JP5791411B2 - capacitor and circuit board - Google Patents

capacitor and circuit board Download PDF

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JP5791411B2
JP5791411B2 JP2011161075A JP2011161075A JP5791411B2 JP 5791411 B2 JP5791411 B2 JP 5791411B2 JP 2011161075 A JP2011161075 A JP 2011161075A JP 2011161075 A JP2011161075 A JP 2011161075A JP 5791411 B2 JP5791411 B2 JP 5791411B2
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capacitor
cover
thickness
internal electrode
circuit board
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JP2013026508A (en
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上野 純
純 上野
信儀 藤川
信儀 藤川
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京セラ株式会社
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Description

  The present invention relates to a high-capacitance capacitor and a circuit board on which the high-capacitance capacitor is used while being capable of suppressing insulation discharge and used for medium-high voltage applications.

  Capacitors are widely used as electronic components for surface mounting. The structure is such that an extraction portion of the internal electrode layer is provided on the end face of the capacitor element body constituted by alternately laminating a plurality of dielectric layers mainly composed of ceramics and the internal electrode layer, and covers the surface thereof. An external electrode for connecting to an external circuit is formed (see, for example, Patent Document 1). In recent years, along with the increase in the density of electronic circuits, capacitors are increasingly required to have a smaller capacity and a larger capacity, and accordingly, the dielectric layer is becoming thinner.

JP-A-5-3132

  However, among such capacitors, those used for medium and high voltage applications, that is, those with a withstand voltage of 100 V or more, are applied with a relatively large voltage, and therefore, between the external electrodes provided on both end faces of the capacitor body. A discharge phenomenon (so-called flashover phenomenon) in which a current flows along the outer surface of the capacitor body is likely to occur, and the withstand voltage may be reduced.

  Therefore, an object of the present invention is to provide a capacitor that can suppress the occurrence of a discharge phenomenon, has a high withstand voltage, and has a high capacitance, and a circuit board on which the capacitor is mounted.

In the capacitor according to the present invention, the dielectric layer and the internal electrode layer are alternately laminated so that the capacitance portion contributing to the expression of capacitance and the capacitance portion are sandwiched from the lamination direction of the dielectric layer and the internal electrode layer. A capacitor comprising a capacitor body having a pair of cover portions provided, and a pair of external electrodes provided to face the end face where the internal electrode layer of the capacitor body is exposed, The thickness of the cover part located on the upper surface side of the capacity part is different from the thickness of the cover part located on the lower surface side of the capacity part, and only the corner part in the cover part with the smaller thickness or The insulating material is covered only on a line extending in a direction connecting the pair of external electrodes and connecting between the corner portions facing each other.

  The circuit board of the present invention is characterized in that the capacitor is mounted on a wiring board.

  According to the present invention, the occurrence of a discharge phenomenon can be suppressed, a capacitor having a high withstand voltage and a high capacitance, and a circuit board on which the capacitor is mounted can be obtained.

1 is an external perspective sectional view showing a capacitor according to a first embodiment of the present invention. It is an appearance perspective sectional view showing a capacitor of a 2nd embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an embodiment of a circuit board of the present invention, and is an external perspective perspective view showing a state in which a capacitor is mounted on a wiring board. The capacitor | condenser of the 3rd Embodiment of this invention is shown, and it shows that the cross section of the capacitor | condenser main body orthogonal to the axis | shaft which connects the external electrode of both ends has comprised trapezoid shape. 4 shows a capacitor according to a fourth embodiment of the present invention, in which the cross section of the capacitor body perpendicular to the axis connecting the external electrodes at both ends has a trapezoidal shape, and the upper surface of the thicker cover portion is convex. It shows that it is curving.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective sectional view showing a capacitor according to a first embodiment of the present invention. The capacitor A according to the present embodiment has a configuration in which the external electrode 3 is provided at the end including the end surface 1 a of the capacitor element body 1.

  Capacitor body 1 includes a capacitor portion 1b in which dielectric layers 5 and internal electrode layers 7 are alternately stacked to develop capacitance, and this capacitor portion 1b is formed from the stacking direction of dielectric layers 5 and internal electrode layers 7. It has a pair of cover parts 1c and 1d provided so as to be sandwiched. Here, the cover portion 1c is preferably provided also on the side surface 1s of the capacitor portion 1b in terms of protecting the capacitor portion 1b from the external environment. In FIG. 1, the laminated state of the dielectric layer 5 and the internal electrode layer 7 is shown in a simplified manner, but the capacitor of this embodiment is a laminated body in which the dielectric layer 5 and the internal electrode layer 7 are several hundred layers. It has become.

  The external electrode 3 is formed, for example, by baking Cu or an alloy paste of Cu and Ni.

  The dielectric layer 5 is formed of a dielectric ceramic containing, as a main component, barium titanate and various additives for controlling dielectric properties and sinterability, and has an average thickness of 5 μm or less, particularly 3 μm or less is desirable, which makes it possible to reduce the size and capacity of the multilayer ceramic capacitor. The average thickness of the dielectric layer 5 is preferably 0.5 μm or more from the viewpoint of reducing variation in capacitance, stabilizing the capacitance-temperature characteristics, and improving the high temperature load life. It is desirable that the cover portions 1c and 1d are also formed of a dielectric ceramic having the same composition as that of the dielectric layer 5, whereby the capacitor portion 1b and the cover portions 1c and 1d are integrally formed by simultaneous firing. be able to.

