CN104181712A - Manufacturing and processing method for direct-bonding TFT LCM - Google Patents
Manufacturing and processing method for direct-bonding TFT LCM Download PDFInfo
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- CN104181712A CN104181712A CN201410377606.7A CN201410377606A CN104181712A CN 104181712 A CN104181712 A CN 104181712A CN 201410377606 A CN201410377606 A CN 201410377606A CN 104181712 A CN104181712 A CN 104181712A
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Abstract
The invention provides a manufacturing and processing method for a direct-bonding TFT LCM (Liquid Crystal Module), and belongs to the technical field of direct-bonding module processing. The realization process of the manufacturing and processing method is as follows: not assembling backlight on TFT LCM in a direct-bonding module, and gluing OCA on the surface of an up polarizer of FOG in the TFT LCM; after pre-baking and pressurizing for defoaming, using a jig to carry out aligned pre-gluing processing on CTP and FOG; adopting a gluing machine for pressing operation; reusing the jig to assemble backlight after warming and pressurizing for defoaming through a defoaming furnace. The manufacturing and processing method has the advantages that direct-bonding products processed by adopting the method has the advantages of being simple in processing process, high in alignment precision, less in foams in product gluing, high in yield and the like.
Description
Technical field
The invention belongs to full laminating module process technology, be specifically related to a kind of production and processing method of full laminating TFT LCD MODULE.
Background technology
With work growth in the living standard, a development trend that shows module complete colored is the future development to laminating TFT LCD MODULE.And common supplier, because CTP and TFT LCD MODULE are not that same supplier makes, generalized case be all FOG first with the TFT of being assembled into LCD MODULE backlight, after laminating OCA glue, assemble with CTP.This production and processing mode TFT FOG and backlight between have build-up tolerance, between TFT LCD MODULE and CTP, there is full laminating tolerance, and easily form full laminating gap, cause deaeration bad, finally cause assembling product TFT FOG and CTP between deviation larger, affect display effect, and steam bubble is more, affects the yield of mass production.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, a kind of production and processing method of full laminating TFT LCD MODULE is provided, have work flow simple, aligning accuracy is high, and product laminating bubble is few, yield advantages of higher.
The present invention is achieved in that a kind of production and processing method of full laminating TFT LCD MODULE, it is characterized in that method step is:
(1) the TFT LCM entirely fitting in module, elder generation does not assemble backlight, and the FOG in TFT LCM is first at upper polaroid surface laminating OCA optical cement;
(2), again through prebake conditions, pressure debubble, is used tool that CTP and FOG are carried out to the contraposition processing of fitting in advance;
(3) finally use make-up machine to carry out pressing operation, through the debubbling oven pressure debubble of heating, re-use tool assembling backlight.
Concrete, TFT LCM part is not first assembled backlight, and FOG first attaches OCA glue.
Concrete, after TFT LCM FOG laminating OCA, through High Temperature High Pressure, carry out deaeration operation.
Concrete, after TFT LCM FOG laminating OCA, and after deaeration, carry out contraposition laminating operation with CTP.
Concrete, when TFT LCM FOG laminating OCA and CTP contraposition laminating, use special-purpose joint tool to position laminating.
Concrete, TFT LCM FOG laminating OCA and with CTP contraposition laminating after, use full laminating pressing machine to carry out pressing.
Concrete, TFT LCM FOG laminating OCA also fits with CTP contraposition and uses full laminating pressing machine to carry out after pressing, uses debubbling oven to carry out High Temperature High Pressure deaeration.
Concrete, TFT LCM FOG laminating OCA also fits with CTP contraposition, assembles backlight after deaeration.
Advantage of the present invention is: use the full jointing product of which processing, have work flow simple, aligning accuracy is high, and product laminating bubble is few, yield advantages of higher.
Accompanying drawing explanation
Fig. 1 is the production and processing schematic diagram of full laminating TFT LCD MODULE of the present invention.
In the drawings, 1 is CTP, and 2 is OCA, and 3 is FOG, and 4 is backlight.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.
As shown in Figure 1, the present invention is achieved in that a kind of production and processing method of full laminating TFT LCD MODULE, TFT LCM in full laminating module, elder generation does not assemble backlight, and the FOG in TFT LCM is first at upper polaroid surface laminating OCA optical cement, through prebake conditions, after pressure debubble, use tool, CTP and FOG are carried out to the contraposition processing of fitting in advance, and use make-up machine to carry out pressing operation, through debubbling oven, heat after pressure debubble, re-use tool assembling backlight.
Concrete, TFT LCM part is not first assembled backlight, and FOG 3 first attaches OCA2 glue.
Concrete, after TFT LCM FOG 3 laminating OCA2, through High Temperature High Pressure, carry out deaeration operation.
Concrete, after TFT LCM FOG3 laminating OCA2, and after deaeration, carry out contraposition laminating operation with CTP 1.
Concrete, when TFT LCM FOG3 laminating OCA2 and CTP1 contraposition laminating, use special-purpose joint tool to position laminating.
Concrete, TFT LCM FOG 3 laminating OCA2 and with CTP1 contraposition laminating after, use full laminating pressing machine to carry out pressing.
Concrete, TFT LCM FOG3 laminating OCA2 also fits with CTP1 contraposition and uses full laminating pressing machine to carry out after pressing, uses debubbling oven to carry out High Temperature High Pressure deaeration.
