JP2011025629A - Recording head and recorder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a recording head and a recorder capable of suppressing blurring in printing. <P>SOLUTION: The recording head is composed by disposing a head base body 10 having a heating element array where a plurality of heating elements 13a are arranged in an array on an upper surface on a radiator 40, and bonding a portion opposed to the heating element array on a lower surface of the head base body 10 to the radiator 40 through a belt-like adhesive layer 16 extending in the arranging direction of the heating elements 13a. The recording head is provided with an air reservoir part 19 in the adhesive layer 16. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a recording head and a recording apparatus, and in particular, a recording head in which a head substrate having a heating element array in which a plurality of heating elements are arranged in a line is bonded to a heat radiator with an adhesive layer, and the recording head and recording The present invention relates to a recording apparatus including a conveyance unit that conveys a medium.

  As a printer such as a facsimile or a register, a thermal printer including a thermal head and a platen roller is used. As a thermal head mounted on such a thermal printer, a head substrate in which a plurality of heating elements are arranged on the surface of a head substrate, a mechanical connection to the head substrate, and a plurality of heating elements. Some have a wiring member that is electrically connected.

  The platen roller has a function of pressing a recording medium such as thermal paper against the protective layer on the heating element side. In the thermal printer having such a configuration, the heating element is heated according to a desired image, and the recording medium is pressed against the protective layer on the heating element with a platen roller substantially uniformly, thereby generating heat generated by the heating element. Good transmission against. Desired printing on the recording medium is performed by repeating this process.

  8 and 9 show a conventional thermal head (a type of recording head) X1, and the thermal head X1 includes a head substrate 50, a control IC 60, a wiring member 70, and a radiator 80. ing.

  The head base 50 includes a head substrate 51 having a rectangular main surface, a glaze layer 52, an electric resistance layer 53, an electrode wiring 54, and a protective layer 55.

  The head substrate 51 has a function of supporting the glaze layer 52, the electrical resistance layer 53, the electrode wiring 54, the protective layer 55, and the control IC 60.

  The glaze layer 52 has a function of temporarily storing a part of heat generated in the heating element 53a of the electric resistance layer 53. The glaze layer 52 has a base 52a and a protrusion 52b. The base 52 a is provided in a substantially flat shape over the entire top surface of the head substrate 51. The protrusion 52b is a part that contributes to favorably pressing the recording medium against the protective layer 55 located on the heating element 53a by the platen roller.

  The electric resistance layer 53 has a heat generating element 53a that generates heat by supplying power. A portion of the electrical resistance layer 53 to which a voltage is applied from the electrode wiring 54, where the electrode wiring 54 is not formed, functions as the heating element 53 a.

  The heating elements 53a are located on the protrusions 52b of the glaze layer 52, and are arranged in a line at substantially the same distance along the main scanning direction D1-D2.

  The electrode wiring 54 is provided on the electric resistance layer 53. The electrode wiring 54 includes a first electrode wiring 541, a second electrode wiring 542, and a third electrode wiring 543.

  The first electrode wiring 541 has an end connected to one end side of the plurality of heating elements 53 a and the wiring member 70. The first electrode wiring 541 is paired with the second electrode wiring 542 and contributes to supplying power to the heating element 53a.

  Each one end of the second electrode wiring 542 is electrically connected to the other end of each heating element 53a. The second electrode wiring 542 contributes to supplying power to the heating element 53a.

  The third electrode wiring 543 is spaced apart from the second electrode wiring 542. A driving IC 60 is connected to one end of the third electrode wiring 543, and a wiring member 70 is connected to the other end.

  8B and 9B, the head substrate 51 is bonded to the heat radiating body 80 with an adhesive layer 56 and a double-sided tape 57. That is, the lower surface of the head substrate 51 located immediately below the heat generating element 53a formed in the protruding portion 52b is an adhesive layer made of a heat-dissipating resin on the protruding surface between the two concave grooves 58 formed in the heat radiator 80. 56 (see, for example, Patent Documents 1 and 2). The lower surface of the head substrate 51 and the heat radiating body 80 other than the portion located directly below the heating element 53a and the groove portion 58 are joined by a double-sided tape 57. In FIG. 9B, only the protrusion 52 b of the glaze layer 52 is shown on the upper surface of the head substrate 51 for easy understanding.

