weight of the whole sheet-like epoxy resin composition. .
A: Epoxy resin containing acetal group B: Phenol resin C: Elastomer D: Inorganic filler E: Imidazole compound The epoxy resin (component A) containing an acetal group is particularly limited as long as it is an epoxy resin containing an acetal group Is not to be done. For example, modified bisphenol A type epoxy resin, modified bisphenol F type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, triphenylmethane type epoxy resin, dicyclopentadiene type epoxy resin, cresol novolac type epoxy resin, phenol novolac A variety of epoxy resins such as epoxy resin, biphenyl epoxy resin, and phenoxy resin into which an acetal group is introduced can be used. These epoxy resins may be used alone or in combination of two or more. Among them, it is preferable to use a modified bisphenol A type epoxy resin having an acetal group from the viewpoint of being liquid and easy to handle. In addition, you may use together the epoxy resin (A component) containing an acetal group, and the epoxy resin which does not contain an acetal group.
アセタール基を含有するエポキシ樹脂（Ａ成分）と併用するエポキシ樹脂は、特に限定されるものではない。例えば、トリフェニルメタン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、変性ビスフェノールＡ型エポキシ樹脂、変性ビスフェノールＦ型エポキシ樹脂、ビフェニル型エポキシ樹脂およびフェノキシ樹脂等の各種のエポキシ樹脂を用いることができる。 The epoxy resin used together with the epoxy resin (component A) containing an acetal group is not particularly limited. For example, triphenylmethane type epoxy resin, dicyclopentadiene type epoxy resin, cresol novolac type epoxy resin, phenol novolac type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol A type epoxy resin, modified bisphenol F Various epoxy resins such as a type epoxy resin, a biphenyl type epoxy resin and a phenoxy resin can be used.
アセタール基を含有するエポキシ樹脂（Ａ成分）の含有量は、シート状エポキシ樹脂組成物全体に対して３〜１０重量％にすることが好ましい。３重量％未満ではシート状エポキシ樹脂組成物の可撓性を得るのが困難となり、１０重量％を超えると樹脂封止後のダイシングにおいて樹脂バリやダイシングテープの糊残りなどが起こる傾向がみられるためである。 The content of the epoxy resin (A component) containing an acetal group is preferably 3 to 10% by weight with respect to the entire sheet-like epoxy resin composition. If it is less than 3% by weight, it is difficult to obtain the flexibility of the sheet-like epoxy resin composition, and if it exceeds 10% by weight, resin burrs and adhesive residue on the dicing tape tend to occur during dicing after resin sealing. Because.
フェノール樹脂（Ｂ成分）は、アセタール基を含有するエポキシ樹脂（Ａ成分）との間で硬化反応を生起するものであれば特に限定するものではない。例えば、ジシクロペンタジエン型フェノール樹脂、ノボラック型フェノール樹脂、クレゾールノボラック樹脂、フェノールアラルキル樹脂等が用いられる。これらフェノール樹脂は単独で用いてもよいし、２種以上併用してもよい。そして、フェノール樹脂（Ｂ成分）は、水酸基当量が７０〜２５０、軟化点が５０〜１１０℃のものを用いることが好ましく、中でも硬化反応性が高いという観点から、ノボラック型フェノール樹脂を好適に用いることができる。また、信頼性の観点から、フェノールアラルキル樹脂やビフェニルアラルキル樹脂のような低吸湿性のものを好適に用いることができる。 The phenol resin (component B) is not particularly limited as long as it causes a curing reaction with the epoxy resin (component A) containing an acetal group. For example, dicyclopentadiene type phenol resin, novolac type phenol resin, cresol novolac resin, phenol aralkyl resin, etc. are used. These phenolic resins may be used alone or in combination of two or more. And it is preferable to use a phenol resin (B component) whose hydroxyl equivalent is 70-250 and whose softening point is 50-110 degreeC, and uses a novolak-type phenol resin suitably from a viewpoint that hardening reactivity is high especially. be able to. From the viewpoint of reliability, low hygroscopic materials such as phenol aralkyl resins and biphenyl aralkyl resins can be suitably used.
そして、アセタール基を含有するエポキシ樹脂（Ａ成分）とフェノール樹脂（Ｂ成分）の配合割合は、アセタール基を含有するエポキシ樹脂（Ａ成分）中のエポキシ基１当量に対して、フェノール樹脂（Ｂ成分）中の水酸基の合計が０．７〜１．５当量となるように配合することが好ましく、０．９〜１．２当量がより好ましい。 And the compounding ratio of the epoxy resin (A component) containing an acetal group and a phenol resin (B component) is a phenol resin (B with respect to 1 equivalent of epoxy groups in the epoxy resin (A component) containing an acetal group. It is preferable to mix | blend so that the sum total of the hydroxyl group in a component) may be 0.7-1.5 equivalent, and 0.9-1.2 equivalent is more preferable.
