JP5338354B2 - Ceramic electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic electronic component protecting an electronic component body from a flexural crack and a solder crack without increasing the component size. <P>SOLUTION: External terminal electrodes 3, 4 comprise main parts 31, 41 formed on end faces 2c, 2d of a ceramic body 2, and auxiliary parts 32, 42 electrically-insulated from the main parts 31, 41, respectively. The main parts 31, 41 are electrically connected to an internal electrode pattern. The auxiliary part 32 is formed by arranging a plurality of circular division pieces 32a in a zigzag form in parallel with the left-side end face 2d, and arranged near the left-side end face 2d on the front face 2a, the back face 2b and side faces 2e, 2f. The auxiliary part 42 is formed by arranging a plurality of circular division pieces 42a in a zigzag form in parallel with the right-side end face 2c, and arranged near the right-side end face 2c on the front face 2a, the back face 2b and the side faces 2e, 2f. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to ceramic electronic components such as capacitors and inductors.

  In order to control a powertrain system such as an engine or a body system such as an air conditioner, an automobile is equipped with a control device called an ECU (Electric Control Unit). Various electronic components are mounted on the ECU. In recent years, with the increase in the number of airbags and the intelligentization of the system, the number of ECUs mounted in one automobile has been steadily increasing. Along with this, there is a demand for downsizing of ECUs and electronic components mounted thereon, and ceramic electronic components such as multilayer ceramic capacitors are increasingly used.

  Furthermore, recently, there is a tendency to install an ECU near an engine or a gear box, and ceramic electronic components are required to operate at a high temperature of, for example, 150 ° C. or higher. That is, the ceramic electronic component is used under a stricter temperature cycle than before. When a temperature cycle occurs in the external environment, an external stress such as a bending stress caused by thermal expansion and contraction of the mounting substrate is applied to the ceramic electronic component, and a bending crack or a solder crack may occur in the ceramic electronic component.

  FIG. 12 is an external perspective view showing a conventional general ceramic electronic component 50. The electronic component 50 is provided on each of the ceramic body 52 having front and back surfaces 52a and 52b, end surfaces 52c and 52d, and side surfaces 52e and 52f, internal electrodes 58 and 59 in the ceramic body 52, and both ends of the ceramic body 52. External terminal electrodes 54 and 55. The external terminal electrodes 54 and 55 have wraparound portions 54a and 55a (the dimension is E) extending to the front and back surfaces 52a and 52b and the side surfaces 52e and 52f, respectively.

  And as shown in FIG. 13, the bending crack C1 means the crack which arises in the ceramic main body 52 when the mounting substrate P bends. Specifically, when the electronic component 50 is mounted on the electrode pattern 60 of the mounting substrate P via the solder 62, the electronic component 50 is stressed, or the mounting substrate P bends when the user uses the electronic component 50. When stress is applied to 50, a flex crack C1 occurs.

  Further, as shown in FIG. 14, the solder crack C <b> 2 is a crack generated in the solder 62 when the mounting substrate P and the electronic component 50 expand and contract due to temperature and the like. In recent years, since the solder has shifted to lead-free solder, the temperature change range has been increased, and it has become a severe environment for ceramic electronic components.

  Therefore, in order to prevent the occurrence of such cracks C1 and C2, for example, a ceramic electronic component to which a new metal terminal as described in Patent Document 1 is added has been proposed.

JP 2000-235932 A

  However, in the structure of Patent Document 1, the height dimension of the electronic component is increased by the newly added metal terminal, which hinders the reduction of the height of the electronic component.

  Therefore, a main object of the present invention is to provide a ceramic electronic component capable of protecting an electronic component main body from bending cracks and solder cracks without increasing the component size.

