CN106556467B - ACF pressure welding temperature detection method - Google Patents
ACF pressure welding temperature detection method Download PDFInfo
- Publication number
- CN106556467B CN106556467B CN201610917590.3A CN201610917590A CN106556467B CN 106556467 B CN106556467 B CN 106556467B CN 201610917590 A CN201610917590 A CN 201610917590A CN 106556467 B CN106556467 B CN 106556467B
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- CN
- China
- Prior art keywords
- circuit board
- acf
- thermometer
- detection method
- pressure welding
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an ACF pressure welding temperature detection method, wherein a thermometer is arranged on a thermocouple, then the thermocouple is arranged on ACF glue to form a clamp for testing temperature, the clamp is placed under a circuit board, a heating head is arranged right above the circuit board, a glass plate is arranged below the circuit board, the circuit board is arranged by the glass plate, a rubber film is arranged between the heating head and the circuit board, the heating head heats the circuit board to simulate pressure welding in the production process, and the conduction temperature of the ACF glue is detected by the thermometer; the actual conduction temperature of the DCF is detected by completely simulating the pressure welding in the ACF production process.
Description
Technical Field
The invention relates to a temperature detection method, in particular to a method for detecting the temperature of pressure welding of ACF glue on a circuit board.
Background
The ACF-Anisotropic Conductive Film Chinese meaning is: anisotropic conductive films, also called anisotropic conductive film, are developed rapidly with the trend of light, thin, short, and small electronic products, and most of various portable electronic products use liquid crystal displays as display panels, and mobile phone cameras have been widely used, and the liquid crystal displays, besides the liquid crystal panels, must be linked with driving chips at the periphery thereof for the control purpose of displaying signals, and ACF glue is used in the interface connection technology of the liquid crystal panels of many liquid crystal displays and the driving IC system and the COB process of the mobile phone cameras, and in the actual production, the conduction temperature of the ACF glue is not easy to detect, resulting in higher detection cost, and therefore, it is very important to solve the problems.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the ACF bonding temperature detection method, which is used for detecting the actual conduction temperature of DCF by completely simulating the bonding in the ACF production process so as to solve the problem of low detection efficiency in the prior art.
In order to solve the problems, the invention provides an ACF pressure welding temperature detection method, wherein a thermometer is arranged on a thermocouple, the thermocouple is arranged on ACF glue to form a clamp for testing temperature, the clamp is placed under a circuit board, a heating head is arranged right above the circuit board, a glass plate is arranged below the circuit board, the circuit board is arranged by the glass plate, a rubber film is arranged between the heating head and the circuit board, the heating head heats the circuit board to simulate pressure welding in the production process, and the conduction temperature of the ACF glue is detected by the thermometer.
The further improvement lies in that: the temperature values measured on the thermometer and the time of retention were recorded by the worker.
The further improvement lies in that: the thermocouple adopts a K-type galvanic couple ST-50.
The further improvement lies in that: the thermometer used DP-700B.
The further improvement lies in that: the temperature is measured by a thermometer in conjunction with a thermocouple.
The invention has the beneficial effects that: the thermocouple and the ACF adhesive are made into a temperature testing clamp to be placed on the circuit board to completely simulate the production scene, and then the actual temperature is detected by the thermometer matched with the thermocouple.
Detailed Description
In order to further understand the present invention, the following detailed description will be made with reference to the following examples, which are only used for explaining the present invention and are not to be construed as limiting the scope of the present invention.
The embodiment provides an ACF pressure welding temperature detection method, wherein a thermometer is arranged on a thermocouple, the thermocouple is arranged on ACF glue to form a clamp for testing temperature, the clamp is placed under a circuit board, a heating head is arranged right above the circuit board, a glass plate is arranged below the circuit board, the circuit board is arranged on the glass plate, a rubber film is arranged between the heating head and the circuit board, the heating head heats the circuit board to simulate pressure welding in a production process, and the conduction temperature of the ACF glue is detected through the thermometer. The temperature values measured on the thermometer and the time of retention were recorded by the worker. The thermocouple adopts a K-type galvanic couple ST-50. The thermometer used DP-700B. The temperature is measured by a thermometer in conjunction with a thermocouple. The thermocouple and the ACF adhesive are made into a temperature testing clamp to be placed on the circuit board to completely simulate the production scene, and then the actual temperature is detected by the thermometer matched with the thermocouple.
Claims (4)
1. An ACF pressure welding temperature detection method is characterized in that: the method comprises the following steps of arranging a thermometer on a thermocouple, then arranging the thermocouple on the ACF adhesive to form a clamp for testing temperature, then placing the clamp under a circuit board, arranging a heating head right above the circuit board, arranging a glass plate below the circuit board, arranging the circuit board by the glass plate, arranging a rubber film between the heating head and the circuit board, heating the circuit board by the heating head to simulate pressure welding in a production process, and detecting the conduction temperature of the ACF adhesive by the thermometer.
2. The ACF bonding temperature detection method of claim 1, wherein: the temperature values measured on the thermometer and the time of retention were recorded by the worker.
