CN102963106A - High-pressure bubble removing method for capacitive touch screen - Google Patents
High-pressure bubble removing method for capacitive touch screen Download PDFInfo
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- CN102963106A CN102963106A CN2012105214277A CN201210521427A CN102963106A CN 102963106 A CN102963106 A CN 102963106A CN 2012105214277 A CN2012105214277 A CN 2012105214277A CN 201210521427 A CN201210521427 A CN 201210521427A CN 102963106 A CN102963106 A CN 102963106A
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Abstract
The invention discloses a high-pressure bubble removing method for a capacitive touch screen. The high-pressure bubble removing method mainly comprises the steps of: placing the capacitive touch screen adhered by an OCA (Optical Clear Adhesive) in a sealed space, raising temperature and pressure of the sealed space, then keeping the temperature and the pressure for a period of time, later decompressing the sealed space to be at an atmospheric pressure value with a constant decompressing rate within the decompressing time, and at last taking out the capacitive touch screen after decompressing is finished. According to the method, the decompressing process is added after the process of temperature and pressure keeping, so that the pressure acted on the capacitive touch screen is decreased gradually, and meanwhile the temperature is lowered gradually; and the stress of the OCA is eliminated or reduced, so that the bubbling rate of the OCA adhered to the capacitive touch screen is lowered and the adhesion yield of the capacitive touch screen is improved greatly.
Description
Technical field
The present invention relates to touch-screen production de-bubble field, relate in particular to a kind of high pressure bubble removing method of capacitive touch screen.
Background technology
Capacitive touch screen generally comprises glass substrate and functional sheet, uses OCA(Optical Clear Adhesive between the two) glue laminating.Mainly be to adopt the HTHP de-bubble after touch-screen is fitted at present, OCA glue can be out of shape under HTHP, and bubble can be distributed in the OCA glue or discharge outside the OCA glue; After the de-bubble time arrived, OCA glue is cooling fast, and the stress of OCA glue can be larger.If the viscous force of OCA glue and glass substrate is during less than the internal stress of OCA glue, OCA glue can break away from glass substrate, and air molecule can gather gap location, thereby produces bubble, reduces the binding yield of touch-screen.
Summary of the invention
The present invention aims to provide a kind of internal stress of eliminating OCA glue that improves, and promotes the method for capacitance plate binding yield.
To achieve these goals, the invention provides a kind of technical scheme is: a kind of high pressure bubble removing method of capacitive touch screen, comprise step: 1, a kind of high pressure bubble removing method of capacitive touch screen comprises step: S1, will use the capacitive touch screen behind the OCA glue laminating to put into confined space; S2, simultaneously confined space is added gentleness and be forced into setting value, wherein, desired temperature is 40 ℃～60 ℃, and pressure set points is 4kgf～6kgf; The temperature and pressure of S3, maintenance confined space is constant within the time of 10min～20min; S4, make the confined space pressure release to atmospheric value, the pressure release time is 5min～20min, wherein, and the pressure release constant rate.
Wherein, described desired temperature is 40 ℃.
Wherein, described pressure set points is 5kgf.
Wherein, constant time time spent of the temperature and pressure of described maintenance confined space is 20min.
Wherein, the pressure release of the time spent of the temperature and pressure of the maintenance confined space of heat pressurization time spent, the S3 of described step S2 and S4 to the time of atmospheric value time spent all equates.
Wherein, the constant rate of heating of described step S2, compression rate is constant.
The beneficial effect of the invention is not: after the de-bubble time that is different from the HTHP bubble removing method of prior art arrives, take out capacitive touch screen, OCA glue is cooling fast, the stress of OCA glue can be larger, anti-bubble rate is high, the applying fraction defective is high, the high pressure bubble removing method of capacitive touch screen of the present invention is after the heat-insulation pressure keeping process, add a pressure release temperature-fall period, in this process, the pressure that acts on the capacitive touch screen can slowly reduce, also slowly reduction of simultaneous temperature, therefore the stress of OCA glue is eliminated or reduces, and makes the anti-bubble rate reduction of OCA glue of applying capacitive touch screen, has improved greatly the binding yield of capacitive touch screen.
Description of drawings
Fig. 1 is the FB(flow block) of the high pressure bubble removing method of capacitive touch screen of the present invention;
Fig. 2 is the time layout of the high pressure bubble removing method of capacitive touch screen of the present invention.
The specific embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, below in conjunction with embodiment and cooperate that accompanying drawing is detailed to give explanation.