  Further, in the ceramic electronic component 50 shown in FIG. 11, the external terminal electrodes 54 and 55 mainly have two functions, and one is conduction with the internal electrodes 58 and 59 by the external terminal electrodes 54 and 55 on the end faces 52c and 52d. It is to secure and prevent solder erosion. Another function is an improvement in bending resistance and mounting stability by the wraparound portions 54a and 55a. Here, the external terminal electrodes 54 and 55 on the end faces 52c and 52d are necessary, but the wraparound portions 54a and 55a are not necessarily required in terms of electrical characteristics, but rather the gap dimension G between the external terminal electrodes 54 and 55 is shortened. Therefore, the surface withstand voltage may be reduced. In other words, since the wraparound portions 54a and 55a are present, the gap dimension G is shortened and the surface discharge start voltage is lowered, which is one of the factors that the electronic component 50 cannot be reduced in size. Therefore, the electronic component 50 can be protected from bending cracks and solder cracks, and if there is no problem in mountability, the wraparound portions 54a and 55a are even unnecessary. Further, in order to increase the bending resistance, there is a tendency that the wraparound portions 54a and 55a are made larger than necessary.

The present invention relates to a ceramic body having a first main surface and a second main surface facing each other, a first side surface and a second side surface facing each other, and a first end surface and a second end surface facing each other, and a ceramic body The first external terminal electrode provided at the end portion on the first end face side and the second external terminal electrode provided at the end portion on the second end face side of the ceramic body and electrically insulated from the first external terminal electrode A first main portion that is provided on the first end surface and is electrically connected to the internal electrode, and a first main portion that is electrically connected to the internal electrode . provided on the first end face closer on second major surface, and first and auxiliary portion which is electrically insulated from the first main portion and the inner electrode has a second external terminal electrodes, on the second end face provided, and a second main portion which is electrically connected to the internal electrodes, on the second main surface Provided at two end surfaces closer, and that has a second auxiliary portion that is electrically insulated to the second main part and the internal electrode, characterized by a ceramic electronic component.

  In this invention, the external terminal electrode is composed of a main portion provided on the end surface of the ceramic body and a sub-portion provided near the end surface on the main surface (mounting surface) and electrically insulated from the main portion. ing. Therefore, when the main part is firmly joined to the internal electrode of the ceramic body, electrical connection between the external terminal electrode and the internal electrode is ensured. On the other hand, since the secondary part is physically separated from the main part, even if a flex crack or a solder crack occurs, the direction of the crack is changed by the secondary part, or the cracks are dispersed and grow into a large crack. Without any damage.

  In the present invention, the first main portion of the first external terminal electrode is provided so as to wrap around the first main surface and the second main surface, and the second main portion of the second external terminal electrode is the first main surface. And it is provided so that it may wrap around to the 2nd main surface. Thereby, the height of the sub part on the main surface of the ceramic main body and the height of the main part are substantially uniform, and the stability when mounting the electronic component on the mounting board is improved.

  In the present invention, the first main portion of the first external terminal electrode is provided so as to wrap around the first side surface and the second side surface, and the second main portion of the second external terminal electrode is formed by the first side surface and the second side surface. It is provided so that it may wrap around to the side. Thereby, the joint strength between the external terminal electrode and the ceramic body is improved, and the electrical connection reliability between the external terminal electrode and the internal electrode is further enhanced.

  Further, according to the present invention, the first subportion of the first external terminal electrode is also provided near the first end surface on the first main surface, and the second subportion of the second external terminal electrode is on the first main surface. It is also provided near the second end face. Thereby, the vertical directionality of the electronic component is lost, and the electronic component can be protected from bending cracks and solder cracks regardless of whether the front surface or the back surface is a mounting surface.

  Further, according to the present invention, the first sub-portion of the first external terminal electrode is also provided near the first end surface on the first side surface and near the first end surface on the second side surface, The sub-portion is also provided near the second end surface on the first side surface and near the second end surface on the second side surface. As a result, the electronic component can be protected from bending cracks and solder cracks, regardless of which of the front surface, the back surface, and the two side surfaces of the electronic component is the mounting surface.

