JP2011009533A - Pin structure of pin insertion component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure a solder supply amount to attain favorable and high-quality soldering to increase reliability of mounting in soldering a pin insertion component by a reflow process.SOLUTION: A pin structure 10 includes a pin body 11 mountable to the pin insertion component 1, a plate 12 pivotally supported while it radially protrudes centering on the pin body 11 at an axial predetermined position of the pin body 11, and solder 13 which is integrally attached to a lower surface 12a of the plate 12 in opposition to its pin insertion component 1 side via a flux material 14. The plate 12 and the solder 13 are disposed between the pin insertion component 1 and a printed wiring board 2 with the pin body 11 inserted into a through-hole 3.

Description

  The present invention relates to a pin structure of a pin insertion component for securing a solder supply amount and improving joint reliability.

  In recent years, as an electronic component mounting method, instead of soldering the wiring directly to the component lead, the lead terminal of the lead component or the pin of the pin insertion component is inserted into the through hole of the printed wiring board, and the through hole Solder is sprayed on the leads or pins protruding from the opposite side, that is, the back surface of the printed wiring board, and flow soldering is performed collectively. Furthermore, a surface mounting method is mainly used in which a solder paste is printed on an arbitrary electrode on the surface of the substrate, and component mounting and reflow soldering are performed.

  However, there are cases where pin insertion components such as large components that cannot be surface-mounted or components that require sufficient bonding strength for insertion / extraction are mixed with surface-mount components. In such a case, the surface mounting component and the pin insertion component are separated from each other. After surface mounting, the pin insertion component is individually mounted and flow soldered, or the pin insertion component is individually soldered manually. However, having two production lines such as reflow soldering and soldering by flow soldering or manual reflow soldering leads to an increase in cost. Therefore, for example, Patent Document 1 discloses a technique for mounting a pin insertion component by reflow soldering.

  In Patent Document 1, a ring solder is inserted into a connector pin inserted through a through hole at a position opposite to the connector of the printed wiring board, a washer is inserted, and the solder is pressed against the printed wiring board by the washer. By soldering in the form, the solder spreads on the pins protruding from the through holes, and the cross-sectional size of the pins prevents the pin from protruding from the through holes from being used as a connector. A connector mounting method that secures supply is disclosed.

  By the way, in the mounting of the pin insertion component by the reflow process as described above, it is necessary to supply an appropriate amount of solder, calculate the amount of solder necessary for solder joining, and determine the printing amount of the solder paste. Yes. Then, by printing the solder paste on the through-hole land using a printing mask, an amount of solder paste calculated from the opening area and the mask thickness of the solder paste printing mask is printed on the printed wiring board. A certain amount of solder paste correlated with the through-hole diameter is secured inside the through-hole. From this, the amount of solder by printing supply can be estimated in advance, and the increase or decrease with respect to the required amount of solder should adopt a printing method by so-called overprinting that prints out the land diameter of the through hole on the printed wiring board. In general, the adjustment is made according to the mask opening area.

Japanese Patent No. 2542657

However, the conventional surface mounting method for electronic components has the following problems.
That is, in the past, the amount of solder supplied was adjusted by using overprint that protrudes from the land and supplied onto the board. However, if there are multiple through holes, the through holes in the inner rows are used. Since the hole is surrounded by other through holes, it is impossible to adjust the amount of solder supplied by overprinting, and the inner row has a problem that the amount of solder necessary for overprinting is insufficient.

In addition, even in the outermost through hole that is considered to be relatively easy to overprint, when the position of the adjacent component bonding pad becomes closer due to high density, the overprint is applied to the electrode of the other adjacent component, There are cases where overprinting is not possible.
Further, even if printing is possible, the solder melted during reflow heating wets the pins, resulting in a problem that the amount of solder that should originally be used for joining is insufficient.

  Furthermore, in Patent Document 1 described above, a mounting method that prevents the solder from getting wet and supplies the solder is required. However, it is necessary to supply solder or a washer from the back surface of the printed wiring board after mounting the components. Therefore, a separate work process for supplying the solder and the washer is required, and soldering is performed separately, and the original purpose of mounting the pin insertion component in the surface mounting process cannot be achieved.

  The present invention has been made in view of the above-mentioned problems, and when soldering pin insertion parts by a reflow process, by securing the amount of solder supply, good and high-quality soldering can be performed, An object of the present invention is to provide a pin structure of a pin insertion component capable of improving reliability.