アセタール基を含有するエポキシ樹脂（Ａ成分）およびフェノール樹脂（Ｂ成分）とともに用いられるエラストマー（Ｃ成分）は、シート状エポキシ樹脂組成物に柔軟性および可撓性を付与するものであり、このような作用を奏するものであれば特にその構造を限定するものではない。例えば、ポリアクリル酸エステル等の各種アクリル系共重合体、スチレンアクリレート系共重合体、ブタジエンゴム、スチレン−ブタジエンゴム（ＳＢＲ）、エチレン−酢酸ビニルコポリマー（ＥＶＡ）、イソプレンゴム、アクリロニトリルゴム等のゴム質重合体を用いることができる。中でも、エポキシ樹脂（Ａ成分）へ分散させやすく、またエポキシ樹脂（Ａ成分）との反応性も高いために、得られるエポキシ樹脂組成物の耐熱性や強度を向上させることができるという観点から、アクリル系共重合体を用いることが好ましい。これらは単独で用いてもよいし、２種以上併せて用いてもよい。アクリル系共重合体は、例えば、所定の混合比にしたアクリルモノマー混合物を、常法によってラジカル重合することにより合成することができる。ラジカル重合の方法としては、有機溶剤を溶媒に行う溶液重合法や、水中に原料モノマーを分散させながら重合を行う懸濁重合法が用いられる。その際に用いる重合開始剤としては、例えば、２，２’−アゾビスイソブチロニトリル、２，２’−アゾビス−（２，４−ジメチルバレロニトリル）、２，２’−アゾビス−４−メトキシ−２，４−ジメチルバレロニトリル、その他のアゾ系またはジアゾ系重合開始剤、ベンゾイルパーオキサイドおよびメチルエチルケトンパーオキサイド等の過酸化物系重合開始剤等が用いられる。なお、懸濁重合の場合は、例えばポリアクリルアミド、ポリビニルアルコールのような分散剤を加えることが望ましい。 The elastomer (C component) used together with the acetal group-containing epoxy resin (component A) and phenol resin (component B) imparts flexibility and flexibility to the sheet-like epoxy resin composition. The structure is not particularly limited as long as it exhibits an advantageous action. For example, various acrylic copolymers such as polyacrylates, styrene acrylate copolymers, butadiene rubber, styrene-butadiene rubber (SBR), ethylene-vinyl acetate copolymer (EVA), isoprene rubber, acrylonitrile rubber, etc. Polymers can be used. Among them, from the viewpoint that the heat resistance and strength of the resulting epoxy resin composition can be improved because it is easy to disperse in the epoxy resin (component A) and the reactivity with the epoxy resin (component A) is high. It is preferable to use an acrylic copolymer. These may be used alone or in combination of two or more. The acrylic copolymer can be synthesized, for example, by radical polymerization of an acrylic monomer mixture having a predetermined mixing ratio by a conventional method. As a method for radical polymerization, a solution polymerization method in which an organic solvent is used as a solvent or a suspension polymerization method in which polymerization is performed while dispersing raw material monomers in water are used. As a polymerization initiator used in that case, for example, 2,2′-azobisisobutyronitrile, 2,2′-azobis- (2,4-dimethylvaleronitrile), 2,2′-azobis-4- Methoxy-2,4-dimethylvaleronitrile, other azo or diazo polymerization initiators, peroxide polymerization initiators such as benzoyl peroxide and methyl ethyl ketone peroxide are used. In the case of suspension polymerization, it is desirable to add a dispersing agent such as polyacrylamide or polyvinyl alcohol.
エラストマー（Ｃ成分）の含有量は、シート状エポキシ樹脂組成物全体の１５〜３０重量％である。エラストマー（Ｃ成分）の含有量が１５重量％未満では、シート状エポキシ樹脂組成物の柔軟性および可撓性を得るのが困難となり、さらには基板の反りを抑えた樹脂封止も困難となる。逆に３０重量％を超えると、シート状エポキシ樹脂組成物の溶融粘度が高くなるために、電子部品と基板の間のギャップに樹脂が充填されにくくなるとともに、シート状エポキシ樹脂組成物の硬化体の強度および耐熱性が低下する傾向がみられる。 Content of an elastomer (C component) is 15 to 30 weight% of the whole sheet-like epoxy resin composition. If the content of the elastomer (component C) is less than 15% by weight, it becomes difficult to obtain the flexibility and flexibility of the sheet-like epoxy resin composition, and further, it becomes difficult to perform resin sealing while suppressing the warpage of the substrate. . On the other hand, if it exceeds 30% by weight, the melt viscosity of the sheet-like epoxy resin composition increases, so that it is difficult to fill the gap between the electronic component and the substrate and the cured product of the sheet-like epoxy resin composition. There is a tendency for the strength and heat resistance to decrease.
