JP2010205916A - Semiconductor unit, and electronic imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily radiate heat generated from a semiconductor chip outside of a unit to suppress an increase in temperature of the semiconductor chip, preventing degrading in function of the semiconductor chip. <P>SOLUTION: An imaging unit 6 includes: a circuit board 12 for mounting a solid-state imaging element chip 11; a heat radiation member 13 surface-contacting with the rear surface of the solid-state imaging element chip 11 to radiate the heat received from the solid-state imaging element chip 11; and a holding frame 14 for pressing the heat radiation member 13 to the rear surface of the solid-state imaging element chip 11 to hold it. The heat radiation member 13 is a soft band-shaped member extending from the inside of the holding frame 14 to outside. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor unit including a semiconductor element chip such as a solid-state image sensor chip and an electronic image pickup apparatus using the semiconductor unit, and more particularly to a semiconductor unit and an electronic image pickup apparatus with improved heat dissipation of a built-in semiconductor element chip. is there.

  2. Description of the Related Art Conventionally, various types of electronic imaging devices such as a digital camera and a digital video camera, an endoscope for observing the inside of an organ of a subject, and a mobile phone having an imaging function have appeared. An electronic imaging device generally includes a semiconductor unit including a semiconductor element chip such as a solid-state imaging element chip and an optical system such as a lens. The electronic imaging device forms an optical image of a subject on a light receiving unit of the solid-state imaging device chip by an optical system, and acquires (images) subject image data by photoelectric conversion processing of the solid-state imaging device chip.

  By the way, the solid-state image pickup device chip of such an electronic image pickup device can be optimally driven under the temperature condition defined in the design specification and pick up a high-quality image. However, the heat generated when the solid-state image sensor chip is driven causes the temperature of the solid-state image sensor chip to rise, and noise such as dark current is generated as the temperature of the solid-state image sensor chip rises. This heat noise causes a decrease in the function of the solid-state image sensor chip, such as a decrease in image quality, making it difficult to capture high-quality images with the solid-state image sensor chip. Such a decrease in the function of the solid-state image sensor chip due to heat becomes remarkable with the recent increase in the number of pixels of the solid-state image sensor chip and the high-speed processing of image data.

  In recent years, various heat dissipation techniques for improving the heat dissipation performance of such a solid-state image sensor chip have been proposed. For example, there is a heat dissipation technique for dissipating heat from a solid-state image sensor chip using a lead wiring of a flexible wiring board sandwiching the solid-state image sensor chip as a heat dissipation path (see Patent Document 1). Further, a heat sink is sandwiched between an image pickup device having an electrode lead (that is, an image pickup device realized by mounting a solid-state image pickup device chip in a semiconductor package having an electrode lead) and a circuit board. There is also a heat dissipating technique for dissipating heat from the image sensor (see Patent Document 2).

JP 2006-319124 A JP 2004-104632 A

  However, in the above-described conventional heat dissipation technology, when heat generated from a semiconductor element chip such as a solid-state imaging element chip is dissipated, heat from the semiconductor element chip can be generated in the internal space of the semiconductor package containing the semiconductor element chip. There is sex. As a result, heat from the semiconductor element chip is concentrated inside the semiconductor package, and as a result, it is difficult to obtain a heat dissipation effect sufficient to prevent the function deterioration of the semiconductor element chip.

  Note that in recent imaging fields where solid-state imaging device chips have higher pixels and higher-speed image data processing, heat from the solid-state imaging device chips can be easily dissipated outside the imaging unit, thereby There is a demand for a semiconductor unit and an electronic imaging device that can suppress a rise in the temperature of the chip and prevent a decrease in the function of the solid-state imaging device chip.

  The present invention has been made in view of the above circumstances, and can easily dissipate heat generated from the semiconductor element chip to the outside of the semiconductor unit, thereby suppressing a temperature rise of the semiconductor element chip. It is an object of the present invention to provide a semiconductor unit and an electronic imaging device that can prevent functional degradation.