3. The ACF bonding temperature detection method of claim 1, wherein: the thermocouple adopts a K-type galvanic couple ST-50.
4. The ACF bonding temperature detection method of claim 1, wherein: the thermometer used DP-700B.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917590.3A CN106556467B (en) | 2016-10-21 | 2016-10-21 | ACF pressure welding temperature detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917590.3A CN106556467B (en) | 2016-10-21 | 2016-10-21 | ACF pressure welding temperature detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106556467A CN106556467A (en) | 2017-04-05 |
| CN106556467B true CN106556467B (en) | 2020-02-25 |
Family
ID=58443819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610917590.3A Expired - Fee Related CN106556467B (en) | 2016-10-21 | 2016-10-21 | ACF pressure welding temperature detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106556467B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4685989A (en) * | 1984-01-25 | 1987-08-11 | Toyo Seikan Kaisha Limited | Process and apparatus for producing welded can body with an organic coated welded part |
| CN1339174A (en) * | 1999-01-29 | 2002-03-06 | 松下电器产业株式会社 | Electronic parts mounting method and device therefor |
| CN101813838A (en) * | 2009-02-20 | 2010-08-25 | 株式会社日立高新技术 | ACF thermo-compression bonding device |
| CN103013370A (en) * | 2012-12-14 | 2013-04-03 | 京东方科技集团股份有限公司 | Anisotropic conductive adhesive film and electronic device |
| CN203733762U (en) * | 2014-02-19 | 2014-07-23 | 合肥鑫晟光电科技有限公司 | Hot pressing device |
| CN104201125A (en) * | 2014-08-13 | 2014-12-10 | 南通富士通微电子股份有限公司 | Measuring method for hot-pressing product temperature curve |
| CN105201778A (en) * | 2015-10-20 | 2015-12-30 | 无锡格莱德科技有限公司 | Vapor-removal air compressor |
| CN105201779A (en) * | 2015-10-20 | 2015-12-30 | 无锡格莱德科技有限公司 | Antiskid-type air compressor |
| CN105388797A (en) * | 2015-12-24 | 2016-03-09 | 信利（惠州）智能显示有限公司 | Anisotropic conductive film binding device and method |
| CN105697315A (en) * | 2016-02-06 | 2016-06-22 | 任雪颖 | Efficient and energy-saving air compression environmental protection device |
| CN105828535A (en) * | 2016-05-20 | 2016-08-03 | 苏州经贸职业技术学院 | Circuit board welding heating machine with temperature control circuit |
| CN105889051A (en) * | 2015-02-16 | 2016-08-24 | Ac（澳门离岸商业服务）有限公司 | Air inlet control for air compressor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX2016000760A (en) * | 2013-08-01 | 2016-04-27 | Nippon Steel & Sumitomo Metal Corp | Friction welding method. |
-
2016
- 2016-10-21 CN CN201610917590.3A patent/CN106556467B/en not_active Expired - Fee Related
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4685989A (en) * | 1984-01-25 | 1987-08-11 | Toyo Seikan Kaisha Limited | Process and apparatus for producing welded can body with an organic coated welded part |
| CN1339174A (en) * | 1999-01-29 | 2002-03-06 | 松下电器产业株式会社 | Electronic parts mounting method and device therefor |
| CN101813838A (en) * | 2009-02-20 | 2010-08-25 | 株式会社日立高新技术 | ACF thermo-compression bonding device |
| TWI416827B (en) * | 2009-02-20 | 2013-11-21 | Hitachi High Tech Corp | ACF thermocompression bonding device |
| CN103013370A (en) * | 2012-12-14 | 2013-04-03 | 京东方科技集团股份有限公司 | Anisotropic conductive adhesive film and electronic device |
| CN203733762U (en) * | 2014-02-19 | 2014-07-23 | 合肥鑫晟光电科技有限公司 | Hot pressing device |
| CN104201125A (en) * | 2014-08-13 | 2014-12-10 | 南通富士通微电子股份有限公司 | Measuring method for hot-pressing product temperature curve |
| CN105889051A (en) * | 2015-02-16 | 2016-08-24 | Ac（澳门离岸商业服务）有限公司 | Air inlet control for air compressor |
| CN105201778A (en) * | 2015-10-20 | 2015-12-30 | 无锡格莱德科技有限公司 | Vapor-removal air compressor |
| CN105201779A (en) * | 2015-10-20 | 2015-12-30 | 无锡格莱德科技有限公司 | Antiskid-type air compressor |
| CN105388797A (en) * | 2015-12-24 | 2016-03-09 | 信利（惠州）智能显示有限公司 | Anisotropic conductive film binding device and method |
| CN105697315A (en) * | 2016-02-06 | 2016-06-22 | 任雪颖 | Efficient and energy-saving air compression environmental protection device |
| CN105828535A (en) * | 2016-05-20 | 2016-08-03 | 苏州经贸职业技术学院 | Circuit board welding heating machine with temperature control circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106556467A (en) | 2017-04-05 |
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Granted publication date: 20200225 Termination date: 20201021 |
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| CF01 | Termination of patent right due to non-payment of annual fee |