JP2018207091A - Multilayer ceramic capacitor and mounting board thereof - Google Patents

Abstract

To provide a multilayer ceramic capacitor capable of reducing step, without deteriorating the electrical characteristics, and to provide a mounting board thereof.SOLUTION: A multilayer ceramic capacitor 100 includes a dielectric layer, and multiple first through third internal electrodes arranged alternately while sandwiching the dielectric layer, and includes first and second faces 1, 2 facing each other, third and fourth faces 3, 4 connected with the first and second faces, and facing each other, and fifth and sixth faces 5, 6 connected with the first and second faces, also connected with the third and fourth faces, and facing each other. Both ends of the first internal electrode is exposed to the third and fourth faces, the second internal electrode has a portion exposed to the fifth or sixth faces, the third internal electrode includes a capacitor body having a portion exposed to the fifth or sixth faces, first and second external electrodes 131, 132 arranged on the third and fourth faces, and connected with the first internal electrode, and third and fourth external electrodes 133, 134 arranged on the fifth and sixth faces, and connected with the second and third internal electrodes.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a multilayer ceramic capacitor and its mounting substrate.

  Examples of electronic parts using ceramic materials include capacitors, inductors, piezoelectric elements, varistors, thermistors, and the like.

  Among such ceramic electronic components, a multi-layered ceramic capacitor (MLCC) has advantages in that it is small in size but has a high capacity and is easy to mount.

  The multilayer ceramic capacitor includes a video device such as a liquid crystal display device (LCD, Liquid Crystal Display) and a plasma display device panel (PDP, Plasma Display Panel), a computer, a personal digital assistant (PDA), and a mobile phone. It is a capacitor in a chip form that is mounted on a circuit board of various products such as charging and discharging electricity.

  Such a multilayer ceramic capacitor is manufactured by alternately laminating a plurality of dielectric layers and internal electrodes to form a multilayer body, and then firing the multilayer body and installing external electrodes. Generally, the product capacity is determined according to the number of stacked internal electrodes.

  On the other hand, in order to mount the multilayer ceramic capacitor on a printed circuit board, a certain area is required.

  At this time, when a plurality of multilayer ceramic capacitors having various electrical characteristics are mounted on one printed circuit board, it is necessary to secure a certain space in order to operate each multilayer ceramic capacitor normally.

  Recently, with the miniaturization of electronic products, ultra-miniaturization and ultra-high capacity are also required for multilayer ceramic capacitors used in such electronic products.

  However, when an electric product is slim and downsized, product design becomes difficult because a space in which the multilayer ceramic capacitor can be mounted is limited.

  In particular, since the size of IT products has been reduced and the battery size for increasing the continuous use time has been increasing, restrictions on the number and size of passive elements as well as the size of the printed circuit board are increasing.

  Against this backdrop, there is an increasing demand for multilayer ceramic capacitors (MLCC) having higher capacities in addition to smaller size products.

  In order to manufacture high-capacity products of small size according to market needs, manufacturers have reduced the thickness of the cover and margin and made each layer thinner to develop a high stack design. ing.

  That is, with the ultra-high capacity and miniaturization of the multilayer ceramic capacitor, the thickness is reduced and the number of layers is increased. As a result, the number of lead portions for realizing electrical characteristics is also increased.

  Thus, when the number of lead portions increases, the cumulative level difference of the stacked body increases. As a result, the reverse step difference from the peripheral portion without the lead portion becomes severe, which adversely affects the product yield and reliability.

  In addition, in order to increase the capacity per unit volume, the thickness of the cover and margin of the laminate tends to be reduced. Thereby, the actual situation is that the above-described adverse effects due to the steps are further increased.

  From such a point of view, there is a need for a method that can eliminate some side effects caused by steps without deteriorating electrical characteristics.

  For example, a technique is disclosed in which negative printing is performed and a dielectric is filled in a portion where there is no internal electrode. However, in this case, since the process is complicated, there is a disadvantage that it is not practical.

JP 2012-138415 A Japanese Patent Application Laid-Open No. 2015-076591

  An object of the present invention is to provide a monolithic ceramic capacitor and a mounting substrate thereof capable of reducing a step difference without deteriorating electrical characteristics.