  Conventionally, the adhesive layer 56 made of a heat-dissipating resin between the lower surface of the head substrate 51 and the heat radiating body 80 located directly below the heat generating element 53a does not contain bubbles from the viewpoint of heat conduction of the adhesive layer 56. (For example, refer patent document 3).

Japanese Utility Model Publication No. 3-52152 JP 2001-96780 A JP 2004-160924 A

  However, in the conventional thermal head X1, heat from the heat generating element 53a is conducted to the heat radiating body 80 through the adhesive layer 56 during printing, and the head expansion due to the difference in thermal expansion coefficient between the head substrate 51 and the heat radiating body 80. There was a possibility that the substrate 51 would be deformed and the print fading might occur.

  That is, conventionally, ceramic such as alumina is used as the head substrate 51 for reasons of insulation, heat dissipation and flatness, and a metal such as aluminum is used as the heat dissipation body 80 for reasons of heat dissipation. Since the thermal expansion coefficients are greatly different, the flatness of the head substrate 51 changes depending on the temperature of the heat radiating body 80, and the force of pressing the recording medium against the heating element 53a by the platen roller may fluctuate, which may cause printing blur. It was.

  An object of the present invention is to provide a recording head and a recording apparatus that can suppress blurring of a print.

  In the recording head of the present invention, a head base having a heat generating element array in which a plurality of heat generating elements are arranged in a row on the upper surface is disposed on a heat radiating body, and a portion facing the heat generating element array on the lower surface of the head base is The recording head is bonded to the heat radiating body through a belt-like adhesive layer extending in the arrangement direction of the heat generating elements, and has an air reservoir in the adhesive layer.

  Since such a recording head has an air reservoir in the adhesive layer, for example, even when the heat sink becomes hot during continuous printing, deformation of the heat sink is absorbed by the air reservoir, and the head substrate Deformation can be suppressed, and the change in the flatness of the head substrate with respect to temperature changes can be suppressed. As a result, even if a temperature change occurs in the radiator, the force with which the recording medium is pressed against the heating element by the platen roller varies. Is suppressed, and blurring of printing can be suppressed.

  The recording head of the present invention is characterized in that a plurality of the air reservoirs are formed at a predetermined interval in the arrangement direction of the heating elements. In such a recording head, the deformation of the heat radiating body can be further absorbed by the air reservoir, and print blur can be further suppressed.

  Furthermore, a recording apparatus of the present invention includes the recording head and a transport unit that transports a recording medium. In such a recording apparatus, it is possible to suppress blurring of printing.

  In the recording head of the present invention, since the air reservoir is provided in the adhesive layer, for example, even when the heat sink becomes hot during continuous printing, the air reservoir absorbs the deformation of the heat sink and Deformation can be suppressed, and the change in the flatness of the head substrate with respect to temperature changes can be suppressed. As a result, even if a temperature change occurs in the radiator, the force with which the recording medium is pressed against the heating element by the platen roller varies. Is suppressed, and blurring of printing can be suppressed.

(A) is a top view which shows schematic structure of the thermal head which is an example of embodiment of the recording head of this invention, (b) is a side view which shows schematic structure of the thermal head which is an example of embodiment of the recording head of this invention. FIG. (A) is the top view to which the principal part of the thermal head shown in FIG. 1 was expanded, (b) is the IIb-IIb sectional view taken on the line of (a). It is a disassembled perspective view of the wiring member shown in FIG. (A) is a perspective plan view showing a state in which a plurality of air reservoirs are formed at predetermined intervals in the arrangement direction of the heating elements, and (b) is an enlarged view of the main part of FIG. 1 (b). It is sectional drawing. (A) is a perspective plan view showing a state in which two rows of air reservoirs formed by forming a plurality of air reservoirs at predetermined intervals in the arrangement direction of the heating elements are formed, and (b) is (a) (C) is a perspective plan view showing a state in which a plurality of elongated air reservoirs are formed at predetermined intervals in the arrangement direction of the heating elements, and (d) is one elongated section. It is a see-through | perspective plan view which shows the state in which the air reservoir part is formed in the sequence direction of a heat generating element. 1 is a diagram illustrating a schematic configuration of a thermal printer which is an example of an embodiment of a recording apparatus of the present invention. (A) is a graph which shows the flatness of the head base | substrate of the thermal head A of this invention, (b) is a graph which shows the flatness of the head base | substrate of the thermal head B of a comparative example. (A) is a top view which shows schematic structure of the conventional thermal head, (b) is a side view which shows schematic structure of the conventional thermal head. (A) is sectional drawing of the thermal head of FIG. 8, (b) is sectional drawing which shows the joining state of the head base | substrate to a heat radiator.

