JP2010514147A - 板状物品のウエット処理用の装置及び方法 - Google Patents
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- 239000012080 ambient air Substances 0.000 claims description 3
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Condensed Matter Physics & Semiconductors (AREA)
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- Cleaning Or Drying Semiconductors (AREA)
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Abstract
【選択図】 図2
Description
板状物品をウエット処理するための装置であって、
−板状物品が液体により処理されているときこれから流れ出る液体を受けるための上向きの面を備えている1個の板状物品を保持するチャックであって、周囲の環状のリップにより外側の境界が定められ、処理される板状物品の最大直径より大きい外径を有する前記チャック、及び
−チャックの周囲のリップから振り飛ばされる液体を受け入れるための上向きのリング状の面を有する回転可能な部品であって、この回転可能な部品はチャックに関して回転可能であり、リング状の面は周囲の環状リップに関して同軸に配置され、リング状の面の内径はチャックの外径より小さく、そしてリップと上向きのリング状の面との間の距離dが0.1mmから5mmの範囲にある前記回転可能な部品
を備えた前記装置
を提供することによりこの目的に適合する。
−板状物品を水平に保持するためにチャック上に板状物品を置き、このチャックは少なくも板状物品の縁の下方に上向きの面を有し、
−板状物品の上向きの面の上に液体を分配し、
−液体を板状分配し縁に向かって流れるようにさせ、
−液体を板状物品からチャックの上向きの面上に逃がし、この面は周囲のリップにより外側の境界が定められ、チャックは処理される板状物品の最大直径より大きい外径を有し、−液体を、上向きの面からチャックの周囲のリップを越えて上向きの回転してるリング面上に逃がしこれにより液体が加速されそして回転しているリング面から振り払われ、
この際、回転している面は板状物品より速く回転しかつ回転しているリングの内径はチャックの外径より小さく、そしてリップと上向きのリング面との間の距離dは0.1mmから5mmの範囲内にある
前記方法である。
まるか又は気体流G2により支持されてリング19の下側を外向きに流れる。過剰な液体(ウエハーWと面15との間の間隙に流入しなかった液体)は、面15の上をリップ14に向かい、そしてリング面21上に流れる。液体処理の後、ウエハーWと面15との間の間隙内の液体は、例えば遠心力により、或いは気体流G2により除去される。
Claims (18)
- 板状物品が液体により処理されているときに板状物品から流れ出る液体を受けるための上向きの面を備えている1個の板状物品を保持するチャックを備え、該チャックは、周囲の環状のリップにより外側の境界が定められ、処理される板状物品の最大直径より大きい外径を前記チャックは有しており、
チャックの周囲のリップから振り飛ばされる液体を受け入れるための上向きのリング状の面を有する回転可能な部品を備えており、該回転可能な部品はチャックに関して回転可能であり、前記リング状の面は周囲の環状リップに関して同軸に配置され、リング状の面の内径はチャックの外径より小さく、そしてリップと上向きのリング状の面との間の距離dが0.1mmから5mmの範囲にある、板状物品をウエット処理するための
装置。 - チャックが回転可能である請求項1による装置。
- チャックに面していない面の上に液体を分配するための液体分配手段を更に備える請求項1による装置。
- 距離dが0.1mmから2mmの範囲である請求項1による装置。
- リップの外側の縁が下向きであるように周囲の環状リップが形成される請求項1による装置。
- チャックの上向きの面が斜めの形にされた縁の区域を有し、斜めの形にされた縁の区域が0.5mmから10mmの範囲の寸法を有する請求項1による装置。
- 回転可能な部品は、チャックがボウル内に配置されている状態で回転可能なボウルの部分であるか又はボウルに取り付けられ、チャックとボウルの間に間隙が形成され、該間隙が0.05mmから20mmの範囲の距離である請求項1による装置。
- ボウルはチャックの下方に置かれた開口部を有し、この開口部はボウルとチャックとの間の間隙内に気体を輸送するために気体源と連通している請求項5による装置。
- 前記気体源が周囲空気である請求項6による装置。
- チャックが、板状物品のチャックに面する面を少なくも部分的に気体清掃をするための気体供給手段を更に備え、チャックの周辺側が第1の気体案内装置を有し、該気体案内装置が板状物品の縁の区域から去る清掃用気体の大部分を案内する請求項1による装置。
- 第1の気体案内装置が環状のノズルの形を有し、該ノズルは処理される板状物品より小さい直径を有する内向きの環状の縁により外側の境界が定められる請求項8による装置。
- 第1の気体案内装置から来ている気体を半径方向外向きに更に案内するために、回転可能なリング状の面の下方の第2の気体案内装置を有する請求項8による装置。
- 板状物品を水平に保持するために少なくも板状物品の縁の下方に上向きの面を有するチャック上に板状物品を置き、
板状物品の上向きの面の上に液体を分配し、
液体を板状物品の縁に向かって流れるようにさせ、
液体を板状物品からチャックの上向きの面上に逃がし、この面は周囲のリップにより外側の境界が定められ、チャックは処理される板状物品の最大直径より大きい外径を有し、 液体を、上向きの面からチャックの周囲のリップを越えて上向きの回転リング面上に逃がし、これにより液体が加速されて回転しているリング面から振り払われる、
ことからなり、この際、回転している面は板状物品より速く回転しかつ回転しているリングの内径はチャックの外径より小さく、そしてリップと上向きのリング面との間の距離dは0.1mmから5mmの範囲内にある、
板状物品のウエット処理のための方法。 - チャックが、0rpmから100rpmの範囲の旋回速度で回転する請求項13による方法。
- 回転リング面が50rpm以上の旋回速度で回転する請求項13による方法。
- 清掃用気体が板状物品とチャックとの間の間隙内に導かれ、そして気体は板状物品の縁に向かって流れる請求項13による方法。
- 清掃用気体の80体積%以上が板状物品の縁の区域から去るように案内される請求項16の方法。
- 板状物品の縁の区域から去るように案内された清掃用気体の80体積%以上が回転リング面の下側で外向きに案内される請求項17の方法。
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AT20732006 | 2006-12-15 | ||
ATA2073/2006 | 2006-12-15 | ||
PCT/EP2007/062489 WO2008071517A1 (en) | 2006-12-15 | 2007-11-19 | Device and method for wet treating plate-like-articles |
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JP2010514147A true JP2010514147A (ja) | 2010-04-30 |
JP4975110B2 JP4975110B2 (ja) | 2012-07-11 |
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US (2) | US8231939B2 (ja) |
EP (1) | EP2102895B1 (ja) |
JP (1) | JP4975110B2 (ja) |
KR (1) | KR101423308B1 (ja) |