また、エラストマー（Ｃ成分）のアセタール基を含有するエポキシ樹脂（Ａ成分）に対する重量比率（Ｃ成分の重量／Ａ成分の重量）は、３〜４．７の範囲に設定することが好ましい。重量比率が３未満の場合は、シート状エポキシ樹脂組成物の流動性をコントロールすることが困難となり、４．７を超えるとシート状エポキシ樹脂組成物の基板への接着性が劣る傾向がみられるためである。 The weight ratio of the elastomer (component C) to the epoxy resin (component A) containing an acetal group (weight of component C / weight of component A) is preferably set in the range of 3 to 4.7. When the weight ratio is less than 3, it is difficult to control the fluidity of the sheet-like epoxy resin composition, and when it exceeds 4.7, the adhesion of the sheet-like epoxy resin composition to the substrate tends to be inferior. Because.
無機質充填剤（Ｄ成分）は、特に限定されるものではなく、従来公知の各種充填剤を用いることができる。例えば、石英ガラス、タルク、シリカ（溶融シリカや結晶性シリカ等）、アルミナ、窒化アルミニウム、窒化珪素等の粉末が挙げられる。これらは単独で用いてもよいし、２種以上併用してもよい。中でも、エポキシ樹脂組成物の硬化体の熱線膨張係数が低減することにより内部応力を低減し、その結果、封止後の基板の反りを抑制できるという点から、シリカ粉末を用いることが好ましく、シリカ粉末の中でも溶融シリカ粉末を用いることがより好ましい。溶融シリカ粉末としては、球状溶融シリカ粉末、破砕溶融シリカ粉末が挙げられるが、流動性という観点から、球状溶融シリカ粉末を用いることが特に好ましい。中でも、平均粒径が０．１〜３０μｍの範囲のものを用いることが好ましく、０．３〜１５μｍの範囲のものを用いることが特に好ましい。なお、平均粒径は、例えば、母集団から任意に抽出される試料を用い、レーザー回折散乱式粒度分布測定装置を用いて測定することにより導き出すことができる。 The inorganic filler (component D) is not particularly limited, and various conventionally known fillers can be used. Examples thereof include powders of quartz glass, talc, silica (such as fused silica and crystalline silica), alumina, aluminum nitride, silicon nitride and the like. These may be used alone or in combination of two or more. Among them, it is preferable to use silica powder from the viewpoint that the internal stress is reduced by reducing the thermal linear expansion coefficient of the cured product of the epoxy resin composition, and as a result, the warpage of the substrate after sealing can be suppressed. Among the powders, it is more preferable to use fused silica powder. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder. From the viewpoint of fluidity, it is particularly preferable to use a spherical fused silica powder. Among them, those having an average particle size in the range of 0.1 to 30 μm are preferably used, and those having a range of 0.3 to 15 μm are particularly preferable. The average particle diameter can be derived, for example, by using a sample arbitrarily extracted from the population and measuring it using a laser diffraction / scattering particle size distribution measuring apparatus.
無機質充填剤（Ｄ成分）の含有量は、好ましくはエポキシ樹脂組成物全体の５０〜８０重量％であり、より好ましくは５５〜７５重量％であり、さらに好ましくは６０〜７０重量％である。すなわち、無機質充填剤（Ｄ成分）の含有量が５０重量％未満では、エポキシ樹脂組成物の硬化体の線膨張係数が大きくなるために、硬化体の反りが大きくなる傾向がみられる。一方、８０重量％を超えると、シート状エポキシ樹脂組成物の柔軟性や流動性が悪くなるために、電子部品や基板との接着性が低下する傾向がみられる。 Content of an inorganic filler (D component) becomes like this. Preferably it is 50 to 80 weight% of the whole epoxy resin composition, More preferably, it is 55 to 75 weight%, More preferably, it is 60 to 70 weight%. That is, when the content of the inorganic filler (component D) is less than 50% by weight, the linear expansion coefficient of the cured product of the epoxy resin composition increases, and thus the warpage of the cured product tends to increase. On the other hand, when it exceeds 80% by weight, the flexibility and fluidity of the sheet-like epoxy resin composition are deteriorated, so that the adhesiveness to the electronic component and the substrate tends to be lowered.
