JP5227915B2 - Electronic component device assembly and manufacturing method thereof - Google Patents
Electronic component device assembly and manufacturing method thereof Download PDFInfo
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- JP5227915B2 JP5227915B2 JP2009182560A JP2009182560A JP5227915B2 JP 5227915 B2 JP5227915 B2 JP 5227915B2 JP 2009182560 A JP2009182560 A JP 2009182560A JP 2009182560 A JP2009182560 A JP 2009182560A JP 5227915 B2 JP5227915 B2 JP 5227915B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
本発明は、電子部品装置集合体およびその製造方法に関する。 The present invention relates to an electronic component device assembly and a manufacturing method thereof.
半導体素子、コンデンサ等の電子部品を実装基板上に実装した電子部品装置は、一般に、複数個の電子部品を実装基板上に実装した電子部品装置集合体を作製した後に、得られた電子部品装置集合体を、ダイシングにより個々の電子部品装置に分断するという方法により製造されている。 An electronic component device in which electronic components such as semiconductor elements and capacitors are mounted on a mounting substrate is generally obtained after an electronic component device assembly in which a plurality of electronic components are mounted on a mounting substrate is manufactured. The assembly is manufactured by a method of dividing the assembly into individual electronic component devices by dicing.
従来、上記電子部品装置集合体における電子部品の封止は、液状エポキシ樹脂組成物によるポッティングにより行われ、ついで、実装基板上の封止樹脂がない領域に形成されたアライメントマークにより電子部品装置の位置を認識して、ダイシングしている。（特許文献１）。 Conventionally, the sealing of electronic components in the electronic component device assembly is performed by potting with a liquid epoxy resin composition, and then the alignment mark formed in the region without the sealing resin on the mounting substrate is used. The position is recognized and dicing is performed. (Patent Document 1).
しかし、ポッティングによる封止では、用いる液状樹脂組成物が流出して実装基板上のアライメントマークを覆い、ダイシングに支障が生じやすかった。このため、実装基板上の電子部品の周囲にダム材等を設置することにより、樹脂組成物の流出を防止することが考えられるが、製造工程が複雑になるために生産効率が低下する。 However, in sealing by potting, the liquid resin composition to be used flows out, covers the alignment mark on the mounting substrate, and dicing is liable to occur. For this reason, it is conceivable to prevent the resin composition from flowing out by installing a dam material or the like around the electronic component on the mounting substrate. However, the production process is complicated, so that the production efficiency is lowered.
本発明はこのような事情に鑑みなされたもので、アライメントマークを使用しなくても精度良くダイシングできる電子部品装置集合体およびその製造方法の提供を目的とする。 The present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component device assembly that can be diced with high accuracy without using an alignment mark, and a method for manufacturing the same.
上記の問題を解決するために、本発明は、実装基板上に設置された複数個の電子部品を封止材料で封止してなる電子部品装置集合体であって、
前記電子部品の周端部上において、前記封止材料がその厚み方向に隆起して凸状部を形成していることを特徴としている。
In order to solve the above problems, the present invention is an electronic component device assembly formed by sealing a plurality of electronic components installed on a mounting substrate with a sealing material,
On the peripheral edge part of the said electronic component, the said sealing material protrudes in the thickness direction, It is characterized by the above-mentioned.
また、本発明は、実装基板上に設置された複数個の電子部品をエポキシ樹脂組成物の硬化体で封止してなる電子部品装置集合体の製造方法であって、
実装基板上に電子部品を設置する工程、
シート状エポキシ樹脂組成物を、前記電子部品を覆うように前記実装基板上に設置する工程、
前記シート状エポキシ樹脂組成物を、温度６０〜１２０℃、圧力１００〜２０００ｋＰａでプレスすることにより、前記電子部品および実装基板と接着する工程、
前記シート状エポキシ樹脂組成物を、プレスの圧力を解放し、温度１００〜２００℃で熱硬化することにより、前記電子部品の周端部上において前記シート状エポキシ樹脂組成物の硬化体がその厚み方向に隆起して凸状部を形成するように前記電子部品を封止する工程、
を含むことを特徴としている。
Further, the present invention is a method for manufacturing an electronic component device assembly formed by sealing a plurality of electronic components installed on a mounting substrate with a cured epoxy resin composition,
The process of installing electronic components on the mounting board,
Installing the sheet-like epoxy resin composition on the mounting substrate so as to cover the electronic component;
Bonding the electronic component and the mounting substrate by pressing the sheet-like epoxy resin composition at a temperature of 60 to 120 ° C. and a pressure of 100 to 2000 kPa;
The sheet-like epoxy resin composition is released from the press pressure and thermally cured at a temperature of 100 to 200 ° C., so that the cured body of the sheet-like epoxy resin composition has a thickness on the peripheral edge of the electronic component. Sealing the electronic component so as to protrude in the direction to form a convex portion,
It is characterized by including.
本発明の電子部品装置集合体は、電子部品の周端部上において、封止材料がその厚み方向に隆起して凸状部を形成しているため、その凸状部の位置を基準にしてダイシングすることができる。したがって、従来のようにアライメントマークを使用しなくても精度良くダイシングすることができる。 In the electronic component device assembly of the present invention, the sealing material bulges in the thickness direction on the peripheral end portion of the electronic component to form a convex portion, so that the position of the convex portion is used as a reference. Can be diced. Therefore, dicing can be performed with high accuracy without using an alignment mark as in the prior art.
また、本発明の電子部品装置集合体の製造方法は、上記の電子部品装置集合体を簡便かつ歩留まり良く得ることができる。 Moreover, the manufacturing method of the electronic component device assembly of the present invention can obtain the above-described electronic component device assembly simply and with a high yield.
つぎに、本発明の実施の形態について詳しく説明する。 Next, embodiments of the present invention will be described in detail.