  The material of the internal electrode layer 7 is preferably a base metal such as Ni or Cu in that the manufacturing cost can be suppressed even when the number of layers is increased. In particular, Ni can be co-fired with the dielectric layer 5 in the present invention. Is more desirable.

  Each of the pair of internal electrode layers 7 adjacent to each other with the dielectric layer 5 formed in a rectangular shape, the long side of the internal electrode layer 7 is substantially perpendicular to the external electrode 3.

  In the capacitor A of the present embodiment, the pair of cover portions 1c and 1d includes a thickness t1 of the cover portion 1c located on the upper surface side of the capacitor portion 1b, and a thickness t2 of the cover portion 1d located on the lower surface side of the capacitor portion 1b. In addition, an insulating material 9 is coated in the vicinity 8 of the corner portion of the cover portion 1d having a smaller thickness. As a result, even when a large voltage is applied to the capacitor A, a discharge phenomenon occurs in which a current flows between the external electrodes 3 provided on the both end faces 1a of the capacitor body 1 through the outer surface 1s of the capacitor body 1. And a capacitor with a high withstand voltage can be obtained.

  That is, in the capacitor A of the present embodiment, the thickness of the cover portions 1c and 1d located on the upper surface side and the lower surface side of the capacitor portion 1b is different, so that the current flowing along the outer surface of the capacitor body 1 has a thickness of It flows preferentially around the corner portion 8 of the thin cover portion 1d. In this case, since the insulating portion 9 is coated around the corner portion 8 of the thin cover portion 1d, the cover portion 1d is covered. This is because the discharge from the vicinity 8 of the corner can be suppressed.

  Further, in the capacitor A of the present embodiment, as described above, for example, since the thickness of the cover portion 1d located on the lower surface side of the capacitor portion 1b is thin, the capacitor having the capacitor element body 1 of a certain size. In this case, since the thickness of the capacitor portion 1b can be increased by the amount corresponding to the decrease in the thickness of the cover portion 1d, a capacitor A having a high electrostatic capacity per unit volume can be obtained.

  In this case, the thickness t1 of the thick cover portion 1c and the thin cover because the current flowing along the outer surface of the capacitor body 1 preferentially flows on the thin cover portion 1d side. The thickness t2 of the portion 1d is preferably that t1 is 1.5 times or more, especially 2 times or more of t2.

  It is desirable to use a highly insulating organic resin such as silicon gel or tetrafluoroethylene as the insulating material covering the corner portion 8 of the cover portion 1d.

  FIG. 2 is an external perspective sectional view showing a capacitor according to a second embodiment of the present invention. In the capacitor shown in FIG. 2, the insulating material 9 is further covered on a line connecting between the corner portions C of the cover portion 1d having a smaller thickness. The current flowing along the outer surface 1s of the capacitor body 1 may be discharged from the line between the opposing corners 8 in the cover 1d. In the capacitor of this embodiment, the insulating material 9 is thin. Since it is further covered on the line connecting the adjacent corner portions C of the cover portion 1d, the discharge from the capacitor A can be more effectively suppressed, thereby further increasing the withstand voltage. In this case, for the reason that the withstand voltage of the capacitor A can be further increased, it is desirable that the insulating material 9 is covered over the entire region on the line connecting the adjacent corner portions 8 of the cover portion 1d having the smaller thickness. .

  FIG. 3 shows an embodiment of a circuit board according to the present invention, and is an external perspective perspective view showing a state in which a capacitor is mounted on a wiring board. The circuit board according to the present embodiment is characterized in that the above-described capacitor A is mounted on the wiring board B. More specifically, the circuit board is formed on the surface of the wiring board B as shown in FIG. The capacitor A of the present embodiment is mounted on the pair of conductor patterns 21 thus formed. Although not shown in FIG. 3, the capacitor A is bonded on the conductor pattern 21 by a bonding material such as solder. According to the circuit board of the present embodiment, since the capacitor A having a high capacitance and a high withstand voltage is mounted on the surface of the wiring board B, an LED light or the like that controls a high voltage current, etc. It becomes possible to employ | adopt suitably for this electronic device. Here, an organic resin or ceramic is preferably used as the insulating substrate 20. The conductor pattern 21 may be generally formed of any metal or alloy, but uses a low-resistance conductor such as copper, silver, or gold that has a low electrical resistance and is suitable for a high-frequency circuit. It is desirable.