  One aspect of the present invention includes a dielectric layer and a plurality of first to third internal electrodes arranged alternately with the dielectric layer interposed therebetween, and first and second surfaces facing each other in the stacking direction, The third and fourth surfaces connected to the first and second surfaces and facing each other and the first and second surfaces connected to each other, the fifth and the fifth surfaces connected to the third and fourth surfaces and facing each other. A third surface including a sixth surface, wherein both ends of the first internal electrode are exposed at the third and fourth surfaces, respectively, and the second internal electrode is exposed at the fifth or sixth surface; Are capacitor bodies having portions exposed on the fifth and sixth surfaces, and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body and connected to the first internal electrodes, respectively. And the second internal electrode disposed on the fifth and sixth surfaces of the capacitor body, respectively. And third and fourth external electrodes connected to the fine said third internal electrode, to provide a laminated ceramic capacitor including.

  In one embodiment of the present invention, the second internal electrode includes a first main body overlapping the first internal electrode in the stacking direction, and from the first main body toward the fifth or sixth surface of the capacitor main body. An extended first lead portion.

  In one embodiment of the present invention, the third internal electrode includes a second body portion that overlaps the first or second internal electrode in the stacking direction, and the fifth and sixth surfaces of the capacitor body from the second body portion. And second and third lead portions respectively extending toward the front.

  In one embodiment of the present invention, the second internal electrodes may be disposed so as to be alternately exposed on the fifth and sixth surfaces of the capacitor body in the stacking direction.

  In one embodiment of the present invention, the plurality of second internal electrodes may include at least one second internal electrode having a portion exposed on the fifth surface of the capacitor body and the sixth surface of the capacitor body. And at least one second internal electrode having an exposed portion.

  In one embodiment of the present invention, the first and second external electrodes extend from the third and fourth surfaces of the capacitor body to a part of the first and second surfaces, respectively. The electrodes may extend from the fifth and sixth surfaces of the capacitor body to a part of the first and second surfaces, respectively.

  In one embodiment of the present invention, the third and fourth external electrodes may be disposed to be separated from the third and fourth surfaces of the capacitor body.

  In one embodiment of the present invention, it further includes a connection electrode located on at least one of the first and second surfaces of the capacitor body and formed to electrically connect the third and fourth external electrodes. be able to.

  According to another aspect of the present invention, there is provided a substrate having a plurality of electrode pads on an upper surface, and the multilayer ceramic capacitor mounted on the substrate so that the plurality of electrode pads and the corresponding external electrodes are connected to each other. A multilayer ceramic capacitor mounting substrate including the same is provided.

  The multilayer ceramic capacitor according to an embodiment of the present invention reduces the number of lead portions of the internal electrode exposed in the width direction of the capacitor body while maintaining the electrical connectivity of the external electrodes arranged in the width direction. In addition to realizing the same characteristics, it is possible to improve the step difference from the peripheral portion of the capacitor body due to the exposure of the internal electrode.

It is a perspective view which shows schematically the multilayer ceramic capacitor by a comparative example. FIG. 2 is an exploded perspective view schematically showing the internal electrode structure of FIG. 1. It is sectional drawing which shows roughly the cut surface of the width-thickness surface in the center part of the capacitor main body of FIG. 1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 5 is an exploded perspective view schematically showing the internal electrode structure of FIG. 4. FIG. 5 is a cross-sectional view schematically showing a cut surface of a width-thickness surface of a central portion in the capacitor main body of FIG. 4. (A)-(c) is a top view which shows schematically the internal electrode of the multilayer ceramic capacitor by one Embodiment of this invention. It is sectional drawing which shows the cut surface of the width-thickness surface in the center part of the capacitor body of the multilayer ceramic capacitor by other embodiment of this invention. (A)-(d) is a top view which shows schematically the internal electrode of the multilayer ceramic capacitor by other embodiment of this invention. FIG. 9 is a photograph of an exposed portion of an internal electrode of the multilayer ceramic capacitor according to the embodiment of FIG. 8. FIG. 6 is a cross-sectional view schematically showing a cut surface of a width-thickness surface in a central portion of a capacitor body of a multilayer ceramic capacitor according to still another embodiment of the present invention. FIG. 5 is a transparent perspective view showing that a connection electrode is added to the embodiment of FIG. 4. FIG. 5 is a perspective view illustrating a substrate on which the multilayer ceramic capacitor according to the embodiment of FIG. 4 is mounted.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of the elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clear description, and the elements indicated by the same reference numerals in the drawings are the same. Elements.