本発明の電子部品装置集合体は、実装基板上に設置された複数個の電子部品を封止材料で封止してなり、かつ前記電子部品の周端部上において、前記封止材料がその厚み方向に隆起して凸状部を形成している。 The electronic component device assembly of the present invention is formed by sealing a plurality of electronic components installed on a mounting substrate with a sealing material, and the sealing material is formed on the peripheral edge of the electronic component. It protrudes in the thickness direction to form a convex portion.
図１に本発明の電子部品装置集合体の厚み方向における断面図の一例を示す。電子部品１に設けられた接続用電極３と実装基板２に設けられた接続用電極（図示せず）が接続された状態で、実装基板２上に複数個の電子部品１が設置されている。この時、電子部品１は、その面積や厚み、機能が異なっていてもよい。また、電子部品１と実装基板２との接続方式については特に限定されるものではなく、接続用電極３として、例えば、金属バンプや半田電極等を用いることができる。そして、実装基板２上に搭載された電子部品１を覆うように、封止材料からなる封止樹脂層４が形成されて電子部品１が封止されており、かつ封止樹脂層４は、電子部品１の周端部上でその厚み方向に隆起して凸状部を形成している。このとき、凸状部の高さ５は２５〜２００μｍであることが好ましい。２５μｍ未満では、ダイシング工程において電子部品の視認性が低下する傾向がみられ、２００μｍを超えると、ダイシング後、電子部品装置のピックアップや搬送にトラブルが起こりやすくなる。なお、凸状部の高さは、封止材料の組成、電子部品１の接着時または封止時の温度および圧力等を適宜変化させることにより、調整することができる。
FIG. 1 shows an example of a cross-sectional view in the thickness direction of an electronic component device assembly of the present invention. A plurality of electronic components 1 are installed on the
上記封止材料としては、エポキシ樹脂組成物、ポリイミド樹脂組成物およびシリコーン樹脂組成物等、封止材料として従来用いられるものが適用可能であるが、低コストで信頼性の高い封止樹脂層が得られるという観点から、エポキシ樹脂組成物が好ましく用いられる。 As the sealing material, those conventionally used as sealing materials such as epoxy resin compositions, polyimide resin compositions, and silicone resin compositions can be applied. However, a low-cost and highly reliable sealing resin layer can be used. From the viewpoint of being obtained, an epoxy resin composition is preferably used.
上記エポキシ樹脂組成物としては、下記Ａ〜Ｄ成分を含み、かつＣ成分がエポキシ樹脂組成物全体の５〜４０重量％であることが好ましい。
Ａ：エポキシ樹脂
Ｂ：フェノール樹脂
Ｃ：エラストマー
Ｄ：無機質充填剤
エポキシ樹脂（Ａ成分）としては、特に限定されるものではない。例えば、トリフェニルメタン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、変性ビスフェノールＡ型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、変性ビスフェノールＦ型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、フェノキシ樹脂等の各種のエポキシ樹脂を用いることができる。これらエポキシ樹脂は単独で用いてもよいし２種以上併用してもよい。エポキシ樹脂の反応性およびエポキシ樹脂組成物の硬化体の靭性を確保する観点からは、エポキシ当量１５０〜２５０、軟化点もしくは融点が５０〜１３０℃の常温で固形のものが好ましく、中でも、信頼性の観点から、トリフェニルメタン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂が好ましい。また、低応力性の観点から、アセタール基やポリオキシアルキレン基等の柔軟性骨格を有する変性ビスフェノールＡ型エポキシ樹脂が好ましく、アセタール基を有する変性ビスフェノールＡ型エポキシ樹脂は、液体状で取り扱い性が良いことから、特に好適に用いることができる。
As said epoxy resin composition, it is preferable that the following AD component is included and C component is 5 to 40 weight% of the whole epoxy resin composition.
A: Epoxy resin B: Phenol resin C: Elastomer D: Inorganic filler The epoxy resin (component A) is not particularly limited. For example, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene type Various epoxy resins such as an epoxy resin, a phenol novolac type epoxy resin, and a phenoxy resin can be used. These epoxy resins may be used alone or in combination of two or more. From the viewpoint of ensuring the reactivity of the epoxy resin and the toughness of the cured product of the epoxy resin composition, an epoxy equivalent of 150 to 250, a softening point or a melting point of 50 to 130 ° C., solid is preferable, and among them, reliability In view of the above, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, and biphenyl type epoxy resin are preferable. Also, from the viewpoint of low stress, a modified bisphenol A type epoxy resin having a flexible skeleton such as an acetal group or a polyoxyalkylene group is preferable, and a modified bisphenol A type epoxy resin having an acetal group is liquid and easy to handle. Since it is good, it can be used particularly preferably.
エポキシ樹脂（Ａ成分）の含有量は、エポキシ樹脂組成物全体に対して３〜２０重量％の範囲に設定することが好ましい。 The content of the epoxy resin (component A) is preferably set in the range of 3 to 20% by weight with respect to the entire epoxy resin composition.
フェノール樹脂（Ｂ成分）は、エポキシ樹脂（Ａ成分）との間で硬化反応を生起するものであれば特に限定されるものではない。例えば、フェノールノボラック樹脂、フェノールアラルキル樹脂、ビフェニルアラルキル樹脂、ジシクロペンタジエン型フェノール樹脂、クレゾールノボラック樹脂、レゾール樹脂等が用いられる。これらフェノール樹脂は単独で用いてもよいし、２種以上併用してもよい。エポキシ樹脂（Ａ成分）との反応性の観点から、水酸基当量が７０〜２５０、軟化点が５０〜１１０℃のものを用いることが好ましく、中でも硬化反応性が高いという観点から、フェノールノボラック樹脂を好適に用いることができる。また、信頼性の観点から、フェノールアラルキル樹脂やビフェニルアラルキル樹脂のような低吸湿性のものを好適に用いることができる。 The phenol resin (component B) is not particularly limited as long as it causes a curing reaction with the epoxy resin (component A). For example, a phenol novolak resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resole resin, or the like is used. These phenolic resins may be used alone or in combination of two or more. From the viewpoint of reactivity with the epoxy resin (component A), it is preferable to use those having a hydroxyl group equivalent of 70 to 250 and a softening point of 50 to 110 ° C. It can be used suitably. From the viewpoint of reliability, low hygroscopic materials such as phenol aralkyl resins and biphenyl aralkyl resins can be suitably used.