  Further, according to the present invention, the first sub-portion of the first external terminal electrode is composed of a plurality of divided pieces arranged in parallel to the first end face, and the second sub-portion of the second external terminal electrode is The plurality of divided pieces are arranged in parallel to the second end face. By configuring the sub part with a plurality of divided pieces, the effect of changing the direction of cracks and the dispersion of cracks by the sub part is improved.

  Further, according to the present invention, the first sub-portion of the first external terminal electrode is continuously annularly arranged over the first main surface, the first side surface, the second main surface, and the second side surface, and the second external terminal electrode The second sub-portion is continuously arranged in an annular shape over the first main surface, the first side surface, the second main surface, and the second side surface. Thereby, compared with the case where a subpart is comprised with a some division | segmentation piece, the structure of a subpart becomes simple and formation of a subpart becomes easy.

  According to this invention, the external terminal electrode is composed of a main portion provided on the end face of the ceramic body and a sub-portion that is electrically insulated from the main portion. Therefore, when the main part is firmly joined to the internal electrode of the ceramic body, electrical connection between the external terminal electrode and the internal electrode can be ensured. On the other hand, since the secondary part is physically separated from the main part, even if a flex crack or a solder crack occurs, the direction of the crack is changed by the secondary part, or the cracks are dispersed and grow into a large crack. Without any damage. As a result, it is possible to obtain a ceramic electronic component that can protect the electronic component body from bending cracks and solder cracks without adding new components and increasing the component size.

  The above-mentioned object, other objects, features and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

1 is an external perspective view showing a ceramic electronic component of a first embodiment according to the present invention. It is II sectional drawing of FIG. It is a disassembled perspective view of a ceramic main body. It is a partial cross section figure which shows a bending crack. It is a partial sectional view showing a solder crack. It is an external appearance perspective view which shows the ceramic electronic component of 2nd Embodiment which concerns on this invention. It is an external appearance perspective view which shows the ceramic electronic component of 3rd Embodiment which concerns on this invention. It is an external appearance perspective view which shows the ceramic electronic component of 4th Embodiment which concerns on this invention. It is an external appearance perspective view which shows the ceramic electronic component of the 5th Embodiment concerning this invention. It is an external appearance perspective view which shows the ceramic electronic component of the 6th Embodiment which concerns on this invention. It is an external appearance perspective view which shows the ceramic electronic component of the 7th Embodiment which concerns on this invention. It is an external appearance perspective view which shows the conventional ceramic electronic component. It is sectional drawing for demonstrating the bending crack of the conventional ceramic electronic component. It is sectional drawing for demonstrating the solder crack of the conventional ceramic electronic component.

(First embodiment)
A ceramic capacitor according to a first embodiment of the present invention will be described together with a manufacturing method. In the following, a case where ceramic capacitors are produced individually will be described as an example. However, in the case of mass production, a mother laminated body including a plurality of ceramic capacitors is manufactured. 1 is an external perspective view of a surface mount type ceramic capacitor 10, FIG. 2 is a cross-sectional view taken along the line II of FIG. 1, and FIG. 3 is an exploded perspective view of the ceramic body 2. The ceramic capacitor 10 includes a ceramic body 2 having front and back surfaces 2a and 2b, end surfaces 2c and 2d, and side surfaces 2e and 2f, and external terminal electrodes 3 and 4 respectively formed at both ends of the ceramic body 2. Yes.

As shown in FIG. 3, the ceramic body 2 includes ceramic green sheets 20c to 20h having internal electrode patterns 22 and 23 formed on the surface, and ceramic green sheets 20a, 20b, 20i, and 20j for outer layers on which no electrode pattern is formed. It is a laminated body constituted by stacking. As a material of the ceramic green sheets 20a to 20j, a material in which a known organic binder or an organic solvent is added to a dielectric ceramic composed of main components such as BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , and CaZrO ₃ is used. Moreover, you may use what added subcomponents, such as a Mn compound, Fe compound, Cr compound, Co compound, Ni compound, to these main components. The thickness of the ceramic green sheets 20c to 20g is preferably set so that the thickness of the ceramic layer between the internal electrode patterns 22 and 23 after firing is 0.5 to 10 μm.