イミダゾール化合物（Ｅ成分）としては、アセタール基を含有するエポキシ樹脂（Ａ成分）とフェノール樹脂（Ｂ成分）との硬化反応を促進させるものであれば、特に限定するものではなく、イミダゾール化合物のみならず、その酸付加物を用いてもよい。これらは単独で用いても、２種以上併せて用いてもよい。イミダゾール化合物（Ｅ成分）を用いることにより、比較的低温で樹脂封止することが可能であり、また基板の反りを抑えた樹脂封止も可能となる。中でも、シート状エポキシ樹脂組成物の保存安定性という観点から、下記の式（１）で表されるイミダゾール化合物を用いることが好ましい。 The imidazole compound (component E) is not particularly limited as long as it accelerates the curing reaction between the acetal group-containing epoxy resin (component A) and the phenol resin (component B). Instead, the acid adduct may be used. These may be used alone or in combination of two or more. By using an imidazole compound (E component), it is possible to perform resin sealing at a relatively low temperature, and it is also possible to perform resin sealing while suppressing warpage of the substrate. Especially, it is preferable to use the imidazole compound represented by following formula (1) from a viewpoint of the storage stability of a sheet-like epoxy resin composition.
イミダゾール化合物（Ｅ成分）の含有量は、シート状エポキシ樹脂組成物全体の０．１〜１０重量％とすることが好ましく、０．３〜３重量％がより好ましく、０．５〜２重量％がさらに好ましい。０．１重量％未満では、硬化反応が非常に進行しにくくなり、１０重量％を超えると、低温でも硬化反応が進行してシート状エポキシ樹脂組成物の保存安定性が低下する傾向がみられるからである。 The content of the imidazole compound (E component) is preferably 0.1 to 10% by weight, more preferably 0.3 to 3% by weight, and more preferably 0.5 to 2% by weight of the entire sheet-like epoxy resin composition. Is more preferable. If it is less than 0.1% by weight, the curing reaction hardly proceeds, and if it exceeds 10% by weight, the curing reaction proceeds even at a low temperature, and the storage stability of the sheet-like epoxy resin composition tends to be lowered. Because.
本発明の電子部品封止用シート状エポキシ樹脂組成物は、例えば、つぎのようにして製造することができる。まず、各配合成分を混合することによりシート状エポキシ樹脂組成物を調製するが、各配合成分が均一に分散混合される方法であれば特に限定するものではない。そして、必要に応じて各配合成分を有機溶剤等に溶解または分散してワニス塗工により製膜する。あるいは、各配合成分を直接ニーダー等で混練することにより固形樹脂組成物を調製し、このようにして得られた固形樹脂組成物をシート状に押し出して製膜成形してもよい。中でも、簡便に均一な厚みのシートを得ることができるという点から、ワニス塗工法を用いることが好ましい。 The sheet-like epoxy resin composition for sealing an electronic component of the present invention can be produced, for example, as follows. First, a sheet-like epoxy resin composition is prepared by mixing each compounding component, but there is no particular limitation as long as each compounding component is uniformly dispersed and mixed. And each compounding component is melt | dissolved or disperse | distributed to the organic solvent etc. as needed, and it forms into a film by varnish coating. Alternatively, a solid resin composition may be prepared by directly kneading each compounding component with a kneader or the like, and the solid resin composition thus obtained may be extruded into a sheet shape to form a film. Especially, it is preferable to use a varnish coating method from the point that the sheet | seat of uniform thickness can be obtained simply.
ワニス塗工法による本発明の電子部品封止用シート状エポキシ樹脂組成物の作製について述べる。すなわち、上記Ａ〜Ｅ成分および必要に応じて他の添加剤を常法に準じて適宜混合し、有機溶剤に均一に溶解あるいは分散させ、ワニスを調製する。ついで、得られたワニスをポリエステル等の基材上に塗布し乾燥させることにより電子部品封止用シート状エポキシ樹脂組成物を得ることができる。そして必要により、シート表面を保護するためにポリエステルフィルム等のフィルムを貼り合わせてもよい。これらポリエステル等の基材およびポリエステルフィルム等のフィルムは、樹脂封止時に剥離する。 Preparation of the sheet-like epoxy resin composition for electronic component sealing of this invention by a varnish coating method is described. That is, the above components A to E and other additives as necessary are mixed as appropriate according to a conventional method, and uniformly dissolved or dispersed in an organic solvent to prepare a varnish. Subsequently, the sheet-like epoxy resin composition for electronic component sealing can be obtained by apply | coating the obtained varnish on base materials, such as polyester, and making it dry. If necessary, a film such as a polyester film may be bonded to protect the sheet surface. These base materials, such as polyester, and films, such as a polyester film, peel at the time of resin sealing.