Since the capacitor A mounted on the circuit board of the present embodiment has different thicknesses of the cover portions 1c and 1d located on the upper surface side and the lower surface side of the capacitor portion 1b, the capacitor portion 1b having the internal electrode layer 7 is a capacitor. It is biased to one side in the stacking direction of the element body 1. In such a capacitor A, due to the difference in specific gravity between the base metal, which is the material of the internal electrode layer 7, and the dielectric material, the specific gravity is larger when the capacitor portion 1b is biased in the stacking direction of the capacitor element 1. Therefore, even when the capacitor A rolls due to handling, it is easy to stand still so that the thin cover portion 1d is on the lower side. For this reason, when mounting the capacitor A on the wiring board B, the suction port of the mounting machine can be preferentially adhered to the thick cover portion 1c side of the capacitor A, and therefore the capacitor A is sucked by the mounting machine. Sometimes, the capacitor A can be prevented from being destroyed.

  According to the capacitor A of the present embodiment, the thin cover portion 1d on the wiring board B is on the wiring board B side, while the thick cover portion 1c is on the upper side opposite to the wiring board B side. Therefore, when the insulating material 9 is coated on the corner portion 8 of the thin cover portion 1d of the capacitor A or on the line between the corner portions 8 in advance, the conductor pattern 21 on the surface of the wiring board B is previously provided. When the insulating material 9 is applied between them and the capacitor A is placed and heated from above, the capacitor A is joined to the conductor pattern 21 of the wiring board B, and at the same time, the insulating material 9 is attached to the cover portion 1d with the thin capacitor A. It is possible to cover the vicinity of the corners 8 or the lines between the corners 8, and thus, it is possible to obtain a circuit board on which the capacitor A having a high withstand voltage that can suppress discharge during operation.

  FIG. 4 is an external perspective cross-sectional view showing a capacitor according to a third embodiment of the present invention. More specifically, the cross section of the capacitor element body 1 perpendicular to the axis connecting the capacitor A to the external electrodes 3 at both ends is shown in FIG. It shows that it has a shape. When the cross section of the capacitor A is trapezoidal as shown in FIG. 4, even if the capacitor A rolls during handling, the capacitor portion 1b is biased to the thin cover portion 1d side where the capacitor portion 1b is biased. It can be easily turned to the side. In this way, the circuit board on which the capacitor A having a high withstand voltage and a high withstand voltage can be suppressed can be manufactured with a high yield.

  FIG. 5 is an external perspective cross-sectional view showing a capacitor according to a fourth embodiment of the present invention. More specifically, the cross section of the capacitor main body perpendicular to the axis connecting the external electrodes at both ends has a trapezoidal shape and has a thickness. This shows that the upper surface of the thicker cover portion is convexly curved.

  When the cross section of the capacitor A has a shape as shown in FIG. 5, the thick cover portion 1 c located on the upper surface side of the capacitor element body 1 is easier to roll, and therefore the thin cover portion 1 d on the opposite side is thin. As a result, the circuit board on which the capacitor A is mounted can be manufactured at a higher yield.

A ··· Capacitor 1 ··· Capacitor element 1a ··· End face 1b ·· Capacitance portion 1c ··· Thick cover portion 1d ··· Thin cover portion 3 ··· External electrode 5 ... Dielectric layer 7 ... Internal electrode layer 8 ... Near corner 9 ... Insulating material B ... Wiring board 20 ... Insulating substrate 21 ... Conductor pattern t1 ... thickness of thick cover part t2 ... thickness of thin cover part

Claims (2)

  1. A pair of dielectric layers and internal electrode layers that are alternately stacked to provide a capacitance portion that contributes to the development of capacitance and a pair of the capacitance portions that are sandwiched from the stacking direction of the dielectric layer and the internal electrode layer A capacitor comprising a capacitor body having a cover portion, and a pair of external electrodes provided to face the end face where the internal electrode layer of the capacitor body is exposed,
    The thickness of the cover portion located on the upper surface side of the capacitor portion is different from the thickness of the cover portion located on the lower surface side of the capacitor portion, and only in the vicinity of the corner portion of the cover portion having the smaller thickness. Alternatively, the capacitor is characterized in that an insulating material is coated only on a line extending in a direction connecting the pair of external electrodes and connecting between the opposing corner portions .
  2. A circuit board, wherein the capacitor according to claim 1 is mounted on a wiring board.
JP2011161075A 2011-07-22 2011-07-22 capacitor and circuit board Active JP5791411B2 (en)

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JP2011161075A JP5791411B2 (en) 2011-07-22 2011-07-22 capacitor and circuit board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101496815B1 (en) * 2013-04-30 2015-02-27 삼성전기주식회사 Multi-layered ceramic electronic part and board for mounting the same
JP6274045B2 (en) * 2014-07-28 2018-02-07 株式会社村田製作所 Ceramic electronic component and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636121A (en) * 1979-08-31 1981-04-09 Matsushita Electric Works Ltd Method of mounting condenser
JPH0534094Y2 (en) * 1985-03-28 1993-08-30
JPH08162357A (en) * 1994-11-30 1996-06-21 Murata Mfg Co Ltd Ceramic electronic part
JPH09180957A (en) * 1995-12-22 1997-07-11 Kyocera Corp Multilayered ceramic capacitor
US7092236B2 (en) * 2005-01-20 2006-08-15 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
JP4771787B2 (en) * 2005-10-26 2011-09-14 京セラ株式会社 Multilayer electronic components
JP5338354B2 (en) * 2009-02-13 2013-11-13 株式会社村田製作所 Ceramic electronic components

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