  The internal electrode patterns 22 and 23 are formed by applying a conductive paste on the ceramic green sheets 20c to 20h by, for example, screen printing. The internal electrode pattern 22 is exposed on the left side of the ceramic green sheets 20c, 20e, and 20g. The internal electrode pattern 23 is exposed on the right side of the ceramic green sheets 20d, 20f, and 20h. The internal electrode patterns 22 and 23 are arranged so as to face each other with the ceramic green sheets 20c to 20g interposed therebetween in the stacked state. Predetermined electrical characteristics can be obtained by this facing portion. In the case of an inductor, a spiral coil conductor pattern is arranged in the ceramic body 2 instead of such a facing pattern. As a material of the internal electrode patterns 22 and 23, for example, Ni, Cu, Ag, Pd, an Ag—Pd alloy, Au, or an alloy mainly containing any one of them is used. The thicknesses of the internal electrode patterns 22 and 23 are preferably set to be 0.3 to 2.0 μm after firing.

  The above ceramic green sheets 20a to 20j are laminated to form a ceramic laminate as shown in FIG. At this time, if necessary, the ceramic laminate may be pressed in the stacking direction by an isostatic press or the like. Next, after cutting the ceramic laminate into a predetermined size, barrel polishing is performed to form roundness at the corners and ridges of the ceramic laminate. Next, the ceramic laminate is fired. The firing temperature depends on the materials of the ceramic green sheets 20a to 20j and the internal electrode patterns 22 and 23, but is preferably 900 to 1300 ° C. Thus, the ceramic body 2 is formed.

  Next, external terminal electrodes 3 and 4 are formed on both ends of the ceramic body 2, respectively. The external terminal electrodes 3 and 4 are electrically insulated. The external terminal electrode 3 includes a main part 31 formed on the left end surface 2 d of the ceramic body 2 and a sub-part 32 electrically insulated from the main part 31. The main portion 31 is electrically connected to the internal electrode pattern 22 and is provided so as to slightly wrap around the front and back surfaces 2a and 2b and the side surfaces 2e and 2f (note that the main portion 31 is formed only on the end surface 2d. It may be) Thereby, the joint strength between the external terminal electrode 3 and the ceramic body 2 is improved, and the electrical connection reliability between the external terminal electrode 3 and the internal electrode pattern 22 is further enhanced. On the other hand, the sub-portion 32 includes a plurality of circular segment pieces 32a arranged in a staggered manner in parallel with the left end surface 2d, and the left end surface 2d on the front surface 2a, the back surface 2b, and the side surfaces 2e and 2f. It is provided near.

  Similarly, the external terminal electrode 4 is composed of a main portion 41 formed on the right end surface 2 c of the ceramic body 2 and a sub-portion 42 that is electrically insulated from the main portion 41. The main portion 41 is electrically connected to the internal electrode pattern 23 and is provided so as to slightly wrap around the front and back surfaces 2a and 2b and the side surfaces 2e and 2f (note that the main portion 41 is formed only on the end surface 2c. It may be) Thereby, the joint strength between the external terminal electrode 4 and the ceramic body 2 is improved, and the electrical connection reliability between the external terminal electrode 4 and the internal electrode pattern 23 is further enhanced. On the other hand, the sub-part 42 has a plurality of circular divided pieces 42a arranged in a staggered manner parallel to the right end surface 2c, and the right end surface 2c on the front surface 2a, the back surface 2b, and the side surfaces 2e and 2f. It is provided near. By arranging the split pieces 32a and 42a of the sub-parts 32 and 42 in a staggered manner, the degree of freedom in designing the electrode pattern 60 of the mounting board P is increased. Further, by making the divided pieces 32a and 42a circular, the directions of cracks C1 and C2 to be described later can be further dispersed. The arrangement dimension E1 of each of the sub-parts 32 and 42 can be set to be equal to or less than the dimension E of the wrap-around parts 54a and 55a of the conventional external terminal electrodes 54 and 55 shown in FIG. The gap dimension G can be made wider than before. As a result, the surface discharge start voltage increases, and the capacitor 10 can be downsized.