  In order to solve the above-described problems and achieve the object, a semiconductor unit according to the present invention includes a circuit board on which a semiconductor element chip is mounted, and the semiconductor element chip that is the surface opposite to the mounting surface of the semiconductor element chip. A heat radiating member that radiates heat received from the semiconductor element chip, and a holding frame that presses and holds the heat radiating member against the back surface of the semiconductor element chip. The holding frame extends from the inside to the outside.

  In the semiconductor unit according to the present invention, in the above invention, the heat radiating member is higher in heat conductivity in the extending direction of the heat radiating member than in the thickness direction of the heat radiating member. It has anisotropy.

  The semiconductor unit according to the present invention is characterized in that, in the above invention, the heat dissipating member is a flexible belt-like member.

  The semiconductor unit according to the present invention is characterized in that, in the above invention, the extended end of the heat dissipating member is in contact with a device housing of an electronic imaging apparatus incorporating the semiconductor unit.

  Further, in the semiconductor unit according to the present invention, in the above invention, the semiconductor element chip is a solid-state image sensor chip, and the circuit board has an opening corresponding to a light receiving portion of the solid-state image sensor chip. The solid-state imaging element chip is mounted in a mode in which the light receiving unit and the opening are opposed to each other.

  The electronic imaging device according to the present invention is in contact with a circuit board on which a semiconductor element chip is mounted and a back surface of the semiconductor element chip that is a surface opposite to the mounting surface of the semiconductor element chip. A semiconductor unit comprising: a heat radiating member that radiates heat received from the semiconductor element chip; and a holding frame that presses and holds the heat radiating member against the back surface of the semiconductor element chip; and a device housing that contains at least the semiconductor unit. The heat radiating member extends from the inside of the holding frame to the outside.

  In the electronic imaging device according to the present invention, in the above invention, the heat radiating member has a higher heat conductivity in the extending direction of the heat radiating member than in the thickness direction of the heat radiating member. It has a conductive anisotropy.

  In the electronic imaging device according to the present invention as set forth in the invention described above, the heat radiating member is a flexible belt-like member.

  Moreover, the electronic imaging device according to the present invention is characterized in that, in the above invention, the extended end of the heat radiating member is in contact with the device casing.

  In the electronic imaging device according to the present invention, in the above invention, the semiconductor element chip is a solid-state imaging element chip, and the circuit board has an opening corresponding to the light receiving part of the solid-state imaging element chip. The solid-state imaging device chip is mounted in a mode in which the light receiving portion and the opening are opposed to each other.

  In the semiconductor unit according to the present invention, the semiconductor element chip is mounted on the circuit board, the holding frame presses and holds the heat radiating member against the back surface of the semiconductor element chip, and the heat radiating member is connected to the mounting surface of the semiconductor element chip. It is in surface contact with the back surface of the semiconductor element chip, which is the opposite surface, and extends from the inside of the holding frame to the outside to dissipate heat received from the semiconductor element chip. For this reason, the heat generated by driving the semiconductor element chip can be easily dissipated outside the semiconductor unit without spreading the heat generated inside the holding frame, thereby increasing the temperature of the semiconductor element chip. As a result, it is possible to realize a semiconductor unit that can suppress the functional degradation of the semiconductor element chip.

  In the electronic imaging device according to the present invention, the semiconductor unit is in surface contact with the circuit board on which the semiconductor element chip is mounted and the back surface of the semiconductor element chip, which is the surface opposite to the mounting surface of the semiconductor element chip. A heat dissipating member that dissipates heat received from the semiconductor element chip; and a holding frame that presses and holds the heat dissipating member against the back surface of the semiconductor element chip, and the heat dissipating member extends from the inside of the holding frame to the outside. The extension and the device housing incorporate at least the semiconductor unit. For this reason, the heat generated by driving the semiconductor element chip can be easily dissipated outside the semiconductor unit without spreading the heat generated inside the holding frame, thereby increasing the temperature of the semiconductor element chip. It is possible to realize an electronic imaging device capable of preventing the deterioration of the function of the semiconductor element chip by suppressing the above.

  Hereinafter, a semiconductor unit and an electronic imaging device which are the best mode for carrying out the present invention will be described with reference to the drawings. In the following, an imaging unit including a solid-state imaging device chip is illustrated as an example of a semiconductor unit according to an embodiment of the present invention, but the present invention is not limited to this embodiment.

