JP2010245381A - Block type composite electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a block type electronic component having a structure capable of following a change in a peripheral temperature and a change in the heating of a component body during the use thereof without generating cracks or breakages on a ceramic chip in a manufacturing process. <P>SOLUTION: A plurality of chip-type multilayer electronic components 1 in each of which ceramic layers 2 and layers of inner electrodes 3 are alternately laminated are prepared. These chip-type electronic components are bundled in a thickness direction and/or a width direction through adhesives B. On external electrodes of at least one electronic component bundled group A composed of the bundled chip-type electronic components, metal plates 6a, 6b are bonded to the edges of the same sides as the external electrodes. A material having almost the same thermal expansion coefficient as that of ceramics is used for the metal plates. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a block type electronic component formed by bonding a common metal plate to an external terminal of an electronic component focusing group obtained by bundling a large number of chip type electronic components.

  As shown in FIG. 7, conventionally, a plurality of internal electrode groups 52 embedded in a plane at a predetermined interval in one dielectric block 51 are alternately arranged at one end thereof. A block type electronic component 54 having a structure in which a pair of external electrode plates 53a and 53b are commonly joined to the exposed end portions of the internal electrode group 52 is known (Japanese Patent Laid-Open No. 2003-124059). Issue gazette).

  The block-type electronic component 54 according to this publicly known technique can not only reduce the series equivalent resistance (ESR) and the series equivalent inductance (ESL) and increase the capacitance, but also the electronic device on which it is mounted. The effect that the mounting area per internal electrode group can be made small with respect to a circuit board is exhibited.

JP 2003-1224059 A

  In recent years, in the block type electronic component 54 incorporated in the smoothing circuit for a power supply device of a hybrid vehicle or an electric vehicle, there is a demand for further improving the charge / discharge current capacity. In the multilayer capacitor used in a mobile phone or a digital camera, In addition to the above requirements, downsizing is required.

  However, when trying to apply the known block-type electronic component 54 to the application, there are the following problems. First, when the block-type electronic component 54 according to the known technique is manufactured, there is a problem that the dielectric block 51 is likely to be chipped or cracked during handling in the manufacturing process. Next, when the block-type electronic component is mounted on an electronic circuit board and used, the dielectric block 51 is thermally expanded and deformed by repetitive heat generation of the internal electrode 52 and is eventually broken, and the external electrode plate 53a, There is a problem that 53b cannot follow the deformation of the dielectric block 51.

  Therefore, the inventor diligently studied to propose a block-type electronic component that can solve the above-described problems, and uses an electronic component focusing group in which a large number of small chip-type multilayer electronic components are bundled. A chip-type multilayer electronic component constituting the same is bonded with a specific adhesive, and the metal plate is connected to a ceramic plate which is a component of the chip-type multilayer electronic component and a metal plate having a specific physical relationship with an external electrode. The present invention has been completed by finding the fact that it should be bonded to the external terminal.

  Accordingly, an object of the present invention is to prevent chipping or cracking of the ceramic chip as a component in the manufacturing process of a block type electronic component, and for example, after mounting on an electronic circuit board such as an electric vehicle, A structure in which the external terminal can follow the deformation of the electronic component focusing group even if the electronic component focusing group is deformed without increasing the deformation of the electronic component focusing group even in the case of a change or temperature change due to heat generation of the component body It is to acquire the block type electronic component.

  In order to solve the above-mentioned problems, the present invention bundles a plurality of chip-type multilayer electronic components in which ceramic layers and internal electrode layers are alternately laminated in the thickness direction and / or the width direction, and is bundled. A means is adopted in which a metal plate is joined to the end face on the same side of the external electrode of at least one electronic component focusing group composed of chip-type laminated electronic components. By adopting this means, the block-type electronic component according to the present invention has a plurality of chip-type multilayer electronic components in which internal electrodes are alternately laminated in an independent relatively small ceramic with their end portions shifted. It is composed of at least one electronic component focusing group that is bundled.

  As a result, unlike a large ceramic block in the prior art, the ceramic chip that is a component of the block-type electronic component manufacturing process is small, so even if an external load is applied to it, chipping and cracking are unlikely to occur. Become. In the present invention, the chip-type laminated electronic component means an electronic component in a chip unit in which ceramic layers and internal electrode layers are alternately laminated, and the block-type electronic component means a plurality of the chips. It means a converging body of electronic components in which a mold laminated electronic component is bundled like a brick block to constitute one large block.

  In order to solve the above-mentioned problem more effectively, the present invention joins a plurality of chip-type laminated electronic components with an adhesive that can be mechanically deformed and / or thermally deformed, preferably with a silicon-based resin. Adopt the means to do. By adopting this means, even if each chip-type multilayer electronic component constituting the block-type electronic component is subjected to thermal load and thermally deformed, or even if the chip-type multilayer electronic component is mechanically displaced, The adhesive material absorbs them.