  Moreover, the component with the same function within the range of the same idea shown to drawing of each embodiment is demonstrated using the same referential mark.

  When defining the direction of the hexahedron for clearly describing the embodiment of the present invention, L, W, and T shown in the drawing indicate the length direction, the width direction, and the thickness direction of the capacitor body, respectively. Here, the thickness direction can be used in the same concept as the stacking direction in which the dielectric layers are stacked.

  1 is a perspective view schematically showing a multilayer ceramic capacitor according to a comparative example, FIG. 2 is an exploded perspective view schematically showing an internal electrode structure of FIG. 1, and FIG. 3 is a central portion of the capacitor body of FIG. It is sectional drawing which shows roughly the cut surface of the width-thickness surface in.

  1 to 3, a multilayer ceramic capacitor 1 according to a comparative example includes a capacitor body 10 formed by laminating a plurality of dielectric layers 11, and first to fourth layers disposed outside the capacitor body 10. And external electrodes 31-34.

  Capacitor body 10 includes first internal electrodes 21 and second internal electrodes 22 that are alternately arranged so as to face each other in the T direction with dielectric layer 11 interposed therebetween.

  Both ends of the first internal electrode 21 are exposed on both end faces in the L direction, and the second internal electrode 22 is exposed on both end faces in the W direction via lead portions 22a.

  In this case, the first internal electrode 21 may be a signal part, and the second internal electrode 22 may be a ground (GND) part.

  As described above, when the first internal electrode 21 and the second internal electrode 22 are cross-laminated, a part of the lead portion 22a of the second internal electrode 22 is partially cut to form the dummy pattern 25. For example, the dummy pattern 25 can be disposed at a position corresponding to the lead portion 22 a of the second internal electrode 22 in the same layer as the first internal electrode 21.

  The lead portion 22a and the dummy pattern 25 arranged at the margin in the width direction of the capacitor body 10 form a peripheral portion where the lead portion 22a and the dummy pattern 25 are not formed, and the lead portion 22a and the dummy pattern 25. The level difference from the raised part may increase significantly, resulting in extreme imbalances. As a result, a fine gap may occur around the lead portion 22a, and the upper and lower portions of the lead portion 22a may have a structure vulnerable to cracks. Therefore, there is a need for a method that can prevent such an increase in level difference.

  4 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment of the present invention, FIG. 5 is an exploded perspective view schematically showing an internal electrode structure of FIG. 4, and FIG. 6 is a capacitor of FIG. FIG. 7 is a cross-sectional view schematically showing a cut surface of a width-thickness surface of a central portion in a main body, and FIGS. 7A to 7C schematically illustrate internal electrodes of a multilayer ceramic capacitor according to an embodiment of the present invention. FIG.

  A multilayer ceramic capacitor according to an embodiment of the present invention will be described with reference to FIGS.

  A multilayer ceramic capacitor 100 according to an embodiment of the present invention includes a capacitor body 110, first to third internal electrodes 121 to 123, and first to fourth external electrodes 131 to 134.

  The capacitor body 110 includes a plurality of dielectric layers 111. The shape of the capacitor body 110 is not particularly limited, but may be a hexahedral shape as shown in FIG.

  The capacitor body 110 is connected to the first and second surfaces 1 and 2 facing each other in the T direction, and the third and fourth surfaces 3, 4 connected to the first and second surfaces 1 and 2 and facing each other in the L direction. And fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2, connected to the third and fourth surfaces 3, 4 and facing each other in the W direction. it can.

  At this time, the dielectric layer 111 is in a sintered state, and can be integrated so that the boundary between the adjacent dielectric layers 111 cannot be confirmed.

  The dielectric layer 111 may include ceramic powder, an organic solvent, and an organic binder.

The ceramic powder is a substance having a high dielectric constant, and is not limited thereto, but barium titanate (BaTiO ₃ ) -based material, strontium titanate (SrTiO ₃ ) -based material, or the like can be used. .

  In addition, the capacitor body 110 may include a plurality of internal electrodes separated from each other with the dielectric layer 111 interposed therebetween.

  In the present embodiment, the plurality of first and second internal electrodes 121 and 122 can be alternately arranged in the T direction with the dielectric layer 111 interposed therebetween.

  Both ends of the first internal electrode 121 are exposed at the third and fourth surfaces 3 and 4 of the capacitor body 110.