(Embodiment)
FIG. 1 is a schematic diagram illustrating a configuration example of an electronic imaging apparatus according to an embodiment of the present invention. As shown in FIG. 1, an electronic imaging apparatus 1 according to this embodiment includes an apparatus housing 2, a light emitting unit 3 that illuminates a subject, a release button 4 for performing an imaging operation, and light from the subject. An optical system 5 such as a condensing lens, an imaging unit 6 that captures an image of a subject, and a power supply unit 7 such as a battery are provided. 1, the electronic imaging device 1 includes a display unit such as a liquid crystal display that displays an image of a subject captured by the imaging unit 6, a storage unit that stores image data of the subject, an electronic A control unit that controls each component of the imaging apparatus 1.

  The device housing 2 forms an exterior of the electronic imaging device 1 and incorporates each component of the electronic imaging device 1. Specifically, the device housing 2 incorporates a light emitting unit 3 in a manner capable of emitting illumination light toward the outside, and a release button 4 in a manner capable of being pushed down from the outside so as to emit light from the subject. The optical system 5 is built in such a manner that it can enter. In addition, the apparatus housing 2 incorporates an imaging unit 6 in a manner that can receive light from a subject condensed by the optical system 5, and a power supply unit 7 in a manner that allows replacement of a battery or the like. In addition, a display unit, a storage unit, a control unit, and the like of the electronic imaging device 1 are built in the apparatus housing 2. In this case, the display unit is built in the apparatus housing 2 in a form in which the display screen is exposed to the outside.

  The light emitting unit 3 is an illuminating unit such as a strobe for illuminating a desired subject, and illuminates the subject by emitting illumination light (for example, flash) to the subject imaged by the imaging unit 6. The release button 4 functions as an imaging operation unit, and is pressed down when the imaging unit 6 captures an image of a subject. The optical system 5 is realized using a condensing lens and a lens frame.

  The optical system 5 is arranged so that its optical axis passes through the center of the light receiving surface of the imaging unit 6. The optical system 5 focuses light from the subject on the light receiving surface of the imaging unit 6 to form an optical image of the subject. The imaging unit 6 receives light from the subject condensed by the optical system 5 through a light receiving surface, and performs photoelectric conversion processing on the received light from the subject to acquire (capture) an image of the subject. .

  The power supply unit 7 is realized using a primary battery, a secondary battery, or the like that is replaceably inserted into the apparatus housing 2. The power supply unit 7 switches between an on state and an off state in response to on / off switching of a power switch (not shown) provided in the apparatus housing 2. The power supply unit 7 supplies power to each component of the electronic imaging device 1 when in the on state, and stops supplying power to each component of the electronic imaging device 1 when in the off state.

  Although not shown in FIG. 1, the display unit of the electronic imaging apparatus 1 is formed by the imaging unit 6 with the display facing outward from the back surface of the apparatus housing 2 (the housing surface opposite to the optical system 5). Display the subject image. In addition, the storage unit of the electronic imaging device 1 stores image data of the subject imaged by the imaging unit 6. The storage unit may be a storage medium such as a nonvolatile semiconductor memory or a hard disk, or may be a portable storage medium that is detachably inserted into the apparatus housing 2.

  In addition, a control unit (not shown) of the electronic imaging device 1 is realized using a CPU that executes a processing program, a memory that stores the processing program, and the like, and controls each component of the electronic imaging device 1. Specifically, this control unit displays the subject image captured by the imaging unit 6 on the display unit described above. In addition, the control unit controls the optical system 5 and the imaging unit 6 based on information input by pressing the release button 4, thereby causing the imaging unit 6 to capture an image of the subject. In this case, the control unit causes the light emitting unit 3 to emit illumination light as necessary, and causes the imaging unit 6 to capture an image of the subject illuminated by the illumination light. In addition, the control unit acquires the image signal generated by the imaging unit 6, performs predetermined image processing on the acquired image signal, and generates image data of the subject. The control unit stores the image data of the subject generated in this way in the storage unit described above and displays an image based on the image data of the subject on the display unit described above.

