WO2018164671A1 - An anisotropy thermally conductive material based thermal interface pads - Google Patents

An anisotropy thermally conductive material based thermal interface pads Download PDF

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Publication number
WO2018164671A1
WO2018164671A1 PCT/US2017/021106 US2017021106W WO2018164671A1 WO 2018164671 A1 WO2018164671 A1 WO 2018164671A1 US 2017021106 W US2017021106 W US 2017021106W WO 2018164671 A1 WO2018164671 A1 WO 2018164671A1
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WIPO (PCT)
Prior art keywords
anisotropic
thermal interface
thermally conductive
conductive film
interface pad
Prior art date
Application number
PCT/US2017/021106
Other languages
French (fr)
Inventor
Xiaoning Wu
Original Assignee
Jones Tech Inc.
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Filing date
Publication date
Application filed by Jones Tech Inc. filed Critical Jones Tech Inc.
Priority to PCT/US2017/021106 priority Critical patent/WO2018164671A1/en
Priority to CN201780054449.8A priority patent/CN110945648A/en
Publication of WO2018164671A1 publication Critical patent/WO2018164671A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/043—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/046—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0278—Polyurethane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/12—Gel
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2307/536—Hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/706—Anisotropic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties

Definitions

  • the present invention generally relates to thermal interface pads, and more particularly relates to an anisotropic based thermal interface pads with high thermal conductivity to increase heat transfer ability between heat emitting components of an electronic device.
  • the portable computing devices become more advanced, higher processing demands required to deliver advanced features produce increasingly greater amounts of heat.
  • active cooling devices such as for example fans
  • heat can become trapped in isolated areas of the device in which the heat is generated.
  • thermal pads should have as high as possible thermal conductivity and easily compressible; but at limitation of hardness, inorganic fillers (ceramic filler or metal filler) based thermal interface pad already touch its ceiling performance 7-10W/m-K.
  • inorganic fillers ceramic filler or metal filler
  • thermal interface material pad already touch its ceiling performance 7-10W/m-K.
  • anisotropic based thermal interface pads with high thermal conductivity to increase heat transfer ability between heat emitting components of an electronic device. Further, the anisotropic based thermal interface pads should be able to form the heat conducting paths between the heat spreader and the heat source of the electronic device.
  • an anisotropic thermal interface pad structure for increasing heat conductivity between a heat spreader and a heat source of an electronic device is disclosed.
  • An object of the present invention an anisotropic thermal interface pad structure for increasing heat conductivity between a heat spreader and a heat source of an electronic device.
  • the thermal interface pad includes an anisotropic film and a carrier polymer material for holding the anisotropic film.
  • the anisotropic film forms the heat conduction path between the heat spreader and the heat source.
  • the anisotropic film is configured in zig-zag layers or wave like structure to build multiple paths to achieve high thermal conductivity of anisotropic thermal interface pads.
  • Another object of the present invention is to provide the anisotropic film which is folded to form the zig-zag structure in the range of over 50 layers. Further, each layer of the zig-zag structure of the anisotropic film is perforated to achieve inter- connection of the carrier polymer material. The inter-connection improves the compression ratio of the anisotropic thermal interface pads.
  • Another object of the present invention is to provide the anisotropic thermal pad wherein the anisotropic film is a flexible synthetic graphite film with extreme high thermal conductivity, upto 1500W/m-k. Further, thickness of the anisotropic thermally conductive film is 32pm.
  • FIG. 1 illustrates a schematic diagram of an anisotropic thermal interface pad structure positioned in between a heat spreader and a heat source of an electronic device; and [0015] FIG. 2 illustrates a perspective view of the anisotropic film in accordance with a preferred embodiment of the present invention.
  • FIG. 1 illustrates a schematic diagram of a thermal interface pad structure 100 positioned in between a heat spreader 102 and a heat source 104 of an electronic device.
  • the thermal interface pad structure 100 includes an anisotropic film 106 and a carrier polymer material 108 for holding the anisotropic film 106 in between the heat spreader 102 and the heat source 104.
  • the anisotropic film 106 fills the air gap between the heat spreader 102 and the heat source 104.
  • the anisotropic film 106 is configured in the zig-zag layers structure to achieve high thermal conductivity throughout the components of the electronic device.
  • the anisotropic film is folded to form the zig-zag structure in the range of over 50 layers.
  • the zig-zag structure of the anisotropic film 106 is filled along the cross-section between the heat spreader 102 and the heat source 104 to achieve thermal conductivity.
  • the zig-zag structure increases the thermal conduction layers and thus leads to achieve high thermal conductivity of more than 15W/m-k in thickness.
  • the anisotropic film 106 is 32pm thick.
  • the carrier polymer material 108 is cured to form with the hardness 10 shore 00 and 80 layers of the zig-zag structure is formed with the width of the 25mm to achieve thermal conductivity of more than 15W/m-k in thickness.
  • Examples of the anisotropic film 106 includes but not limited to synthetic graphite, a nature graphite film, a graphene-based coating film, and a high thermal conductivity anisotropy film.
  • Examples of the carrier polymer material 108 include but not limited to either silicone based gel or foam or rubber, polyurethane based gel or foam or rubber, and other resilience material.
  • FIG. 2 illustrates a perspective view of the anisotropic film 200 in accordance with another preferred embodiment of the present invention.
  • the anisotropic film 200 includes plurality of perforations 202a, 202b are configured on each layer of the zig-zag structure to achieve inter-connection of polymer material. The interconnection improves the compression ratio of the anisotropic film 200 and the carrier polymer material (108, as shown in FIG. 1 ).
  • the width of each perforation 202a is 0.20 mm.
  • Examples of the shape of the perforation 202a include but not limited to circle, rectangle, or any other geometrical shape.