  FIG. 1A is a plan view showing a schematic configuration of a thermal head X as an example of an embodiment of a recording head according to the present invention, and FIG. 1B is a side view of the thermal head X.

  2A is an enlarged view of the main part of the thermal head X shown in FIG. 1, and FIG. 2B is a cross-sectional view taken along the line IIb-IIb shown in FIG. In FIG. 2A, the driving IC, the wiring member, the heat radiating body, and the protective layer are omitted from FIG. 2B, and the heat radiating body is omitted from FIG.

  The thermal head X includes a head substrate 10, a drive IC 20, a wiring member 30, and a heat radiator 40.

  The head base 10 includes a head substrate 11, a glaze layer 12, an electrical resistance layer 13, an electrode wiring 14, and a protective layer 15.

  The head substrate 11 has a function of supporting the glaze layer 12, the electrical resistance layer 13, the electrode wiring 14, the protective layer 15, and the drive IC 20. The head substrate 11 is configured in a rectangular shape extending in the arrow direction D1-D2 when viewed in the direction of the arrow D6, and the main surface is rectangular. Examples of the material for forming the head substrate 11 include insulating materials. For example, ceramics such as alumina ceramics and inorganic materials such as glass materials are preferably used.

  The reason why the patterning of the mask using photolithography of the electric resistance layer 13 and the electrode wiring 14 is facilitated and the smoothness can be improved on the upper surface of the head substrate 11 in the thickness direction D5-D6 in the D5 direction side. The glaze layer 12 is provided over the whole because it is easy to manufacture.

  The glaze layer 12 has a function of temporarily storing a part of heat generated in a heating element 13a described later of the electrical resistance layer 13. That is, the glaze layer 12 plays a role of improving the thermal response characteristics of the thermal head X by shortening the time required to raise the temperature of the heating element 13a. An example of a material for forming the glaze layer 12 is glass. The glaze layer 12 has a base portion 12a and a protruding portion 12b.

  The base portion 12a is provided in a substantially flat shape over the entire upper surface of the head substrate 11, and the thickness thereof is 20 to 250 μm. The protrusion 12b is a part that contributes to pressing the recording medium against the protective layer 15 located on the heating element 13a. The protrusion 12b protrudes in the direction D5 in the thickness direction D5-D6 from the base 12a. Further, the projecting portion 12b is formed in a strip shape extending in the main scanning direction D1-D2. The protrusion 12b has a substantially semi-elliptical cross section in the sub-scanning direction D3-D4 orthogonal to the main scanning direction D1-D2. In the present embodiment, the arrangement direction in a state where the heating elements 13a are held is the main scanning direction of the thermal head X. The glaze layer 12 need not be formed on the entire top surface of the head substrate 11.

  The electrical resistance layer 13 is formed on the glaze layer 12. The electric resistance layer 13 has a thickness of 0.01 to 0.5 μm. In the present embodiment, a portion of the electrical resistance layer 13 to which a voltage is applied from the electrode wiring 14 where the electrode wiring 14 is not formed functions as the heating element 13 a, and the heating element 13 a is a protruding portion of the glaze layer 12. 12b is formed. Examples of the material for forming the electric resistance layer 13 include a TaN-based material, a TaSiO-based material, a TaSiNO-based material, a TiSiO-based material, a TiSiCO-based material, and an NbSiO-based material.

  The heat generating element 13 a generates heat when a voltage is applied from the electrode wiring 14. The heat generating element 13a is configured such that a heat generation temperature due to voltage application from the electrode wiring 14 is in a range of 200 to 550 ° C., for example.

  Further, the heating elements 13a are formed in a line at predetermined intervals in the direction of the arrows D1-D2, forming a heating element array.

  The electrode wiring 14 includes a first electrode wiring 141, a second electrode wiring 142, and a third electrode wiring 143.

  The end portion of the first electrode wiring 141 is connected to one end side of the plurality of heating elements 13a and a power source (not shown). One end of the first electrode wiring 141 is located on the arrow D3 direction side of the heating element 13a.

  The second electrode wiring 142 has one end connected to the other end of the heat generating element 13 a and the other end connected to the drive IC 20. One end of the second electrode wiring 142 is located on the arrow D4 direction side of the heating element 13a.