  Next, the imaging unit 6 which is an example of the semiconductor unit according to the embodiment of the present invention will be described. FIG. 2 is a schematic diagram illustrating a configuration example of the imaging unit according to the embodiment of the present invention. 3 is a schematic cross-sectional view taken along the line AA of the imaging unit shown in FIG. 4 is a schematic cross-sectional view taken along line BB of the imaging unit shown in FIG. As shown in FIGS. 2 to 4, the imaging unit 6 according to this embodiment includes a solid-state imaging element chip 11 which is an example of a semiconductor element chip, a circuit board 12 on which the solid-state imaging element chip 11 is mounted, and a solid-state imaging element. A heat radiating member 13 that radiates heat generated from the chip 11, a holding frame 14 that holds the heat radiating member 13, and a cover glass 15 that protects the solid-state imaging device chip 11 are provided.

  The solid-state imaging device chip 11 is a solid-state imaging device in a bare chip state, and is realized using a CCD or a CMOS image sensor. Specifically, the solid-state imaging device chip 11 includes a light receiving unit 11 a that receives light from a subject and a terminal unit 11 b that is electrically connected to the circuit board 12 on the surface of a substrate such as a silicon substrate. Prepare. In addition, the solid-state imaging element chip 11 includes various circuits necessary for an imaging function such as a driver circuit, although not particularly shown in FIGS.

  The light receiving unit 11a is realized by using a plurality of pixels and a color filter that are two-dimensionally arranged. The light receiving unit 11a receives light from the subject through the above-described optical system 5 (see FIG. 1) and the cover glass 15, and performs photoelectric conversion processing on the received light. The solid-state image sensor chip 11 generates an image signal of the subject based on the signal subjected to the photoelectric conversion processing by the light receiving unit 11a, and as a result, the image processing of the image of the subject is achieved. The terminal portion 11b includes a plurality of electrode pads that are electrically connected to the circuit of the solid-state imaging element chip 11 and metal bumps on each electrode pad. The metal bumps on the electrode pads of the terminal portion 11b are connected to the electrodes of the circuit board 12 by flip chip mounting of the solid-state imaging device chip 11 and the circuit board 12. As a result, the terminal portion 11b realizes an electrical connection between the circuit of the solid-state imaging device chip 11 and the circuit board 12. Note that the image signal generated by the solid-state imaging device chip 11 is output to the circuit board 12 side via the terminal portion 11b.

  The circuit board 12 is a printed board on which a circuit for realizing the imaging function of the solid-state imaging device chip 11 is formed. Further, as shown in FIG. 4, the circuit board 12 has an opening 12 a corresponding to the light receiving part 11 a of the solid-state imaging device chip 11 and an opening 12 b for inserting the holding frame 14. As shown in FIGS. 3 and 4, the solid-state image pickup device chip 11 is flip-chip mounted on the circuit board 12 in such a manner that the opening 12 a and the light-receiving portion 11 a of the solid-state image pickup device chip 11 face each other. In this case, the circuit board 12 mounts the solid-state image sensor chip 11 so as to close the opening 12 a with the solid-state image sensor chip 11. The opening 12a of the circuit board 12 has an opening dimension designed to correspond to the light receiving portion 11a of the solid-state image sensor chip 11, and allows light from a subject to enter the light receiving portion 11a. In addition, although not particularly illustrated in FIGS. 2 to 4, the circuit board 12 includes an external terminal unit for electrically connecting to an electronic component such as a control unit of the electronic imaging apparatus 1. The image signal from the solid-state image sensor chip 11 described above is output to the control unit of the electronic image pickup apparatus 1 via the circuit board 12. The circuit board 12 may be a flexible flexible circuit board that can be easily deformed by applying an external force, or may be a rigid circuit board that is less likely to be deformed than a flexible circuit board.

