CN104360762A - ON CELL solid-state full lamination module processing method - Google Patents
ON CELL solid-state full lamination module processing method Download PDFInfo
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- CN104360762A CN104360762A CN201410527259.1A CN201410527259A CN104360762A CN 104360762 A CN104360762 A CN 104360762A CN 201410527259 A CN201410527259 A CN 201410527259A CN 104360762 A CN104360762 A CN 104360762A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
- B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Nonlinear Science (AREA)
- Human Computer Interaction (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses an ON CELL solid-state full lamination module processing method which comprises the following steps: bonding a DRIVER IC at an IC MASK of a TFT substrate under an ON CELL TFT liquid crystal display, then bonding a touch SENSOR FPC at a PIN outlet end of an ITO SENSOR circuit on a colored filter substrate of the ON CELL TFT liquid crystal display, bonding a TFT FPC on the TFT substrate under the ON CELL TFT liquid crystal display, pasting an upper polaroid and a lower polaroid, pasting solid-state OCA optical cement on the upper polaroid of the prepared ON CELL TFT liquid crystal display, performing full lamination on the upper polaroid and cover plate glass, and finally, assembling backlight with the full lamination upper polaroid and cover plate glass to form an ON CELL solid-state full lamination module. The processing method has the following advantages: the prepared ON CELL solid-state full lamination module has the advantages of simple processing flow, high assembling accuracy and processing yield.
Description
Technical field
The invention belongs to ON CELL entirely to fit module technical field, be specifically related to the solid-state full laminating module processing method of a kind of ON CELL.
Background technology
With work growth in the living standard, a development trend of colour liquid crystal display device module is to touching aobvious integrative development, touching at present aobvious integrated module is divided into again CTP type touch-screens such as () GF/GFF/OGS to form with TFT module of entirely fitting, and ON CELL, IN CELL etc. touches aobvious integrated TFT LCD and adds cover plate (COVER GLASS) and form two kinds of forms such as full laminating module.
Common ON CELL touches aobvious integrated module, and flow process is generally that after first sticking lower polaroid, nation determines COG IC, then nation determines ITO SENSOR FPC, and last nation determines TFT FPC.Full attaching process divides again solid-state and liquid attaching process, solid state process is for taking on ON CELL module, fit after solid-state OCA optical cement, entirely fit with upper cover plate again, the ON CELL using this technology mode to make fits module entirely, there is polaroid in ON CELL TFT LCD easily to occur burning, the display of Bang Ding district is turned white, the more bad control of technique, the situations such as yield is low, the module and the ON CELL using liquid OCA glue to produce fits entirely, need to use the special full make-up machine of liquid state, the equipment such as UV curing, and easily occur that solidification is not enough, liquid cull uses wiping manually too much, the shortcomings such as full coating thickness is wayward.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of work flow smooth and easy, Stability Analysis of Structures, the solid-state full laminating module processing method of a kind of ON CELL that processing yield is high.
The present invention is achieved in that the solid-state full laminating module processing method of a kind of ON CELL, it is characterized in that comprising the steps:
(1) under ON CELL TFT LCD, in TFT substrate, nation of IC MASK place determines DRIVER IC;
(2) on ON CELL TFT LCD filter substrate ITO SENSOR circuit go out PIN hold nation surely touch SENSOR FPC;
(3) under ON CELL TFT LCD, in TFT substrate, nation determines TFT FPC, and posts polaroid and lower polaroid;
(4) by the ON CELL TFT LCD module be made into, polaroid posts solid-state OCA optical cement again, entirely fit with cover-plate glass;
(5) the solid-state full laminating module of ON CELL is assembled into again with backlight.
Concrete, after first IC MASK place attaches ACF (anisotropic conductive) in TFT substrate under ON CELL TFT LCD, then this pressure of vacation is carried out to COG IC.
