JP2010512262A5 - - Google Patents

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Publication number
JP2010512262A5
JP2010512262A5 JP2009541309A JP2009541309A JP2010512262A5 JP 2010512262 A5 JP2010512262 A5 JP 2010512262A5 JP 2009541309 A JP2009541309 A JP 2009541309A JP 2009541309 A JP2009541309 A JP 2009541309A JP 2010512262 A5 JP2010512262 A5 JP 2010512262A5
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JP
Japan
Prior art keywords
liquid
chamber
organic material
substrate
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009541309A
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English (en)
Japanese (ja)
Other versions
JP5139444B2 (ja
JP2010512262A (ja
Filing date
Publication date
Priority claimed from US11/609,365 external-priority patent/US7600856B2/en
Application filed filed Critical
Publication of JP2010512262A publication Critical patent/JP2010512262A/ja
Publication of JP2010512262A5 publication Critical patent/JP2010512262A5/ja
Application granted granted Critical
Publication of JP5139444B2 publication Critical patent/JP5139444B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009541309A 2006-12-12 2007-12-04 液体射出装置および液体射出装置を製造する方法 Expired - Fee Related JP5139444B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/609,365 2006-12-12
US11/609,365 US7600856B2 (en) 2006-12-12 2006-12-12 Liquid ejector having improved chamber walls
PCT/US2007/024836 WO2008073242A2 (en) 2006-12-12 2007-12-04 Liquid ejector having improved chamber walls

Publications (3)

Publication Number Publication Date
JP2010512262A JP2010512262A (ja) 2010-04-22
JP2010512262A5 true JP2010512262A5 (enExample) 2011-01-27
JP5139444B2 JP5139444B2 (ja) 2013-02-06

Family

ID=39133827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009541309A Expired - Fee Related JP5139444B2 (ja) 2006-12-12 2007-12-04 液体射出装置および液体射出装置を製造する方法

Country Status (5)

Country Link
US (1) US7600856B2 (enExample)
EP (1) EP2089231A2 (enExample)
JP (1) JP5139444B2 (enExample)
CN (1) CN101557938B (enExample)
WO (1) WO2008073242A2 (enExample)

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US7914127B2 (en) * 2005-05-31 2011-03-29 Telecom Italia S.P.A. Nozzle plate for an ink jet print head comprising stress relieving elements
US7938974B2 (en) * 2007-03-12 2011-05-10 Silverbrook Research Pty Ltd Method of fabricating printhead using metal film for protecting hydrophobic ink ejection face
US7669967B2 (en) 2007-03-12 2010-03-02 Silverbrook Research Pty Ltd Printhead having hydrophobic polymer coated on ink ejection face
US7605009B2 (en) * 2007-03-12 2009-10-20 Silverbrook Research Pty Ltd Method of fabrication MEMS integrated circuits
US7794613B2 (en) * 2007-03-12 2010-09-14 Silverbrook Research Pty Ltd Method of fabricating printhead having hydrophobic ink ejection face
US8012363B2 (en) * 2007-11-29 2011-09-06 Silverbrook Research Pty Ltd Metal film protection during printhead fabrication with minimum number of MEMS processing steps
US20090233386A1 (en) * 2008-03-12 2009-09-17 Yimin Guan Method for forming an ink jetting device
US8173030B2 (en) 2008-09-30 2012-05-08 Eastman Kodak Company Liquid drop ejector having self-aligned hole
US8110117B2 (en) * 2008-12-31 2012-02-07 Stmicroelectronics, Inc. Method to form a recess for a microfluidic device
JP5359642B2 (ja) * 2009-07-22 2013-12-04 東京エレクトロン株式会社 成膜方法
US20110043555A1 (en) * 2009-08-20 2011-02-24 Yonglin Xie Drop ejection method through multi-lobed nozzle
US8267501B2 (en) * 2009-08-20 2012-09-18 Eastman Kodak Company Drop ejector having multi-lobed nozzle
US8205338B2 (en) * 2009-08-20 2012-06-26 Eastman Kodak Company Method of making a multi-lobed nozzle
US8449086B2 (en) 2011-03-30 2013-05-28 Eastman Kodak Company Inkjet chamber and inlets for circulating flow
US9403365B2 (en) * 2011-04-29 2016-08-02 Funai Electric Co., Ltd. Method for fabricating fluid ejection device
US20120274707A1 (en) * 2011-04-29 2012-11-01 Xiaorong Cai Ejection devices for inkjet printers and method for fabricating ejection devices
US20130186301A1 (en) 2012-01-24 2013-07-25 Thomas Nelson Blanton Ink having antibacterial and antifungal protection
US20130189499A1 (en) 2012-01-24 2013-07-25 Thomas Nelson Blanton Antibacterial and antifungal protection for ink jet image
US20130083126A1 (en) * 2011-09-30 2013-04-04 Emmanuel K. Dokyi Liquid ejection device with planarized nozzle plate
US20130082028A1 (en) * 2011-09-30 2013-04-04 Emmanuel K. Dokyi Forming a planar film over microfluidic device openings
US20130237661A1 (en) 2011-12-22 2013-09-12 Thomas B. Brust Inkjet ink composition
JP6041527B2 (ja) 2012-05-16 2016-12-07 キヤノン株式会社 液体吐出ヘッド
JP5740371B2 (ja) * 2012-09-11 2015-06-24 東芝テック株式会社 インクジェットヘッド
JP6095315B2 (ja) 2012-10-02 2017-03-15 キヤノン株式会社 液体吐出ヘッドの製造方法
JP5972139B2 (ja) * 2012-10-10 2016-08-17 キヤノン株式会社 液体吐出ヘッドの製造方法及び液体吐出ヘッド
JP6116198B2 (ja) 2012-11-15 2017-04-19 キヤノン株式会社 液体吐出ヘッドの製造方法
JP2014188656A (ja) * 2013-03-28 2014-10-06 Tokyo Electron Ltd 中空構造体の製造方法
US9199460B2 (en) * 2013-06-28 2015-12-01 Hewlett-Packard Development Company, L.P. Apparatuses including a plate having a recess and a corresponding protrusion to define a chamber
JP6234095B2 (ja) 2013-07-16 2017-11-22 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP6214284B2 (ja) 2013-09-02 2017-10-18 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP6202987B2 (ja) 2013-10-30 2017-09-27 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
CN105599452A (zh) * 2016-03-03 2016-05-25 中国科学院苏州纳米技术与纳米仿生研究所 多层材料喷孔结构及打印机
CN105667090A (zh) * 2016-03-03 2016-06-15 中国科学院苏州纳米技术与纳米仿生研究所 平整薄膜层喷孔结构及喷墨打印机
EP3694899B1 (en) 2017-10-11 2023-08-23 Eastman Kodak Company Compositions d'encres aqueuses pour impressions par jet d'encre et ensembles d'encre
CN107757127B (zh) * 2017-10-30 2023-05-26 苏州工业园区纳米产业技术研究院有限公司 喷头结构、喷头结构的制备方法及微机电喷墨打印头
WO2020159517A1 (en) * 2019-01-31 2020-08-06 Hewlett-Packard Development Company, L.P. Fluidic die with surface condition monitoring