  The heat radiating member 13 is for radiating the heat of the solid-state image sensor chip 11 to the outside. Specifically, the heat radiating member 13 is implement | achieved using heat conductive anisotropic members, such as a carbon crystal structure material. As shown in FIGS. 2 to 4, the heat radiating member 13 is a flexible belt-like member and extends from the inside of the holding frame 14 to the outside. Further, the heat radiating member 13 is covered with a dielectric that is more flexible than the solid-state image sensor chip 11. One end of the heat radiating member 13 is sandwiched between the solid-state imaging device chip 11 and the holding frame 14 in an internal space surrounded by the holding frame 14. In this case, as shown in FIGS. 3 and 4, the heat radiating member 13 is in surface contact with the back surface of the solid-state imaging device chip 11 via the heat conductive grease 16. The thermally conductive grease 16 may be applied to the back surface of the solid-state image sensor chip 11 or may be applied to one end surface of the heat radiation member 13 facing the back surface of the solid-state image sensor chip 11. On the other hand, the other end of the heat radiating member 13, that is, the extended end is in surface contact with a large heat capacity body such as the device housing 2 of the electronic imaging device 1 described above, although not particularly shown in FIGS.

  Further, as described above, the heat dissipation member 13 in the form extending from the inside of the holding frame 14 to the outside has a higher thermal conductivity in the extending direction from the holding frame 14 than the thermal conductivity in the thickness direction. Has thermal conductivity anisotropy. Specifically, the heat dissipation member 13 is in thermal surface contact with the back surface of the solid-state image sensor chip 11 while maintaining an insulation state with the solid-state image sensor chip 11, and the heat received from the solid-state image sensor chip 11 is The light is transmitted in the direction of extension from the holding frame 14, that is, the surface direction toward the extended end of the heat radiating member 13, with little transmission in its own thickness direction. The heat dissipating member 13 sequentially dissipates the heat of the solid-state image sensor chip 11 sequentially transmitted in the extending direction to the outside of the image capturing unit 6. In this case, the heat of the solid-state imaging element chip 11 radiated to the outside of the imaging unit 6 by the heat radiating member 13 is a large heat capacity body (for example, the device of the electronic imaging device 1) in surface contact with the extended end of the heat radiating member 13. Heat is radiated to the outside of the electronic imaging device 1 through the housing 2) and the like.

  In the present invention, of the front and back surfaces of the solid-state image sensor chip 11, the bare chip surface on the side where the light receiving portion 11a and the terminal portion 11b are formed, that is, the functional surface of the solid-state image sensor chip 11 is the solid-state image sensor chip 11. The surface opposite to the functional surface is the back surface of the solid-state imaging device chip 11. The heat dissipating member 13 may be in direct surface contact with the back surface of the solid-state image sensor chip 11 without using the thermal conductive grease 16, but as described above, the solid-state image sensor chip through the thermal conductive grease 16. It is desirable to make a surface contact with the back surface of 11. This is because the thermal conductive grease 16 is interposed between the heat radiation member 13 and the back surface of the solid-state image sensor chip 11 to fill a gap between the heat radiation member 13 and the back surface of the solid-state image sensor chip 11. This is because the thermal conductivity between the heat radiating member 13 and the solid-state imaging device chip 11 can be improved.

  The holding frame 14 is for pressing and holding the heat radiating member 13 against the back surface of the solid-state imaging device chip 11. Specifically, the holding frame 14 is a bottomed frame body having a flat bottom surface and an upper opening end facing the bottom surface, and as illustrated in FIG. 14a. The holding frame 14 presses the heat radiation member 13 against the back surface of the solid-state imaging device chip 11 by pressing the flat bottom surface against one end surface of the heat radiation member 13. In this case, the upper opening end of the holding frame 14 is inserted into the opening 12b of the circuit board 12 and bonded to the cover glass 15 with an adhesive or the like, as shown in FIG. The holding frame 14 presses the heat radiating member 13 on the back surface of the solid-state image sensor chip 11 in a plane, and holds the heat radiating member 13 so that the back surface of the solid-state image sensor chip 11 and the heat radiating member 13 are in surface contact. . At the same time, the holding frame 14 presses its flat bottom surface against the back surface of the solid-state image sensor chip 11 through the heat radiating member 13, thereby supporting the solid-state image sensor chip 11 flatly. As a result, the holding frame 14 maintains the flatness of the solid-state image sensor chip 11.