  In order to achieve the above object, in the pin structure of the pin insertion component according to the present invention, when the pin insertion component is mounted on the printed wiring board, the pin insertion component is inserted into the through hole of the printed wiring board and soldered. A pin body that can be mounted on a pin insertion component, a plate that is pivotally supported in a state of projecting in a radial direction around the pin body at a predetermined position in the axial direction of the pin body, Solder integrally provided via an adhesive layer on the lower surface opposite to the pin insertion component side, and the plate and the solder, with the pin body inserted into the through hole, the pin insertion component and the printed wiring It is characterized by being arranged between the plates.

According to the pin structure of the pin insertion component of the present invention, when the pin insertion component is soldered by the reflow process, the plate acts as a barrier and restricts the leakage of the solder to the pin body. The solder is not wet and spreads, and the solder provided on the pin body can be effectively and sufficiently supplied into the through hole of the printed wiring board, and the solder supply amount into the through hole is prevented from decreasing. be able to. Therefore, even if it is a printed wiring board with multiple through-holes, it is possible to reliably mount electronic components without adopting overprinting, and to ensure a sufficient amount of solder supply. The mounting reliability can be improved.
Also, during the reflow process, since a plate and solder are provided between the pin insertion component and the printed wiring board and a space is formed, it becomes possible to make it easy to flow the heated air that is forced convection by heating. Bad attachment can be suppressed.

It is a perspective view of the pin insertion component provided with the pin structure by the 1st Embodiment of this invention. It is side sectional drawing which shows the state which mounts a pin insertion component in a printed wiring board. It is a side view of the pin structure shown in FIG. It is the perspective view which abbreviate | omitted the pin main body of the pin structure shown in FIG. It is a side view of the pin structure shown in FIG. It is the sectional view on the AA line shown in FIG. (A)-(c) is a figure explaining the process at the time of reflow soldering. It is a perspective view of the pin insertion component provided with the pin structure by 2nd Embodiment, Comprising: It is a figure corresponding to FIG. It is a side view of the pin structure shown in FIG. It is a perspective view of the pin insertion component provided with the pin structure by 3rd Embodiment, Comprising: It is a figure corresponding to FIG. It is a side view of the pin structure shown in FIG. It is a side view which shows the pin structure by 4th Embodiment. It is a top view shown in FIG. It is a perspective view of the pin insertion component provided with the pin structure by 5th Embodiment.

Hereinafter, the pin structure of the pin insertion component according to the first embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the pin insertion component 1 according to the first embodiment includes a plurality of pin structures 10, 10,... And a through hole 3 formed in the printed wiring board 2. The pin structure 10 is inserted through and reflow soldered together with the ring solder 4 to be mounted at a predetermined position on the printed wiring board 2.
Here, the thickness direction of the printed wiring board 2 is the vertical direction, the pin insertion component 1 side is the upper side along the vertical direction, the opposite side is the lower side, and the axial direction of the pin structure 10 is the vertical direction. Hereinafter, the direction perpendicular to the central axis of the pin structure 10 in the state of the pin structure 10 will be described as the radial direction.

  As shown in FIGS. 2 to 6, the pin structure 10 includes a pin main body 11 for soldering whose upper end 11 a is fixed to the pin insertion component 1, and the pin main body 11 at a predetermined position in the axial direction of the pin main body 11. A disk-shaped plate 12 that is pivotally supported in a state of projecting in the central radial direction, and a solder 13 that is integrally provided on a lower surface 12a of the plate 12 via a flux material 14 (adhesive layer). It is roughly structured. And the plate 12 and the solder 13 are located between the pin insertion component 1 and the printed wiring board 2 in the state which inserted the pin main body 11 in the through hole 3 (refer FIG. 2).

The plate 12 has a structure in which a circular hole 12b inserted through the pin body 11 is penetrated in the thickness direction at the center of the plate in a plan view, and functions as a barrier that restricts the wetting of the solder 13 during reflow heating. 13 is held at a predetermined position in the axial direction of the pin body 11. The plate 12 is made of a material having suitable elasticity such as silicone, polyimide, epoxy, PPE and the like and capable of holding the shape even at high temperature, and is fixed to the pin body 11 by its own elastic deformation. It has become.
For example, by setting the thickness of the plate 12 to about 0.05 mm to 0.2 mm, the solder wets up in a state where the shape is maintained around the pin body 11 even at a temperature of 230 ° C. or higher during reflow soldering. It is preferable that a barrier for preventing the above can be formed.