そして、エポキシ樹脂（Ａ成分）とフェノール樹脂（Ｂ成分）の配合割合は、硬化反応性という観点から、エポキシ樹脂（Ａ成分）中のエポキシ基１当量に対して、フェノール樹脂（Ｂ成分）中の水酸基の合計が０．７〜１．５当量となるように配合することが好ましく、より好ましくは０．９〜１．２当量である。 And the compounding ratio of an epoxy resin (A component) and a phenol resin (B component) is a phenol resin (B component) with respect to 1 equivalent of epoxy groups in an epoxy resin (A component) from a viewpoint of hardening reactivity. It is preferable to mix | blend so that the sum total of a hydroxyl group may be 0.7-1.5 equivalent, More preferably, it is 0.9-1.2 equivalent.
エポキシ樹脂（Ａ成分）およびフェノール樹脂（Ｂ成分）とともに用いられるエラストマー（Ｃ成分）は、エポキシ樹脂組成物に柔軟性および可撓性を付与するものであり、このような作用を奏するものであれば特にその構造を限定するものではない。例えば、ポリアクリル酸エステル等の各種アクリル系共重合体、スチレンアクリレート系共重合体、ブタジエンゴム、スチレン−ブタジエンゴム（ＳＢＲ）、エチレン−酢酸ビニルコポリマー（ＥＶＡ）、イソプレンゴム、アクリロニトリルゴム等のゴム質重合体を用いることができる。中でも、エポキシ樹脂（Ａ成分）へ分散させやすく、またエポキシ樹脂（Ａ成分）との反応性も高いために、得られるエポキシ樹脂組成物の耐熱性や強度を向上させることができるという観点から、アクリル系共重合体を用いることが好ましい。これらは単独で用いてもよいし、２種以上併せて用いてもよい。アクリル系共重合体は、例えば、所定の混合比にしたアクリルモノマー混合物を、常法によってラジカル重合することにより合成することができる。ラジカル重合の方法としては、有機溶剤を溶媒に行う溶液重合法や、水中に原料モノマーを分散させながら重合を行う懸濁重合法が用いられる。その際に用いる重合開始剤としては、例えば、２，２’−アゾビスイソブチロニトリル、２，２’−アゾビス−（２，４−ジメチルバレロニトリル）、２，２’−アゾビス−４−メトキシ−２，４−ジメチルバレロニトリル、その他のアゾ系またはジアゾ系重合開始剤、ベンゾイルパーオキサイドおよびメチルエチルケトンパーオキサイド等の過酸化物系重合開始剤等が用いられる。なお、懸濁重合の場合は、例えばポリアクリルアミド、ポリビニルアルコールのような分散剤を加えることが望ましい。 The elastomer (component C) used together with the epoxy resin (component A) and the phenol resin (component B) imparts flexibility and flexibility to the epoxy resin composition, and has such an effect. The structure is not particularly limited. For example, various acrylic copolymers such as polyacrylates, styrene acrylate copolymers, butadiene rubber, styrene-butadiene rubber (SBR), ethylene-vinyl acetate copolymer (EVA), isoprene rubber, acrylonitrile rubber, etc. Polymers can be used. Among them, from the viewpoint that it is easy to disperse in the epoxy resin (component A) and the reactivity with the epoxy resin (component A) is high, so that the heat resistance and strength of the resulting epoxy resin composition can be improved. It is preferable to use an acrylic copolymer. These may be used alone or in combination of two or more. The acrylic copolymer can be synthesized, for example, by radical polymerization of an acrylic monomer mixture having a predetermined mixing ratio by a conventional method. As a method for radical polymerization, a solution polymerization method in which an organic solvent is used as a solvent or a suspension polymerization method in which polymerization is performed while dispersing raw material monomers in water are used. As a polymerization initiator used in that case, for example, 2,2′-azobisisobutyronitrile, 2,2′-azobis- (2,4-dimethylvaleronitrile), 2,2′-azobis-4- Methoxy-2,4-dimethylvaleronitrile, other azo or diazo polymerization initiators, peroxide polymerization initiators such as benzoyl peroxide and methyl ethyl ketone peroxide are used. In the case of suspension polymerization, it is desirable to add a dispersing agent such as polyacrylamide or polyvinyl alcohol.
エラストマー（Ｃ成分）の含有量は、好ましくはエポキシ樹脂組成物全体の５〜４０重量％であり、より好ましくは１０〜３５重量％、さらに好ましくは１５〜３０重量％である。エラストマー（Ｃ成分）の含有量が５重量％未満では、エポキシ樹脂組成物の柔軟性および可撓性を得るのが困難となるとともに、電子部品の周端部上にある樹脂組成物の硬化体が凸状に形成されにくい傾向がみられ、４０重量％を超えると、エポキシ樹脂組成物の溶融粘度が高くなるために、電子部品と実装基板の間のギャップに樹脂が充填されにくくなるとともに、エポキシ樹脂組成物の硬化体の強度が不足する傾向がみられ、耐熱性が低下する傾向もみられる。さらには、電子部品の周端部上にある樹脂組成物の硬化体が凸状に形成されるが、凸部の段差が大きくなりすぎるために、ダイシング後の電子部品装置のピックアップや搬送に支障が生じる場合がある。 The content of the elastomer (component C) is preferably 5 to 40% by weight of the entire epoxy resin composition, more preferably 10 to 35% by weight, and still more preferably 15 to 30% by weight. When the content of the elastomer (component C) is less than 5% by weight, it becomes difficult to obtain the flexibility and flexibility of the epoxy resin composition, and the cured product of the resin composition on the peripheral edge of the electronic component Tends to be difficult to form in a convex shape, and when it exceeds 40% by weight, the melt viscosity of the epoxy resin composition becomes high, so that it becomes difficult to fill the gap between the electronic component and the mounting substrate, and There is a tendency that the strength of the cured product of the epoxy resin composition is insufficient, and there is also a tendency that the heat resistance is lowered. Furthermore, although the cured body of the resin composition on the peripheral edge of the electronic component is formed in a convex shape, the step of the convex portion becomes too large, which hinders pick-up and transportation of the electronic component device after dicing. May occur.