Abstract

Disclosed is an anisotropic thermal interface pad structure for increasing heat conductivity between heat spreader and heat source of an electronic device. The anisotropic thermal interface pad structure includes an anisotropic thermally conductive film and a carrier polymer material for holding the anisotropic thermally conductive film. The anisotropic thermally conductive film fills the air gap between the heat spreader and the heat source. The anisotropic thermally conductive film is configured in zig-zag layers structure to achieve high thermal conductivity throughout the components of the electronic device. Further, each layer of the zig-zag structure of anisotropic film is perforated to achieve inter-connection. The inter-connection improves the compression ratio of the anisotropic film.

Description

AN ANISOTROPY THERMALLY CONDUCTIVE MATERIAL BASED THERMAL
INTERFACE PADS
BACKGROUND OF THE INVENTION
1 . Field of the Invention [0001 ] The present invention generally relates to thermal interface pads, and more particularly relates to an anisotropic based thermal interface pads with high thermal conductivity to increase heat transfer ability between heat emitting components of an electronic device.
2. Description of Related Art [0002] In recent years, electronic devices have become smaller and more densely packed. Designers and manufacturers are now facing the challenge of dissipating the heat generated in these devices using various thermal management systems. Thermal management has evolved to address the increased temperatures created within such electronic devices, as a result of the increased processing speed and power of these devices.
[0003] The portable computing devices become more advanced, higher processing demands required to deliver advanced features produce increasingly greater amounts of heat. When the portable computing devices do not include active cooling devices, such as for example fans, heat can become trapped in isolated areas of the device in which the heat is generated.
[0004] The new generation of electronic components squeezes more power into a smaller space; and hence the relative importance of thermal management within the overall product design continues to increase. Good thermal pads should have as high as possible thermal conductivity and easily compressible; but at limitation of hardness, inorganic fillers (ceramic filler or metal filler) based thermal interface pad already touch its ceiling performance 7-10W/m-K. [0005] Beyond this boundary, need to use higher K anisotropy filler like carbon fiber or graphite in thermal interface material pad. There is challenge for aligning the max thermal conductivity of anisotropy filler into vertical thickness direction to realize high thermal conductivity in thermal interface material pads. [0006] Therefore, there is a need of an anisotropic based thermal interface pads with high thermal conductivity to increase heat transfer ability between heat emitting components of an electronic device. Further, the anisotropic based thermal interface pads should be able to form the heat conducting paths between the heat spreader and the heat source of the electronic device. SUMMARY OF THE INVENTION
[0007] In accordance with teachings of the present invention, an anisotropic thermal interface pad structure for increasing heat conductivity between a heat spreader and a heat source of an electronic device is disclosed.
[0008] An object of the present invention an anisotropic thermal interface pad structure for increasing heat conductivity between a heat spreader and a heat source of an electronic device. The thermal interface pad includes an anisotropic film and a carrier polymer material for holding the anisotropic film.
[0009] The anisotropic film forms the heat conduction path between the heat spreader and the heat source. The anisotropic film is configured in zig-zag layers or wave like structure to build multiple paths to achieve high thermal conductivity of anisotropic thermal interface pads.
[0010] Another object of the present invention is to provide the anisotropic film which is folded to form the zig-zag structure in the range of over 50 layers. Further, each layer of the zig-zag structure of the anisotropic film is perforated to achieve inter- connection of the carrier polymer material. The inter-connection improves the compression ratio of the anisotropic thermal interface pads.
[0012] Another object of the present invention is to provide the anisotropic thermal pad wherein the anisotropic film is a flexible synthetic graphite film with extreme high thermal conductivity, upto 1500W/m-k. Further, thickness of the anisotropic thermally conductive film is 32pm.