  In the present invention, a metal plate to which a large number of internal electrodes in a block type electronic component are joined is used in the same manner as in the prior art, but in the present invention, external electrodes each of which has a metal plate in a chip type multilayer electronic component. In this case, a metal having the same thermal expansion coefficient as that of the ceramic is used as the metal conductor. By adopting this means, the external electrode of the chip-type multilayer electronic component is bonded to and sandwiched between the metal conductor and the dielectric via the metal joined body. As a result, even if the external electrode attempts to expand under a heat load, the expansion is suppressed by the metal conductor and the dielectric.

  In the present invention, as the metal conductor, a metal having a thermal expansion coefficient of 3 to 10 ppm / ° C. in a temperature range from room temperature to 400 ° C., preferably an alloy with nickel containing iron as a main component, More preferably, an alloy containing about 58% iron and about 42% nickel by weight is used. As another metal conductor, an alloy with nickel and cobalt containing iron as a main component, preferably an alloy containing about 54 wt% iron, about 29 wt% nickel and about 19 wt% cobalt is used. .

  In the present invention, the block-type electronic component can also be constituted by a converging body of a plurality of types of chip-type laminated electronic components. In this case, an electronic component made of a dielectric and a semiconductor can be used as the ceramic constituting the chip-type laminated electronic component.

  The present invention does not cause chipping or cracking of a ceramic chip as a component in the manufacturing process of a block type electronic component, and the electronic component focusing group can be used even in a change in ambient temperature or a temperature change due to heat generation of a component body. Therefore, even if the electronic component focusing group is deformed, it is possible to provide a block type electronic component having a structure in which the external terminal can follow the deformation of the electronic component focusing group.

It is a partially broken perspective view of a chip type multilayer electronic component. It is a partial fracture perspective view showing the 1st mode of block type electronic parts concerning the present invention. It is a fragmentary sectional view which shows a part of block-type electronic component similarly. It is a partially broken perspective view which similarly shows a 2nd aspect. It is a perspective view which shows a 3rd aspect. It is a perspective view which shows a 4th aspect. It is a partially broken perspective view which shows a prior art.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings. As shown in FIG. 1, a chip-type laminated electronic component 1 constituting a block-type electronic component according to the present invention is a chip in which ceramic layers 2 made of dielectrics or semiconductors and layers of internal electrodes 3 are alternately laminated. The end of the internal electrode 3 is alternately exposed outward at both ends of the chip body 4 and the end of the internal electrode 3 exposed to the outside is exposed to the chip body. 4 can be energized to the external electrodes 5a and 5b respectively formed at both ends.

  Next, a manufacturing method of the block-type electronic component 11 according to the first embodiment of the present invention using the chip-type multilayer electronic component 1 having such a structure will be described. As shown in FIG. 2 and FIG. The chip-type multilayer electronic components 1 are bundled like brick wall in the length direction indicated by the arrow X and the width direction indicated by the Y through the adhesive B, and the adjacent chip-type multilayer electronic components 1 are connected to each other. Join. Then, one electronic component focusing group A having a structure in which the external electrons 5a and 5b are exposed from each of the bundled chip-type multilayer electronic components 1 is formed. The adhesive B is made of a silicon-based resin that can follow the deformation of the block-type electronic component 11 when the block-type electronic component 11 is mounted on the electronic circuit board and is subjected to a thermal load and consequently a mechanical load. Is selected.

  Subsequently, one metal plate 6a, 6b is joined to each of the external electrons 5a, 5b exposed on both side surfaces of the electronic component focusing group A. As the metal plates 6a and 6b, when the block-type electronic component 11 is mounted on the electronic circuit board in the same manner as described above and receives a thermal load, the thermal expansion coefficient of the ceramic constituting the chip-type multilayer electronic component 1 is almost the same. A metal plate having a thermal expansion coefficient, preferably a metal plate having a thermal expansion coefficient of 3 to 10 ppm / ° C. in the temperature range from room temperature to 400 ° C. is used. Specifically, as such a metal, an alloy with nickel containing iron as a main component, preferably an alloy containing about 58 wt% iron and about 42 wt% nickel, or nickel containing iron as a main component and An alloy with cobalt is used, preferably an alloy comprising about 54% iron, about 29% nickel and about 19% cobalt.

  As the metal plates 6a and 6b, any metal plate can be used as long as the metal plates 6a and 6b have a shape and structure that can be installed on the external electrodes 5a and 5b and an electric circuit board and can energize an electronic circuit. In addition, a stand 7 that can be erected on an electronic circuit board, or one having a seat leg 8 as shown in FIG. 4 is used.