Concrete, after nation determines TFT COG IC, go out PIN end at ON CELL TFT LCD filter substrate upper surface ITO circuit and first attach ACF (anisotropic conductive), then nation touches SENSOR FPC surely.
Concrete, after nation touches SENSOR FPC surely, under ON CELL TFT LCD, TFT substrate first attaches ACF, then nation determines TFT FPC.
Concrete, after nation determines TFT FPC, then attach polaroid on ON CELL TFT LCD filter substrate, attach lower polaroid on the tft substrate.
Concrete, after having pasted upper and lower polaroid, attach solid-state OCA optical cement on upper polaroid surface.
Concrete, after having pasted solid-state OCA optical cement, use special localization tool, module of entirely being fitted by ON CELL carries out contraposition with cover-plate glass and fits in advance, after adding suitable temperature and pressure pressing with press equipment of entirely fitting, carries out deaeration process, completes full laminating.
Concrete, after deaeration process completes, use special finished product assembling localization tool, solid-state for the ON CELL after deaeration full laminating module semi-finished articles and backlight are assembled, is assembled into finished product.
To have work flow simple for module to use the ON CELL that manufactures of the inventive method entirely to fit, and assembly precision is high, processing yield advantages of higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of the solid-state full laminating module processing method of a kind of ON CELL that the embodiment of the present invention provides.
1, cover-plate glass, 2, solid-state OCA optical cement, 31, upper polaroid, 32, ITO circuit, 33, ON CELL TFT LCD filter substrate, 34, middle TFT liquid crystal and surrounding frame glue-line, 35, TFT substrate under ON CELL TFT LCD, 36, lower polaroid, 37, DRIVER IC, 38, SENSOR FPC, 39, TFT FPC, 4, backlight.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.
As shown in Figure 1, the structure of the solid-state full laminating module of a kind of ON CELL, it comprises the cover-plate glass 1 of stacked setting from top to down, solid-state OCA optical cement 2, upper polaroid 31, upper polaroid, ITO circuit 32, ON CELL TFT LCD filter substrate 33, middle TFT liquid crystal and surrounding frame glue-line 34, TFT substrate 35 under ON CELL TFT LCD, lower polaroid 36, DRIVER IC37, SENSOR FPC38, TFT FPC39 and backlight 4.
The solid-state full laminating module processing method of a kind of ON CELL that the embodiment of the present invention provides: after nation of TFT substrate (35) upper IC MASK place determines DRIVER IC (37) under ON CELL TFT LCD, going out PIN at the upper ITO circuit (32) of ON CELL TFT LCD filter substrate (33) holds nation surely to touch SENSOR FPC (38), under ON CELL TFT LCD, the upper nation of TFT substrate (35) determines TFT FPC (39) again, and posts polaroid (31) and lower polaroid (36).By on the ON CELL TFT LCD module be made into, polaroid (31) posts solid-state OCA optical cement (2) again, and entirely fit with cover-plate glass (1), be finally assembled into the solid-state full laminating module of ON CELL with backlight (4) again.
Concrete, after first under ON CELL TFT LCD, the upper IC MASK place of TFT substrate (35) attaches ACF (anisotropic conductive), then to DRIVER IC(37) carry out this pressure of vacation.
Concrete, nation determines TFT DRIVER IC(37) after, on ON CELL TFT LCD filter substrate, (33) surperficial SENSOR circuit (32) goes out PIN place and first attaches ACF (anisotropic conductive), then nation touches SENSOR FPC(38 surely).
Concrete, nation touches SENSOR FPC(38 surely) after, under ON CELL TFT LCD, TFT substrate (35) first attaches ACF, then nation determines TFT FPC(39).
Concrete, nation determines TFT FPC(39) after, upper polaroid (31) is attached in ON CELL TFT LCD filter substrate (33), attach lower polaroid (36) on the tft substrate.
Concrete, after having pasted upper and lower polaroid (31) (36), attach solid-state OCA optical cement (2) on upper polaroid surface.