有機溶剤としては、特に限定するものではなく従来公知の各種有機溶剤、例えばメチルエチルケトン、アセトン、ジオキサン、ジエチルケトン、トルエン、酢酸エチル等を用いることができる。これらは単独で用いてもよいし、２種以上併せて用いてもよい。また通常、ワニスの固形分濃度が３０〜６０重量％の範囲となるように有機溶剤を用いることが好ましい。 The organic solvent is not particularly limited, and various conventionally known organic solvents such as methyl ethyl ketone, acetone, dioxane, diethyl ketone, toluene, ethyl acetate and the like can be used. These may be used alone or in combination of two or more. Usually, it is preferable to use an organic solvent so that the solid content concentration of the varnish is in the range of 30 to 60% by weight.
有機溶剤乾燥後のシートの厚みは、特に制限されるものではないが、厚みの均一性と残存溶剤量の観点から、通常、５〜１００μｍに設定することが好ましく、より好ましくは２０〜７０μｍである。このようにして得られた本発明の電子部品封止用シート状エポキシ樹脂組成物は、必要により所望の厚みとなるように積層して使用してもよい。すなわち、本発明の電子部品封止用シート状エポキシ樹脂組成物は、単層構造にて使用してもよいし、２層以上の多層構造に積層してなる積層体として使用してもよい。 Although the thickness of the sheet after drying the organic solvent is not particularly limited, it is usually preferably set to 5 to 100 μm, more preferably 20 to 70 μm, from the viewpoint of uniformity of thickness and the amount of residual solvent. is there. The sheet-like epoxy resin composition for sealing an electronic component of the present invention thus obtained may be used by being laminated so as to have a desired thickness if necessary. That is, the sheet-like epoxy resin composition for electronic component sealing of the present invention may be used in a single layer structure, or may be used as a laminate formed by laminating two or more layers.
このようにして得られる本発明の電子部品封止用シート状エポキシ樹脂組成物を用いることにより、基板上に搭載された複数個の電子部品を一括で樹脂封止することが可能となる。基板上に搭載された複数個の電子部品を一括で樹脂封止するには、例えば、つぎのようにして行われる。すなわち、基板上の所定位置に複数個の電子部品を搭載した後に、基板上の複数個の電子部品を覆うように電子部品封止用シート状エポキシ樹脂組成物を配置する。電子部品封止用シート状エポキシ樹脂組成物を配置後、所定の封止条件にてシートを熱硬化することにより樹脂封止して、電子部品装置集合体を得る。ついで、電子部品装置集合体の樹脂封止面にダイシングテープを貼り、ダイシングして、個々の電子部品装置を得る。 By using the thus obtained sheet-like epoxy resin composition for sealing electronic components of the present invention, it becomes possible to collectively seal a plurality of electronic components mounted on a substrate. For example, a plurality of electronic components mounted on a substrate are collectively sealed with resin as follows. That is, after mounting a plurality of electronic components at predetermined positions on the substrate, an electronic component sealing sheet-like epoxy resin composition is disposed so as to cover the plurality of electronic components on the substrate. After disposing the sheet-like epoxy resin composition for electronic component sealing, the sheet is heat-cured under predetermined sealing conditions to be resin-sealed to obtain an electronic component device assembly. Next, a dicing tape is applied to the resin sealing surface of the electronic component device assembly, and dicing is performed to obtain individual electronic component devices.
上記封止条件としては、例えば、温度７０〜１２０℃、圧力１００〜５００ｋＰａにて０．５〜５分間プレスを行い、ついで、プレスの圧力を開放して温度１５０〜１９０℃にて３０〜１２０分間加熱することで電子部品封止用シート状エポキシ樹脂組成物を硬化させる。また、電子部品および基板の凹凸形状に対する電子部品封止用シート状エポキシ樹脂組成物の追従性という観点から、上記プレスを真空度５０〜１０００Ｐａの条件下で行うことが好ましい。 As the sealing conditions, for example, pressing is performed for 0.5 to 5 minutes at a temperature of 70 to 120 ° C. and a pressure of 100 to 500 kPa, and then the pressure of the press is released to be 30 to 120 at a temperature of 150 to 190 ° C. The sheet-shaped epoxy resin composition for electronic component sealing is cured by heating for a minute. Moreover, it is preferable to perform the said press on 50 to 1000 Pa conditions from a viewpoint of the followable | trackability of the sheet-like epoxy resin composition for electronic component sealing with respect to the uneven | corrugated shape of an electronic component and a board | substrate.