  When the external terminal electrodes 3 and 4 are formed, external terminal electrode base layers are previously formed on both ends of the ceramic body 2 by sintered metal, plating, sputtering, vapor deposition, or the like. As a material for the external terminal electrode base layer, for example, Ni, Cu, Ag, Pd, an Ag—Pd alloy, Au, or an alloy containing any one of them as a main component is used. The external terminal electrode base layer is covered with a plating layer. As the material of the plating layer, for example, Ni, Cu, Au, Sn, or an alloy mainly containing any one of them is used. These external terminal electrode base layer and plating layer are formed independently by the main portions 31 and 41 and the sub portions 32 and 42. The thickness of the external terminal electrode base layer is preferably set to be 10 to 50 μm. The thickness per one plating layer is preferably set to be 1 to 10 μm.

  Next, the main parts 31 and 41 of the external terminal electrodes 3 and 4 are formed by applying a conductive paste for external terminal electrodes to the end faces 2c and 2d of the ceramic body 2 by an immersion method, respectively. Further, by a method such as a transfer method, a screen printing method, an ink jet method, etc., for the external terminal electrodes on the front surface 2a, the back surface 2b, and the side surfaces 2e and 2f of the ceramic main body 2 near the right end surface 2c and the left end surface 2d. The sub portions 32 and 42 of the external terminal electrodes 3 and 4 are formed by applying a conductive paste. Thereafter, the main portions 31 and 41 and the sub portions 32 and 42 of the external terminal electrodes 3 and 4 are baked at a temperature of 700 to 900 ° C.

  In addition, before baking a ceramic laminated body, the method of apply | coating the electrically conductive paste for external terminal electrodes to a ceramic laminated body, and baking external terminal electrodes 3 and 4 simultaneously with baking of a ceramic laminated body may be sufficient.

  In the surface mount type ceramic capacitor 10 thus obtained, the external terminal electrodes 3 and 4 are electrically insulated from the main portions 31 and 41 provided on the end faces 2c and 2d of the ceramic body 2 and the main portions 31 and 41, respectively. The sub-parts 32 and 42 are formed. Therefore, the main portions 31 and 41 have a function of ensuring electrical connection between the external terminal electrodes 3 and 4 and the internal electrodes 22 and 23 by firmly joining the internal electrodes 22 and 23 of the ceramic body 2. On the other hand, the sub-parts 32 and 42 have a function of ensuring the stability when the capacitor 10 is mounted on the mounting substrate P, and are physically separated from the main parts 31 and 41. Even if C2 occurs, the direction of the cracks C1 and C2 is changed by the sub-parts 32 and 42, or the cracks C1 and C2 are dispersed, so that they do not grow into large cracks C1 and C2, and minimal damage is required. Has a fail-safe function. Accordingly, the main portions 31 and 41 having an electrical connection function between the external terminal electrodes 3 and 4 and the internal electrodes 22 and 23 are not affected by the cracks C1 and C2.

  For example, as shown in FIG. 4, when the electronic component 50 is stressed when the electronic component 50 is mounted on the electrode pattern 60 of the mounting substrate P via the solder 62, or when the user uses the mounting substrate P, When the electronic component 50 is stressed by bending, a bending crack C1 is generated in the ceramic body 2. However, since the sub-parts 32 and 42 are physically separated from the main parts 31 and 41, the direction of the flex crack C1 is changed or dispersed by the sub-parts 32 and 42, and the large flex crack C1 is not formed. . Similarly, as shown in FIG. 5, when the mounting substrate P and the capacitor 10 expand and contract due to temperature and the like, a solder crack C <b> 2 occurs in the solder 62. However, since the sub-parts 32 and 42 are physically separated from the main parts 31 and 41, the direction of the solder crack C2 is changed or dispersed by the sub-parts 32 and 42, and the large solder crack C2 does not occur. . As a result, the capacitor 10 can be protected from the flex crack C1 and the solder crack C2 without increasing the component size.