  The cover glass 15 is an optical member that is transparent to light from the subject, that is, light that should be received by the light receiving unit 11a of the solid-state imaging device chip 11. As shown in FIGS. 3 and 4, the cover glass 15 is fixed to the circuit board 12 so as to close the opening 12 a of the circuit board 12 facing the light receiving part 11 a of the solid-state imaging element chip 11. In this case, the cover glass 15 is bonded to the vicinity of the opening 12 a of the circuit board 12 and the opening end of the holding frame 14 with an adhesive or the like. The cover glass 15 transmits light from the subject to the light receiving unit 11a side of the solid-state image sensor chip 11, prevents foreign matter from entering the light receiving unit 11a, and protects the light receiving unit 11a from damage due to external force.

  Next, the case where the large heat capacity body that is in surface contact with the heat radiating member 13 is the device housing 2 of the electronic image pickup device 1 will be described as an example, and the heat radiating action of the image pickup unit 6 according to the embodiment of the present invention will be described. . FIG. 5 is a schematic diagram for explaining the heat radiation action of the imaging unit according to the embodiment of the present invention. In FIG. 5, a wavy arrow indicates the flow of heat generated by the solid-state image sensor chip 11.

  As described above, the solid-state imaging device chip 11 that is flip-chip mounted on the circuit board 12 receives heat from the subject and picks up an image of the subject, and generates heat accompanying driving each time. The heat generated by the solid-state image sensor chip 11 is sequentially transmitted from the back surface of the solid-state image sensor chip 11 to the heat radiating member 13 through the heat conductive grease 16 as shown in FIG.

  The heat dissipating member 13 in surface contact with the back surface of the solid-state image sensor chip 11 receives heat from the solid-state image sensor chip 11 via the thermal conductive grease 16 and receives the heat of the received solid-state image sensor chip 11. Heat is radiated to the outside of the holding frame 14. Here, as described above, the heat dissipation member 13 is a flexible belt-like member that extends from the inside of the holding frame 14 through the opening 14a of the holding frame 14 and has a heat conductivity in the thickness direction. Compared with the heat conduction anisotropy, the heat conductivity in the extending direction from the holding frame 14 is high. The heat conductivity in the extending direction of the heat radiating member 13 is, for example, about 600 W / mK. The heat radiating member 13 having such heat conduction anisotropy extends from the holding frame 14 in the internal space of the holding frame 14 while hardly transferring the heat received from the solid-state imaging device chip 11 in its thickness direction. Transmission is sequentially performed in the exit direction, that is, the surface direction toward the extended end of the heat dissipation member 13. Thereafter, the heat dissipating member 13 sequentially dissipates the heat of the solid-state image sensor chip 11 sequentially dispersed in the extending direction to the outside of the image capturing unit 6 as indicated by the wavy arrow in FIG.

  Further, as shown in FIG. 5, the extended end of the heat radiating member 13 is in surface contact with the apparatus housing 2 which is an example of a large heat capacity body. The heat dissipating member 13 sequentially transfers the heat of the solid-state image sensor chip 11 to the apparatus housing 2 in surface contact with the extending end. The heat of the solid-state image sensor chip 11 transmitted to the apparatus housing 2 is sequentially dissipated to the outside of the electronic imaging apparatus 1.

  Due to the heat dissipation action of the heat radiating member 13 as described above, the heat of the solid-state image pickup device chip 11 is promptly transmitted to the outside of the imaging unit 6 through the heat radiating member 13 without being transferred into the holding frame 14 after being generated. The Thereafter, the heat of the solid-state imaging device chip 11 is transmitted to the device housing 2 and is quickly released from the device housing 2 to the outside of the electronic imaging device 1. The imaging unit 6 including the heat dissipation member 13 capable of realizing the above-described heat dissipation function can easily release the heat of the solid-state image sensor chip 11 to the outside of the image pickup unit 6 by the heat dissipation member 13, and as a result, the solid-state image sensor chip 11. The rise in the temperature of the solid-state image pickup device chip 11 can be prevented from being deteriorated by suppressing the temperature rise.