  The solder 13 has an external dimension that does not short-circuit with other pin bodies 11 arranged around it. For example, if the pin body 11 and the through hole 3 are combined, the shape of the cylindrical solder 13 has an outer diameter. Necessary for supplying solder equivalent to the volume of the clearance around the pin in the through hole 3 when the hole diameter of the central portion is φ1.0 mm and the board thickness of the printed wiring board 2 is 2.0 mm, for example. A cylindrical solder thickness of 0.25 mm is sufficient, and it can be easily formed by, for example, a pressing method or die pressing.

  Further, the position of the solder 13 fixed on the axis of the pin body 11 is a position that can secure a space S that does not crush the printed solder on the housing of the pin insertion part 1 or the back surface of the package. The printing thickness of the solder is larger than 0.1 mm to 0.3 mm, and a height that does not excessively increase the mounting height is required, so that the height of the solder 13 can be secured, for example, about 0.5 mm to 5 mm. Is preferable. That is, by adopting a shape composed of the plate 12 and the solder 13 that can secure this height, the structure is such that heated air by forced convection during reflow soldering can easily flow into the bottom surface 1a of the pin insertion component 1. ing.

  The flux material 14 that adheres and holds the solder 13 to the plate 12 is a material that contains a large amount of rosin (pine resin), has adhesiveness that is used for mounting a solder ball, and has a large volatilization of the solvent. A material that can easily protect the surface of the solder 13 that is easily oxidized is employed.

  That is, the pin structure 10 is manufactured by, for example, bonding the polyimide film or the like after pressing with a flux material 14 having tackiness such as thermoplastic polyimide, and then pressing and molding the polyimide film in the same manner. can do.

Next, a method of mounting the pin insertion component 1 on the printed wiring board 2 by soldering by a reflow process and an operation of the pin structure 10 will be described.
As shown in FIGS. 7A to 7C, first, the pin body 11 of the pin structure 10 is inserted into the ring solder 4 arranged in advance in the through hole 3 of the printed wiring board 2 (FIG. 7A). And (b)) When the solder 13 provided at a predetermined position of the pin main body 11 is heated by reflow soldering, the solder 13 is melted by this heating, and the periphery of the pin main body 11 is caused by gravity and surface tension and below it. Since the solder 13 is additionally supplied to the ring solder 4 and spreads to the through-holes 3 and the land of the through-holes (FIG. 7C), good soldering can be performed and high-quality manufacturing can be performed. .

  At this time, as shown in FIG. 7C, the plate 12 serves as a barrier and restricts the leakage of the solder 13 to the pin body 11, so that the solder 13 does not spread above the plate 12. Therefore, the solder 13 provided in the pin main body 11 can be effectively and sufficiently supplied into the through hole 3, and a decrease in the amount of solder supplied into the through hole 3 can be prevented.

  Further, as shown in FIG. 2, since the plate 12 and the solder 13 fixed to the pin body 11 are positioned on the bottom surface 1a of the pin insertion component 1, the pin structure 10 is inserted into the through hole 3. By adjusting the amount of pressing, the space S (see FIG. 7B) can be secured between the bottom surface 1a of the pin insertion component 1 and the printed wiring board 2, and during reflow soldering heating Heated air that is forced to convect can be made easier to flow. As a result, it is possible to reduce soldering defects.

  Further, in the present pin structure 10, the tip 13 b of the pin body 11 is pushed in while being adjusted so that it does not protrude greatly from the through hole 3, so that the solder 13 on the pin tip 11 b side (downside) of the printed wiring board 2 is Wetting and spreading can be prevented.

  Since the plate 12 and the solder 13 are integrally provided at a predetermined position of the pin body 11, particularly when the pin structure 10 is mounted on the bottom surface 1a of the pin insertion component 1 as in the present embodiment. Then, as described above, it is possible to sufficiently heat at the time of reflow soldering, and it is possible to secure the space S so as not to crush the printed solder paste.

  Thus, in the pin structure 10 of the present embodiment, printing by overprinting cannot be performed, and the amount of solder is insufficient, so that it can be applied to a surface mounting method that has been impossible in the past, and the pin can be formed only by the surface mounting line. There is an effect that the insertion component 1 can be mounted.