CN (1) | CN101589453B (ja) |
AT (1) | ATE495544T1 (ja) |
DE (1) | DE602007011986D1 (ja) |
TW (1) | TWI359456B (ja) |
WO (1) | WO2008071517A1 (ja) |
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US10269615B2 (en) * | 2011-09-09 | 2019-04-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US8974632B2 (en) * | 2011-11-30 | 2015-03-10 | Lam Research Ag | Device and method for treating wafer-shaped articles |
US9589818B2 (en) * | 2012-12-20 | 2017-03-07 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles and liquid control ring for use in same |
JP6045357B2 (ja) * | 2013-01-16 | 2016-12-14 | キヤノン株式会社 | 薬液層の形成方法 |
US10022745B2 (en) * | 2013-08-01 | 2018-07-17 | Veeco Precision Surface Processing Llc | Apparatus for dual speed spin chuck |
TWI556878B (zh) * | 2014-02-26 | 2016-11-11 | 辛耘企業股份有限公司 | 流體加速裝置 |
US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
US11728202B2 (en) * | 2019-01-29 | 2023-08-15 | Boe Technology Group Co., Ltd. | Element pickup device, method for manufacturing the same and method for using the same |
CN109738261A (zh) * | 2019-02-28 | 2019-05-10 | 东莞市丰易仪器有限公司 | 自动浸润仪器 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11169774A (ja) * | 1997-08-27 | 1999-06-29 | Tokyo Electron Ltd | 処理装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4856456A (en) * | 1988-10-03 | 1989-08-15 | Machine Technology, Inc. | Apparatus and method for the fluid treatment of a workpiece |
US5439519A (en) * | 1992-04-28 | 1995-08-08 | Tokyo Ohka Kogyo Co., Ltd. | Solution applying apparatus |
DE59407361D1 (de) | 1993-02-08 | 1999-01-14 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige Gegenstände |
US5879576A (en) * | 1996-05-07 | 1999-03-09 | Hitachi Electronics Engineering Co., Ltd. | Method and apparatus for processing substrates |
TW459266B (en) * | 1997-08-27 | 2001-10-11 | Tokyo Electron Ltd | Substrate processing method |
TW392226B (en) * | 1997-11-05 | 2000-06-01 | Tokyo Electron Ltd | Apparatus for processing substrate |
US6706321B2 (en) * | 2000-06-13 | 2004-03-16 | Tokyo Electron Limited | Developing treatment method and developing treatment unit |
AT413162B (de) | 2001-09-26 | 2005-11-15 | Sez Ag | Ringförmige aufnahmevorrichtung für einen rotierenden träger zur aufnahme eines scheibenförmigen gegenstandes wie eines halbleiterwafers |
JP3761457B2 (ja) * | 2001-12-04 | 2006-03-29 | Necエレクトロニクス株式会社 | 半導体基板の薬液処理装置 |
AT500984B1 (de) * | 2002-06-25 | 2007-05-15 | Sez Ag | Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen |
EP1609172B1 (en) * | 2003-03-20 | 2009-01-14 | Sez Ag | Device and method for wet treatment of disc-shaped articles |
CN101308766B (zh) * | 2003-06-24 | 2010-06-09 | 兰姆研究股份公司 | 湿处理盘状基片的部件和方法 |
WO2006062321A1 (en) * | 2004-12-10 | 2006-06-15 | Lg Chem, Ltd. | Spin-coating apparatus and coated substrates prepared using the same |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11169774A (ja) * | 1997-08-27 | 1999-06-29 | Tokyo Electron Ltd | 処理装置 |
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CN101589453B (zh) | 2011-05-18 |
US8231939B2 (en) | 2012-07-31 |
US8936832B2 (en) | 2015-01-20 |
EP2102895B1 (en) | 2011-01-12 |
WO2008071517A1 (en) | 2008-06-19 |
TWI359456B (en) | 2012-03-01 |
US20110059242A1 (en) | 2011-03-10 |
KR20090100371A (ko) | 2009-09-23 |
DE602007011986D1 (de) | 2011-02-24 |
JP4975110B2 (ja) | 2012-07-11 |
US20120085374A1 (en) | 2012-04-12 |
EP2102895A1 (en) | 2009-09-23 |
CN101589453A (zh) | 2009-11-25 |
KR101423308B1 (ko) | 2014-07-24 |
ATE495544T1 (de) | 2011-01-15 |
TW200834707A (en) | 2008-08-16 |
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