JP2011014671A - Metal-ceramic circuit board with terminal, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive and high-reliable metal-ceramic circuit board with a terminal in which the terminal is attached to the metal-ceramic circuit board without using solder, and to provide a method of manufacturing the metal-ceramic circuit board with the terminal.SOLUTION: A ceramic board is arranged in a ceramic board holding recess 22c. By cooling a first metal melt for solidification after pouring it into molds 22 and 24 so as to be in contact with both sides of the ceramic board, a metal circuit board is formed in a metal circuit board forming recess 24c, and one surface of the metal circuit board is directly joined to one surface of the ceramic board. At the same time, a metal base board is formed in a metal base board forming recess 22d and is directly joined to the other surface of the ceramic board. Thereafter, by cooling a second metal melt for solidification after pouring it so as to be in contact with the other surface of the metal circuit board in the mold, a terminal made of a second metal is formed in a terminal forming recess 24d and is directly joined to the other surface of the metal circuit board.

Description

  The present invention relates to a metal-ceramic circuit board with a terminal and a method for manufacturing the same, and more particularly to a metal-ceramic circuit board with a terminal in which a terminal is attached to a metal circuit board bonded to a ceramic substrate.

  In recent years, a metal-ceramic circuit board in which a metal circuit board is directly bonded to a ceramic board has been used as an insulating board for a high-reliability power module that controls a large current of an electric vehicle or a machine tool. In such a metal-ceramic circuit board, for example, in the so-called molten metal bonding method, after a ceramic substrate is placed in a mold, the molten metal is poured into the mold so as to come into contact with the ceramic substrate, and then cooled to melt the molten metal. Is produced by directly joining a metal circuit board to a ceramic substrate (see, for example, Patent Documents 1 and 2). When a power module is manufactured using such a metal-ceramic circuit board, a terminal made of copper or the like is soldered on the metal circuit board of the metal-ceramic circuit board.

JP 2002-76551 A (paragraph number 0015) Japanese Patent Laying-Open No. 2005-103560 (paragraph numbers 0008-0009)

  However, when a terminal is soldered onto a metal circuit board of a metal-ceramic circuit board, a large stress is generated in a lower portion of the metal circuit board to which the terminal is soldered, and there is a possibility that a crack may occur in the ceramic board. -There exists a problem that the reliability of a ceramic circuit board falls. In particular, when the metal circuit board of the metal-ceramic circuit board is an aluminum circuit board on which Ni plating is applied, when the copper terminal is soldered to the aluminum circuit board, the solder is eroded by the Ni plating and the Ni plating is peeled off. -There exists a problem that the reliability of a ceramic circuit board falls. Further, in order to solder the terminals on the metal circuit board of the metal-ceramic circuit board, a solder material and a soldering cost are required, and a manufacturing cost is increased.

  In recent years, it has been desired to make solder Pb-free due to environmental problems, and it is also desirable to use Pb-free solder when soldering terminals onto a metal circuit board of a metal-ceramic circuit board. . However, when soldering must be performed using high-temperature solder, an alternative material for Pb-free solder having characteristics equal to or higher than that of conventional high-temperature solder has not been developed, and thus it is difficult to make Pb-free. .

  Therefore, in view of such a conventional problem, the present invention provides an inexpensive and highly reliable metal-ceramic circuit board with a terminal in which terminals are attached to a metal-ceramic circuit board without using solder, and a method for manufacturing the same. The purpose is to provide.

  As a result of diligent research to solve the above problems, the present inventors have formed a metal circuit board in a mold and directly bonded it to a ceramic substrate, and then formed terminals in the mold to form a metal circuit board. By directly joining, or when forming a metal circuit board in a mold and joining it directly to a ceramic substrate, the terminals are directly joined to the metal circuit board, so that the metal-ceramic circuit board can be used without using solder. It has been found that an inexpensive and highly reliable metal-ceramic circuit board with a terminal to which a terminal is attached can be manufactured, and the present invention has been completed.

  That is, in the method for manufacturing a metal-ceramic circuit board with terminals according to the present invention, a ceramic substrate is placed in a mold, and a molten metal of the first metal is poured so as to contact one surface of the ceramic substrate in the mold. After that, the molten metal of the first metal is cooled and solidified to form a metal circuit board on one surface of the ceramic substrate and to directly join one surface of the metal circuit board. After pouring the second metal melt so as to contact the other surface of the metal circuit board, the second metal melt is cooled and solidified, whereby the second surface of the metal circuit board is placed on the other surface. A metal terminal is formed and directly bonded.