  The third electrode wiring 143 is formed away from the second electrode wiring 142, in other words, the third electrode wiring 143 is provided in the vicinity of the second electrode wiring 142. The third electrode wiring 143 is provided between the plurality of driving ICs 20 and the wiring member 30. The third electrode wiring 143 is connected to the driving IC 20 and the wiring member 30. In other words, the third electrode wiring 143 has a function of electrically connecting the driving IC 20 and the wiring member 30 and contributes to driving of the heating element 13a. Here, “contributes to driving of the heating element” means that a current flows along with driving or driving control of the heating element 13a. The third electrode wiring 143 has the driving IC 20 connected to one end thereof and the wiring member 30 connected to the other end thereof.

  As a material for forming the first electrode wiring 141, the second electrode wiring 142, and the third electrode wiring 143, for example, any one metal of aluminum, gold, silver, copper, or an alloy thereof can be given. The thickness is set to 0.7 to 1.2 μm.

The protective layer 15 has a function of protecting the heat generating element 13 a and the electrode wiring 14. The protective layer 15 covers the heat generating element 13a and a part of the electrode wiring 14. Examples of the material for forming the protective layer 15 include diamond-like carbon-based materials, SiC-based materials, SiN-based materials, SiCN-based materials, SiAlON-based materials, SiO ₂ -based materials, and TaO-based materials. It is formed. Here, “diamond-like carbon-based material” refers to a material in which the proportion of carbon atoms (C atoms) taking sp ³ hybrid orbits is in the range of 1 [atomic%] to less than 100 [atomic%]. Note that the protective layer 15 is omitted in FIG. 2A from the viewpoint of easy viewing.

  The drive IC 20 has a function of controlling power supply to the plurality of heating elements 13a. The drive IC 20 is connected to the second electrode wiring 142 and the third electrode wiring 143 through a conductive connection member 49 whose connection terminal is made of solder. With such a configuration, the heating element 13a can selectively generate heat in accordance with an electric signal input through the electrode wiring 14.

  FIG. 3 is an exploded perspective view illustrating a schematic configuration of the wiring member 30. The connection member of the wiring member 30 is connected to the first electrode wiring 141 and the third electrode wiring 143 through a conductive connection member 49 made of solder. The wiring member 30 has a function of transmitting an electric signal transmitted from the outside to the driving IC 20 and the electrode wiring 14. Examples of the electrical signal include power supplied to the heating element 13a and the driving IC 20, and image information for selectively controlling the power supply state of the heating element 13a. The wiring member 30 of this embodiment includes a wiring body 31, an external connection terminal 32, a support plate 33, and an adhesive layer 34.

The wiring body 31 includes a first wiring body 311, a second wiring body 312, and a wiring portion 313. As this wiring body 31, what has flexibility is employ | adopted, for example. Here, the flexibility means that the flexural modulus defined by JIS standard K7171 is, for example, 2.5 × 10 ^{3 to} 4.5 × 10 ³ N / mm ² .

The first wiring body 311 and the second wiring body 312 have a function of supporting the plurality of wiring portions 313 and ensuring their electrical insulation. The first wiring body 311 and the second wiring body 312 sandwich the wiring portion 313. Examples of a material for forming the first wiring body 311 and the second wiring body 312 include a flexible resin material including a polyimide resin, an epoxy resin, and an acrylic resin. In the present embodiment, the wiring body 31 is made of a polyimide resin, and its thermal expansion coefficient is about 1.1 × 10 ⁻⁵ K ⁻¹ . As thickness of the 1st wiring body 311 and the 2nd wiring body 312 in this embodiment, the range of 0.5-2.0 mm is mentioned, for example.

Examples of the material for forming the wiring portion 313 include any one kind of metal such as gold, silver, copper, and aluminum, or an alloy thereof. In the present embodiment, the wiring part 313 is made of copper, and its thermal expansion coefficient is about 1.7 × 10 ⁻⁵ K ⁻¹ .

  The external connection terminal 32 is a part to which an electric signal is input from the outside. The external connection terminal 32 is electrically connected to the drive IC 20 and the electrode wiring 14. Note that the external connection terminals 32 are omitted in FIG. 3 from the viewpoint of easy viewing.