Concrete, after having pasted solid-state OCA optical cement (2), use special localization tool, module of entirely being fitted by ON CELL carries out contraposition laminating with cover-plate glass (1), after adding suitable temperature and pressure pressing with press equipment of entirely fitting, carries out deaeration process.
Concrete, after deaeration process completes, use special finished product assembling localization tool, solid-state for the ON CELL after deaeration full laminating module semi-finished articles and backlight (4) are assembled, is assembled into finished product.
To have work flow simple for module to use the ON CELL that manufactures of the inventive method entirely to fit, and assembly precision is high, processing yield advantages of higher.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (8)
1. the solid-state full laminating module processing method of ON CELL, is characterized in that comprising the steps:
(1) under ON CELL TFT LCD, in TFT substrate, nation of IC MASK place determines DRIVER IC;
(2) on ON CELL TFT LCD filter substrate ITO SENSOR circuit go out PIN hold nation surely touch SENSOR FPC;
(3) under ON CELL TFT LCD, in TFT substrate, nation determines TFT FPC, and posts polaroid and lower polaroid;
(4) by the ON CELL TFT LCD module be made into, polaroid posts solid-state OCA optical cement again, entirely fit with cover-plate glass;
(5) the solid-state full laminating module of ON CELL is assembled into again with backlight.
2. the solid-state full laminating module processing method of a kind of ON CELL according to claim 1, is characterized in that, after first IC MASK place attaches ACF in TFT substrate under ON CELL TFT LCD, adds DRIVER IC and carries out this pressure of vacation.
3. the solid-state full laminating module processing method of a kind of ON CELL according to claim 1, it is characterized in that, after nation determines TFT DRIVER IC, go out PIN end at ON CELL TFT LCD filter substrate upper surface ITO SENSOR circuit and first attach ACF, then nation touches SENSOR FPC surely.
4. the solid-state full laminating module processing method of a kind of ON CELL according to claim 1, is characterized in that, after nation touches SENSOR FPC surely, under ON CELL TFT LCD, TFT substrate first attaches ACF, then nation determines TFT FPC.
5. the solid-state full laminating module processing method of a kind of ON CELL according to claim 1, is characterized in that, after nation determines TFT FPC, then attaches polaroid on ON CELL TFT LCD filter substrate, attaches lower polaroid on the tft substrate.
6. the solid-state full laminating module processing method of a kind of ON CELL according to claim 1, is characterized in that, after having pasted upper and lower polaroid, attaches solid-state OCA optical cement on upper polaroid surface.
7. the solid-state full laminating module processing method of a kind of ON CELL according to claim 1, it is characterized in that, after having pasted solid-state OCA optical cement, use localization tool, entirely fitted by ON CELL module and cover-plate glass carries out contraposition laminating, after adding suitable temperature and pressure pressing with full laminating press equipment, carry out deaeration process.