  Also, the method of manufacturing a metal-ceramic circuit board with terminals according to the present invention includes disposing a ceramic substrate in a mold and pouring a first metal melt so as to contact both surfaces of the ceramic substrate in the mold. By cooling and solidifying the molten metal of the first metal, a metal circuit board is formed on one surface of the ceramic substrate, and one surface of the metal circuit plate is directly bonded to the other surface of the ceramic substrate. A metal member is formed on the metal member, the metal member is directly joined, and after that, a second metal melt is poured so as to contact the other surface of the metal circuit board in the mold, and then the second metal melt By cooling and solidifying, a terminal made of the second metal is formed on the other surface of the metal circuit board and directly bonded.

  In the above method for producing a metal-ceramic circuit board with a terminal, the first metal hot water is preferably a molten aluminum or aluminum alloy. The second metal is preferably a metal having a melting point lower than that of the first metal, and is preferably aluminum or an aluminum alloy having a melting point lower than that of the first metal.

  In addition, the method for manufacturing a metal-ceramic circuit board with a terminal according to the present invention places a ceramic substrate and a terminal (preferably apart from each other) in a mold and makes contact with one surface of the ceramic substrate in the mold and the terminal. After pouring the molten metal in this way, the molten metal is cooled and solidified to form a metal circuit board on one surface of the ceramic substrate and directly bond one surface of the metal circuit board, A terminal is directly joined to a metal circuit board (preferably the other surface).

  Furthermore, in the method for manufacturing a metal-ceramic circuit board with a terminal according to the present invention, the ceramic substrate and the terminal are arranged (preferably separated from each other) in the mold, and the both sides of the ceramic substrate in the mold are in contact with the terminal. After pouring the molten metal, the molten metal is cooled and solidified to form a metal circuit board on one surface of the ceramic substrate and directly bond one surface of the metal circuit board to the other surface of the ceramic substrate. A metal member is formed on this surface and the metal member is directly bonded, and a terminal is directly bonded to the metal circuit board (preferably the other surface).

  In the method for producing a metal-ceramic circuit board with a terminal, the molten metal is preferably a molten aluminum or an aluminum alloy, and the terminal is preferably made of a metal having a melting point higher than that of the molten metal.

  Further, in the metal-ceramic circuit board with a terminal according to the present invention, one surface of the metal circuit board is directly bonded to one surface of the ceramic substrate, and the terminal is directly bonded to the metal circuit board (preferably the other surface). It is characterized by that.

  In this metal-ceramic circuit board with terminals, the metal circuit board is preferably made of aluminum or an aluminum alloy. The terminal can be bonded to a metal circuit board (preferably the other surface) without using solder, and is preferably made of a metal having higher strength than the metal circuit board. In addition, when the terminal is formed after the metal circuit board is formed and directly bonded to the ceramic substrate, the terminal is preferably made of a metal having a melting point lower than that of the metal circuit board. When the terminal is directly bonded to the metal circuit board when the circuit board is formed and directly bonded to the ceramic substrate, the terminal is preferably made of a metal having a melting point higher than that of the metal circuit board.

  In the metal-ceramic circuit board with terminals described above, it is preferable that a metal member made of the same aluminum or aluminum alloy as the metal circuit board is directly bonded to the other surface of the ceramic board.

  According to the present invention, it is possible to manufacture an inexpensive and highly reliable metal-ceramic circuit board with terminals in which terminals are attached to a metal-ceramic circuit board without using solder.