  Further, conventionally, since it has been necessary to design a wide outer layer or the like so that the active area (the internal electrode patterns 22 and 23 in the ceramic body 2) does not cause the bending crack C1, the active area occupying in the ceramic body 2 is required. The ratio was small. However, in the first embodiment, since the possibility that the flex crack C1 grows to the active area is extremely low, the proportion of the active area in the ceramic body 2 can be increased, and the capacitor 10 can be reduced in size. And high capacity.

  Further, because of the electrical characteristics, the sub-portions 32 and 42 are not electrically connected to the internal electrode patterns 22 and 23, so that cracks C1 and C2 are generated in all the circular divided pieces 32a and 42a of the sub-portions 32 and 42. Even if the function cannot be performed, the electrical connection between the internal electrode patterns 22 and 23 and the external terminal electrodes 3 and 4 and the electrode pattern 60 of the mounting substrate P is not affected.

  Further, when only the sub-portions 32 and 42 protrude on the front and back surfaces 2a and 2b of the ceramic body 2, the installation stability when the capacitor 10 is mounted on the mounting board P is low. Therefore, in the first embodiment, the main portions 31 and 41 of the external terminal electrodes 3 and 4 are provided so as to wrap around the front and back surfaces 2a and 2b, respectively. The height of the parts 32 and 42 and the height of the main parts 31 and 41 can be substantially equalized, and the installation stability when the capacitor 10 is mounted on the mounting board P can be improved. Moreover, the solder wettability to the main parts 31 and 41 is also good.

  Further, since the sub-parts 32 and 42 are constituted by a plurality of circular segment pieces 32a and 42a, the effect of changing the direction of the cracks C1 and C2 and the distribution of the cracks C1 and C2 by the sub-parts 32 and 42 is further increased. Can be improved. Further, even if cracks C1 and C2 occur in a part of the plurality of circular divided pieces 32a and 42a and the function cannot be performed, the other divided pieces 32a and 42a perform the function, so that the fail-safe function works reliably. It will be.

  In the first embodiment, the sub-portions 32 and 42 are formed on the front and back surfaces 2a and 2b and the side surfaces 2e and 2f, so that any one of the front and back surfaces 2a and 2b and the two side surfaces 2e and 2f of the capacitor 10 is formed. As a mounting surface, the capacitor 10 can be protected from the flex crack C1 and the solder crack C2. However, as a modification of the capacitor 10, the sub portions 32 and 42 are not formed on the side surfaces 2e and 2f. Thus, it may be formed only on the front and back surfaces 2a and 2b. In this case, the capacitor 10 has no vertical direction, and the capacitor 10 can be protected from the flex crack C1 and the solder crack C2 regardless of which of the front surface 2a and the back surface 2b is the mounting surface. As another modification, the sub-portions 32 and 42 may be formed only on the back surface 2b without being formed on the front surface 2a and the side surfaces 2e and 2f.

(Second Embodiment, Third Embodiment)
FIG. 6 is an external perspective view of the surface mount type ceramic capacitor 10A of the second embodiment, and FIG. 7 is an external perspective view of the surface mount type ceramic capacitor 10B of the third embodiment. In FIG. 6 and FIG. 7, the same parts and the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 6, the capacitor 10 </ b> A has external terminal electrodes 3 and 4 formed at both ends of the ceramic body 2. The external terminal electrode 3 includes a main part 31 formed on the left end surface 2 d of the ceramic body 2 and a sub-part 32 electrically insulated from the main part 31. The sub-portion 32 includes a plurality of circular segment pieces 32a arranged in a line parallel to the left end surface 2d, and is provided near the left end surface 2d on the front surface 2a, the back surface 2b, and the side surfaces 2e and 2f. It has been. Similarly, the external terminal electrode 4 is composed of a main portion 41 formed on the right end surface 2 c of the ceramic body 2 and a sub-portion 42 that is electrically insulated from the main portion 41. The sub-part 42 is formed by arranging a plurality of circular segment pieces 42a in a line parallel to the right end surface 2c, and is provided near the right end surface 2c on the front surface 2a, the back surface 2b, and the side surfaces 2e and 2f. It has been.