無機質充填剤（Ｄ成分）は、特に限定されるものではなく、従来公知の各種充填剤を用いることができる。例えば、石英ガラス、タルク、シリカ（溶融シリカや結晶性シリカ等）、アルミナ、窒化アルミニウム、窒化珪素等の粉末が挙げられる。これらは単独で用いてもよいし、２種以上併用してもよい。中でも、エポキシ樹脂組成物の硬化体の熱線膨張係数が低減することにより内部応力を低減し、その結果、封止後の基板の反りを抑制できるという点から、シリカ粉末を用いることが好ましく、シリカ粉末の中でも溶融シリカ粉末を用いることがより好ましい。溶融シリカ粉末としては、球状溶融シリカ粉末、破砕溶融シリカ粉末が挙げられるが、流動性という観点から、球状溶融シリカ粉末を用いることが特に好ましい。中でも、平均粒径が０．１〜３０μｍの範囲のものを用いることが好ましく、０．３〜１５μｍの範囲のものを用いることが特に好ましい。なお、平均粒径は、例えば、母集団から任意に抽出される試料を用い、レーザー回折散乱式粒度分布測定装置を用いて測定することにより導き出すことができる。 The inorganic filler (component D) is not particularly limited, and various conventionally known fillers can be used. Examples thereof include powders of quartz glass, talc, silica (such as fused silica and crystalline silica), alumina, aluminum nitride, silicon nitride and the like. These may be used alone or in combination of two or more. Among them, it is preferable to use silica powder from the viewpoint that the internal stress is reduced by reducing the thermal linear expansion coefficient of the cured product of the epoxy resin composition, and as a result, the warpage of the substrate after sealing can be suppressed. Among the powders, it is more preferable to use fused silica powder. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder. From the viewpoint of fluidity, it is particularly preferable to use a spherical fused silica powder. Among them, those having an average particle size in the range of 0.1 to 30 μm are preferably used, and those having a range of 0.3 to 15 μm are particularly preferable. The average particle diameter can be derived, for example, by using a sample arbitrarily extracted from the population and measuring it using a laser diffraction / scattering particle size distribution measuring apparatus.
無機質充填剤（Ｄ成分）の含有量は、好ましくはエポキシ樹脂組成物全体の５０〜８０重量％であり、より好ましくは５５〜７５重量％であり、さらに好ましくは６０〜７０重量％である。すなわち、無機質充填剤（Ｄ成分）の含有量が５０重量％未満では、エポキシ樹脂組成物の硬化体の線膨張係数が大きくなるために、硬化体の反りが大きくなる傾向がみられる。一方、８０重量％を超えると、エポキシ樹脂組成物の柔軟性や流動性が悪くなるために、電子部品や実装基板との接着性が低下する傾向がみられる。 Content of an inorganic filler (D component) becomes like this. Preferably it is 50 to 80 weight% of the whole epoxy resin composition, More preferably, it is 55 to 75 weight%, More preferably, it is 60 to 70 weight%. That is, when the content of the inorganic filler (component D) is less than 50% by weight, the linear expansion coefficient of the cured product of the epoxy resin composition increases, and thus the warpage of the cured product tends to increase. On the other hand, when it exceeds 80% by weight, the flexibility and fluidity of the epoxy resin composition are deteriorated, so that the adhesiveness with an electronic component or a mounting substrate tends to be lowered.
なお、本発明において、上記エポキシ樹脂組成物には、上記成分以外にも必要に応じて、硬化促進剤、難燃剤、カーボンブラックをはじめとする顔料等、他の添加剤を適宜配合することができる。 In the present invention, the epoxy resin composition may contain other additives such as a curing accelerator, a flame retardant, and a pigment such as carbon black as needed in addition to the above components. it can.
本発明の電子部品装置集合体は、以下に示す製造工程によって簡便かつ歩留まり良く得ることができる。 The electronic component device assembly of the present invention can be obtained simply and with a good yield by the following manufacturing process.
まず、実装基板上に電子部品を、実装基板の接続用電極部と電子部品の接続用電極部が接続するように設置する。 First, the electronic component is installed on the mounting substrate so that the connection electrode portion of the mounting substrate and the connection electrode portion of the electronic component are connected.
シート状エポキシ樹脂組成物を、電子部品を覆うように実装基板上に設置する。その際、０．１〜１ｋＰａに減圧すると、ボイドが生じにくくなるので好ましい。 The sheet-like epoxy resin composition is placed on the mounting substrate so as to cover the electronic component. At that time, it is preferable to reduce the pressure to 0.1 to 1 kPa because voids are less likely to occur.