[0013] These and other features and advantages will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings.
BRIEF DESCRIPTION OF DRAWINGS
[0014] FIG. 1 illustrates a schematic diagram of an anisotropic thermal interface pad structure positioned in between a heat spreader and a heat source of an electronic device; and [0015] FIG. 2 illustrates a perspective view of the anisotropic film in accordance with a preferred embodiment of the present invention.
DETAILED DESCRIPTION OF DRAWINGS
[0016] While this technology is illustrated and described in a preferred embodiment of an anisotropic based thermal interface pads positioned in between heat spreader and heat source of an electronic device may be produced in many different configurations, shapes, sizes, forms and materials. There is depicted in the drawings, and will herein be described in detail, as a preferred embodiment of the invention, with the understanding that the present disclosure is to be considered as an exemplification of the principles of the invention and the associated functional specifications for its construction and is not intended to limit the invention to the embodiment illustrated. Those skilled in the art will envision many other possible variations within the scope of the technology described herein.
[0017] FIG. 1 illustrates a schematic diagram of a thermal interface pad structure 100 positioned in between a heat spreader 102 and a heat source 104 of an electronic device. In accordance with a preferred embodiment of the present invention, the thermal interface pad structure 100 includes an anisotropic film 106 and a carrier polymer material 108 for holding the anisotropic film 106 in between the heat spreader 102 and the heat source 104. [0018] The anisotropic film 106 fills the air gap between the heat spreader 102 and the heat source 104. The anisotropic film 106 is configured in the zig-zag layers structure to achieve high thermal conductivity throughout the components of the electronic device. In a preferred embodiment of the present invention, the anisotropic film is folded to form the zig-zag structure in the range of over 50 layers.
[0019] The zig-zag structure of the anisotropic film 106 is filled along the cross-section between the heat spreader 102 and the heat source 104 to achieve thermal conductivity. The zig-zag structure increases the thermal conduction layers and thus leads to achieve high thermal conductivity of more than 15W/m-k in thickness. [0020] In a preferred embodiment of the present invention, the anisotropic film 106 is 32pm thick. Further, the carrier polymer material 108 is cured to form with the hardness 10 shore 00 and 80 layers of the zig-zag structure is formed with the width of the 25mm to achieve thermal conductivity of more than 15W/m-k in thickness.
[0021 ] Examples of the anisotropic film 106 includes but not limited to synthetic graphite, a nature graphite film, a graphene-based coating film, and a high thermal conductivity anisotropy film. Examples of the carrier polymer material 108 include but not limited to either silicone based gel or foam or rubber, polyurethane based gel or foam or rubber, and other resilience material.
[0022] FIG. 2 illustrates a perspective view of the anisotropic film 200 in accordance with another preferred embodiment of the present invention. The anisotropic film 200 includes plurality of perforations 202a, 202b are configured on each layer of the zig-zag structure to achieve inter-connection of polymer material. The interconnection improves the compression ratio of the anisotropic film 200 and the carrier polymer material (108, as shown in FIG. 1 ). [0023] In a preferred embodiment of the present invention, wherein the width of each perforation 202a is 0.20 mm. Examples of the shape of the perforation 202a include but not limited to circle, rectangle, or any other geometrical shape. The multiple thermal layers of anisotropic film 200 with perforations 202a, 202b increases the high thermal conductivity more than 15W/m-k in thickness. [0024] Many changes, modifications, variations and other uses and applications of the subject invention will, however, become apparent to those skilled in the art after considering this specification and the accompanying drawings which disclose the preferred embodiments thereof. All such changes, modifications, variations and other uses and applications which do not depart from the spirit and scope of the invention are deemed to be covered by the invention, which is to be limited only by the claims which follow.