It is a perspective view of 1st Embodiment of the metal-ceramics circuit board with a terminal by this invention. It is a top view of the metal-ceramics circuit board with a terminal of FIG. 1A. It is IC-IC sectional view taken on the line of FIG. 1B. It is a perspective view of the casting_mold | template used for manufacture of the metal-ceramics circuit board with a terminal of FIG. 1A. 1D is a plan view of the mold of FIG. 1D. FIG. It is IF-IF sectional view taken on the line of FIG. 1E. 1D is a plan view of a lower mold member of the mold of FIG. 1D. FIG. It is a perspective view of the 1st modification of the metal-ceramics circuit board with a terminal of FIG. 1A. It is a top view of the metal-ceramics circuit board with a terminal of FIG. 2A. It is the IIC-IIC sectional view taken on the line of FIG. 2B. It is a perspective view of the casting_mold | template used for manufacture of the metal-ceramics circuit board with a terminal of FIG. 2A. It is a top view of the casting_mold | template of FIG. 2D. It is the IIF-IIF sectional view taken on the line of FIG. 2E. It is a top view of the lower mold member of the mold of FIG. 2D. It is a perspective view of the 2nd modification of the metal-ceramics circuit board with a terminal of FIG. 1A. It is a top view of the metal-ceramics circuit board with a terminal of FIG. 3A. It is the IIIC-IIIC sectional view taken on the line of FIG. 3B. It is a perspective view of the casting_mold | template used for manufacture of the metal-ceramics circuit board with a terminal of FIG. 3A. It is a top view of the casting_mold | template of FIG. 3D. It is the IIIF-IIIF sectional view taken on the line of FIG. 3E. It is a top view of the lower mold member of the mold of FIG. 3D. It is a perspective view of 2nd Embodiment of the metal-ceramics circuit board with a terminal by this invention. It is a top view of the metal-ceramics circuit board with a terminal of FIG. 4A. It is the IVC-IVC sectional view taken on the line of FIG. 4B. It is a perspective view of the casting_mold | template used for manufacture of the metal-ceramics circuit board with a terminal of FIG. 4A. It is a top view of the casting_mold | template of FIG. 4D. It is the IVF-IVF sectional view taken on the line of FIG. 4E. FIG. 4D is a plan view of the lower mold member of the mold of FIG. 4D. It is a perspective view of the 1st modification of the metal-ceramics circuit board with a terminal of FIG. 4A. It is a top view of the metal-ceramics circuit board with a terminal of FIG. 5A. It is the VC-VC sectional view taken on the line of FIG. 5B. It is a perspective view of the casting_mold | template used for manufacture of the metal-ceramics circuit board with a terminal of FIG. 5A. It is a top view of the casting_mold | template of FIG. 5D. It is the VF-VF sectional view taken on the line of FIG. 5E. 5D is a plan view of the lower mold member of the mold of FIG. 5D. FIG. It is a perspective view of the 2nd modification of the metal-ceramics circuit board with a terminal of FIG. 4A. It is a top view of the metal-ceramics circuit board with a terminal of FIG. 6A. It is the VIC-VIC sectional view taken on the line of FIG. 6B. It is a perspective view of the casting_mold | template used for manufacture of the metal-ceramics circuit board with a terminal of FIG. 6A. It is a top view of the casting_mold | template of FIG. 6D. It is the VIF-VIF sectional view taken on the line of FIG. 6E. FIG. 6D is a plan view of the lower mold member of the mold of FIG. 6D.

  Embodiments of a metal-ceramic circuit board with a terminal and a method for manufacturing the same according to the present invention will be described below with reference to the accompanying drawings.

[First Embodiment]
1A to 1C show a first embodiment of a metal-ceramic circuit board with a terminal according to the present invention, and FIGS. 1D to 1G show a mold for manufacturing the metal-ceramic circuit board with a terminal. ing.

  As shown in FIGS. 1A to 1C, the metal-ceramic circuit board with terminals of the present embodiment includes a ceramic substrate 10, a heat-dissipating metal base plate 12 directly bonded to one surface of the ceramic substrate 10, and ceramics. The metal circuit board 14 is directly bonded to the other surface of the substrate 10 and the terminals 16 are directly bonded to the metal circuit board 14. The terminal 16 of the metal-ceramic circuit board with a terminal according to the present embodiment is made of a metal having a higher strength than the metal circuit board 14, and is a substantially square pillar extending vertically upward from one longitudinal end of the upper surface of the metal circuit board 14. Has a shape.

  Direct bonding between the ceramic substrate 10 and the heat radiating metal base plate 12, between the ceramic substrate 10 and the metal circuit board 14, and between the metal circuit board 14 and the terminal 16 can be performed by a so-called melt bonding method. For example, it is performed by pouring a molten metal into a mold 20 composed of a lower mold member 22 and an upper mold member 24 as shown in FIGS. 1D to 1G and cooling it.

  The lower mold member 22 includes a bottom surface portion 22a having a substantially rectangular planar shape, and a side wall portion 22b extending vertically upward from a peripheral edge portion of the bottom surface portion 22a. A ceramic substrate housing recess 22c having substantially the same shape and size as the ceramic substrate 10 is formed on the upper surface of the bottom surface portion 22a of the lower mold member 22, and a heat radiating metal base is formed on the bottom surface of the ceramic substrate housing recess 22c. A metal base plate forming recess 22d having a shape and size substantially the same as the plate 12 is formed.