ついで、シート状エポキシ樹脂組成物を、温度６０〜１２０℃、圧力１００〜２０００ｋＰａでプレスすることにより、電子部品および実装基板と接着する。より好ましい温度は７０〜１１０℃であり、さらに好ましくは８０〜１００℃である。より好ましい圧力は１００〜１０００ｋＰａ、さらに好ましくは１００〜５００ｋＰａである。温度が６０℃未満では、シート状エポキシ樹脂組成物の実装基板および電子部品に対する密着性が不十分となる場合があり、１２０℃を超えると、溶融したシート状エポキシ樹脂組成物が流出することにより、実装基板側面や底面の汚染や電子部品上面の露出が起こる場合があるためである。圧力が１００ｋＰａ未満では、エポキシ樹脂組成物の十分な密着性、凹凸追従性が得られない場合があり、２０００ｋＰａを超えると、エポキシ樹脂組成物が流出することにより、実装基板側面や底面の汚染や電子部品上面の露出が起こる場合があるためである。また、プレス時間は０．５〜５分が好ましい。プレス時間が０．５分未満であるとエポキシ樹脂組成物の十分な密着性が得られにくく、５分を超えると生産性が低下するためである。プレスの際、電子部品および実装基板の凹凸形状に対するシート状エポキシ樹脂組成物の追従性および密着性を向上させるため、真空条件下で加圧することが好ましい。真空条件としては、真空度が０．０６〜０．６ｋＰａであることが好ましい。０．０６ｋＰａ未満では、真空到達までに時間を要するため生産効率が悪く、０．６ｋＰａを超えると、シート状エポキシ樹脂組成物と実装基板および電子部品との界面に剥離を生じやすくなるためである。 Next, the sheet-like epoxy resin composition is pressed at a temperature of 60 to 120 ° C. and a pressure of 100 to 2000 kPa to adhere to the electronic component and the mounting substrate. A more preferable temperature is 70 to 110 ° C, and further preferably 80 to 100 ° C. A more preferable pressure is 100 to 1000 kPa, and more preferably 100 to 500 kPa. When the temperature is less than 60 ° C., the adhesion of the sheet-like epoxy resin composition to the mounting substrate and the electronic component may be insufficient, and when it exceeds 120 ° C., the molten sheet-like epoxy resin composition flows out. This is because the side surface or bottom surface of the mounting substrate may be contaminated or the top surface of the electronic component may be exposed. If the pressure is less than 100 kPa, sufficient adhesion and unevenness followability of the epoxy resin composition may not be obtained. If the pressure exceeds 2000 kPa, the epoxy resin composition will flow out, causing contamination on the side surface and bottom surface of the mounting substrate. This is because the upper surface of the electronic component may be exposed. The pressing time is preferably 0.5 to 5 minutes. This is because if the pressing time is less than 0.5 minutes, sufficient adhesion of the epoxy resin composition is difficult to obtain, and if it exceeds 5 minutes, the productivity decreases. During pressing, it is preferable to apply pressure under vacuum conditions in order to improve the followability and adhesion of the sheet-like epoxy resin composition to the uneven shape of the electronic component and the mounting substrate. As vacuum conditions, the degree of vacuum is preferably 0.06 to 0.6 kPa. If it is less than 0.06 kPa, it takes time to reach the vacuum, so the production efficiency is poor, and if it exceeds 0.6 kPa, peeling tends to occur at the interface between the sheet-like epoxy resin composition, the mounting substrate and the electronic component. .
最後に、シート状エポキシ樹脂組成物を、プレスの圧力から解放し、温度１００〜２００℃で熱硬化することにより、電子部品の周端部上において、シート状エポキシ樹脂組成物の硬化体がその厚み方向に隆起して凸状部を有する封止樹脂層を形成し、電子部品装置集合体（図１）を得る。より好ましい熱硬化の温度は１３０〜１９０℃であり、さらに好ましくは１５０〜１８０℃である。温度が１００℃未満ではエポキシ樹脂組成物の熱硬化が進みにくく、２００℃を超えた場合は硬化物の熱劣化が起こる可能性があるためである。また、速やかにかつ完全に熱硬化を進行させるため、加熱時間は３０〜１２０分であることが好ましい。また、上記熱硬化は、大気圧下で行うことが可能である。 Finally, the sheet-like epoxy resin composition is released from the pressure of the press and thermally cured at a temperature of 100 to 200 ° C., so that a cured body of the sheet-like epoxy resin composition is formed on the peripheral edge of the electronic component. A sealing resin layer that protrudes in the thickness direction and has a convex portion is formed, and an electronic component device assembly (FIG. 1) is obtained. A more preferable thermosetting temperature is 130 to 190 ° C, and further preferably 150 to 180 ° C. This is because if the temperature is less than 100 ° C., it is difficult for the epoxy resin composition to be thermally cured, and if it exceeds 200 ° C., the cured product may be thermally deteriorated. Moreover, in order to advance thermosetting rapidly and completely, it is preferable that heating time is 30 to 120 minutes. Moreover, the said thermosetting can be performed under atmospheric pressure.
なお、電子部品の周端部上において、シート状エポキシ樹脂組成物が、硬化時にその厚み方向に隆起して凸状部を形成する理由は定かではないが、つぎのように推測している。シート状エポキシ樹脂組成物を、温度６０〜１２０℃、圧力１００〜２０００ｋＰａでプレスして電子部品および実装基板と接着した際に、電子部品の周端部上において、シート状エポキシ樹脂組成物に応力が発生し、ついで、プレスの圧力を解放し、温度１００〜２００℃で熱硬化した際に、先に発生した応力が開放されることにより、シート状エポキシ樹脂組成物の硬化体がその厚み方向に隆起して凸状部を形成すると推測している。 The reason why the sheet-like epoxy resin composition bulges in the thickness direction at the time of curing to form a convex portion on the peripheral end portion of the electronic component is not clear, but is estimated as follows. When a sheet-like epoxy resin composition is pressed at a temperature of 60 to 120 ° C. and a pressure of 100 to 2000 kPa and bonded to an electronic component and a mounting substrate, stress is applied to the sheet-like epoxy resin composition on the peripheral edge of the electronic component. Then, when the pressure of the press is released and thermosetting is performed at a temperature of 100 to 200 ° C., the previously generated stress is released, so that the cured body of the sheet-like epoxy resin composition is in the thickness direction. It is presumed that it protrudes to form a convex part.