  The second internal electrode 122 can be exposed on any of the fifth and sixth surfaces 5 and 6 of the capacitor body 110. In the present embodiment, the second internal electrode 122 is shown and described so as to be exposed on the fifth surface 5 of the capacitor body 110, but the present invention is not necessarily limited thereto.

  Further, the second internal electrode 122 is exposed to the first body 122 a that overlaps at least a part of the first internal electrode 121 in the T direction, and from the first body 122 a toward the fifth surface 5 of the capacitor body 110. A first lead part 122b extended to the first lead part 122b.

  In the present embodiment, the second internal electrode 122 has the first lead portion 122b disposed only on one side of the capacitor body 110 in the W direction. As described above, by exposing the first lead portion 122b of the second internal electrode 122 only to one side of the capacitor body 110, a step difference from the peripheral portion where the lead portion is not formed can be reduced. .

  The third internal electrode 123 may be exposed on the fifth and sixth surfaces 5 and 6 of the capacitor body 110.

  The third internal electrode 123 can be arranged for each predetermined region in which the first and second internal electrodes 121 and 122 are laminated, and the number of the first and second internal electrodes positioned therebetween is a specific number. It is not limited to. However, if the number of the third internal electrodes 123 is too large, there is a possibility that the effect of improving the level difference may be reduced. Therefore, it is necessary to adjust appropriately.

  The third internal electrode 123 includes a second main body portion 123a that overlaps at least a part of the first internal electrode 121 or the first main body portion 122a of the second internal electrode 122 in the T direction, and a capacitor main body from the second main body portion 123a. The second and third lead parts 123b and 123c may be included so as to be exposed toward the fifth and sixth surfaces 5 and 6 of the 110, respectively.

  On the other hand, when there is no internal electrode connected to the multilayer ceramic capacitor 100 together with the third and fourth external electrodes 133 and 134, there is a possibility that the capacity is reduced by about half compared to the comparative example. There is. In particular, in an application, there is a case where there is no problem because it is connected to the ground (GND) via a circuit, but a problem occurs in the selection process.

  On the other hand, the third internal electrode 123 according to the present embodiment can prevent such a problem. That is, by including the third internal electrode, it is possible to prevent the capacitance from being reduced in the selection process and to prevent the capacitance of the multilayer ceramic capacitor 100 from being lowered.

  The first to third internal electrodes 121, 122, 123 can be formed of a conductive paste containing a conductive metal.

  The conductive metal is not limited thereto, but may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

  The multilayer ceramic capacitor 100 according to the present embodiment may include first to fourth external electrodes 131 to 134 that are formed outside the capacitor body 110 and selectively connected to and electrically connected to the internal electrodes. .

  The first and second external electrodes 131 and 132 may be disposed on the third and fourth surfaces 3 and 4 of the capacitor body 110. The first and second external electrodes 131 and 132 may be connected to both ends of the first internal electrode 121 and electrically connected to the first internal electrode 121.

  At this time, the first and second external electrodes 131 and 132 may extend to a part of the first and second surfaces 1 and 2 of the capacitor body 110. Further, the first and second external electrodes 131 and 132 may be further extended to part of the fifth and sixth surfaces 5 and 6 of the capacitor body 110 as necessary.

  The third and fourth external electrodes 133 and 134 may be disposed on the fifth and sixth surfaces 5 and 6 of the capacitor body 110. The third external electrode 133 may be electrically connected by connecting the first lead part 122b of the second internal electrode 121 and the second lead part 123b of the third internal electrode 123 together. The fourth external electrode 134 may be connected to and electrically connected to the third lead part 123c of the third internal electrode 123.

  At this time, the third and fourth external electrodes 133 and 134 may be extended to a part of the first and second surfaces 1 and 2 of the capacitor body 110.

  Further, the third and fourth external electrodes 133 and 134 may be disposed to be separated from the third and fourth surfaces 3 and 4 of the capacitor body 110 by a predetermined distance.

  Further, the first to fourth external electrodes 131 to 134 can be formed of a conductive paste containing a conductive metal.

  At this time, the conductive metal is not limited thereto, but may be nickel (Ni), copper (Cu), tin (Sn), or an alloy thereof.

  In addition, the conductive paste may further include an insulating material, and is not limited thereto. For example, the insulating material may be glass.

  Further, the method of forming the first to fourth external electrodes 131 to 134 is not particularly limited, and for example, the capacitor body 110 may be formed by dipping, or other methods such as sputtering or plating may be used. May be used.