The support plate 33 has a function of supporting the wiring body 31. Examples of a material for forming the support plate 33 include ceramics, resins, ceramics and resin composites. Examples of ceramics include alumina ceramics, aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics, glass ceramics, and mullite sintered bodies. Examples of resins include epoxy resins, polyimide resins, and acrylic resins. Examples thereof include thermosetting types such as resins, phenolic resins, and polyester resins, ultraviolet curable types, and chemical reaction curable types. In the present embodiment, the support plate 33 is made of glass fiber containing an epoxy resin, and has a thermal expansion coefficient of about 1.7 × 10 ⁻⁵ K ⁻¹ .

  The adhesive layer 34 has a function of bonding the wiring body 31 and the support plate 33. Examples of the thickness of the adhesive layer 34 include a range of 10 to 35 μm.

  The radiator 40 has a function of transmitting heat generated by driving the heat generating portion 13a to the outside. In the present embodiment, the radiator 40 functions as a support base material for the head base 10 and the wiring member 30. As a material for forming the radiator 40, for example, a metal material containing copper or aluminum can be used. Here, “a material having high thermal conductivity” means a material having higher thermal conductivity than the material constituting the head substrate 11. In particular, a radiator 40 made of a metal material, particularly aluminum, is desirable from the viewpoint of thermal conductivity.

  In the recording head, a head base 10 having a heat generating element array in which a plurality of heat generating elements 13a are arranged in a line is disposed on a heat radiating body 40, and a portion facing the heat generating element array on the lower surface of the head base 10 is In other words, as shown in FIG. 4, the surface of the head substrate 10 immediately below the heating element array extends in the arrangement direction of the heating elements 13a (arrow D1-D2 direction) and has a belt-like adhesive layer 16 with good thermal conductivity. Further, the double-sided tape 17 is connected between the lower surface of the head base 10 and the upper surface of the heat radiator 40 other than the portion located directly below the heating element 13a and the groove 18. Are glued together. The support plate 33 and the radiator 40 are also bonded with the double-sided tape 17. Examples of the adhesive layer 16 include thermosetting or chemical reaction curing types such as epoxy resins, polyimide resins, acrylic resins, phenol resins, and polyester resins.

  In the present invention, as shown in FIG. 4, a plurality of air reservoirs 19 are formed on the side of the head base 10 of the adhesive layer 16. As shown in FIG. 4A, the air reservoir 19 is arranged in the center of the band-shaped adhesive layer 16 in the width direction (arrow D3-D4 direction) and in the arrangement direction of the heating elements 13a (arrow D1-D2 direction). Are formed at a predetermined interval to form an air reservoir column. In FIG. 4B, only the protrusion 12b of the glaze layer 12 is shown on the upper surface of the head base 10 for easy understanding.

  The air reservoir 19 has a circular shape when the head base 10 is peeled and the adhesive layer 16 is viewed in plan, and the diameter of the air reservoir 19 inhibits heat conduction by the adhesive layer 16 from the heating element 13a so much. The diameter of the air reservoir 19 is 30 to 150 μm, and is 5% or less of the length of the protruding portion 12b of the glaze layer 12 in the arrow D3-D4 direction.

  Further, the interval between the air reservoirs 19 is also set so as not to disturb the heat conduction by the adhesive layer 16 from the heating element 13a.

  The air reservoir portion 19 is formed on the head base 10 side of the adhesive layer 16, and the air reservoir portion 19 appears as a recess on the upper surface of the adhesive layer 16 when the head base body 10 is peeled off.

  In such a recording head, since the air reservoir 19 is provided on the head base side of the adhesive layer 16, for example, even when the heat radiator 40 becomes hot during continuous printing, the air reservoir 40 causes the heat sink 40 to remain. Therefore, the platen roller is prevented from fluctuating the force with which the recording medium is pressed against the heating element 13a, and blurring of printing can be suppressed. As shown in FIG. 4A, when a plurality of air reservoirs 19 are formed at predetermined intervals in the arrangement direction of the heating elements 13a, the heat sink 40 is further deformed by the air reservoir 19 It can be absorbed and blurring of printing can be further suppressed.

  Conventionally, the foreign matter adhering to the surface of the thermal medium comes into contact with the surface of the protective layer 15 and is pressed, but the surface of the protective layer 15 on the thermal head side can be absorbed by the medium or the platen roller. However, in the present invention, the adhesive immediately below the heating element 13a is likely to cause mechanical damage to the heating element 13a and the electrode wiring 14 via the protective layer 15. Since the air reservoir 19 is formed in the layer 16, the adhesive layer 16 has elasticity, and durability against mechanical stress can be improved.