  The upper mold member 24 includes an upper surface portion 24a having a substantially rectangular planar shape, and a side wall portion 24b extending vertically downward from a peripheral edge portion of the upper surface portion 24a. On the bottom surface of the upper surface portion 24a of the upper mold member 24, a metal circuit plate forming recess 24c having a shape and size substantially equal to those of the metal circuit plate 14 is formed. A terminal forming recess 24d having a shape and size substantially equal to the terminal 16 is formed at one end in the longitudinal direction of the bottom surface of the metal circuit board forming recess 24c.

  In addition, a top 24 a of the upper mold member 24 is formed with a pouring port 24 e for pouring the molten metal into the mold 20 and a gas vent 24 f for venting the gas in the mold 20. The pouring port 24e communicates with one end in the longitudinal direction of the bottom surface of the metal circuit board forming recess 24c via the terminal forming recess 24d, and the vent hole 24f is connected to the other end in the longitudinal direction of the bottom surface of the metal circuit board forming recess 24c. Communicate.

  Further, when the upper mold member 24 and the lower mold member 22 are placed on the lower mold member 22 after the ceramic substrate 10 is accommodated in the ceramic substrate accommodating recess 22c, the metal circuit board is formed. In order to inject the molten metal from the metal circuit plate forming recess 24c of the upper mold member 24 to the metal base plate forming recess 22d of the lower mold member 22 by communicating between the forming recess 24c and the metal base plate forming recess 22d ( A melt flow path (not shown) is formed.

  The ceramic substrate 10 is housed in a ceramic substrate housing recess 22c of the lower mold member 22 of the mold 20 and placed in a furnace. The furnace is filled with an inert gas (for example, nitrogen gas) atmosphere, and the oxygen concentration is set to 10 ppm (for example, 10 ppm). The first metal melt (for example, molten aluminum or molten aluminum alloy) is poured from the pouring port 24e into the metal circuit board forming recess 24c while removing the oxide film, and the molten metal flow (not shown) The first metal melt is filled up to the metal base plate formation recess 22d through the path, and then cooled to solidify the first metal melt, whereby the ceramic substrate 10, the heat radiating metal base plate 12, and the metal A metal-ceramic circuit board in which the circuit board 14 is integrally bonded is manufactured, and then the second melting point is lower than that of the first metal from the pouring port 24e. By pouring molten metal of the genus (for example, molten aluminum or aluminum alloy having a composition different from that of the first metal) into the terminal forming recess 24d, and then cooling to solidify the molten metal of the second metal The metal-ceramic circuit board with terminals can be manufactured by directly joining the terminals 16 to the metal circuit board 14.

  Before the molten metal of the first metal is poured into the mold 20, in order to reduce the temperature difference between the molten metal of the mold 20 and the first metal, the mold 20 is preheated and the thermal shock during the pouring is performed. Is preferably small. Further, when pouring the second metal melt from the pouring port 24e, a part of the pouring port 24e can be used with a vent hole.

(First modification)
2A to 2C show a first modification of the metal-ceramic circuit board with a terminal of the present embodiment, and FIGS. 2D to 2G show a mold for manufacturing the metal-ceramic circuit board with a terminal. Show. Since the metal-ceramic circuit board with terminals of this modification has substantially the same configuration as the metal-ceramic circuit board with terminals of FIG. 1A except for the shape of the terminals, 100 is added to the reference numerals of the same parts. The description is omitted.

  The terminal 116 of the metal-ceramic circuit board with terminals of the present modification includes a first vertical portion having a substantially quadrangular prism shape extending vertically upward from one longitudinal end portion of the upper surface of the metal circuit board 114, and the first vertical portion. And a horizontal portion having a substantially quadrangular prism shape extending substantially parallel to the metal circuit board 114 from the front end thereof.

(Second modification)
FIGS. 3A to 3C show a second modification of the metal-ceramic circuit board with terminals of the present embodiment, and FIGS. 3D to 3G show a mold for manufacturing the metal-ceramic circuit board with terminals. Show. The metal-ceramic circuit board with terminals of this modification is the same as the metal-ceramic circuit board with terminals of FIG. 1A except that bumps 216 are provided as substantially cylindrical terminals (electrodes) having low height instead of the terminals 16 Since they have substantially the same configuration, 200 is added to the reference numerals of the same parts, and the description thereof is omitted.