図１にこのようにして得られる電子部品装置集合体の厚み方向における断面図の一例を示す。電子部品１に設けられた接続用電極３と基板２に設けられた接続用電極（図示せず）が接続された状態で、基板２上に複数個の電子部品１が設置されている。この時、各電子部品１は、その面積や厚み、機能が異なっていてもよい。また、電子部品１と基板２との接続方式については特に限定されるものではなく、接続用電極３として、例えば、金属バンプや半田電極等を用いることができる。そして、基板２上に搭載された複数個の電子部品１を覆うように、電子部品封止用シート状エポキシ樹脂組成物を硬化してなる封止樹脂層４が形成されて電子部品１が封止されており、電子部品１と基板２の間のギャップ５にも樹脂が充填されている。
FIG. 1 shows an example of a cross-sectional view in the thickness direction of the electronic component device assembly thus obtained. A plurality of electronic components 1 are installed on the
つぎに、実施例について比較例と併せて説明する。ただし、本発明は、これら実施例に限定されるものではない。 Next, examples will be described together with comparative examples. However, the present invention is not limited to these examples.
まず、下記に示す各成分を準備した。
〔アセタール基を含有するエポキシ樹脂〕
変性ビスフェノールＡ型エポキシ樹脂（ＤＩＣ株式会社、ＥＰＩＣＬＯＮ ＥＸＡ−４８５０−１５０）
〔エポキシ樹脂ａ〕
トリフェニルメタン型エポキシ樹脂（日本化薬株式会社、ＥＰＰＮ−５０１ＨＹ）
〔エポキシ樹脂ｂ〕
変性ビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン株式会社、ＹＬ７１７５−５００）
〔フェノール樹脂〕
ノボラック型フェノール樹脂（荒川化学工業株式会社、Ｐ−２００）
〔エラストマー〕
アクリル系共重合体（ブチルアクリレート：アクリロニトリル：グリシジルメタクリレート＝８５：８：７重量％からなる共重合体。重量平均分子量８０万）
上記アクリル系共重合体は次のように合成した。ブチルアクリレート、アクリロニトリル、グリシジルメタクリレートを８５：８：７の仕込み重量比率にて、２，２’−アゾビスイソブチロニトリルを重合開始剤に用い、メチルエチルケトン中で窒素気流下、７０℃で５時間と８０℃で1時間のラジカル重合を行うことにより、目的とするアクリル系共重合体を得た。
〔イミダゾール化合物ａ〕
２−フェニル−４，５−ジヒドロキシメチルイミダゾール（式（２）で表される化合物であり、式（１）においてＲ1およびＲ2がメチロール基である。）
First, each component shown below was prepared.
[Epoxy resin containing acetal group]
Modified bisphenol A type epoxy resin (DIC Corporation, EPICLON EXA-4850-150)
[Epoxy resin a]
Triphenylmethane type epoxy resin (Nippon Kayaku Co., Ltd., EPPN-501HY)
[Epoxy resin b]
Modified bisphenol A type epoxy resin (Japan Epoxy Resin Co., Ltd., YL7175-500)
[Phenolic resin]
Novolac type phenolic resin (Arakawa Chemical Industries, Ltd., P-200)
[Elastomer]
Acrylic copolymer (copolymer composed of butyl acrylate: acrylonitrile: glycidyl methacrylate = 85: 8: 7 wt%. Weight average molecular weight 800,000)
The acrylic copolymer was synthesized as follows. Butyl acrylate, acrylonitrile, glycidyl methacrylate in a weight ratio of 85: 8: 7, using 2,2′-azobisisobutyronitrile as a polymerization initiator in methyl ethyl ketone at 70 ° C. in a nitrogen stream for 5 hours And the intended acrylic copolymer was obtained by performing radical polymerization at 80 ° C. for 1 hour.
[Imidazole compound a]
2-Phenyl-4,5-dihydroxymethylimidazole (a compound represented by the formula (2), in which R 1 and R 2 are methylol groups in the formula (1)).
〔イミダゾール化合物ｂ〕
２−フェニル−４−メチル−５−ヒドロキシメチルイミダゾール（式（３）で表される化合物であり、式（１）においてＲ1がメチル基であり、Ｒ2がメチロール基である。）
[Imidazole compound b]
2-phenyl-4-methyl-5-hydroxymethylimidazole (a compound represented by the formula (3), wherein R 1 is a methyl group and R 2 is a methylol group in the formula (1)).
〔イミダゾール化合物ｃ〕
２，４−ジアミノ−６−（２’−ウンデシルイミダゾリル）−エチル−ｓ−トリアジン
〔イミダゾール化合物ｄ〕
２−フェニルイミダゾール
〔イミダゾール化合物以外の硬化促進剤ｅ〕
テトラフェニルホスホニウム・テトラフェニルボレート
〔イミダゾール化合物以外の硬化促進剤ｆ〕
トリフェニルホスフィン
〔無機質充填剤〕
平均粒径０．５μｍの球状溶融シリカ粉末
〔実施例１〜３、比較例１、２〕
〔電子部品封止用シート状エポキシ樹脂組成物の作製〕
表１〜３に示す割合で各成分を分散混合し、これに各成分の合計量と同量のメチルエチルケトンを加えて、塗工用ワニスを調製した。
[Imidazole compound c]
2,4-Diamino-6- (2′-undecylimidazolyl) -ethyl-s-triazine [imidazole compound d]
2-phenylimidazole [curing accelerator e other than imidazole compound]
Tetraphenylphosphonium ・ tetraphenylborate [Curing accelerator other than imidazole compound f]
Triphenylphosphine (inorganic filler)
Spherical fused silica powder having an average particle size of 0.5 μm [Examples 1 to 3, Comparative Examples 1 and 2]
[Production of sheet-like epoxy resin composition for sealing electronic parts]
Each component was dispersed and mixed in the proportions shown in Tables 1 to 3, and the same amount of methyl ethyl ketone as the total amount of each component was added thereto to prepare a coating varnish.