  As described above, the imaging unit and the electronic imaging device according to the embodiment of the present invention hold the heat dissipation member by pressing it against the back surface of the solid-state imaging device chip mounted on the circuit board with the holding frame. The back surface of the solid-state imaging device chip and the heat radiating member are brought into surface contact, and the heat radiating member extends from the inside of the holding frame to the outside. For this reason, the heat generated by driving the solid-state image pickup device chip is taken away from the inside of the holding frame (that is, concentrated), and heat is taken away from the solid-state image pickup device chip. It is possible to realize an imaging unit and an electronic imaging device that can dissipate heat to the outside of the imaging unit promptly after heat generation, thereby suppressing a rise in temperature of the solid-state imaging element chip and preventing deterioration of the function of the solid-state imaging element chip. .

  In the embodiment of the present invention, the heat dissipation member described above has a thermal conductivity anisotropy that has a higher thermal conductivity in the extending direction from the holding frame than the thermal conductivity in the thickness direction. For this reason, the heat of the solid-state image sensor chip can be sequentially transmitted in the surface direction toward the extending end of the heat radiating member without almost transmitting the heat in the thickness direction of the heat radiating member. Heat can be dissipated outside the imaging unit.

  Furthermore, in the embodiment of the present invention, the flat bottom surface of the holding frame is pressed against the heat radiating member, and the heat radiating member is pressed against the back surface of the solid-state imaging element chip. For this reason, the flat bottom surface of the holding frame can be pressed against the back surface of the solid-state image sensor chip via the heat dissipation member, so that the solid-state image sensor chip can be supported flatly. Can be maintained. As a result, even if the heat radiating member pressed against the back surface of the solid-state image sensor chip is a flexible member, the flatness of the solid-state image sensor chip necessary for capturing a subject image with high image quality can be ensured.

  Further, in the embodiment of the present invention, since the above-described heat radiating member is a flexible belt-like member, the extending portion of the heat radiating member held on the back surface of the solid-state imaging element chip by the holding frame is freely curved. The imaging unit can be disposed inside the apparatus housing. As a result, the volume occupied by the image pickup unit (that is, the space required for the arrangement) inside the apparatus housing can be reduced, and as a result, the image pickup unit and the electronic image pickup apparatus can be easily reduced in size, thickness, and weight. be able to.

  In the embodiment described above, a belt-shaped heat radiating member is used, but the heat radiating member in the present invention only needs to extend from the inside of the holding frame, and the shape of the heat radiating member is as follows. The shape is not limited to the above-described band shape, and may be a desired shape such as a rectangular shape, a polygonal shape, a circular shape, or an elliptical shape.

  In the above-described embodiment, the flexible heat radiating member is used. However, the present invention is not limited to this, and the heat radiating member in the present invention may be a hard member such as a plate-like member or bendable. The part may be formed.

  Furthermore, the holding frame 14 in the above-described embodiment is a camera shake that mechanically corrects camera shake during imaging by moving (vibrating) the solid-state image sensor chip 11 in response to camera shake that occurs when an image of the subject is captured. It may also serve as a vibration frame of the correction mechanism. In this case, since the heat radiating member 13 described above is a flexible belt-like member, the holding frame 14 can freely vibrate while maintaining the state in which the heat radiating member 13 is held on the back surface of the solid-state imaging element chip 11. As a result, the holding frame 14 can easily have a function as a vibration frame of the camera shake correction mechanism.

  In the above-described embodiment, the solid-state image sensor chip 11 is flip-chip mounted on the circuit board 12. However, the present invention is not limited to this, and the peripheral edge of the back surface side of the solid-state image sensor chip 11 and the circuit board 12 are bonded to each other. The solid-state imaging element chip 11 may be mounted on the circuit board 12 by bonding using a bonding technique or the like. In this case, the circuit board 12 and the solid-state imaging element chip 11 may be electrically connected by metal wire bonding or the like.

  Further, in the above-described embodiment, the digital camera mode is illustrated as an example of the electronic imaging apparatus according to the present invention as shown in FIG. 1, but the electronic imaging apparatus according to the present invention is not limited to this. Any device may be used as long as it has an imaging unit inside the device housing. For example, it may be a digital video camera, a mobile phone or PDA having an imaging function, or observe the inside of an organ of a subject. It may be an endoscope or a mobile phone having an imaging function. That is, the imaging unit 6 according to the present invention is applied to various types of electronic imaging devices such as a digital camera and a digital video camera, an endoscope for observing the inside of an organ of a subject, and a mobile phone having an imaging function. It may be built in.