  A plating layer can be formed on the first to fourth external electrodes 131 to 134. The plating layer can include a nickel plating layer formed on the external electrode and a tin plating layer formed on the nickel plating layer.

  The multilayer ceramic capacitor according to the present embodiment configured as described above can solve the problem of the step due to the lead portion by disposing the first lead portion 122b of the second internal electrode 122 only on one side in the width direction. In addition, by forming the third internal electrode 123 to be connected to the third and fourth external electrodes 133 and 134, it is possible to improve the electrical connectivity and solve the problem that occurs in the selection process.

  In particular, the number of lead portions exposed in the width direction of the internal electrode is reduced, damage to the cover region of the capacitor body can be reduced, and a fine gap (gap) that can be generated by a step in the peripheral portion of the lead portion. And the occurrence of cracks can also be reduced.

  On the other hand, in the present embodiment, the multilayer ceramic capacitor 100 is described as a four-terminal capacitor having a total of four external electrodes. However, the present invention is not limited to this, and if necessary, It can also be modified to include many external electrodes.

  FIG. 8 is a cross-sectional view showing a cut surface of a width-thickness surface at the center of a capacitor body of a multilayer ceramic capacitor according to another embodiment of the present invention, and FIGS. It is a top view which shows schematically the internal electrode of the multilayer ceramic capacitor by embodiment of this.

  Referring to FIGS. 8 to 9D, the multilayer ceramic capacitor according to another embodiment of the present invention may further include a fourth internal electrode 124.

  The fourth internal electrode 124 has a structure similar to that of the second internal electrode 122. The fourth internal electrode 124 has a third main body portion 124a that overlaps the first main body portion 122a of the second internal electrode 122 in the T direction, and a capacitor from the third main body portion 124a. A fourth lead portion 124b that is extended to be exposed on the sixth surface 6 of the main body 110 and is formed to face the first lead portion 122b of the second internal electrode 122 in the W direction may be included.

  As described above, the second internal electrode 122 and the fourth internal electrode 124 are arranged so that each lead portion crosses both sides in the W direction and is exposed only on one side, so that the multilayer ceramic capacitor according to the comparative example is compared. Thus, the total number of lead portions exposed on one side surface of the capacitor body 110 can be reduced.

  That is, by arranging the first lead portion 122b of the second internal electrode 122 and the fourth lead portion 124b of the fourth internal electrode 124 so as to be exposed only on one side of the capacitor body 110, the lead portions 122b and 124b are formed. It is possible to reduce the step difference from the peripheral portion that is not formed.

  At this time, the first and fourth lead portions 122b and 124b of the second and fourth internal electrodes 122 and 124 can be stacked while the positions of the first and fourth lead portions 122b and 124b are dispersed.

  Hereinafter, except for the above description, redundant description is omitted.

  FIG. 10 is a photograph of the exposed portion of the internal electrode of the multilayer ceramic capacitor according to the embodiment of FIG.

  Referring to FIG. 10, as a result of evaluating the number of lead portions exposed on one side to be ½ that of the multilayer ceramic capacitor according to the comparative example of FIG. 1, the step difference due to the lead portions hardly affects. Can be confirmed.

  FIG. 11 is a cross-sectional view schematically showing a cut surface of a width-thickness surface in a central portion of a capacitor body of a multilayer ceramic capacitor according to still another embodiment of the present invention.

  Referring to FIG. 11, the third internal electrode 123 may be disposed in the upper and lower cover regions of the capacitor body 110. That is, the third internal electrode 123 can be used as upper and lower internal electrodes in the capacitor body 110.

  As another embodiment, the third internal electrode 123 may be disposed on the center portion and the upper and lower cover portions of the capacitor body 110.

  At this time, the number of stacked third internal electrodes 123 may be one or a plurality may be continuously arranged according to the characteristics of the chip. In the present embodiment, it is described that three are arranged in succession in the upper and lower cover regions, but the present invention is not limited to this.

  Hereinafter, except for the above description, redundant description is omitted.

  FIG. 12 is a perspective view showing that a connection electrode is added to the embodiment of FIG.

  The multilayer ceramic capacitor according to the present invention has third and fourth external electrodes formed on the first surface 1 or the second surface 2 of the capacitor body 110 as shown in FIG. A connection electrode 140 connected to 133 and 134 may be further disposed.