  Thus, in the method for manufacturing a metal-ceramic circuit board with a terminal according to the present embodiment, by changing the shape of the terminal-forming recess of the mold, solder is not used (and the terminal connection portion is plated with Ni or the like). Various types of terminals can be attached to the metal-ceramic circuit board (unnecessarily) to produce a low-cost and highly reliable metal-ceramic circuit board with terminals.

  In the metal-ceramic circuit board with terminals of the present embodiment, the terminals are made of a material having sufficient strength (hardness) and the metal circuit board is made of a soft material, thereby reducing the thermal stress generated in the ceramics board. Therefore, it is preferable that the metal circuit board is made of aluminum or an aluminum alloy having a Vickers hardness HV25 to 40 and the terminal is made of aluminum or an aluminum alloy having a Vickers hardness HV50 or more.

[Second Embodiment]
4A to 4C show a second embodiment of a metal-ceramic circuit board with a terminal according to the present invention, and FIGS. 4D to 4G show a mold for manufacturing the metal-ceramic circuit board with a terminal. ing.

  As shown in FIGS. 4A to 4C, the metal-ceramic circuit board with terminals of the present embodiment includes a ceramic substrate 310, a heat-dissipating metal base plate 312 directly bonded to one surface of the ceramic substrate 310, and ceramics. A metal circuit board 314 directly bonded to the other surface of the substrate 310 and a terminal 316 directly bonded to the metal circuit board 314 are configured. The terminal 316 of the metal-ceramic circuit board with terminal of the present embodiment is made of a metal such as copper or copper alloy having a melting point higher than that of the metal circuit board 314, and is vertically upward from one longitudinal end of the upper surface of the metal circuit board 314. It has the shape of a substantially quadrangular prism extending in the direction.

  Direct bonding between the ceramic substrate 310 and the heat radiating metal base plate 312, between the ceramic substrate 310 and the metal circuit board 314, and between the metal circuit board 314 and the terminal 316 can be performed by a so-called melt bonding method. For example, it is performed by pouring a molten metal into a mold 320 composed of a lower mold member 322 and an upper mold member 324 as shown in FIGS. 4D to 4G and cooling it. 4D to 4F show a state in which the terminals 316 are arranged on the mold 320. FIG.

  The lower mold member 322 includes a bottom surface portion 322a having a substantially rectangular planar shape, and a side wall portion 322b extending vertically upward from the peripheral edge portion of the bottom surface portion 322a. A ceramic substrate housing recess 322c having substantially the same shape and size as the ceramic substrate 310 is formed on the upper surface of the bottom surface portion 322a of the lower mold member 322, and a heat radiating metal base is formed on the bottom surface of the ceramic substrate housing recess 322c. A metal base plate forming recess 322d having a shape and size substantially the same as the plate 312 is formed.

  The upper mold member 324 includes an upper surface portion 324a having a substantially rectangular planar shape, and a side wall portion 324b extending vertically downward from a peripheral edge portion of the upper surface portion 324a. On the bottom surface of the upper surface portion 324a of the upper mold member 324, a metal circuit board forming recess 324c having a shape and size substantially the same as the metal circuit board 314 is formed.

  In addition, a top 324 a of the upper mold member 324 is formed with a pouring port 324 e for pouring the molten metal into the mold 320 and a gas vent hole 324 f for venting the gas in the mold 320. The pouring port 324e communicates with one end in the longitudinal direction of the bottom surface of the metal circuit board forming recess 324c, and the vent hole 324f communicates with the other end in the longitudinal direction of the bottom surface of the metal circuit plate forming recess 324c. A part of the pouring port 324e serves as a terminal accommodating part that accommodates a part of the terminal 316 so that the terminal 316 extends from one end in the longitudinal direction of the bottom surface of the metal circuit board forming recess 324c along the pouring port 324e. Also has a role.

  Further, when the upper mold member 324 is placed on the lower mold member 322 after the ceramic substrate 310 is accommodated in the ceramic substrate accommodation recess 322c, the upper mold member 324 and the lower mold member 322 have a metal circuit board. In order to inject the molten metal from the metal circuit plate forming recess 324c of the upper mold member 324 to the metal base plate forming recess 322d of the lower mold member 322 by communicating between the forming recess 324c and the metal base plate forming recess 322d ( A melt flow path (not shown) is formed.