  In the above-described embodiment, the imaging unit 6 is illustrated as an example of the semiconductor unit according to the present invention. However, the present invention is not limited thereto, and the semiconductor unit according to the present invention includes a semiconductor element chip that is a semiconductor element in a bare chip state. The semiconductor element chip may be provided with a heat radiating member that is held by the holding frame and extends from the holding frame on the back surface of the semiconductor element chip. For example, the semiconductor unit according to the present invention may be a light-emitting unit including a light-emitting element chip instead of the above-described solid-state image sensor chip, or a control element chip such as a CPU instead of the above-described solid-state image sensor chip. It may be a control unit provided.

It is a schematic diagram which shows one structural example of the electronic imaging device concerning embodiment of this invention. It is a schematic diagram which shows one structural example of the imaging unit concerning embodiment of this invention. FIG. 3 is a schematic cross-sectional view taken along line AA of the imaging unit illustrated in FIG. 2. FIG. 3 is a schematic cross-sectional view taken along line BB of the imaging unit illustrated in FIG. 2. It is a schematic diagram for demonstrating the thermal radiation effect | action of the imaging unit concerning embodiment of this invention.

DESCRIPTION OF SYMBOLS 1 Electronic imaging device 2 Apparatus housing 3 Light emission part 4 Release button 5 Optical system 6 Imaging unit 7 Power supply part 11 Solid-state image sensor chip 11a Light receiving part 11b Terminal part 12 Circuit board 12a, 12b Opening part 13 Heat radiating member 14 Holding frame 14a Opening Part 15 Cover glass 16 Thermally conductive grease

Claims (10)

A circuit board on which a semiconductor element chip is mounted;
A heat dissipating member that radiates heat received from the semiconductor element chip in surface contact with the back surface of the semiconductor element chip, which is the surface opposite to the mounting surface of the semiconductor element chip;
A holding frame for pressing and holding the heat radiating member against the back surface of the semiconductor element chip;
With
The semiconductor unit, wherein the heat dissipation member extends from the inside of the holding frame to the outside.   The heat radiating member has thermal conductivity anisotropy having a higher thermal conductivity in the extending direction of the heat radiating member than the heat conductivity in the thickness direction of the heat radiating member. Semiconductor unit.   The semiconductor unit according to claim 1, wherein the heat radiating member is a flexible belt-shaped member.   4. The semiconductor unit according to claim 1, wherein the extended end of the heat radiating member is in contact with an apparatus housing of an electronic imaging apparatus incorporating the semiconductor unit. The semiconductor element chip is a solid-state image sensor chip,
The circuit board has an opening corresponding to a light receiving portion of the solid-state image pickup device chip, and the solid-state image pickup device chip is mounted in a form in which the light receiving portion and the opening are opposed to each other. Item 5. The semiconductor unit according to any one of Items 1 to 4. A circuit board on which the semiconductor element chip is mounted; and a heat dissipation member that dissipates heat received from the semiconductor element chip in surface contact with the back surface of the semiconductor element chip, which is a surface opposite to the mounting surface of the semiconductor element chip; A holding unit that holds and holds the heat dissipation member against the back surface of the semiconductor element chip, and a semiconductor unit,
An apparatus housing containing at least the semiconductor unit;
With
The electronic imaging apparatus, wherein the heat radiating member extends from the inside of the holding frame to the outside.   The heat radiating member has thermal conductivity anisotropy having a higher thermal conductivity in the extending direction of the heat radiating member than a thermal conductivity in a thickness direction of the heat radiating member. Electronic imaging device.   The electronic imaging apparatus according to claim 6, wherein the heat radiating member is a flexible belt-shaped member.   The electronic imaging apparatus according to claim 6, wherein an extended end of the heat radiating member is in contact with the apparatus housing. The semiconductor element chip is a solid-state image sensor chip,
The circuit board has an opening corresponding to a light receiving portion of the solid-state image pickup device chip, and the solid-state image pickup device chip is mounted in a form in which the light receiving portion and the opening are opposed to each other. Item 10. The electronic imaging device according to any one of Items 6 to 9.

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