As described above, according to the pin structure of the pin insertion component according to the first embodiment, when the pin insertion component 1 is soldered by the reflow process, the plate 12 serves as a barrier, and the pin body 11 Since the solder 13 is prevented from leaking upward from the plate 12, the solder 13 does not spread above the plate 12, and the solder 13 provided on the pin body 11 is effectively and sufficiently supplied into the through hole 3 of the printed wiring board 2. It is possible to prevent a decrease in the amount of solder supplied into the through hole 3. Therefore, even if it is a printed wiring board having a plurality of through-holes 3, it is possible to reliably mount electronic components without employing overprinting, and to ensure a sufficient amount of solder supply, which is good and high quality. Soldering can be performed, and mounting reliability can be improved.
Further, during the reflow process, the plate 12 and the solder 13 are provided between the pin insertion component 1 and the printed wiring board 2 and the space S is formed. It is possible to suppress soldering defects.

  Next, another embodiment of the present invention will be described with reference to the drawings. However, the same or similar members and parts as those of the above-described first embodiment are denoted by the same reference numerals, and description thereof is omitted. The configuration will be described.

As shown in FIGS. 8 and 9, the pin structure 20 according to the second embodiment has a plate 22 that is a barrier to the wetting of the solder 23 provided on the pin main body 21 and a protrusion 25 that extends downward. It is. The configuration of the pin main body 21, the plate 22, the solder 23, the flux material 24, and the like is the same as the configuration of the first embodiment described above, and thus detailed description thereof is omitted in this embodiment.
In the present pin structure 20, when the pin insertion component 1 is attached to the pin structure 20 and mounted on the printed wiring board 2, the lower surface 25 a of the protrusion 25 abuts on the upper surface 2 a of the printed wiring board 2, The pin insertion component 1 is positioned with respect to the printed wiring board 2. That is, a space S corresponding to the height dimension of the protrusion 25 can be secured between the bottom surface 1a of the pin insertion component 1 and the printed wiring board 2, and air heated by reflow soldering can easily flow into the space S. In addition, the occurrence of defects due to soldering can be reduced.
The shape and size of the protrusion 25 are not limited to the shape of the second embodiment as long as the heated air can be easily introduced.

  Also, as shown in FIGS. 10 and 11, in the pin structure 30 according to the third embodiment, the shape of the solder 13 (see FIG. 1) of the first embodiment is changed, and from below. A solder 33 having a truncated cone shape with gradually increasing dimensions as it goes upward is provided. The solder 33 is thin and long with respect to the axial direction of the pin body 31. Thus, as in the second embodiment (see FIG. 9) described above, when the pin insertion component 1 is mounted on the printed wiring board 2, the lower surface 33a (FIG. 11) of the solder 33 is placed on the printed wiring board 2. The pin insertion component 1 is positioned with respect to the printed wiring board 2 in contact with the upper surface 2a. At this time, a space S corresponding to the height dimension of the bead-like solder 33 is secured between the bottom surface 1a of the pin insertion component 1 and the printed wiring board 2, so that heated air flows in the reflow soldering. It becomes easy and the generation | occurrence | production of the defect by soldering can be reduced.

  In the second and third embodiments described above, the diagram of the second embodiment ensures a space S between the bottom surface 1a of the pin insertion component 1 and the printed wiring board 2 and does not crush the printed solder. 8. Reflow soldering by adopting the plate 22 formed with the projection 25 shown in FIG. 9 and the bead-shaped solder 33 having the thin height shown in FIGS. 10 and 11 of the third embodiment. Heating becomes possible. This is because, in reflow heating, heat transfer due to radiation from the heater cannot be expected to the pin structure portion sandwiched between the printed wiring board 2 and the bottom surface 1a of the pin insertion component 1, whereas the printed wiring board 2 and the pin By securing a space between the bottom surface 1a of the insertion part, in addition to heat conduction from the substrate, heat transfer due to convection is further promoted, and the temperature is quickly raised to the soldering temperature.

