JP2011000884A - 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール - Google Patents

適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール Download PDF

Info

Publication number
JP2011000884A
JP2011000884A JP2010123934A JP2010123934A JP2011000884A JP 2011000884 A JP2011000884 A JP 2011000884A JP 2010123934 A JP2010123934 A JP 2010123934A JP 2010123934 A JP2010123934 A JP 2010123934A JP 2011000884 A JP2011000884 A JP 2011000884A
Authority
JP
Japan
Prior art keywords
flexible
heat transfer
layer
heat
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010123934A
Other languages
English (en)
Japanese (ja)
Inventor
Richard F Hill
エフ．ヒル リチャード
Robert Michael Smythe
マイケル スマイズ ロバート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/486,456 external-priority patent/US20100321897A1/en
Priority claimed from US12/486,472 external-priority patent/US8081468B2/en
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Publication of JP2011000884A publication Critical patent/JP2011000884A/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
JP2010123934A 2009-06-17 2010-05-31 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール Pending JP2011000884A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/486,456 US20100321897A1 (en) 2009-06-17 2009-06-17 Compliant multilayered thermally-conductive interface assemblies
US12/486,472 US8081468B2 (en) 2009-06-17 2009-06-17 Memory modules including compliant multilayered thermally-conductive interface assemblies

Publications (1)

Publication Number Publication Date
JP2011000884A true JP2011000884A (ja) 2011-01-06

Family

ID=43370026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010123934A Pending JP2011000884A (ja) 2009-06-17 2010-05-31 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール

Country Status (4)

Country Link
JP (1) JP2011000884A (ko)
KR (2) KR101385576B1 (ko)
CN (1) CN101930952B (ko)
TW (1) TWI489597B (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8837151B2 (en) 2009-06-17 2014-09-16 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
KR101487480B1 (ko) 2013-01-16 2015-01-29 주식회사 엘엠에스 함몰홈에 접착부가 구비된 방열시트
KR101605139B1 (ko) * 2014-04-08 2016-03-21 주식회사 엘엠에스 이방성열전도부를 포함하는 방열시트
KR101727159B1 (ko) * 2016-07-27 2017-05-04 주식회사 이녹스 무선 충전용 복합 시트 및 그 제조 방법
JP2019510380A (ja) * 2016-03-30 2019-04-11 パーカー・ハニフィン・コーポレーション 熱インターフェイス材料
CN110049661A (zh) * 2019-05-17 2019-07-23 台州思碳科技有限公司 一种石墨多孔金属箔散热膜及其制备方法
CN113115557A (zh) * 2021-02-05 2021-07-13 吕建忠 一种内嵌导热组的散热硅胶片