  The ceramic substrate 310 is accommodated in the ceramic substrate accommodating recess 322c of the lower mold member 322 of the mold 320, the terminal 316 is disposed in a part of the terminal accommodating portion of the pouring port 324e, and is placed in the furnace. An oxygen gas is reduced (for example, to 10 ppm or less) in an inert gas (for example, nitrogen gas) atmosphere, and a molten metal (for example, a molten aluminum or molten aluminum alloy) is formed in the metal circuit board formation recess 324c from the pouring port 324e. The ceramic substrate 10 and the heat-dissipating metal are melted by filling the molten metal up to the metal base plate formation recess 322d through a molten metal flow path (not shown) and then cooling to solidify the molten metal. Metal-ceramic circuit board with terminals in which base plate 12, metal circuit board 14 and terminals 16 are integrally joined It can be produced.

  Before pouring the molten metal into the mold 320, it is preferable to reduce the thermal shock during pouring by preheating the mold 20 in order to reduce the temperature difference between the mold 20 and the molten metal. Moreover, when pouring a molten metal from the pouring port 24e, a part of the pouring port 24e can also be used with a vent hole.

(First modification)
5A to 5C show a first modification of the metal-ceramic circuit board with terminals of the present embodiment, and FIGS. 5D to 5G show a mold for manufacturing the metal-ceramic circuit board with terminals. Show. Since the metal-ceramic circuit board with terminals of this modification has substantially the same configuration as the metal-ceramic circuit board with terminals of FIG. 4A except for the shape of the terminals, 100 is added to the reference numerals of the same parts. The description is omitted.

  The terminal 416 of the metal-ceramic circuit board with terminals of the present modification includes a first vertical portion having a substantially quadrangular prism shape extending vertically upward from one longitudinal end portion of the upper surface of the metal circuit board 414, and the first vertical portion. A substantially rectangular column-shaped horizontal portion extending substantially parallel to the metal circuit board 414 from the front end thereof, and a substantially rectangular column-shaped second vertical portion extending substantially parallel to the first vertical portion from the front end of the horizontal portion. Yes.

(Second modification)
6A to 6C show a second modification of the terminal-equipped metal-ceramic circuit board according to the present embodiment, and FIGS. 6D to 6G show a mold for manufacturing the terminal-equipped metal-ceramic circuit board. Show. The metal-ceramics circuit board with terminals of this modification is the same as the metal-ceramics circuit board with terminals of FIG. 4A except that bumps 516 are provided as substantially cylindrical terminals (electrodes) having a low height instead of the terminals 316. Since they have substantially the same configuration, 200 is added to the reference numerals of the same parts, and the description thereof is omitted.

  Thus, in the manufacturing method of the metal-ceramic circuit board with a terminal according to the present embodiment, the shape of the terminal (and the shape of the terminal accommodating portion as necessary) is changed in a part of the terminal accommodating portion of the pouring gate. By doing so, it is possible to attach various shapes of terminals to the metal-ceramic circuit board without using solder (and to eliminate the need for plating of Ni or the like at the terminal connection portion), and to provide an inexpensive and highly reliable metal-ceramic circuit with terminals. A substrate can be manufactured.

  In the metal-ceramic circuit board with terminals of the present embodiment, the terminals are made of a material having sufficient strength (hardness) and the metal circuit board is made of a soft material, thereby reducing the thermal stress generated in the ceramics board. Therefore, it is preferable that the metal circuit board is made of aluminum or an aluminum alloy having a Vickers hardness HV25 to 40, and the terminal is made of a metal having a Vickers hardness HV50 or more.

10, 110, 210, 310, 410, 510 Ceramic substrate 12, 112, 212, 312, 412, 512 Metal base plate for heat dissipation 14, 114, 214, 314, 414, 514 Metal circuit board 16, 116, 216, 316 416, 516 terminal 20, 120, 220, 320, 420, 520 mold 22, 122, 222, 322, 422, 522 lower mold member 24, 124, 224, 324, 424, 524 upper mold member 22a, 122a, 222a, 322a, 422a, 522a Bottom surface portion 22b, 122b, 222b, 322b, 422b, 522b Side wall portion 22c, 122c, 222c, 322c, 422c, 522c Ceramic substrate receiving recess 22d, 122d, 222d, 322d, 422d, 522d Metal base Plate formation recesses 24a, 124a, 224a, 324a, 424a, 524a Upper surface portions 24b, 124b, 224b, 324b, 424b, 524b Side wall portions 24c, 124c, 224c, 324c, 424c, 524c Metal circuit plate formation recesses 24d, 124d, 224d Terminal forming recess 24e, 124e, 224e, 324e, 424e, 524e Pouring port 24f, 124f, 224f, 324f, 424f, 524f Gas vent hole

