JP2010287646A5 - - Google Patents
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- Publication number
- JP2010287646A5 JP2010287646A5 JP2009138835A JP2009138835A JP2010287646A5 JP 2010287646 A5 JP2010287646 A5 JP 2010287646A5 JP 2009138835 A JP2009138835 A JP 2009138835A JP 2009138835 A JP2009138835 A JP 2009138835A JP 2010287646 A5 JP2010287646 A5 JP 2010287646A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wiring pattern
- pad
- substrate body
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 230000000875 corresponding Effects 0.000 claims 1
- 230000000149 penetrating Effects 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009138835A JP5091916B2 (ja) | 2009-06-10 | 2009-06-10 | 配線基板及び半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009138835A JP5091916B2 (ja) | 2009-06-10 | 2009-06-10 | 配線基板及び半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010287646A JP2010287646A (ja) | 2010-12-24 |
JP2010287646A5 true JP2010287646A5 (ko) | 2012-06-07 |
JP5091916B2 JP5091916B2 (ja) | 2012-12-05 |
Family
ID=43543154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009138835A Expired - Fee Related JP5091916B2 (ja) | 2009-06-10 | 2009-06-10 | 配線基板及び半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5091916B2 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9293405B2 (en) * | 2011-03-22 | 2016-03-22 | Renesas Electronics Corporation | Semiconductor device |
JP2013236039A (ja) * | 2012-05-11 | 2013-11-21 | Renesas Electronics Corp | 半導体装置 |
JP6251828B2 (ja) * | 2017-01-30 | 2017-12-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04255291A (ja) * | 1991-02-07 | 1992-09-10 | Nec Corp | 印刷配線板 |
JP4150511B2 (ja) * | 2001-05-16 | 2008-09-17 | 株式会社日立製作所 | 半導体レ−ザ装置 |
JP3877642B2 (ja) * | 2002-05-21 | 2007-02-07 | ローム株式会社 | 半導体チップを使用した半導体装置 |
JP2008047761A (ja) * | 2006-08-18 | 2008-02-28 | Ricoh Printing Systems Ltd | 半導体レーザ装置 |
JP2008060159A (ja) * | 2006-08-29 | 2008-03-13 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP5018155B2 (ja) * | 2007-03-16 | 2012-09-05 | 富士通セミコンダクター株式会社 | 配線基板、電子部品の実装構造、及び半導体装置 |
JP2009105139A (ja) * | 2007-10-22 | 2009-05-14 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法と半導体装置 |
-
2009
- 2009-06-10 JP JP2009138835A patent/JP5091916B2/ja not_active Expired - Fee Related
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