  In addition, when the head substrate 11 of the head base 10 is formed thin (1 mm or less) from the viewpoint of thermal conductivity, the head substrate 11 is easily deformed, and thus the present invention can be preferably used. Moreover, since the head substrate 11 is easily deformed even when the length of the head substrate 11 is 100 mm or more, that is, when the heating element array is long, the present invention can be suitably used. Furthermore, since the head substrate 11 is easily deformed even when the width of the head substrate 11 (the length in the direction of the arrows D3-D4) is 10 mm or less, the present invention can be preferably used.

  In particular, in the recording head for images and medical use, since the head substrate 11 tends to be long, the present invention can be suitably used.

  5 (a) and 5 (b) are formed with two air reservoir portions. Even in such a recording head, for example, continuous printing is performed by the air reservoir 19 as in the recording head of FIG. At this time, even when the heat radiating body 40 becomes high temperature, the deformation of the heat radiating body 40 is further absorbed by the air reservoir 19, the deformation of the head base 10 can be suppressed, and the print fading can be suppressed. Further, the portion immediately below the heat generating element 13a formed at the center of the projecting portion 12b of the glaze layer 12 is located between the air reservoirs 19, so that the heat dissipation from the heat generating element 13a can be improved as compared with FIG.

5 (c), a plurality of elongated air reservoirs 19 are formed at predetermined intervals, and FIG. 5 (d) is a single elongated air reservoir 19, which can further absorb deformation of the radiator 40, Print blur can be suppressed. The width of the air reservoir 19 in the arrow D3-D4 direction is 5% or less of the length of the protruding portion 12b of the glaze layer 12 in the arrow D3-D4 direction.
<Method for manufacturing recording head>
Next, the manufacturing method of the recording head of the present invention will be described taking the above-described thermal head X as an example of the recording head as an example.

  First, an element body preparation step is performed. Specifically, a mother substrate having a plurality of head substrate regions is prepared. Next, a glaze layer forming step is performed. Specifically, the glaze layer 12 is formed on the entire upper surface of the mother substrate. Examples of the forming method include known methods such as a printing method and a baking method.

  Next, a resistor film is formed on the entire upper surface of the glaze layer 12 formed on each head substrate region. Examples of the film forming method include conventionally known methods including sputtering technology and vapor deposition technology. Next, a conductive film is formed on the entire upper surface of the resistor film. Examples of the method for forming the conductive film include conventionally known methods including sputtering technology and vapor deposition technology.

  Next, the conductive film is etched into a predetermined pattern to form the electrode wiring 14, and a part of the resistor film is exposed from the electrode wiring 14 to function as the heating element 13a. At this time, an element row composed of a plurality of heating elements 13a is arranged along arrow directions D1 and D2. As this etching method, for example, a conventionally known method including a combination of a photoresist technique and a wet etching technique can be cited.

  Next, the resistor film is etched to form the electric resistance layer 13. As this etching method, for example, a conventionally known method including a combination of a photoresist technique and a wet etching technique can be cited.

  Next, a protective layer 15 forming step is performed. Specifically, the protective layer 15 is formed so as to cover the heat generating portion 13a and a part of the electrode wiring 14 by sputtering.

  Next, a mother substrate dividing step is performed. Specifically, the mother substrate is divided into head substrate regions to obtain a plurality of head substrates 11.

  Next, a wiring member is prepared. Specifically, first, a wiring body 31 including a first wiring body 311, a second wiring body 312, and a wiring portion 313 is prepared. Next, an adhesive 34 is applied to the upper surface of the support plate 33, and the wiring body 31 is joined to the support plate 33.

  Next, a wiring member bonding step is performed. Specifically, first, a solder paste that becomes the conductive connection member 49 is applied on the first electrode wiring 141 and the third electrode wiring 143 of the head substrate 10. Next, the first electrode wiring 141, the third electrode wiring 143, and the connection terminal of the wiring member 30 are opposed to each other through a solder paste and heated, and the first electrode wiring 141, the third electrode wiring 143, and the wiring member 30 are connected. The connection terminal is fixed with heat-melted solder.