Claims (16)

By placing a ceramic substrate in a mold, pouring a molten metal of the first metal so as to contact one surface of the ceramic substrate in the mold, and then cooling and solidifying the molten metal of the first metal The metal circuit board is formed on one surface of the ceramic substrate, and one surface of the metal circuit board is directly joined, and then the second metal is contacted with the other surface of the metal circuit board in the mold. After the molten metal is poured, the second metal melt is cooled and solidified, thereby forming a terminal made of the second metal on the other surface of the metal circuit board and directly joining it, Manufacturing method of metal-ceramic circuit board with terminal. A ceramic substrate is disposed in a mold, and after pouring a molten metal of the first metal so as to contact both surfaces of the ceramic substrate in the mold, the molten metal of the first metal is cooled and solidified. Forming a metal circuit board on one side of the substrate and directly bonding one surface of the metal circuit board, forming a metal member on the other surface of the ceramic substrate and directly bonding the metal member, The second metal melt is poured so as to contact the other surface of the metal circuit board in the mold, and then the second metal melt is cooled and solidified, so that the other surface of the metal circuit board is placed on the other surface. A method of manufacturing a metal-ceramic circuit board with a terminal, wherein a terminal made of a second metal is formed and directly joined. The method for producing a metal-ceramic circuit board with a terminal according to claim 1 or 2, wherein the first metal is aluminum or an aluminum alloy. 4. The method for manufacturing a metal-ceramic circuit board with a terminal according to claim 1, wherein the second metal is a metal having a melting point lower than that of the first metal. 4. The method for manufacturing a metal-ceramic circuit board with a terminal according to claim 1, wherein the second metal is aluminum or an aluminum alloy having a melting point lower than that of the first metal. A ceramic substrate and a terminal are arranged in a mold, and after pouring a molten metal so as to be in contact with one surface of the ceramic substrate and the terminal in the mold, the molten metal is cooled and solidified. A metal-ceramic circuit board with a terminal, characterized in that a metal circuit board is formed on one side and one side of the metal circuit board is directly joined, and a terminal is directly joined to the metal circuit board. Method. By placing the ceramic substrate and terminals in the mold, pouring the molten metal in contact with both sides of the ceramic substrate and the terminals in the mold, and then cooling and solidifying the molten metal, A metal circuit board is formed on the surface, one surface of the metal circuit board is directly bonded, a metal member is formed on the other surface of the ceramic substrate, the metal member is directly bonded, and a terminal is connected to the metal circuit board. A method for producing a terminal-attached metal-ceramic circuit board, wherein: The method of manufacturing a metal-ceramic circuit board with a terminal according to claim 6 or 7, wherein the molten metal is a molten aluminum or aluminum alloy. The method for producing a metal-ceramic circuit board with a terminal according to any one of claims 6 to 8, wherein the terminal is made of a metal having a melting point higher than that of the molten metal. A metal-ceramic circuit board with a terminal, wherein one surface of a metal circuit board is directly bonded to one surface of the ceramic substrate, and a terminal is directly bonded to the metal circuit board. The metal-ceramic circuit board with a terminal according to claim 10, wherein the metal circuit board is made of aluminum or an aluminum alloy. The metal-ceramic circuit board with a terminal according to claim 10 or 11, wherein the terminal is joined to the metal circuit board without using solder. 13. The metal-ceramic circuit board with a terminal according to claim 10, wherein the terminal is made of a metal having a higher strength than the metal circuit board. The metal-ceramic circuit board with a terminal according to any one of claims 10 to 13, wherein the terminal is made of a metal having a melting point lower than that of the metal circuit board. The metal-ceramic circuit board with a terminal according to any one of claims 10 to 13, wherein the terminal is made of a metal having a melting point higher than that of the metal circuit board. The metal with terminal according to any one of claims 10 to 15, wherein a metal member made of the same aluminum or aluminum alloy as the metal circuit board is directly bonded to the other surface of the ceramic substrate. -Ceramic circuit board.

Images