See also Fig. 1 and Fig. 2, a kind of high pressure bubble removing method of capacitive touch screen comprises step:
S1, will use the capacitive touch screen behind the OCA glue laminating to put into confined space, confined space generally is defoaming machine;
S2, simultaneously confined space is added gentleness and be forced into setting value, wherein, desired temperature is 40 ℃～60 ℃, pressure set points is 4kgf～6kgf, and this process is for softening OCA glue, makes it have flowability, can be that bubble flows in OCA glue, make the bubble in the OCA glue be extruded discharge under the effect of pressure, the pressurization of heating is in addition carried out simultaneously, can save time; Certainly, in another embodiment, also can be to heat first and then pressurize, or then pressurization heat first.
The temperature and pressure of S3, maintenance confined space is constant within the time of 10min～20min, and this process is in order there to be the sufficient time more thoroughly the bubble in the OCA glue to be discharged;
S4, make the confined space pressure release to atmospheric value, the pressure release time is 5min～20min, wherein, the pressure release constant rate, this process is slowly pressure release, and the simultaneous temperature that the pressure of confined space constantly diminishes also can be along with attenuating, makes stress among the OCA eliminate or reduce in this engineering, reduce anti-bubble rate, improve binding yield.
Above-mentioned steps can be taken out capacitive touch screen after finishing.
In the present embodiment, described desired temperature is 40 ℃, that is to say when step S2 heats to 40 ℃, and stopped heating, the OCA gum softening degree of this moment is moderate, and is better mobile, but again can be not too soft, loses viscosity.
In the present embodiment, described pressure set points is 5kgf, that is to say that step S2 inflating pressure stops inflating pressure when force value is 5kgf, and this moment, force value can not cause damage to capacitive touch screen, and de-bubble is respond well.
In the present embodiment, constant time time spent of the temperature and pressure of the maintenance confined space of described step S3 is 20min, can make like this effect of de-bubble best, can not lose time simultaneously.
In the present embodiment, the time spent of the temperature and pressure of the maintenance confined space of heat pressurization time spent, the S3 of described step S2 and the pressure release of S4 to the time of atmospheric value time spent all equates, the setting between like this can be at one's leisure.
In the present embodiment, the constant rate of heating in the process of heating of described step S2, compression rate is constant, the rapid high or rapid situation such as low of temperature like this can not can occur, damages capacitive touch screen or enters bubble in OCA glue.
Principle of the present invention is: capacitive touch screen generally comprises functional sheet and glass substrate, both use the OCA glue bond, after fitting, both generally have Bubble formation in OCA glue, affect the result of use of touch-screen, therefore need de-bubble, in the process of de-bubble, use defoaming machine, behind the design temperature of heating in the defoaming machine, make the OCA gum softening have flowability, then the glass substrate of capacitive touch screen and functional sheet are subject to mutual gas pressure, and the bubble in the OCA glue after softening is discharged, then slowly pressure release cooling, can effectively reduce or eliminate the internal stress of OCA glue in this process, reduce anti-bubble rate, improve binding yield.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (6)
1. the high pressure bubble removing method of a capacitive touch screen comprises step:
S1, will use the capacitive touch screen behind the OCA glue laminating to put into confined space;
S2, simultaneously confined space is added gentleness and be forced into setting value, wherein, desired temperature is 40 ℃～60 ℃, and pressure set points is 4kgf～6kgf;
The temperature and pressure of S3, maintenance confined space is constant within the time of 10min～20min;
S4, make the confined space pressure release to atmospheric value, the pressure release time is 5min～20min, wherein, and the pressure release constant rate.
2. the high pressure bubble removing method of capacitive touch screen according to claim 1 is characterized in that, described desired temperature is 40 ℃.
3. the high pressure bubble removing method of capacitive touch screen according to claim 1 is characterized in that, described pressure set points is 5kgf.
4. the high pressure bubble removing method of capacitive touch screen according to claim 1 is characterized in that, constant time time spent of the temperature and pressure of described maintenance confined space is 20min.
5. the high pressure bubble removing method of each described capacitive touch screen according to claim 1-4, it is characterized in that the time spent of the temperature and pressure of the maintenance confined space of heat pressurization time spent, the S3 of described step S2 and the pressure release of S4 to the time of atmospheric value time spent all equates.
6. the high pressure bubble removing method of each described capacitive touch screen is characterized in that according to claim 1-4, the constant rate of heating of described step S2, and compression rate is constant.
