JP2010192834A - Acf thermocompression bonding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ACF thermocompression bonding apparatus for FPD for accurately measuring the temperature of a pressure head and having high reliability. <P>SOLUTION: The ACF thermocompression bonding apparatus for pressing an ACF by using a heated compression blade 11 and fixing the ACF on a substrate of an FPD includes: a heater block 20 for heating the compression blade by a heater; a fitting hole for a sheath-incorporated thermocouple 21, which is formed in the heater block; and the sheath-incorporated thermocouple arranged in the fitting hole: wherein, a base of the sheath-incorporated thermocouple is screwed and the screwed portion is stuck and fixed with a heat-resistant inorganic adhesive 24. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  In the present invention, TAB (Tape Automated Bonding) / COF (Chip on film) and COG (Chip on glass) are heat-bonded and fixed to an FPD (Flat panel display) substrate by ACF (Anisotropic Conductive Film). In particular, the present invention relates to a thermocompression bonding head that can accurately measure and control the temperature of a fixed portion.

  Conventionally, in TAB / COF and COG mounting machines of FPD devices typified by liquid crystal substrates, a thermocouple with a sheath is sandwiched on the side of a thermocompression bonding head used for ACF pressure heating with (1) a spring material or screw And (2) pasting with a thermosetting resin adhesive, or pasting with a heat-resistant resin film adhesive tape.

  As another conventional method, for example, as described in JP-A-2001-34187, a member equivalent to TCP with a built-in thermocouple is provided in advance on the liquid crystal panel side to be bonded, and heated and pressurized simultaneously with TCP. Also, a method for measuring the actual temperature in real time has been proposed.

JP 2001-34187 A

  However, in the former prior art method, for example, screw loosening occurred while repeating the temperature cycle, and the detected temperature also fluctuated due to fluctuations in the contact state between the thermocouple and the side surface of the thermocompression bonding head at that time. . In recent years, in order to improve productivity, it is desired to realize a process in the shortest time by precisely controlling the temperature, and there is a problem that the required temperature accuracy cannot be satisfied. In addition, it is necessary to increase the heater temperature for the purpose of short-time thermosetting treatment, which exceeds the heat resistance temperature of the organic adhesive for fixing thermocouples and heat-resistant resin tape, and the thermocouple is properly held by long-term equipment operation. There was a problem that made it impossible.

  In the prior art method described in Japanese Patent Laid-Open No. 2001-34187, the former problem can be solved, but it is necessary to provide a dummy member in the very vicinity of the TAB / COF to be joined, thus limiting the design of the liquid crystal panel as a product. It is necessary and not a realistic solution.

  An object of the present invention is to provide a highly reliable ACF thermocompression bonding apparatus for an FPD by accurately measuring the pressure head temperature.

  In order to achieve the above object, the present invention provides a heater block that heats the crimping blade with a heater in an ACF thermocompression bonding apparatus that pressurizes and heats the ACF using a heated crimping blade and fixes the ACF to an FPD substrate. A thermocouple with a sheath provided in the heater block and a thermocouple with a sheath provided in the attachment hole, and screwing the base of the thermocouple with the sheath and heat-resistant the screw-fastened portion. The first feature is that it is bonded and fixed with a conductive inorganic adhesive.

  In order to achieve the above object, in addition to the first feature, the present invention provides a heat transfer from the thermocouple with a sheath between the crimping blade and the heater or from the heater to the crimping blade. The second feature is that the route is avoided.

  Furthermore, in order to achieve the above object, the present invention is characterized in that, in addition to the first feature, the heat-resistant inorganic adhesive is made of alumina, silica, and water glass.

  In order to achieve the above object, in addition to the first feature, the present invention provides a stress diffusion member at the tip of the thermocouple with sheath, and the tip of the stress diffusion member corresponds to the tip of the mounting hole. A fourth feature is that it has a shape similar to that of the portion.

  Furthermore, in order to achieve the above object, in addition to the fourth feature, the present invention is similar to the above-mentioned, in that both the tip portion and the corresponding portion have a flat shape, or the tip portion has a truncated cone shape. A fifth feature is that the corresponding portion is a cone having the same shape as the cone.

  In order to achieve the above object, in addition to the fifth feature, the present invention has a sixth feature that the apex angle of the cone is an obtuse angle.

  Finally, in order to achieve the above object, in addition to any of the features of the fourth to sixth aspects, the present invention fills the gap between the tip portion and the corresponding portion with a deformable heat resistant material, or A seventh feature is that an adhesive is also applied to the stress diffusion member.

  ADVANTAGE OF THE INVENTION According to this invention, the crimping head temperature can be measured correctly and the ACF thermocompression bonding apparatus for FPD with high reliability can be provided.