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JP3143307B2 (ja) * 1993-02-03 2001-03-07 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US6234608B1 (en) * 1997-06-05 2001-05-22 Xerox Corporation Magnetically actuated ink jet printing device
US6331258B1 (en) * 1997-07-15 2001-12-18 Silverbrook Research Pty Ltd Method of manufacture of a buckle plate ink jet printer
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US6022482A (en) * 1997-08-04 2000-02-08 Xerox Corporation Monolithic ink jet printhead
JPH1199649A (ja) 1997-09-30 1999-04-13 Canon Inc インクジェットヘッド、その製造方法、及びインクジェット装置
JP3619036B2 (ja) * 1997-12-05 2005-02-09 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US6382777B1 (en) * 1998-06-19 2002-05-07 Canon Kabushiki Kaisha Liquid jet recording head
EP1065059B1 (en) * 1999-07-02 2007-01-31 Canon Kabushiki Kaisha Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate
US6474795B1 (en) * 1999-12-21 2002-11-05 Eastman Kodak Company Continuous ink jet printer with micro-valve deflection mechanism and method of controlling same
US6482574B1 (en) * 2000-04-20 2002-11-19 Hewlett-Packard Co. Droplet plate architecture in ink-jet printheads
US6561627B2 (en) * 2000-11-30 2003-05-13 Eastman Kodak Company Thermal actuator
US6750290B2 (en) * 2001-04-19 2004-06-15 Canon Kabushiki Kaisha Epoxy resin composition, method of improving surface of substrate, ink jet recording head and ink jet recording apparatus
US6555480B2 (en) * 2001-07-31 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate with fluidic channel and method of manufacturing
US6626523B2 (en) * 2001-10-31 2003-09-30 Hewlett-Packard Development Company, Lp. Printhead having a thin film membrane with a floating section
US6942318B2 (en) * 2002-05-31 2005-09-13 Hewlett-Packard Development Company, L.P. Chamber having a protective layer
US6644786B1 (en) * 2002-07-08 2003-11-11 Eastman Kodak Company Method of manufacturing a thermally actuated liquid control device
ITTO20021099A1 (it) * 2002-12-19 2004-06-20 Olivetti I Jet Spa Processo di rivestimento protettivo di microcircuiti idraulici rispetto a liquidi aggressivi. particolarmente per una testina di stampa a getto d'inchiostro.
KR100570822B1 (ko) * 2004-05-11 2006-04-12 삼성전자주식회사 잉크젯 헤드의 제조방법 및 그에 의해 제조된 잉크젯 헤드

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