  As shown in FIG. 7, in the case of the capacitor 10B, the sub-portion 32 of the external terminal electrode 3 is formed by arranging a plurality of circular divided pieces 32a in an arc shape, on the front surface 2a, on the back surface 2b, and It is provided near the left end face 2d on the side faces 2e and 2f. Similarly, the sub-portion 42 of the external terminal electrode 4 is formed by arranging a plurality of circular divided pieces 42a in an arc shape, and is closer to the right end surface 2c on the front surface 2a, the back surface 2b, and the side surfaces 2e and 2f. Is provided.

  The ceramic capacitors 10A and 10B having the above-described configuration have the same operational effects as the capacitor 10 of the first embodiment.

(4th Embodiment, 5th Embodiment)
FIG. 8 is an external perspective view of a surface mount type ceramic capacitor 10C of the fourth embodiment, and FIG. 9 is an external perspective view of a surface mount type ceramic capacitor 10D of the fifth embodiment. In FIG. 8 and FIG. 9, the same parts and the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 8, in the case of the capacitor 10C, the sub-portion 32 of the external terminal electrode 3 is formed by arranging a plurality of rectangular divided pieces 32a in a line parallel to the left end face 2d, and on the surface 2a. Further, it is provided near the left end face 2d on the back surface 2b and the side faces 2e and 2f. Similarly, the sub-portion 42 of the external terminal electrode 4 is formed by arranging a plurality of rectangular divided pieces 42a in a line parallel to the right end surface 2c, and on the front surface 2a, the back surface 2b, and the side surfaces 2e, 2f. It is provided near the upper right end face 2c.

  As shown in FIG. 9, in the case of the capacitor 10 </ b> D, the sub-portion 32 of the external terminal electrode 3 is formed by arranging two types of long and short rectangular divided pieces 32 a in parallel with the left end surface 2 d. , On the front surface 2a, on the back surface 2b, and on the side surfaces 2e and 2f. Similarly, the sub-portion 42 of the external terminal electrode 4 is formed by arranging two types of long and short rectangular divided pieces 42a in parallel with the right end surface 2c, on the front surface 2a, the back surface 2b, and the side surface 2e. , 2f is provided near the right end face 2c.

  The ceramic capacitors 10C and 10D having the above configuration have the same operational effects as the capacitor 10 of the first embodiment.

(Sixth embodiment)
FIG. 10 is an external perspective view of a surface mount type ceramic capacitor 10E of the sixth embodiment. In FIG. 10, the same parts and the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the capacitor 10E, the sub-portions 32 and 42 of the external terminal electrodes 3 and 4 are annularly arranged continuously across the front and back surfaces 2a and 2b and the side surfaces 2e and 2f, respectively. Thereby, compared with the case where the subparts 32 and 42 are comprised by the some division | segmentation piece 32a, 42a, the structure of the subparts 32 and 42 becomes simple and formation of the subparts 32 and 42 becomes easy. . That is, the main portions 31 and 41 and the sub portions 32 and 42 are integrally formed in advance, a part is removed by a laser or the like in a later process, and the main portions 31 and 41 and the sub portions 32 and 42 are separated and independent. Thus, the external terminal electrodes 3 and 4 can be easily formed.

(Seventh embodiment)
FIG. 11 is an external perspective view of a surface mount type ceramic capacitor 10F of the seventh embodiment. In FIG. 11, the same parts and the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the capacitor 10F, the longitudinal dimensions of the end faces 2c and 2d are longer than the longitudinal dimensions of the side faces 2e and 2f. The plurality of circular divided pieces 32a and 42a of the sub-portions 32 and 42 of the external terminal electrodes 3 and 4 are disposed on the front and back surfaces 2a and 2b and the side surfaces 2e and 2f, respectively. Thereby, the arrangement | positioning length of the subparts 32 and 42 becomes long (in other words, the number of circular division | segmentation pieces 32a and 42a increases), and the effect which prevents the bending crack C1 and the solder crack C2 increases.