つぎに、上記ワニスを、厚み３８μｍのポリエステルフィルム（三菱樹脂株式会社、ＭＲＦ−３８）の剥離処理面上にコンマコーターにて塗工し、乾燥することにより厚みが５０μｍのシート状エポキシ樹脂組成物を得た。 Next, the varnish is coated on a release-treated surface of a 38 μm thick polyester film (Mitsubishi Resin Co., Ltd., MRF-38) with a comma coater and dried to give a sheet-like epoxy resin composition having a thickness of 50 μm. Got.
ついで、別途用意したポリエステルフィルムの剥離処理面を、シート状エポキシ樹脂組成物に貼り合わせて巻き取った。その後、ポリエステルフィルムを適宜剥離しながら、ロールラミネーターにより上記シート状エポキシ樹脂組成物を１２枚積層することにより、厚み６００μｍの電子部品封止用シート状エポキシ樹脂組成物を得た。
〔保存安定性〕
上記で得られた電子部品封止用シート状エポキシ樹脂組成物の８０℃における粘度を、粘弾性測定装置（レオメトリック社製：ＡＲＥＳ。サンプルサイズ７．９ｍｍφ厚み１ｍｍ、測定周波数１Ｈｚ）により測定した。また、電子部品封止用シート状エポキシ樹脂組成物を２０℃で３０日間保存した後に、同様にして８０℃における粘度を測定し、保存前後での粘度の変化率が１００％未満のものを◎、１００％〜５００％のものを○、それ以外のものを×として評価した。
〔電子部品装置集合体の作製〕
電子部品として厚み５００μｍの積層セラミックコンデンサ（以下、単にコンデンサという）を碁盤目状に１万個配列設置した縦１５０ｍｍ、横１５０ｍｍ、厚み３００μｍのガラス−エポキシ（ＦＲ−４）基板を準備し、上記で得られた厚み６００μｍの電子部品封止用シート状エポキシ樹脂組成物（縦１５０ｍｍ、横１５０ｍｍにカットしたもの）を基板上の全てのコンデンサを覆うように配置した。配置した電子部品封止用シート状エポキシ樹脂組成物を、真空下（０．１ｋＰａ）、温度８０℃、圧力１０００ｋＰａでプレスすることにより、コンデンサおよび基板とに接着した。ついで、プレスの圧力を解放し、電子部品封止用シート状エポキシ樹脂組成物を熱硬化（１５０℃、１時間）させてコンデンサを封止し、常温まで自然冷却させることによりコンデンサ装置集合体を得た。
〔反り評価〕
上記で得られたコンデンサ装置集合体について、最大反り量をティーテック社製レーザー３次元測定装置ＬＳ２２０−ＭＴ５０で計測して、反り量が５ｍｍ未満のものを○、５ｍｍ以上のものを×として評価した。なお、５ｍｍ以上であると、コンデンサ装置の特性劣化が見られるとともに、その後の製造工程において搬送、吸着エラーを発生しやすくなる。
〔狭ギャップ充填性〕
上記で得られたコンデンサ装置集合体を、ダイシングして個片状のコンデンサ装置を得た。得られたコンデンサ装置の断面観察を行い、コンデンサ底部とガラス−エポキシ基板表面との間のギャップ（高さ約３０μｍ）に、樹脂が充填されているかどうかを確認した。ギャップ部分が樹脂で完全に充填されていたものを○、未充填部分があったものを×として評価した。
Subsequently, the release treatment surface of the separately prepared polyester film was bonded to the sheet-like epoxy resin composition and wound up. Thereafter, 12 sheets of the sheet-like epoxy resin composition were laminated with a roll laminator while appropriately peeling the polyester film to obtain a sheet-like epoxy resin composition for sealing an electronic component having a thickness of 600 μm.