  Next, a driving IC mounting process is performed. Specifically, first, a solder paste that becomes the conductive connection member 49 is applied to the second electrode wiring 142 and the third electrode wiring 143, and the second electrode wiring 142 and the third electrode wiring 143 are driven via the solder paste. The connection terminals of the IC 20 are made to face each other, and then the solder paste is thermally melted to connect the second electrode wiring 142 and the third electrode wiring 143 and the connection terminals of the driving IC 20.

  Next, the head base 10 and the wiring member 30 are joined on the heat radiating body 40. This will be specifically described. Adhesive so that the central part in the direction of the arrow D3-D4 is concave on the projecting surface between the concave grooves 18 of the radiator 40 in which the concave groove 18 is formed in the direction of the arrow D1-D2 using a coating device such as a dispenser. Apply. In order to apply the adhesive in such a shape, for example, when one dispenser is used, the adhesive is discharged from the discharge port of the dispenser by pressing the discharge port of the dispenser against the protruding surface between the concave grooves 18. For example, it is formed by moving the dispenser in the direction D2. Or, using two dispensers, while discharging the adhesive so that the center in the direction of arrows D3-D4 is concave, the dispenser is moved in the direction of D2, for example, so that the center is concave. Can be applied.

  On the other hand, a double-sided tape is affixed on the upper surface of the heat radiating body 40 other than the protruding surface between the concave grooves 18. Then, the head base 10 is disposed on the upper surface of the heat radiating body 40 to which the adhesive is applied and the double-sided tape is affixed, and the lower surface of the head base 10 is bonded to the double-sided tape 17 and the adhesive is cured. The recording medium having the air reservoir 19 as shown in FIG. 4 can be manufactured by bonding the head substrate 10 with the agent layer 16. That is, the concave adhesive is pressed toward the heat radiating body 40 by the head base 10, and the air reservoir 19 having a circular shape in plan view is formed by the flow of the adhesive and the like.

  When the adhesive is cured by heating, for example, even when cooling after heating, deformation of the head base 10 is suppressed by the air reservoir portion 19, and the manufacturing yield of the recording head can be improved.

  Further, in the two rows of air reservoirs as shown in FIG. 5A, two concaves are formed in the direction of arrows D3-D4 using a coating device such as a dispenser on the protruding surface between the concave grooves 18. Apply adhesive to For example, while applying adhesive from the three outlets of the dispenser arranged in the direction of arrows D3-D4, for example, the dispenser is moved in the D2 direction, and the adhesive is applied so that two rows of recesses are formed, The head base 10 can be formed by pressing a concave adhesive against the radiator 40 and curing it.

  4 (c) and 4 (d) can be produced by adjusting the viscosity of the adhesive used in FIG. 3 and the concave shape when the adhesive is applied.

As described above, the thermal head X is formed.
<Recording device>
FIG. 6 is a diagram showing a schematic configuration of a thermal printer Y which is an example of an embodiment of a recording apparatus of the present invention.

  The thermal printer Y includes a thermal head X, a transport mechanism 59, and a control mechanism 69.

  The transport mechanism 59 has a function of bringing the recording medium P into contact with the heating element 13a of the thermal head X while transporting the recording medium P in the direction of the arrow D3. The transport mechanism 59 includes a platen roller 61 and transport rollers 62, 63, 64, and 65.

  The platen roller 61 has a function of pressing the recording medium P toward the heating element 13a. The platen roller 61 is rotatably supported in contact with the protective layer 15 located on the heat generating element 13a. The platen roller 61 has a configuration in which an outer surface of a columnar base is covered with an elastic member. This base is made of, for example, a metal such as stainless steel, and this elastic member is made of, for example, butadiene rubber having a thickness of 3 to 15 mm.

  The transport rollers 62, 63, 64 and 65 have a function of transporting the recording medium P. That is, the transport rollers 62, 63, 64, 65 supply the recording medium P between the heating element 13 a of the thermal head X and the platen roller 61, and between the heating element 13 a of the thermal head X and the platen roller 61. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 62, 63, 64, 65 may be formed by, for example, a metal columnar member. For example, like the platen roller 61, the outer surface of the columnar substrate is covered with an elastic member. There may be.

  The control mechanism 69 has a function of supplying image information to the drive IC 20. That is, the control mechanism 69 plays a role of supplying image information for selectively driving the heat generating portion 13 a to the drive IC 20 via the external connection terminal 32.