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102893390A (zh) * 2010-05-21 2013-01-23 诺基亚西门子通信公司 用于将热沉热耦合到部件的方法和设备
CN103568389A (zh) * 2012-07-26 2014-02-12 苏州沛德导热材料有限公司 一种石墨复合非金属材料
KR102068493B1 (ko) * 2012-12-11 2020-02-11 도레이첨단소재 주식회사 열확산 시트 및 그 제조방법
KR102068492B1 (ko) * 2012-12-11 2020-01-21 도레이첨단소재 주식회사 열확산 시트 및 그 제조방법
KR102075360B1 (ko) * 2013-01-07 2020-02-10 도레이첨단소재 주식회사 열확산 시트 및 그 제조방법
US8907472B2 (en) 2013-02-07 2014-12-09 Taiwan Semiconductor Manufacturing Company, Ltd. 3DIC package comprising perforated foil sheet
CN103985679B (zh) * 2013-02-07 2016-12-28 台湾积体电路制造股份有限公司 包括穿孔箔片的3dic 封装件
CN104219932A (zh) * 2013-06-03 2014-12-17 联想(北京)有限公司 一种电子设备
CN103342993A (zh) * 2013-06-26 2013-10-09 苏州天脉导热科技有限公司 一种石墨膜与热界面材料的复合材料
JP5798210B2 (ja) * 2013-07-10 2015-10-21 デクセリアルズ株式会社 熱伝導性シート
KR102293691B1 (ko) * 2014-07-23 2021-08-25 삼성디스플레이 주식회사 복합 시트 및 이를 포함하는 표시장치
KR102241412B1 (ko) * 2014-08-19 2021-04-19 삼성디스플레이 주식회사 복합 시트 및 이를 포함하는 표시장치
CN105783576B (zh) * 2014-12-24 2019-03-22 中国科学院宁波材料技术与工程研究所 一种复合导热片
KR102287921B1 (ko) * 2015-01-22 2021-08-09 에스케이씨 주식회사 그라파이트 시트 및 이의 제조방법
CA2980764C (en) 2015-03-28 2023-07-11 The Regents Of The University Of California Thermoelectric temperature controlled cooler for biomedical applications
CN104883814A (zh) * 2015-05-28 2015-09-02 乐健科技（珠海）有限公司 石墨基板及其制造方法、led模组及其制造方法
AU2016401161A1 (en) 2016-03-28 2018-10-18 The Regents Of The University Of California Heat exchange module and system for medical applications
CA3019211A1 (en) * 2016-03-28 2017-10-05 Hypothermia Devices, Inc. Heat exchange module, system and method
CN107396592B (zh) * 2016-05-17 2021-02-02 中兴通讯股份有限公司 终端设备及其散热结构
KR102122450B1 (ko) * 2016-08-26 2020-06-12 주식회사 엘지화학 방열재, 이를 제조하는 방법 및 방열재를 포함하는 배터리 모듈
CN107872943A (zh) * 2016-09-23 2018-04-03 天津莱尔德电子材料有限公司 用于从电子设备内的一个或更多个热源散热的热系统
CA3037915A1 (en) 2016-09-28 2018-04-05 Hypothermia Devices, Inc. Heat exchange module, system and method
WO2018164671A1 (en) * 2017-03-07 2018-09-13 Jones Tech Inc. An anisotropy thermally conductive material based thermal interface pads
US11350490B2 (en) * 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method
CN107484388B (zh) * 2017-07-28 2019-09-24 Oppo广东移动通信有限公司 一种石墨片、移动终端和石墨片的贴装方法
CN109808282A (zh) * 2017-11-21 2019-05-28 中兴通讯股份有限公司 一种石墨铝基复合材料及其制备方法
TWI646744B (zh) 2017-12-05 2019-01-01 財團法人工業技術研究院 避雷結構
CN109548379A (zh) * 2018-12-14 2019-03-29 中国航空工业集团公司西安航空计算技术研究所 一种机械连接的石墨导热板
CN109693427A (zh) * 2019-01-31 2019-04-30 广东思泉新材料股份有限公司 一种多层石墨导热板及其制备方法
CN113826455B (zh) * 2019-05-15 2024-05-24 阿维德热管公司 均热板热带组件和方法
CN112714585A (zh) * 2019-10-25 2021-04-27 北京小米移动软件有限公司 散热组件及移动终端
CN114585212B (zh) * 2020-11-30 2024-05-17 华为技术有限公司 散热装置和电子设备
US20220347990A1 (en) * 2021-04-29 2022-11-03 GM Global Technology Operations LLC Flexible sheet of polyethylene terephthalate and heat-activated adhesive, and thermal cooling structure using the same
WO2023070254A1 (zh) * 2021-10-25 2023-05-04 高柏科技股份有限公司 双层热界面材料结构、其制造方法及具有其之电池装置
US11665856B2 (en) 2021-10-26 2023-05-30 Eagle Technology, Llc Electronic device having flexible, heat conductive layer and associated methods
US11503701B1 (en) 2021-10-26 2022-11-15 Eagle Technology, Llc Electronic device having heat transfer clamp and associated methods
CN114180026B (zh) * 2021-12-28 2023-12-01 中南大学 一种疏导相变复合柔性热防护结构及其在可变形飞行器中的应用
CN117895210B (zh) * 2024-03-15 2024-05-10 北京钧天航宇技术有限公司 一种热控装置及制备方法、t/r组件、有源相控阵天线