Claims

CLAIMS OF THE INVENTION
CLAIM 1 . An anisotropic thermal interface pad structure for increasing heat conductivity between a heat spreader and a heat source of an electronic device, the anisotropic thermal interface pad structure comprising: an anisotropic thermally conductive film for forming heat conduction path between the heat spreader and the heat source, wherein the anisotropic film configured in zig-zag layers structure to achieve high thermal conductivity throughout the components of the electronic device; and a carrier polymer material for holding the anisotropic thermally conductive film in between the heat spreader and the heat source.
CLAIM 2. The anisotropic thermal interface pad structure according to claim 1 , wherein the anisotropic thermally conductive film is folded to form over 50 layers to form the zigzag structure.
CLAIM 3. The anisotropic thermal interface pad structure according to claim 2, wherein the carrier polymer material is cured to form network bonding structure for the zig-zag structure of anisotropic thermally conductive film.
CLAIM 4. The thermal interface pad structure according to claim 1 wherein the anisotropic thermally conductive film comprising plurality of perforations on each layer of the zig-zag structure to achieve inter-connection, wherein the inter-connection improves the compression ratio of the anisotropic thermal conductive film and the carrier polymer material.
CLAIM 5. The anisotropic thermal interface pad structure according to claim 1 wherein the anisotropic thermally conductive film comprising of at least one of synthetic graphite; a nature graphite film; a graphene-based coating film; and a high thermal conductivity anisotropy film.
CLAIM 6. The anisotropic thermal interface pad structure according to claim 1 wherein the carrier polymer material comprising of at least one of silicon; polyurethane; or any other resilience material.
CLAIM 7. The anisotropic thermal interface pad structure according to claim 4 wherein the perforation comprising of at least one of a circular shape; a rectangle shape or other similar geometrical shape.
PCT/US2017/021106 2017-03-07 2017-03-07 An anisotropy thermally conductive material based thermal interface pads WO2018164671A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111196878A (en) * 2018-11-20 2020-05-26 通用汽车环球科技运作有限责任公司 Cured in place lightweight thermal interface

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111574968B (en) * 2020-05-22 2021-04-13 南京邮电大学 Interface material with convertible heat conduction and heat insulation performance

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US20050126766A1 (en) * 2003-09-16 2005-06-16 Koila,Inc. Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact
WO2016040872A1 (en) * 2014-09-12 2016-03-17 Gentherm Incorporated Graphite thermoelectric and/or resistive thermal management systems and methods
US20170006736A1 (en) * 2013-12-26 2017-01-05 Terrella Energy Systems Ltd. Exfoliated Graphite Materials and Composite Materials and Devices for Thermal Management

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011000884A (en) * 2009-06-17 2011-01-06 Laird Technologies Inc Suitable multilayer heat conductive intermediate structure, and memory module equipped with the same
JP5698932B2 (en) * 2010-07-29 2015-04-08 日東電工株式会社 Thermally conductive sheet
CN106715636A (en) * 2014-09-26 2017-05-24 W.L.戈尔有限公司 Process for the production of a thermally conductive article

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US20050126766A1 (en) * 2003-09-16 2005-06-16 Koila,Inc. Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact
US20170006736A1 (en) * 2013-12-26 2017-01-05 Terrella Energy Systems Ltd. Exfoliated Graphite Materials and Composite Materials and Devices for Thermal Management
WO2016040872A1 (en) * 2014-09-12 2016-03-17 Gentherm Incorporated Graphite thermoelectric and/or resistive thermal management systems and methods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111196878A (en) * 2018-11-20 2020-05-26 通用汽车环球科技运作有限责任公司 Cured in place lightweight thermal interface
US11398653B2 (en) 2018-11-20 2022-07-26 GM Global Technology Operations LLC Cure-in-place lightweight thermally-conductive interface
CN111196878B (en) * 2018-11-20 2022-11-29 通用汽车环球科技运作有限责任公司 Cured in place lightweight thermal interface

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