It is a schematic perspective view of the ACF thermocompression bonding apparatus for FPD which shows embodiment of this invention. FIG. 2 is a side view above the thermocompression bonding head in the ACF thermocompression bonding apparatus for FPD shown in FIG. FIG. 3 is a detailed view of a portion surrounded by a thick square line shown in FIG. It is the schematic diagram of the part B enclosed with the square bold line of FIG. 3, It is the figure which showed the shape of the stress diffusion member of a seal | sticker thermocouple front-end | tip, and the part of the said front-end | tip of a thermocouple attachment hole with a sheath. It is the schematic diagram of the part B enclosed with the square bold line of FIG. 3, and is the figure which showed other embodiment of the shape of the stress diffusion member of a seal | sticker thermocouple front-end | tip, and the corresponding part of the said front-end | tip of a thermocouple attachment hole with a sheath. is there.

  FIG. 1 shows an embodiment of the present invention and shows a thermocompression bonding apparatus 100 for FPD equipped with TAB. The FPD thermocompression bonding apparatus 100 includes four processing units Ua, Ub, Uc, and Ud (hereinafter simply referred to as U). Each processing unit U moves independently to the left and right as indicated by an arrow A while maintaining a vertical posture by rails Rd and Rb provided at the bottom and back. Each processing unit U includes a thermocompression bonding head 10 that thermocompression-bonds a processing unit (not shown) composed of TAB, ACF, and a substrate in the center, a heater block 20 that heats the thermocompression bonding head 10, and a thermocompression bonding head that moves up and down. The pressure cylinder part 30, the backup 40 which is the mounting part of the said process, and the backup heater 50 which makes the said mounting part a predetermined temperature before the said thermocompression bonding. It should be noted that the number of the processing units U may be large or one according to the design specification of the FPD to be manufactured. It is also possible to prepare a large number of processing units U and operate a necessary number in preparation for the replacement of the target product.

  2 is a side view of the pressure bonding head side above the thermocompression bonding head 10 in FIG. 1, and FIG. 3 is a detailed view of a portion A surrounded by a thick square line shown in FIG. It is a figure which shows the thermocompression-bonding head 10 and the heater block 20. FIG. The pressurizing cylinder unit 30 includes a pusher rod 32 that extends from the cylinder body 31 and moves up and down the crimping blade 11 provided in a convex shape on the thermocompression bonding head 10. The heater block 20 has a sheath heater 22 fitted on its side surface, and a thermocouple with a sheath (hereinafter simply referred to as a thermocouple) between the sheath heater 22 and the crimping blade 11 below the sheath heater 22 and closer to the crimping blade 11. 21 is provided. In addition, 21a is a thermocouple wiring and 22a is a heater wiring.

  In order to facilitate replacement of the thermocouple 21, a screw 21b is cut at the base of the sheath, and the flange 23 is processed into a hexagonal bolt shape. The thermocouple 21 is fixed to the heater block 20 with a heat-resistant inorganic adhesive 24 made of alumina, silica, and water glass, while the thermocouple 21 is screwed to a female screw portion on the inner surface of the heater block 20. Withstands the temperature rise due to the curing process and there is no risk of screw loosening due to repeated thermal stress. Further, since the heat-resistant inorganic adhesive 24 is applied to the inside of the hole provided in the heater block 20, the heat-resistant inorganic adhesive 24 is peeled off due to vibration during operation or contact with the FPD as a product, thereby contaminating the FPD. There is no worry to do.

  On the other hand, a sheath tip cover made of a thick stainless steel plate is provided as a stress diffusion member 25 at the tip of the thermocouple. For this reason, even if the screw tightening torque of the thermocouple 21 is large, the internal thermocouple wiring is not easily damaged.

  4 is a schematic cross-sectional view of a portion B surrounded by a thick square line in FIG. 3, and a portion 26a corresponding to the stress diffusion member 25 of the thermocouple 21 and the thermocouple mounting hole 26 provided in the heater block 20. It is the figure which showed the shape. The stress diffusion member 25 and the corresponding portion 26a are also flattened. In particular, the thermocouple mounting hole 26 is flattened by milling instead of the usual drill finish. Such flattening enables both to secure a sufficient contact area while dispersing stress, so that the amount of plastic deformation of the stress diffusion member or heater block inner wall due to repeated thermal stress can be reduced, and further minute deformation can occur. Even if a gap is generated, it is difficult to cause a temperature difference. Moreover, even if the thermocouple 21 is disconnected due to aging, it can be easily replaced.

  Further, the tip of the thermocouple is preferably in the vicinity of the crimping blade 11. However, when the insertion amount is slightly shallower, the temperature distribution of the cutting edge temperature is less likely to occur due to a decrease in internal thermal conductivity caused by drilling the thermocouple. That is, the thermocouple 21 is not provided at a position that hinders heat conduction from the sheath heater 22 to the crimping blade 11. In FIG. 3, it is preferable that the lateral distance from the center surface of the crimping blade 11 to the tip of the thermocouple 21 is larger than the vertical distance from the heater lower surface to the heater block lower surface.

  In Fig. 3, the insertion direction of the heater block and thermocouple is parallel and perpendicular to the extension direction of this crimping blade, but if the target TAB / COF or COG chip mounting pitch is wide enough, the heater should be It is easier to equalize the temperature when installed in parallel with the main crimping blade.