また、本発明の電子部品装置集合体の製造方法に用いるシート状エポキシ樹脂組成物は、たとえば以下のようにして製造することができる。 Moreover, the sheet-like epoxy resin composition used for the manufacturing method of the electronic component apparatus assembly of this invention can be manufactured as follows, for example.
まず、各配合成分を混合することによりエポキシ樹脂組成物を調製するが、各配合成分が均一に分散混合される方法であれば特に限定するものではない。たとえば、各配合成分を有機溶剤等に溶解または分散したワニスを塗工してシート状に形成する。あるいは、各配合成分を直接ニーダー等で混練することにより固形樹脂組成物を調製し、このようにして得られた固形樹脂組成物を押し出してシート状に形成してもよい。簡便に均一な厚みのシートを得ることができるという点から、上記ワニス塗工を用いることが好ましい。 First, an epoxy resin composition is prepared by mixing each compounding component, but there is no particular limitation as long as each compounding component is uniformly dispersed and mixed. For example, a varnish in which each compounding component is dissolved or dispersed in an organic solvent or the like is applied to form a sheet. Alternatively, a solid resin composition may be prepared by directly kneading each compounding component with a kneader or the like, and the solid resin composition thus obtained may be extruded to form a sheet. It is preferable to use the varnish coating because a sheet having a uniform thickness can be easily obtained.
より具体的には、上記Ａ〜Ｄ成分および必要に応じて他の添加剤を常法に準じて適宜混合し、有機溶剤に均一に溶解あるいは分散させ、ワニスを調製する。ついで、上記ワニスをポリエステル等の基材上に塗布し乾燥させることによりシート状エポキシ樹脂組成物を得ることができる。そして必要により、シート状エポキシ樹脂組成物の表面を保護するためにポリエステルフィルム等の剥離シートを貼り合わせてもよい。剥離シートは封止時に剥離する。 More specifically, the above-mentioned components A to D and other additives as necessary are appropriately mixed according to a conventional method, and uniformly dissolved or dispersed in an organic solvent to prepare a varnish. Subsequently, the sheet-like epoxy resin composition can be obtained by applying the varnish on a substrate such as polyester and drying it. And if necessary, in order to protect the surface of a sheet-like epoxy resin composition, you may bond together peeling sheets, such as a polyester film. The release sheet peels at the time of sealing.
上記有機溶剤としては、特に限定するものではなく従来公知の各種有機溶剤、例えばメチルエチルケトン、アセトン、シクロヘキサノン、ジオキサン、ジエチルケトン、トルエン、酢酸エチル等を用いることができる。これらは単独で用いてもよいし、２種以上併せて用いてもよい。また通常、ワニスの固形分濃度が３０〜６０重量％の範囲となるように有機溶剤を用いることが好ましい。 The organic solvent is not particularly limited, and various conventionally known organic solvents such as methyl ethyl ketone, acetone, cyclohexanone, dioxane, diethyl ketone, toluene, and ethyl acetate can be used. These may be used alone or in combination of two or more. Usually, it is preferable to use an organic solvent so that the solid content concentration of the varnish is in the range of 30 to 60% by weight.
有機溶剤乾燥後のシートの厚みは、特に制限されるものではないが、厚みの均一性と残存溶剤量の観点から、５〜１００μｍとすることが好ましく、２０〜７０μｍとするのがより好ましい。このようにして得られたシート状エポキシ樹脂組成物は、必要により所望の厚みとなるように積層して使用してもよい。すなわち、シート状エポキシ樹脂組成物は、単層構造にて使用してもよいし、２層以上の多層構造に積層してなる積層体として使用してもよい。 The thickness of the sheet after drying the organic solvent is not particularly limited, but is preferably 5 to 100 μm and more preferably 20 to 70 μm from the viewpoint of uniformity of thickness and the amount of residual solvent. The sheet-like epoxy resin composition thus obtained may be used by being laminated so as to have a desired thickness if necessary. That is, the sheet-like epoxy resin composition may be used in a single layer structure, or may be used as a laminate formed by laminating two or more multilayer structures.
つぎに、実施例について比較例と併せて説明する。ただし、本発明は、これら実施例に限定されるものではない。 Next, examples will be described together with comparative examples. However, the present invention is not limited to these examples.
まず、下記に示す各成分を準備した。
〔エポキシ樹脂ａ〕
変性ビスフェノールＡ型エポキシ樹脂（ＤＩＣ株式会社、ＥＰＩＣＬＯＮ ＥＸＡ−４８５０−１５０）
〔エポキシ樹脂ｂ〕
トリフェニルメタン型エポキシ樹脂（日本化薬株式会社、ＥＰＰＮ−５０１ＨＹ）
〔フェノール樹脂〕
ノボラック型フェノール樹脂（荒川化学工業株式会社、Ｐ−２００）
〔エラストマー〕
アクリル系共重合体（ブチルアクリレート：アクリロニトリル：グリシジルメタクリレート＝８５：８：７重量％からなる共重合体。重量平均分子量８０万）
上記アクリル系共重合体は次のように合成した。ブチルアクリレート、アクリロニトリルおよびグリシジルメタクリレートを重量比率が８５：８：７となるように仕込み、２，２’−アゾビスイソブチロニトリルを重合開始剤に用いて、窒素気流下、メチルエチルケトン中にて７０℃で５時間および８０℃で1時間のラジカル重合を行うことにより、目的とするアクリル系共重合体を得た。
〔無機質充填剤〕
平均粒径０．５μｍの球状溶融シリカ粉末
〔硬化促進剤〕
２−フェニル−４，５−ジヒドロキシメチルイミダゾール（四国化成工業株式会社、２ＰＨＺ）
〔シート状エポキシ樹脂組成物の作製〕
表１に示す割合で各成分を分散混合し、これに各成分の合計量と同量のメチルエチルケトンを加えて、塗工用ワニスを調製した。
First, each component shown below was prepared.