Concrete, TFT LCM FOG3 laminating OCA2 also fits with CTP1 contraposition, assembles backlight 4 after deaeration.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (3)
1. a production and processing method for the TFT LCD MODULE of entirely fitting, is characterized in that method step is:
(1) the TFT LCM entirely fitting in module, elder generation does not assemble backlight, and the FOG in TFT LCM is first at upper polaroid surface laminating OCA optical cement;
(2), again through prebake conditions, pressure debubble, is used tool that CTP and FOG are carried out to the contraposition processing of fitting in advance;
(3) finally use full laminating pressing machine to carry out pressing operation, through the debubbling oven pressure debubble of heating, re-use tool assembling backlight.
2. the production and processing method of a kind of full laminating TFT LCD MODULE according to claim 1, is characterized in that: after TFT LCM FOG laminating OCA, through High Temperature High Pressure, carry out deaeration operation.
3. the production and processing method of a kind of full laminating TFT LCD MODULE according to claim 1, it is characterized in that: TFT LCM FOG laminating OCA also fits with CTP contraposition and uses full laminating pressing machine to carry out after pressing, uses debubbling oven to carry out High Temperature High Pressure deaeration.
Priority Applications (1)
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CN201410377606.7A CN104181712A (en) | 2014-08-04 | 2014-08-04 | Manufacturing and processing method for direct-bonding TFT LCM |
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CN201410377606.7A CN104181712A (en) | 2014-08-04 | 2014-08-04 | Manufacturing and processing method for direct-bonding TFT LCM |
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CN201410377606.7A Pending CN104181712A (en) | 2014-08-04 | 2014-08-04 | Manufacturing and processing method for direct-bonding TFT LCM |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104267517A (en) * | 2014-09-11 | 2015-01-07 | 江西合力泰科技有限公司 | Production and process method of full-lamination TFT LCD module |
CN104924729A (en) * | 2015-06-15 | 2015-09-23 | 江西合力泰科技有限公司 | TFT full-lamination module processing method |
CN105630236A (en) * | 2015-12-25 | 2016-06-01 | 江西合力泰科技有限公司 | Processing method of P+G CTP (Capacitive Touch Panel) and TFT (Thin Film Transistor) edge lamination module |
CN107992233A (en) * | 2017-12-29 | 2018-05-04 | 东莞北斗同创智能科技有限公司 | A kind of assemble method of intelligence wearing touch display screen |
CN108287625A (en) * | 2017-12-20 | 2018-07-17 | 深圳市比亚迪电子部品件有限公司 | A kind of full fitting module production method |
CN108287626A (en) * | 2017-12-20 | 2018-07-17 | 深圳市比亚迪电子部品件有限公司 | A kind of intelligence is bonded module production method entirely |
CN108932072A (en) * | 2017-05-22 | 2018-12-04 | 蓝思科技(长沙)有限公司 | The preparation method and abutted equipment of touch display screen |
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CN203658700U (en) * | 2013-12-04 | 2014-06-18 | 常州碳时代科技有限公司 | Full-lamination touch liquid crystal display |
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JP2004213187A (en) * | 2002-12-27 | 2004-07-29 | Nissha Printing Co Ltd | Touch panel with icon |
JP2010117903A (en) * | 2008-11-13 | 2010-05-27 | Unon Giken:Kk | Method for manufacturing transparent touch panel input side transparent resin substrate |
CN101504496A (en) * | 2009-03-04 | 2009-08-12 | 信利半导体有限公司 | Touch screen and panel display module integrated combination module and method for producing the same |
CN202159206U (en) * | 2011-07-01 | 2012-03-07 | 深圳市立德通讯器材有限公司 | Liquid crystal display module with capacitance-type touch screen |
CN102609134A (en) * | 2012-01-16 | 2012-07-25 | 苏州欧菲光科技有限公司 | Method for controlling glue overflow in liquid optical clear adhesive gluing |
CN103729086A (en) * | 2012-10-16 | 2014-04-16 | 胜华科技股份有限公司 | Touch display device and manufacturing method thereof |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104267517A (en) * | 2014-09-11 | 2015-01-07 | 江西合力泰科技有限公司 | Production and process method of full-lamination TFT LCD module |
CN104924729A (en) * | 2015-06-15 | 2015-09-23 | 江西合力泰科技有限公司 | TFT full-lamination module processing method |
CN105630236A (en) * | 2015-12-25 | 2016-06-01 | 江西合力泰科技有限公司 | Processing method of P+G CTP (Capacitive Touch Panel) and TFT (Thin Film Transistor) edge lamination module |
CN108932072A (en) * | 2017-05-22 | 2018-12-04 | 蓝思科技(长沙)有限公司 | The preparation method and abutted equipment of touch display screen |
CN108287625A (en) * | 2017-12-20 | 2018-07-17 | 深圳市比亚迪电子部品件有限公司 | A kind of full fitting module production method |
CN108287626A (en) * | 2017-12-20 | 2018-07-17 | 深圳市比亚迪电子部品件有限公司 | A kind of intelligence is bonded module production method entirely |
CN107992233A (en) * | 2017-12-29 | 2018-05-04 | 东莞北斗同创智能科技有限公司 | A kind of assemble method of intelligence wearing touch display screen |
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