  FIG. 12 illustrates that the connection electrode 140 is formed on the second surface 2 of the capacitor body 110 and is connected to the third and fourth external electrodes 133 and 134. However, the connection electrode of the present invention is illustrated in FIG. 140 may be formed only on the first surface 1 of the capacitor body 110 or may be formed on both the first and second surfaces 1 and 2 of the capacitor body 110.

  Moreover, although the connection electrode 140 in this embodiment is shown by the rectangular parallelepiped shape, this invention is not limited to this, You may comprise by curvilinear shape or zigzag shape etc. as needed.

  Further, if necessary, a dielectric layer (not shown) is further disposed on the connection electrode 140 so as to cover the connection electrode 140, thereby preventing the connection electrode 140 from being exposed to the outside. can do.

  The material of the connection electrode 140 is not particularly limited, and can be formed using, for example, a conductive paste containing a conductive metal, like the first to fourth internal electrodes 121 to 124.

  At this time, the conductive metal is not limited thereto, but may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

  Hereinafter, except for the above description, redundant description is omitted.

  FIG. 13 is a perspective view showing a substrate on which the multilayer ceramic capacitor according to the embodiment of FIG. 4 is mounted.

  Referring to FIG. 13, a multilayer ceramic capacitor mounting substrate according to an embodiment of the present invention includes a substrate 210 having first to fourth electrode pads 221 to 224 on one surface, and first to fourth external surfaces on one surface of the substrate 210. The multilayer ceramic capacitor 100 is mounted so that the electrodes 131 to 134 are connected to the first to fourth electrode pads 221 to 224, respectively. Reference numeral 230 in FIG. 13 denotes solder for joining the electrode pad and the external electrode.

  As mentioned above, although embodiment of this invention was described in detail, the scope of the present invention is not limited to this, and various correction and deformation | transformation are within the range which does not deviate from the technical idea of this invention described in the claim. It will be apparent to those having ordinary knowledge in the art.

DESCRIPTION OF SYMBOLS 100 Multilayer ceramic capacitor 110 Capacitor main body 111 Dielectric layer 121, 122, 123, 124 1st-4th internal electrode 122a, 123a, 124a 1st-3rd main-body part 122b, 123b, 123c, 124b 1st-4th lead Portions 131, 132, 133, 134 First to fourth external electrodes 140 Connection electrode 210 Substrate 221, 222, 223, 224 First to fourth electrode pads

Claims (16)