[Epoxy resin a]
Modified bisphenol A type epoxy resin (DIC Corporation, EPICLON EXA-4850-150)
[Epoxy resin b]
Triphenylmethane type epoxy resin (Nippon Kayaku Co., Ltd., EPPN-501HY)
[Phenolic resin]
Novolac type phenolic resin (Arakawa Chemical Industries, Ltd., P-200)
[Elastomer]
Acrylic copolymer (copolymer composed of butyl acrylate: acrylonitrile: glycidyl methacrylate = 85: 8: 7 wt%. Weight average molecular weight 800,000)
The acrylic copolymer was synthesized as follows. Butyl acrylate, acrylonitrile, and glycidyl methacrylate were charged so that the weight ratio was 85: 8: 7, and 2,2′-azobisisobutyronitrile was used as a polymerization initiator in a methyl ethyl ketone under a nitrogen stream. The target acrylic copolymer was obtained by performing radical polymerization at 5 ° C. for 5 hours and at 80 ° C. for 1 hour.
[Inorganic filler]
Spherical fused silica powder with an average particle size of 0.5 μm [curing accelerator]
2-Phenyl-4,5-dihydroxymethylimidazole (Shikoku Chemicals Co., Ltd., 2PHZ)
[Preparation of sheet-like epoxy resin composition]
Each component was dispersed and mixed at the ratio shown in Table 1, and methyl ethyl ketone in the same amount as the total amount of each component was added thereto to prepare a coating varnish.
つぎに、上記ワニスを、厚さ３８μｍのポリエステルフィルム（三菱樹脂株式会社、ＭＲＦ−３８）の剥離処理面上にコンマコーターにて塗工し、乾燥することにより厚みが５０μｍのシート状エポキシ樹脂組成物を得た。 Next, the varnish is coated on a release treatment surface of a 38 μm thick polyester film (Mitsubishi Resin Co., Ltd., MRF-38) with a comma coater, and dried to form a sheet-like epoxy resin composition having a thickness of 50 μm. I got a thing.
ついで、別途用意したポリエステルフィルムの剥離処理面を、シート状エポキシ樹脂組成物に貼り合わせて巻き取った。その後、ポリエステルフィルムを適宜剥離しながら、ロールラミネーターにより上記シート状エポキシ樹脂組成物を４枚積層することにより、厚さ２００μｍのシート状エポキシ樹脂組成物を得た。
〔実施例１〜６〕
電子部品として積層セラミックコンデンサ（コンデンサ厚み５００μｍ）を碁盤目状に１万個配列設置した縦１５０ｍｍ、横１５０ｍｍ、厚み３００μｍのガラス−エポキシ（ＦＲ−４）基板を準備し、上記で得られた厚さ２００μｍのシート状エポキシ樹脂組成物（縦１５０ｍｍ、横１５０ｍｍにカットしたもの）を基板上の全ての電子部品を覆うように配置した。配置したシート状エポキシ樹脂組成物を、真空下（０．１ｋＰａ）、温度８０℃、圧力３００ｋＰａでプレスすることにより、電子部品および実装基板と接着した。ついで、プレスの圧力を解放し、シート状エポキシ樹脂組成物を熱硬化（１５０℃、１時間）させて電子部品を封止し、常温まで自然冷却させることにより電子部品装置集合体を得た。
〔実施例７〕
シート状エポキシ樹脂組成物を電子部品および実装基板と接着する際に、大気圧下、温度８０℃、圧力３００ｋＰａでプレスすること以外は、実施例１と同様にして電子部品装置集合体を得た。
〔実施例８〕
シート状エポキシ樹脂組成物を電子部品および実装基板と接着する際に、真空下（０．１ｋＰａ）、温度５０℃、圧力３００ｋＰａでプレスすること以外は、実施例１と同様にして電子部品装置集合体を得た。
〔実施例９〕
シート状エポキシ樹脂組成物を電子部品および実装基板と接着する際に、真空下（０．１ｋＰａ）、温度８０℃、圧力８０ｋＰａでプレスすること以外は、実施例１と同様にして電子部品装置集合体を得た。
〔凸状部高さ〕
実施例１〜９で得られた電子部品装置集合体における、電子部品の周端部上にあるエポキシ樹脂組成物の硬化体の凸状部高さを触針式表面形状測定器（株式会社アルバック、Ｄｅｋｔａｋ ８）により測定した。表１に実施例１〜９の凸状部高さを、接着時の真空度、温度およびプレス圧力とあわせて示した。
〔ダイシング性〕
実施例１〜９で得られた電子部品装置集合体を、ダイサーを用いて電子部品の周端部上にあるエポキシ樹脂組成物の硬化体の凸状部を基準としてダイシングし、個々の電子部品装置に分断した。得られた電子部品装置は、設計における寸法規格に対して寸法誤差が±５％未満であり、ダイシング性が良好であった。
Subsequently, the release treatment surface of the separately prepared polyester film was bonded to the sheet-like epoxy resin composition and wound up. Then, the sheet-like epoxy resin composition having a thickness of 200 μm was obtained by laminating four sheets of the sheet-like epoxy resin composition with a roll laminator while appropriately peeling the polyester film.
[Examples 1 to 6]
As an electronic component, a glass-epoxy (FR-4) substrate having a length of 150 mm, a width of 150 mm, and a thickness of 300 μm in which 10,000 multilayer ceramic capacitors (capacitor thickness of 500 μm) are arranged in a grid pattern is prepared, and the thickness obtained above is prepared. A 200 μm thick sheet-shaped epoxy resin composition (cut to 150 mm length and 150 mm width) was placed so as to cover all the electronic components on the substrate. The placed sheet-like epoxy resin composition was bonded to an electronic component and a mounting substrate by pressing under vacuum (0.1 kPa) at a temperature of 80 ° C. and a pressure of 300 kPa. Next, the pressure of the press was released, the sheet-shaped epoxy resin composition was thermally cured (150 ° C., 1 hour), the electronic component was sealed, and the electronic component device assembly was obtained by naturally cooling to room temperature.