8. the solid-state full laminating module processing method of a kind of ON CELL according to claim 1, it is characterized in that, after deaeration process completes, use finished product assembling localization tool, solid-state for ON CELL after deaeration full laminating module semi-finished articles and backlight are assembled, is assembled into finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410527259.1A CN104360762A (en) | 2014-10-10 | 2014-10-10 | ON CELL solid-state full lamination module processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410527259.1A CN104360762A (en) | 2014-10-10 | 2014-10-10 | ON CELL solid-state full lamination module processing method |
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| CN104360762A true CN104360762A (en) | 2015-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410527259.1A Pending CN104360762A (en) | 2014-10-10 | 2014-10-10 | ON CELL solid-state full lamination module processing method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898883A (en) * | 2015-06-15 | 2015-09-09 | 江西合力泰科技有限公司 | Processing method of ON CELL surface fitting module |
| CN105278742A (en) * | 2015-07-13 | 2016-01-27 | 维沃移动通信有限公司 | Screen, manufacturing method for screen and mobile electronic product |
| CN105630236A (en) * | 2015-12-25 | 2016-06-01 | 江西合力泰科技有限公司 | Processing method of P+G CTP (Capacitive Touch Panel) and TFT (Thin Film Transistor) edge lamination module |
| CN106965534A (en) * | 2017-03-24 | 2017-07-21 | 信利光电股份有限公司 | A kind of preparation method of touch-control display module |
| CN107450216A (en) * | 2017-08-31 | 2017-12-08 | 河源中光电通讯技术有限公司 | A kind of processing method of ON CELL faces fitting module |
| CN108319043A (en) * | 2018-02-26 | 2018-07-24 | 深圳市比亚迪电子部品件有限公司 | A kind of method for sticking and covering based on COG techniques touch panel and liquid crystal display panel |
| CN108469698A (en) * | 2018-04-10 | 2018-08-31 | 信利半导体有限公司 | A kind of liquid crystal display die set is bonded production method entirely |
| CN108776554A (en) * | 2018-06-26 | 2018-11-09 | 赵宗轩 | Integrated module of ultrathin touch display and preparation method thereof |
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| JPH0274984A (en) * | 1988-09-12 | 1990-03-14 | Mitsubishi Electric Corp | Flat panel type display device |
| JP2007114361A (en) * | 2005-10-19 | 2007-05-10 | Nakan Corp | Patterning method for alignment film |
| EP2701040A2 (en) * | 2012-08-21 | 2014-02-26 | Beijing Boe Optoelectronics Technology Co. Ltd. | Capacitive in-cell touch panel and display device |
| CN104275907A (en) * | 2014-09-11 | 2015-01-14 | 江西合力泰科技有限公司 | Machining method for 3D ON CELL full-lamination module |
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2014
- 2014-10-10 CN CN201410527259.1A patent/CN104360762A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0274984A (en) * | 1988-09-12 | 1990-03-14 | Mitsubishi Electric Corp | Flat panel type display device |
| JP2007114361A (en) * | 2005-10-19 | 2007-05-10 | Nakan Corp | Patterning method for alignment film |
| EP2701040A2 (en) * | 2012-08-21 | 2014-02-26 | Beijing Boe Optoelectronics Technology Co. Ltd. | Capacitive in-cell touch panel and display device |
| CN104275907A (en) * | 2014-09-11 | 2015-01-14 | 江西合力泰科技有限公司 | Machining method for 3D ON CELL full-lamination module |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898883A (en) * | 2015-06-15 | 2015-09-09 | 江西合力泰科技有限公司 | Processing method of ON CELL surface fitting module |
| CN105278742A (en) * | 2015-07-13 | 2016-01-27 | 维沃移动通信有限公司 | Screen, manufacturing method for screen and mobile electronic product |
| CN105630236A (en) * | 2015-12-25 | 2016-06-01 | 江西合力泰科技有限公司 | Processing method of P+G CTP (Capacitive Touch Panel) and TFT (Thin Film Transistor) edge lamination module |
| CN106965534A (en) * | 2017-03-24 | 2017-07-21 | 信利光电股份有限公司 | A kind of preparation method of touch-control display module |
| CN107450216A (en) * | 2017-08-31 | 2017-12-08 | 河源中光电通讯技术有限公司 | A kind of processing method of ON CELL faces fitting module |
| CN108319043A (en) * | 2018-02-26 | 2018-07-24 | 深圳市比亚迪电子部品件有限公司 | A kind of method for sticking and covering based on COG techniques touch panel and liquid crystal display panel |
| CN108469698A (en) * | 2018-04-10 | 2018-08-31 | 信利半导体有限公司 | A kind of liquid crystal display die set is bonded production method entirely |
| CN108776554A (en) * | 2018-06-26 | 2018-11-09 | 赵宗轩 | Integrated module of ultrathin touch display and preparation method thereof |
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Application publication date: 20150218 |
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