JP2010272835A5 - - Google Patents
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- Publication number
- JP2010272835A5 JP2010272835A5 JP2009151841A JP2009151841A JP2010272835A5 JP 2010272835 A5 JP2010272835 A5 JP 2010272835A5 JP 2009151841 A JP2009151841 A JP 2009151841A JP 2009151841 A JP2009151841 A JP 2009151841A JP 2010272835 A5 JP2010272835 A5 JP 2010272835A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor particles
- porous film
- wiring board
- particle diameter
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims description 38
- 239000004020 conductor Substances 0.000 claims description 27
- 239000012528 membrane Substances 0.000 claims description 12
- 239000011148 porous material Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009151841A JP5426246B2 (ja) | 2009-04-23 | 2009-06-26 | 配線板、およびその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009105273 | 2009-04-23 | ||
| JP2009105273 | 2009-04-23 | ||
| JP2009151841A JP5426246B2 (ja) | 2009-04-23 | 2009-06-26 | 配線板、およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010272835A JP2010272835A (ja) | 2010-12-02 |
| JP2010272835A5 true JP2010272835A5 (enExample) | 2012-07-12 |
| JP5426246B2 JP5426246B2 (ja) | 2014-02-26 |
Family
ID=43420592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009151841A Expired - Fee Related JP5426246B2 (ja) | 2009-04-23 | 2009-06-26 | 配線板、およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5426246B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013021750A1 (ja) * | 2011-08-11 | 2013-02-14 | 古河電気工業株式会社 | 配線基板およびその製造方法ならびに半導体装置 |
| WO2016166751A1 (en) * | 2015-04-13 | 2016-10-20 | Printcb Ltd. | Printing of multi-layer circuits |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4042497B2 (ja) * | 2002-04-15 | 2008-02-06 | セイコーエプソン株式会社 | 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体 |
| JP2005229106A (ja) * | 2004-01-15 | 2005-08-25 | Ｎｅｘｔ Ｉ＆Ｄ株式会社 | 回路描画用の導電性材料 |
| KR100633846B1 (ko) * | 2005-03-23 | 2006-10-13 | 삼성전기주식회사 | 도전성 배선재료, 배선기판의 제조방법 및 배선기판 |
| KR100768341B1 (ko) * | 2005-11-09 | 2007-10-17 | 주식회사 나노신소재 | 금속성 잉크, 그리고 이를 이용한 전극형성방법 및 기판 |
-
2009
- 2009-06-26 JP JP2009151841A patent/JP5426246B2/ja not_active Expired - Fee Related
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