  After such a process, the block type electronic component 11 according to the present invention is composed of a plurality of chip type laminated electronic components 1 in which ceramic layers 2 and internal electrode 3 layers are alternately laminated. The electronic component 1 has a structure bundled in the thickness direction and the width direction. And it has the structure where metal plate 6a, 6b was joined to the end surface of the same side in external electrode 5a, 5b of one electronic component focusing group A which consists of bundled chip type multilayer electronic component 1.

  When this block type electronic component 11 is mounted on an electronic circuit board (not shown) and the block type electronic component 11 itself undergoes a temperature change due to a change in ambient temperature or heat generation of the electronic circuit board, it constitutes it. When each chip-type multilayer electronic component 1 is thermally and / or mechanically deformed or displaced, the adhesive B between them absorbs the deformation or displacement. At this time, the external electrodes 5a and 5b also try to deform, but the thermal expansion coefficients of the metal plates 6a and 6b to which they are joined are substantially the same as those of the ceramic constituting the chip-type multilayer electronic component 1, Constrained by these, damage to the external electrodes 5a and 5b and consequently the block-type electronic component 11 is also suppressed.

The present invention can be implemented as follows, for example, by changing a part of the above-described embodiment within the limits that follow the fundamental technical idea and do not significantly impair the effects of the invention.
(1) As shown in FIG. 5, the electronic component convergence group A obtained by bundling the block-type electronic components 11 in the vertical direction can be overlapped in the three-dimensional directions of X, Y, and Z. In this embodiment, the metal plates 6a and 6b can be bent on the upper and lower surfaces.
(2) As shown in FIG. 6, the electronic component convergence group A obtained by bundling the block-type electronic components 11 in the vertical direction can be overlapped in the two-dimensional directions of X and Z.

(3) Although not shown in the drawing, as the ceramic, two types of dielectric and semiconductor are selected, two types of chip-type laminated electronic components are formed, and they are bundled to form a block-type electronic component. Can do. In this case, by using a zinc oxide varistor material as a semiconductor, a plurality of types of chip-type multilayer electronic components such as a chip-type multilayer capacitor and a chip-type multilayer varistor can be incorporated into one block-type electronic component.

  The present invention is a block-type electronic component in which element groups constituting a plurality of types of electronic components are embedded in a large ceramic body that generates heat when mounted on an electronic circuit board, or a plurality of types in a small ceramic body. The present invention can be widely used in the field of block-type electronic components in which element groups constituting electronic components are integrated and embedded.

1: chip-type laminated electronic component 2: layer 3: internal electrode 4: chip body 5a, 5b: external electrode,
6a, 6b: Metal plate 7: Standing leg 8: Seat leg 11: Block type electronic component A: Electronic component focusing group B: Adhesives X, Y, Z: Arrows.

Claims (13)

  A plurality of chip-type multilayer electronic components (1) in which ceramic layers (2) and internal electrode (3) layers are alternately laminated are bundled in the thickness direction and / or the width direction, and the bundled chip-type laminates are bundled. A block type electronic component comprising a metal plate (6a, 6b) joined to an end face on the same side of an external electrode of at least one electronic component focusing group (A) made of electronic components.   The block-type electronic component according to claim 1, wherein the plurality of chip-type laminated electronic components are joined by an adhesive (B) that can be mechanically deformed and / or thermally deformed.   The block-type electronic component according to claim 2, wherein the adhesive (B) is made of a silicon-based resin.   The block type electronic component according to claim 1, wherein the metal plates (6a, 6b) are bonded to each of two end faces on the same side of the external electrode of the chip type multilayer electronic component (1).   The block-type electronic component according to claim 1, wherein the metal plates (6a, 6b) have substantially the same thermal expansion coefficient as that of the ceramic.   The block-type electronic component according to claim 4, wherein the metal plates (6a, 6b) have a thermal expansion coefficient of 3 to 10 ppm / ° C in a temperature range from room temperature to 400 ° C.   The block type electronic component according to claim 5, wherein the metal plate (6a, 6b) is an alloy with nickel containing iron as a main component.   The block type electronic component according to claim 7, wherein the metal plate (6a, 6b) is an alloy containing about 58 wt% iron and about 42 wt% nickel.   The block type electronic component according to claim 5, wherein the metal plates (6a, 6b) are an alloy of nickel and cobalt containing iron as a main component.   The block type electronic component according to claim 9, wherein the metal plate (6a, 6b) is an alloy containing about 54 wt% iron, about 29 wt% nickel and about 19 wt% cobalt.   The block type electronic component according to claim 1, wherein the ceramic is a dielectric or a semiconductor.   2. The block type electronic device according to claim 1, wherein said chip type multilayer electronic component (1) comprises a plurality of types, one of which uses a dielectric as said ceramic and the other uses a semiconductor as said ceramic. parts.   The block type electronic component according to claim 11 or 12, wherein the semiconductor is a zinc oxide varistor material.

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