(Other embodiments)
In addition, this invention is not limited to the said embodiment, In the range of the summary, it changes variously. In addition to the capacitor, the ceramic electronic component may be an inductor, a piezoelectric component, a thermistor, or the like. When a piezoelectric ceramic such as PZT ceramic is used as the material of the ceramic body, a piezoelectric component is obtained. When a semiconductor ceramic such as a spinel ceramic is used, a thermistor is formed. When a magnetic ceramic such as ferrite is used, it becomes an inductor. The ceramic body is not necessarily a ceramic laminate having internal electrodes, and may be a single ceramic plate having no internal electrodes. Further, the main part and the sub part of the external terminal electrode may be formed of different materials. For example, a resin containing a conductive filler may be used as the material for the sub part.

2 Ceramic body 2a Surface (first main surface)
2b Back surface (second main surface)
2c, 2d End face 2e, 2f Side face 3, 4 External terminal electrode 10, 10A, 10B, 10C, 10D, 10E, 10F Ceramic capacitor 31, 41 Main part 32, 42 Sub part 32a, 42a Split piece

Claims (7)

A ceramic body having a first main surface and a second main surface facing each other, a first side surface and a second side surface facing each other, and a first end surface and a second end surface facing each other;
A first external terminal electrode provided at an end portion on the first end face side of the ceramic body;
A second external terminal electrode provided at an end portion on the second end face side of the ceramic body and electrically insulated from the first external terminal electrode;
An internal electrode provided inside the ceramic body ,
The first external terminal electrode is provided on the first end surface , and is provided near a first main portion electrically connected to the internal electrode and the first end surface on the second main surface. and, anda first auxiliary portion which is electrically insulated from the first main portion and the inner electrode,
The second external terminal electrode is provided on the second end surface , and is provided near a second main portion electrically connected to the internal electrode and the second end surface on the second main surface. and to have a second auxiliary portion that is electrically insulated from the second main portion and the inner electrode,
Features ceramic electronic parts.   The first main portion of the first external terminal electrode is provided so as to wrap around the first main surface and the second main surface, and the second main portion of the second external terminal electrode includes the first main surface and The ceramic electronic component according to claim 1, wherein the ceramic electronic component is provided so as to wrap around the second main surface.   The first main portion of the first external terminal electrode is provided to wrap around the first side surface and the second side surface, and the second main portion of the second external terminal electrode is formed of the first side surface and the second side. The ceramic electronic component according to claim 1, wherein the ceramic electronic component is provided so as to wrap around the side surface.   The first sub-portion of the first external terminal electrode is also provided near the first end surface on the first main surface, and the second sub-portion of the second external terminal electrode is on the first main surface. The ceramic electronic component according to any one of claims 1 to 3, wherein the ceramic electronic component is also provided near the second end surface.   The first sub-portion of the first external terminal electrode is also provided near the first end surface on the first side surface and near the first end surface on the second side surface, and the second sub-terminal of the second external terminal electrode is provided. The sub-portion is provided near the second end surface on the first side surface and also near the second end surface on the second side surface, according to any one of claims 1 to 4. The ceramic electronic component described.   The first sub-portion of the first external terminal electrode is composed of a plurality of divided pieces arranged in parallel to the first end surface, and the second sub-portion of the second external terminal electrode is the first sub-portion The ceramic electronic component according to any one of claims 1 to 5, wherein the ceramic electronic component includes a plurality of divided pieces arranged in parallel to the two end faces.   The first sub-portion of the first external terminal electrode is annularly arranged continuously over the first main surface, the first side surface, the second main surface, and the second side surface, and the second external terminal electrode The second sub-portion is arranged in an annular shape continuously over the first main surface, the first side surface, the second main surface, and the second side surface. Item 6. The ceramic electronic component according to any one of Items 5.

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