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| CN2012105214277A CN102963106A (en) | 2012-12-07 | 2012-12-07 | High-pressure bubble removing method for capacitive touch screen |
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| CN2012105214277A CN102963106A (en) | 2012-12-07 | 2012-12-07 | High-pressure bubble removing method for capacitive touch screen |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103472970A (en) * | 2013-09-26 | 2013-12-25 | 无锡宇宁光电科技有限公司 | Method for removing solid optical glue joint air bubbles of capacitive screen |
| CN104181712A (en) * | 2014-08-04 | 2014-12-03 | 江西合力泰科技有限公司 | Manufacturing and processing method for direct-bonding TFT LCM |
| CN104267517A (en) * | 2014-09-11 | 2015-01-07 | 江西合力泰科技有限公司 | Production and process method of full-lamination TFT LCD module |
| CN105268216A (en) * | 2015-11-04 | 2016-01-27 | 铜陵市佳龙飞电容器有限公司 | Device for eliminating epoxy resin bubbles on surface of CBB60 type capacitor |
| CN107704138A (en) * | 2017-11-01 | 2018-02-16 | 四川皇泽光电科技有限公司 | A kind of applying method of touch-screen and the preparation method of touch-screen and touch-screen |
| CN108099346A (en) * | 2017-12-22 | 2018-06-01 | 柳州铁道职业技术学院 | Mobile phone liquid crystal screen repairs all-in-one machine and its control method |
| CN109471567A (en) * | 2018-09-27 | 2019-03-15 | 广西中沛光电科技有限公司 | A kind of attaching process of capacitive touch screen |
| CN111128018A (en) * | 2019-12-13 | 2020-05-08 | Oppo广东移动通信有限公司 | Display screen assembly attaching method and sealing plug |
| CN111365336A (en) * | 2020-04-17 | 2020-07-03 | Oppo广东移动通信有限公司 | Attaching jig and attaching method for display screen assembly |
| CN112797061A (en) * | 2020-12-30 | 2021-05-14 | 盐城创盈利科技有限公司 | Full-lamination process for touch screen production |
| CN113501991A (en) * | 2021-08-04 | 2021-10-15 | 江苏松上科技有限公司 | Formula, preparation method and production equipment of high-tensile-strength PBT material |
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| CN101504496A (en) * | 2009-03-04 | 2009-08-12 | 信利半导体有限公司 | Touch screen and panel display module integrated combination module and method for producing the same |
| CN101650622A (en) * | 2009-08-18 | 2010-02-17 | 城步鼎盛微电子科技有限公司 | Technology for attaching capacitive touch screens |
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2012
- 2012-12-07 CN CN2012105214277A patent/CN102963106A/en active Pending
Patent Citations (2)
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| CN101504496A (en) * | 2009-03-04 | 2009-08-12 | 信利半导体有限公司 | Touch screen and panel display module integrated combination module and method for producing the same |
| CN101650622A (en) * | 2009-08-18 | 2010-02-17 | 城步鼎盛微电子科技有限公司 | Technology for attaching capacitive touch screens |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103472970A (en) * | 2013-09-26 | 2013-12-25 | 无锡宇宁光电科技有限公司 | Method for removing solid optical glue joint air bubbles of capacitive screen |
| CN104181712A (en) * | 2014-08-04 | 2014-12-03 | 江西合力泰科技有限公司 | Manufacturing and processing method for direct-bonding TFT LCM |
| CN104267517A (en) * | 2014-09-11 | 2015-01-07 | 江西合力泰科技有限公司 | Production and process method of full-lamination TFT LCD module |
| CN105268216A (en) * | 2015-11-04 | 2016-01-27 | 铜陵市佳龙飞电容器有限公司 | Device for eliminating epoxy resin bubbles on surface of CBB60 type capacitor |
| CN107704138A (en) * | 2017-11-01 | 2018-02-16 | 四川皇泽光电科技有限公司 | A kind of applying method of touch-screen and the preparation method of touch-screen and touch-screen |
| CN108099346A (en) * | 2017-12-22 | 2018-06-01 | 柳州铁道职业技术学院 | Mobile phone liquid crystal screen repairs all-in-one machine and its control method |
| CN109471567A (en) * | 2018-09-27 | 2019-03-15 | 广西中沛光电科技有限公司 | A kind of attaching process of capacitive touch screen |
| CN109471567B (en) * | 2018-09-27 | 2022-02-11 | 广西中沛光电科技有限公司 | Attaching process of capacitive touch screen |
| CN111128018A (en) * | 2019-12-13 | 2020-05-08 | Oppo广东移动通信有限公司 | Display screen assembly attaching method and sealing plug |
| CN111128018B (en) * | 2019-12-13 | 2021-10-15 | Oppo广东移动通信有限公司 | Display screen assembly attaching method and sealing plug |
| CN111365336A (en) * | 2020-04-17 | 2020-07-03 | Oppo广东移动通信有限公司 | Attaching jig and attaching method for display screen assembly |
| CN111365336B (en) * | 2020-04-17 | 2022-04-01 | Oppo广东移动通信有限公司 | Attaching jig and attaching method for display screen assembly |
| CN112797061A (en) * | 2020-12-30 | 2021-05-14 | 盐城创盈利科技有限公司 | Full-lamination process for touch screen production |
| CN113501991A (en) * | 2021-08-04 | 2021-10-15 | 江苏松上科技有限公司 | Formula, preparation method and production equipment of high-tensile-strength PBT material |
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Application publication date: 20130313 |