  The thermal printer Y includes a thermal head X and a transport mechanism 59 that transports the recording medium P. Therefore, the thermal printer Y can enjoy the effects of the thermal head X. Therefore, the thermal printer Y can suppress blurring of printing and improve image quality.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  A head substrate 10, a wiring member 30, and a radiator 40 having a heating element array in which a plurality of heating elements are arranged in a row on the upper surface were prepared.

  The head substrate 10 had a width of 9 mm, a length of 168 mm, and a thickness of 1 mm, and a heating element array was formed in the length direction. The radiator 40 is made of Al, has a width of 20 mm, a length of 170 mm, and a thickness of 4 mm, and two grooves are formed in a portion corresponding to the heating element array.

  A thermosetting adhesive is used in the D2 direction while pressing the discharge port of the dispenser against the protruding surface so that the central portion in the direction of the arrow D3-D4 is concave using the dispenser on the protruding surface between the concave grooves of the radiator 40. Was applied. Moreover, the double-sided tape was affixed on the upper surface of the heat radiator 40 other than the protruding surface between the concave grooves. Then, the head substrate 10 is disposed on the upper surface of the adhesive and the double-sided tape, and the wiring member 30 is disposed on the upper surface of the double-sided tape, and is heated at 90 ° C. for 1 hour to cure the adhesive. Was made.

  About the produced thermal head A, after hold | maintaining at 25 degreeC and 80 degreeC for 10 minute (s) in oven, the flatness was measured, respectively. The flatness is measured by bringing a contact-type measuring head into contact with the surface of the protective layer 15 immediately above the heating element 13a. The flatness is measured by the protruding height from this line segment with reference to the line segment connecting both ends of the head substrate 10. Indicated. The result is shown in FIG.

  From the results shown in this graph, it can be seen that in the thermal head A of the present invention, there is no significant change in head flatness due to temperature change. As a result, even if a temperature change occurs in the heat radiating body 40, it can be seen that fluctuations in the force with which the platen roller presses the recording medium against the heating element 13a are suppressed, and a good image without blurring of the print can be obtained. .

  When the head substrate 10 is peeled off from the heat radiating body 40 and the adhesive layer 16 is viewed in plan, as shown in FIG. It was formed with a plurality of intervals of 0.01 to 1 mm in the direction.

  As a comparative example, an adhesive is applied so that the central portion in the direction of arrows D3-D4 is convex so that there is no air reservoir in the adhesive layer, and the thermal head B of the comparative example is manufactured in the same manner as described above. Then, the flatness of the head substrate at 25 ° C. and 80 ° C. was measured as in the present invention, and the result is shown in FIG. From this graph, in the thermal head B of the comparative example, the flatness of the head substrate greatly changes due to the temperature change, and as a result, the force of pressing the recording medium against the heating element 13a side by the platen roller fluctuates and print blurring occurs I understand that

  When the head substrate 10 was peeled from the heat radiating body 4 and the adhesive layer 16 was viewed in plan, the air reservoir as in the present invention was not formed.

  Therefore, by forming the air reservoir 19 in the adhesive layer 16, even when the radiator 40 becomes high temperature, the deformation of the radiator 40 is absorbed by the air reservoir 19 and the deformation of the head base 10 can be suppressed. It can be seen that fluctuations in the force of pressing the recording medium against the heating element 13a side by the platen roller are suppressed, and blurring of the print can be suppressed.

X thermal head Y thermal printer 10 head substrate 11 head substrate 12 glaze layer 13 electrical resistance layer 13a heating element 14 electrode wiring 141 first electrode wiring 142 second electrode wiring 143 third electrode wiring 15 protective layer 16 adhesive layer 17 double-sided tape 18 Concave groove 19 Air reservoir 20 Drive IC
30 Wiring member 40 Heat radiating body 59 Conveying mechanism 61 Platen rollers 62, 63, 64, 65 Conveying roller 69 Control mechanism P Recording medium

Claims (3)

  A head base having a heat generating element array in which a plurality of heat generating elements are arranged in a row on the upper surface is disposed on a heat radiating body, and a portion of the lower surface of the head base facing the heat generating element array extends in the arrangement direction of the heat generating elements. A recording head formed by bonding to the heat radiating body via a belt-like adhesive layer, wherein the adhesive layer has an air reservoir.   The recording head according to claim 1, wherein a plurality of the air reservoirs are formed at predetermined intervals in the arrangement direction of the heat generating elements.   A recording apparatus comprising: the recording head according to claim 1; and a transport unit that transports a recording medium.

Images