[Storage stability]
The viscosity at 80 ° C. of the sheet-shaped epoxy resin composition for electronic component sealing obtained above was measured with a viscoelasticity measuring device (Rheometric Co., Ltd .: ARES. Sample size 7.9 mmφ thickness 1 mm, measurement frequency 1 Hz). . Further, after storing the sheet-like epoxy resin composition for electronic component sealing at 20 ° C. for 30 days, the viscosity at 80 ° C. was measured in the same manner, and the viscosity change rate before and after storage was less than 100%. 100% to 500% were evaluated as ◯, and the others were evaluated as ×.
[Production of electronic device assembly]
As an electronic component, a glass-epoxy (FR-4) substrate having a length of 150 mm, a width of 150 mm, and a thickness of 300 μm in which 10,000 ceramic multilayer capacitors (hereinafter simply referred to as capacitors) are arranged in a grid pattern is prepared. The sheet-shaped epoxy resin composition for sealing an electronic component obtained in (1) was placed so as to cover all the capacitors on the substrate (cut in 150 mm length and 150 mm width). The placed sheet-shaped epoxy resin composition for encapsulating electronic components was bonded to the capacitor and the substrate by pressing under vacuum (0.1 kPa) at a temperature of 80 ° C. and a pressure of 1000 kPa. Next, the pressure of the press is released, the sheet-shaped epoxy resin composition for electronic component sealing is thermally cured (150 ° C., 1 hour), the capacitor is sealed, and the capacitor device assembly is naturally cooled to room temperature. Obtained.
[Curve evaluation]
About the capacitor | condenser apparatus aggregate | assembly obtained above, the largest amount of curvature is measured with the laser three-dimensional measuring apparatus LS220-MT50 made from a tea tech company, and the thing with less than 5 mm of curvature amount is evaluated as (circle) and 5 mm or more as x. did. In addition, when it is 5 mm or more, characteristic deterioration of the capacitor device is observed, and conveyance and suction errors are likely to occur in the subsequent manufacturing process.
(Narrow gap filling)
The capacitor device assembly obtained above was diced to obtain individual capacitor devices. Cross section observation of the obtained capacitor | condenser apparatus was performed, and it was confirmed whether resin was filled into the gap (about 30 micrometers in height) between a capacitor | condenser bottom part and the glass-epoxy board | substrate surface. The case where the gap portion was completely filled with the resin was evaluated as ◯, and the case where there was an unfilled portion was evaluated as ×.
上記の結果、実施例品は、大面積を封止しても基板の反りを抑制していた。また、特定の構造を有するイミダゾール化合物（Ｅ成分）を用いた実施例１および２ならびに５〜７は、保存安定性にも特に優れていた。 As a result, the example product suppressed the warpage of the substrate even when the large area was sealed. In addition, Examples 1 and 2 and 5 to 7 using an imidazole compound (E component) having a specific structure were particularly excellent in storage stability.
これに対して、イミダゾール化合物（Ｅ成分）を用いなかった比較例１および２、ならびにエラストマー（Ｃ成分）の含有量が１５重量％未満である比較例３は、大面積を封止した場合には樹脂封止後の基板の反りが大きく、搬送トラブルや電子部品装置の特性に影響を与えることが予想される。また、エラストマー（Ｃ成分）の含有量が３０重量％超である比較例４は、狭ギャップ充填性に劣っていた。さらに、アセタール基を含有するエポキシ樹脂（Ａ成分）を用いなかった比較例５についても、狭ギャップ充填性に劣っていた。 In contrast, Comparative Examples 1 and 2 in which no imidazole compound (E component) was used, and Comparative Example 3 in which the content of the elastomer (C component) was less than 15% by weight were used when sealing a large area. Has a large warpage of the substrate after resin sealing, and it is expected to affect conveyance troubles and characteristics of the electronic component device. Moreover, the comparative example 4 whose content of an elastomer (C component) is more than 30 weight% was inferior to narrow gap filling property. Furthermore, the comparative example 5 which did not use the epoxy resin (A component) containing an acetal group was also inferior in narrow gap filling property.
１ 電子部品
２ 基板
３ 電子部品の接続用電極部
４ 封止樹脂層
５ ギャップ部分
DESCRIPTION OF SYMBOLS 1
Claims (5)
Ａ：アセタール基を含有するエポキシ樹脂
Ｂ：フェノール樹脂
Ｃ：エラストマー
Ｄ：無機質充填剤
Ｅ：イミダゾール化合物 Electronic component encapsulating, which is a sheet-like epoxy resin composition for encapsulating electronic components, and contains the following components A to E, and the content of component C is 15 to 30% by weight of the entire sheet-like epoxy resin composition A sheet-like epoxy resin composition for stopping.
A: Epoxy resin containing acetal group B: Phenol resin C: Elastomer D: Inorganic filler E: Imidazole compound
An electronic component device obtained by dicing the electronic component device assembly according to claim 4.
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