Example 7
An electronic component device assembly was obtained in the same manner as in Example 1 except that when the sheet-like epoxy resin composition was bonded to the electronic component and the mounting substrate, pressing was performed at a temperature of 80 ° C. and a pressure of 300 kPa under atmospheric pressure. .
Example 8
The electronic component device assembly is the same as in Example 1 except that when the sheet-like epoxy resin composition is bonded to the electronic component and the mounting substrate, pressing is performed under vacuum (0.1 kPa), temperature 50 ° C., and pressure 300 kPa. Got the body.
Example 9
The electronic component device assembly is the same as in Example 1 except that when the sheet-like epoxy resin composition is bonded to the electronic component and the mounting substrate, pressing is performed at a temperature of 80 ° C. and a pressure of 80 kPa under vacuum (0.1 kPa). Got the body.
[Convex height]
In the electronic component device assembly obtained in Examples 1 to 9, the height of the convex portion of the cured body of the epoxy resin composition on the peripheral end of the electronic component was measured using a stylus type surface shape measuring instrument (ULVAC, Inc.). , Dektak 8). Table 1 shows the heights of the convex portions of Examples 1 to 9 together with the degree of vacuum during bonding, the temperature, and the pressing pressure.
[Dicing]
The electronic component device assembly obtained in Examples 1 to 9 was diced using a dicer on the basis of the convex portion of the cured body of the epoxy resin composition on the peripheral end portion of the electronic component, and each electronic component was diced. Divided into equipment. The obtained electronic component device had a dimensional error of less than ± 5% with respect to the dimensional standard in the design, and had good dicing properties.
１ 電子部品
２ 実装基板
３ 電子部品の接続用電極部
４ 封止樹脂層
５ 凸状部高さ
DESCRIPTION OF SYMBOLS 1
Claims (2)
前記電子部品の周端部上において、前記封止材料がその厚み方向に隆起して凸状部を形成しており、
前記凸状部の高さが２５〜２００μｍであり、
前記封止材料がエポキシ樹脂組成物の硬化体であり、
前記電子部品と前記実装基板の間のギャップに前記エポキシ樹脂組成物が充填されており、
前記エポキシ樹脂組成物が下記Ａ〜Ｄ成分を含み、かつＣ成分の含有量がエポキシ樹脂組成物全体の５〜４０重量％であることを特徴とする、電子部品装置集合体。
Ａ：エポキシ樹脂
Ｂ：フェノール樹脂
Ｃ：エラストマー
Ｄ：無機質充填剤 An electronic component device assembly formed by sealing a plurality of electronic components installed on a mounting substrate with a sealing material,
On the peripheral edge of the electronic component, the sealing material is raised in the thickness direction to form a convex portion ,
The height of the convex portion is 25 to 200 μm,
The sealing material is a cured body of an epoxy resin composition,
The epoxy resin composition is filled in the gap between the electronic component and the mounting substrate,
The said epoxy resin composition contains the following AD component, and content of C component is 5 to 40 weight% of the whole epoxy resin composition , The electronic component device assembly characterized by the above-mentioned.
A: Epoxy resin
B: Phenolic resin
C: Elastomer
D: Inorganic filler
実装基板上に電子部品を設置する工程、
シート状エポキシ樹脂組成物を、前記電子部品を覆うように前記実装基板上に設置する工程、
前記シート状エポキシ樹脂組成物を、温度６０〜１２０℃、圧力１００〜２０００ｋＰａでプレスすることにより、前記電子部品および実装基板と接着する工程、
前記シート状エポキシ樹脂組成物を、前記プレスの圧力から解放し、温度１００〜２００℃で熱硬化することにより、前記電子部品の周端部上において前記シート状エポキシ樹脂組成物の硬化体がその厚み方向に隆起して凸状部を形成するように前記電子部品を封止する工程、
を含み、
前記凸状部の高さが２５〜２００μｍであり、
前記エポキシ樹脂組成物が下記Ａ〜Ｄ成分を含み、かつＣ成分の含有量がエポキシ樹脂組成物全体の５〜４０重量％であることを特徴とする、電子部品装置集合体の製造方法。
Ａ：エポキシ樹脂
Ｂ：フェノール樹脂
Ｃ：エラストマー
Ｄ：無機質充填剤
Ri a plurality of electronic components mounted on the mounting board name is sealed with the cured product of the epoxy resin composition, the epoxy resin composition is filled in the gap between the mounting board and the electronic component A method of manufacturing an electronic component device assembly,
The process of installing electronic components on the mounting board,
Installing the sheet-like epoxy resin composition on the mounting substrate so as to cover the electronic component;
Bonding the electronic component and the mounting substrate by pressing the sheet-like epoxy resin composition at a temperature of 60 to 120 ° C. and a pressure of 100 to 2000 kPa;
The sheet-like epoxy resin composition is released from the pressure of the press and thermally cured at a temperature of 100 to 200 ° C., so that the cured body of the sheet-like epoxy resin composition is on the peripheral edge of the electronic component. Sealing the electronic component so as to protrude in the thickness direction to form a convex portion,
Only including,
The height of the convex portion is 25 to 200 μm,
The said epoxy resin composition contains the following AD component, and content of C component is 5 to 40 weight% of the whole epoxy resin composition, The manufacturing method of the electronic component apparatus aggregate | assembly characterized by the above-mentioned.
A: Epoxy resin
B: Phenolic resin
C: Elastomer
D: Inorganic filler
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