A first layer and a second surface, each of which includes a dielectric layer and a plurality of first to third internal electrodes arranged alternately with the dielectric layer in between, and facing each other in the stacking direction; The third and fourth surfaces connected to each other, and the fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposite to each other; Both ends of the first internal electrode are exposed at the third and fourth surfaces, respectively, the second internal electrode has a portion exposed at the fifth or sixth surface, and the third internal electrode is at the fifth and sixth surfaces. A capacitor body having a portion exposed to each of
First and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body and connected to the first internal electrode;
A multilayer ceramic capacitor including third and fourth external electrodes disposed on the fifth and sixth surfaces of the capacitor body, respectively, and connected to the second internal electrode and the third internal electrode.   The second internal electrode includes a first body portion that overlaps the first internal electrode in the stacking direction, and a first lead portion that extends from the first body portion toward the fifth or sixth surface of the capacitor body. The multilayer ceramic capacitor according to claim 1, comprising:   The third internal electrode includes a second body portion that overlaps the first or second internal electrode in the stacking direction, and a second body portion extending from the second body portion toward the fifth and sixth surfaces of the capacitor body. The multilayer ceramic capacitor according to claim 1, comprising: 2 and a third lead portion.   4. The multilayer ceramic capacitor according to claim 1, wherein the second internal electrodes are disposed so as to be alternately exposed on the fifth and sixth surfaces of the capacitor body in the stacking direction. 5.   The plurality of second internal electrodes include at least one second internal electrode having a portion exposed on the fifth surface of the capacitor body and at least one or more having a portion exposed on the sixth surface of the capacitor body. The multilayer ceramic capacitor according to claim 4, further comprising: a second internal electrode.   The first and second external electrodes extend from the third and fourth surfaces of the capacitor body to a part of the first and second surfaces, respectively, and the third and fourth external electrodes are connected to the first and second surfaces of the capacitor body. The multilayer ceramic capacitor according to any one of claims 1 to 5, wherein the multilayer ceramic capacitor extends from the fifth and sixth surfaces to a part of the first and second surfaces.   The multilayer ceramic capacitor according to claim 1, wherein the third and fourth external electrodes are disposed so as to be separated from the third and fourth surfaces of the capacitor body.   8. The device according to claim 1, further comprising a connecting electrode positioned on at least one of the first and second surfaces of the capacitor body and formed to electrically connect the third and fourth external electrodes. The multilayer ceramic capacitor according to claim 1. A plurality of first to third internal electrodes, first and second surfaces facing each other in the stacking direction, connected to the first and second surfaces, and facing each other in a length direction perpendicular to the stacking direction; 3rd and 4th surface and 5th and 5th which are connected with the said 1st and 2nd surface, are connected with the said 3rd and 4th surface, and mutually oppose in the width direction orthogonal to the said lamination direction and length direction. Including a capacitor body including six sides,
The plurality of first internal electrodes are spaced apart from the fifth and sixth surfaces of the capacitor body,
The plurality of second internal electrodes are spaced apart from the third and fourth surfaces of the capacitor body and separated from at least one of the fifth and sixth surfaces of the capacitor body,
The third internal electrode is a multilayer ceramic capacitor separated from the third and fourth surfaces of the capacitor body. First and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body and electrically connected to the plurality of first internal electrodes;
A third and a fourth external electrode disposed on the fifth and sixth surfaces of the capacitor body and electrically connected to the plurality of third internal electrodes, respectively.
The multilayer ceramic capacitor of claim 9, wherein at least one of the third and fourth external electrodes is electrically connected to the plurality of second internal electrodes.   11. The multilayer ceramic capacitor according to claim 9, wherein all of the plurality of second internal electrodes are separated from the sixth surface of the capacitor body. At least one of the plurality of second internal electrodes is separated from the fifth surface of the capacitor body,
11. The multilayer ceramic capacitor according to claim 9, wherein at least one of the plurality of second internal electrodes is separated from a sixth surface of the capacitor body. The electrode disposed at the uppermost end in the capacitor body in the stacking direction comprises at least one third internal electrode,
The second internal electrode is disposed between a second internal electrode spaced apart from the fifth surface of the capacitor body and a second internal electrode spaced apart from the sixth surface of the capacitor body at a lower portion of the uppermost end in the capacitor body. The multilayer ceramic capacitor according to any one of claims 9 to 12, wherein an electrode is alternately laminated in the thickness direction with the first internal electrode and the second internal electrode arranged to face each other.   The electrode disposed at the lowermost end in the capacitor body in the stacking direction includes at least one third internal electrode, and the first and second internal electrodes stacked alternately include the uppermost electrode and the uppermost electrode. The multilayer ceramic capacitor according to claim 13, wherein the multilayer ceramic capacitor is disposed between the lowermost electrode. A plurality of first to third internal electrodes, first and second surfaces facing each other in the stacking direction, connected to the first and second surfaces, and facing each other in a length direction perpendicular to the stacking direction; 3rd and 4th surface and 5th and 4th which are connected with the said 1st and 2nd surface, and are mutually connected with the said 3rd and 4th surface, and the width direction orthogonal to the said lamination direction and the said length direction. A capacitor body including a sixth surface;
First and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body and electrically connected to the plurality of first internal electrodes;
Third and fourth external electrodes disposed on the fifth and sixth surfaces of the capacitor body and electrically connected to the plurality of third internal electrodes, respectively.
The plurality of first internal electrodes are spaced apart from the fifth and sixth surfaces of the capacitor body, are exposed on the third and fourth surfaces of the capacitor body, and have ends facing each other,
The plurality of second internal electrodes are separated from the third and fourth surfaces of the capacitor body and exposed to the sixth surface of the capacitor body or separated from the sixth surface of the capacitor body. A portion exposed on the fifth surface of
The plurality of third internal electrodes have portions that are separated from the third and fourth surfaces of the capacitor body and exposed on the fifth and sixth surfaces of the capacitor body, respectively.
A multilayer ceramic capacitor in which at least one of the third and fourth external electrodes is electrically connected to the plurality of second internal electrodes. A substrate having a plurality of electrode pads on an upper surface;
The multilayer ceramic capacitor according to any one of claims 1 to 15, wherein the multilayer ceramic capacitor is mounted on the substrate such that the plurality of electrode pads and corresponding external electrodes are connected to each other. substrate.