  As shown in FIGS. 12 and 13, the pin structure 40 according to the fourth embodiment has a plate 42 and a solder 43 attached from the side of the pin body 41, and the outer periphery of the plate 42 and the solder 43. It is structured to be caulked from the side and fixed to the pin body 41. That is, the solder 43 provided on the lower surface of the plate 42 is substantially U-shaped in a plan view, and has an opening corresponding to the cross-sectional shape of the pin body 41 at a substantially central portion, and a U-shaped U-shape from the center of the opening. Cut the slit 41a on the open side of the pin, fit it so that the U-shaped open side contacts the pin main body 41 from the side, and abut the U-shaped tip to any position of the pin main body 41 from the side. The structure is fixed by closing.

Next, as shown in FIG. 14, the pin structure 50 according to the fifth embodiment has a structure in which a linear solder 53 is wound around and fixed to a pin body 51.
In the present pin structure 50, the plate 52 is fixed to the pin body 51 in advance and is used as a guide for the starting position of the linear solder 53. Then, with the plate 52 as a reference, the linear solder 53 is wound around and fixed to the pin body 51 in the manner of wire wrapping. By adjusting the number of turns of the linear solder 53, the necessary amount of solder can be easily adjusted.
Further, when it is determined that the winding force of the solder 53 is weak, it has a tack property such as flux at the position where the previously fixed plate 52 and the linear solder 53 are in contact with each other, and inhibits soldering. Alternatively, it is possible to apply and fix a material that functions as an adhesive.

The first to fifth embodiments of the pin structure of the pin insertion component according to the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and may be appropriately selected without departing from the scope of the present invention. It can be changed.
For example, in the first embodiment described above, the plate 12 has a structure in which the circular hole 12a corresponding to the size of the pin body 11 is provided. However, the present invention is not limited to this. It is also possible to adopt a structure in which a notch is radially cut into a predetermined length and held on the pin body 11 by elastic deformation of a plate made of an elastic member.

In the first embodiment, the flux material 14 is used as an adhesive layer for bonding the plate 12 and the solder 13, but the present invention is not limited to this and is a material having tackiness such as an adhesive. It doesn't matter.
Furthermore, as for the shape of the solder 13, both the plate 12 and the solder 13 can have a square cross section and other shapes as long as they can not be short-circuited with the adjacent pin body 11.

  In addition, in the pin structure according to the present embodiment, the solder melts due to heat transferred from the surface of the pin main body and the printed wiring board during the flow soldering to the pin main body even when the solder rises due to the flow soldering. Improves solder joint quality of pin insertion parts by assisting solder joints due to poor wetting and spreading of pins, ensuring the amount of solder in the through-hole, and preventing short-circuiting due to wetting up the pin body can do.

  In addition, in the range which does not deviate from the meaning of this invention, it is possible to replace suitably the component in above-mentioned embodiment with a well-known component, and you may combine each above-mentioned embodiment suitably.

DESCRIPTION OF SYMBOLS 1 Pin insertion part 1a Pin insertion part bottom face 2 Printed wiring board 2a Printed wiring board upper surface 3 Through hole 4 Ring solder 10, 20, 30, 40, 50 Pin structure 11, 21, 31, 41, 51 Pin main body 11a Pin upper end 11b Pin tip 12, 22, 32, 42, 52 Plate 12a Plate lower end 12b Plate hole 13, 23, 33, 43, 53 Solder 33a Solder bottom surface 14 Flux material (adhesive layer)
25 Projection 25a Projection bottom surface S Space

Claims (5)

When mounting the pin insertion component on the printed wiring board, the pin structure of the pin insertion component for soldering by inserting the through hole of the printed wiring board,
A pin body attachable to the pin insertion part;
A plate pivotally supported in a state of projecting in a radial direction around the pin body at a predetermined position in the axial direction of the pin body;
Solder integrally provided on the lower surface of the plate opposite to the pin insertion component side via an adhesive layer;
With
The pin structure of the pin insertion component, wherein the plate and the solder are arranged between the pin insertion component and the printed wiring board in a state where the pin body is inserted into the through hole.   The pin structure of the pin insertion part according to claim 1, wherein the adhesive layer is a flux material. The plate is provided with a protrusion extending downward,
The pin structure of the pin insertion component according to claim 1, wherein a lower end of the protrusion is positioned below the lower surface of the solder.   4. The solder according to claim 1, wherein the solder has a substantially U shape partially opened in a plan view, and is configured to be fitted to the pin body from the U-shaped opening. 5. Pin structure of the pin insertion component described in 1.   The pin structure of the pin insertion component according to any one of claims 1 to 3, wherein the solder has a configuration in which a linear solder is wound around the pin body.

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