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0440589U (ko) * 1990-07-31 1992-04-07
JP2003181971A (ja) * 2001-12-13 2003-07-03 Suzuki Sogyo Co Ltd 熱伝導性シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198063A (en) * 1991-06-03 1993-03-30 Ucar Carbon Technology Corporation Method and assembly for reinforcing flexible graphite and article
KR100261634B1 (ko) * 1995-01-11 2000-07-15 모리시타 요이찌 그래파이트클래드구조체
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
JP3515368B2 (ja) * 1998-05-22 2004-04-05 ポリマテック株式会社 実装素子用の高熱伝導性電磁波シールドシートおよびその製造方法ならびに実装素子の放熱および電磁波シールド構造
BR0107793A (pt) * 2000-01-24 2002-10-29 Graftech Inc Artigo de grafite flexìvel permeável a fluido com condutividade életrica e térmica aumentada
US6538892B2 (en) * 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
US20020166654A1 (en) * 2001-05-02 2002-11-14 Smalc Martin D. Finned Heat Sink Assemblies
US7505275B2 (en) * 2005-11-04 2009-03-17 Graftech International Holdings Inc. LED with integral via

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0440589U (ko) * 1990-07-31 1992-04-07
JP2003181971A (ja) * 2001-12-13 2003-07-03 Suzuki Sogyo Co Ltd 熱伝導性シート

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8837151B2 (en) 2009-06-17 2014-09-16 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US9222735B2 (en) 2009-06-17 2015-12-29 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
KR101487480B1 (ko) 2013-01-16 2015-01-29 주식회사 엘엠에스 함몰홈에 접착부가 구비된 방열시트
KR101605139B1 (ko) * 2014-04-08 2016-03-21 주식회사 엘엠에스 이방성열전도부를 포함하는 방열시트
JP2019510380A (ja) * 2016-03-30 2019-04-11 パーカー・ハニフィン・コーポレーション 熱インターフェイス材料
JP7028788B2 (ja) 2016-03-30 2022-03-02 パーカー・ハニフィン・コーポレーション 熱インターフェイス材料
KR101727159B1 (ko) * 2016-07-27 2017-05-04 주식회사 이녹스 무선 충전용 복합 시트 및 그 제조 방법
WO2018021623A1 (en) * 2016-07-27 2018-02-01 Innox Advanced Materials Co., Ltd. Complex sheet for wireless charging and method for fabricating the same
CN110049661A (zh) * 2019-05-17 2019-07-23 台州思碳科技有限公司 一种石墨多孔金属箔散热膜及其制备方法
CN113115557A (zh) * 2021-02-05 2021-07-13 吕建忠 一种内嵌导热组的散热硅胶片

Also Published As

Publication number Publication date
TW201110282A (en) 2011-03-16
KR101538944B1 (ko) 2015-07-27
KR101385576B1 (ko) 2014-04-29
TWI489597B (zh) 2015-06-21
CN101930952B (zh) 2012-07-04
CN101930952A (zh) 2010-12-29
KR20130081270A (ko) 2013-07-16
KR20100135664A (ko) 2010-12-27

Similar Documents

Publication Publication Date Title
JP2011000884A (ja) 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール
US9222735B2 (en) Compliant multilayered thermally-conductive interface assemblies
US20100321897A1 (en) Compliant multilayered thermally-conductive interface assemblies
EP1865552B1 (en) Heat transfer sheet, radiation structure and method for using heat transfer sheet
JP5165017B2 (ja) 電子機器の冷却構造
US20120061135A1 (en) Compliant multilayered thermally-conductive interface assemblies having emi shielding properties
US7623349B2 (en) Thermal management apparatus and method for a circuit substrate
JP5384522B2 (ja) ヒートシンク、および楔係止システムを用いたヒートシンク形成方法
US7839643B1 (en) Heat spreader for memory modules
US9414526B2 (en) Cooling apparatus with dynamic load adjustment
US20150301568A1 (en) Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader
JP2003188323A (ja) グラファイトシート及びその製造方法
KR20170118883A (ko) 열 전도 시트 및 전자 디바이스
US20060263570A1 (en) Thermal lamination module
JP2019510380A (ja) 熱インターフェイス材料
KR101796206B1 (ko) 그라파이트 점착제층 방열패드
US10117355B2 (en) Heat dissipation foil and methods of heat dissipation
TWM504439U (zh) 散熱組件
JP7242824B1 (ja) 放熱構造および電子機器

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20120120

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120327

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120403

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121030