  In the embodiment described above, the tip of the stress diffusion member 25 is flattened, and the corresponding portion 26a of the thermocouple mounting hole 26 is also flattened by milling. However, another embodiment is shown in FIG. For example, in FIG. 5 (a), the shape of the stress diffusion member 25 is a truncated cone having an acute angle, and the corresponding portion 26a of the thermocouple mounting hole 26 is a conical hole that fits into this. This embodiment is useful for further increasing the contact area and reducing the gap distance due to the difference in thermal expansion, and can be expected to improve temperature measurement accuracy. It should be noted that the tip of the stress diffusion member 25 should not be sharpened. In this case, it is difficult to process the corresponding portion 26a of the thermocouple mounting hole 26 into a hole with a sufficient accuracy, and there is a possibility that the thermocouple 21 cannot be inserted correctly.

  In the embodiment of FIG. 5 (a), it is difficult to sufficiently increase the thermal conductivity of the inorganic adhesive at a low cost. Therefore, no adhesive is applied to the stress diffusion member 25 itself. However, if there is a margin for the required temperature accuracy or if there is a margin for kneading the precious metal powder with good thermal conductivity in the inorganic adhesive, the stress diffusion member 25 can also be deformed with adhesive, ceramic powder, metal powder, etc. It is also possible to use the structure shown in FIG. 5B by applying the filler 27 made of a heat resistant material. In this case, the heat-resistant material 27 can be used by filling a certain gap as a filler even with an inexpensive drilling process in which the processing accuracy of the corresponding portion 26a of the thermocouple mounting hole 26 is poor. However, there is an advantage that process error is less likely to occur even if the amount is insufficient.

  According to the embodiment described above, by using a heat-resistant inorganic adhesive on the fixing screw portion to prevent loosening, it is possible to prevent the sensor screw from loosening due to repeated stress, and to provide a highly reliable ACF thermocompression bonding apparatus for FPD. Can be provided.

  Further, according to the above-described embodiment, by providing the thermocouple between the sheath heater 22 and the crimping blade 11, a temperature close to the actual temperature of the contact portion with the processing portion of the crimping blade can be measured, and the reliability It is possible to provide an ACF thermocompression bonding apparatus for a high FPD.

  Furthermore, according to the above-described embodiment, the thermocouple can be pressed against the inside of the heater block with a sufficient pressing force by providing the stress diffusion member at the tip of the thermocouple with a seal. In this case, the amount of gap generated in the member due to plastic deformation due to internal thermal stress can be reduced, the actual temperature of the contact portion with the processing portion of the crimping blade can be accurately measured, and the ACF thermocompression bonding apparatus for FPD with high reliability. Can be provided.

  The present invention is suitable for FPD manufacturing equipment that requires relatively long high-precision ACF bonding such as liquid crystal, PDP, FED, organic EL, etc., and is indispensable for cost reduction by high-speed bonding. It can be applied to FPD manufacturing equipment that supports curing.

10: Thermocompression bonding head 11: Crimping blade 20: Heater block 21: Thermocouple with sheath 22: Sheath heater 23: Flange 24: Heat-resistant inorganic adhesive 25: Stress diffusion member 26: Thermocouple mounting hole 26a: Thermocouple mounting hole A portion corresponding to the stress diffusion member 27: heat-resistant material 30: pressure cylinder portion 31: cylinder body 32: pusher rod 40: backup 50: backup heater 100: thermocompression bonding device.

Claims (10)

In an ACF thermocompression bonding apparatus that pressurizes ACF using a heated crimping blade and fixes the ACF to an FPD substrate.
A heater block that heats the crimp blade with a heater, a mounting hole for a thermocouple with a sheath provided inside the heater block, and a thermocouple with a sheath provided in the mounting hole, and the base of the thermocouple with a sheath is screwed An ACF thermocompression bonding apparatus characterized in that the screw fixing part is bonded and fixed with a heat-resistant inorganic adhesive.   The ACF thermocompression bonding apparatus according to claim 1, wherein the thermocouple with a sheath is provided between the crimping blade and the heater.   The ACF thermocompression bonding apparatus according to claim 1, wherein the sheathed thermocouple is provided so as to avoid a heat transfer path from the heater to the crimping blade.   The ACF thermocompression bonding apparatus according to claim 1, wherein the heat-resistant inorganic adhesive is made of alumina, silica, or water glass.   2. The ACF heat according to claim 1, wherein a stress diffusion member is provided at a distal end of the sheathed thermocouple, and a distal end portion of the stress diffusion member has a shape similar to a corresponding portion of the distal end of the mounting hole. Crimping device.   6. The ACF thermocompression bonding apparatus according to claim 5, wherein the similarity means that both the tip portion and the corresponding portion have a flat shape.   6. The ACF thermocompression bonding apparatus according to claim 5, wherein the tip portion has a truncated cone shape and the corresponding portion has a cone shape having the same shape as the cone.   The ACF thermocompression bonding apparatus according to claim 7, wherein an apex angle of the cone is an obtuse angle.   The ACF thermocompression bonding apparatus according to any one of claims 5 to 8, wherein a deformable heat-resistant material is filled in a gap between the tip portion and the corresponding portion.   The ACF thermocompression bonding apparatus according to claim 5, wherein an adhesive or a filler is applied also to the stress diffusion member.

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