CN104185414A - Bonding machine pressing head capable of improving hot-press yield - Google Patents
Bonding machine pressing head capable of improving hot-press yield Download PDFInfo
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- CN104185414A CN104185414A CN201410404621.6A CN201410404621A CN104185414A CN 104185414 A CN104185414 A CN 104185414A CN 201410404621 A CN201410404621 A CN 201410404621A CN 104185414 A CN104185414 A CN 104185414A
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- pressure head
- hot
- pressing head
- press
- heating
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Abstract
The invention discloses a bonding machine pressing head capable of improving the hot-press yield. The bonding machine pressing head comprises a pressing head body, one side of the pressing head face of the pressing head body is provided with at least two heating points at intervals, the heating points are respectively connected with a heating wire, and the heating wires are connected to a heating circuit of an electromagnetic heater in parallel. According to the bonding machine pressing head capable of improving the hot-press yield, the heating points on the pressing head face are additionally arranged, the arrangement positions of the heating points are optimized, all the heating points are connected to the heating circuit through the heating lines in parallel, so that the current situation that the temperature of the pressing head is not even is improved, the hot-press consistency is improved, and the hot-press functional yield is guaranteed.
Description
Technical field
The present invention relates to this press, relate in particular to a kind of this press pressure head that promotes hot pressing yield.
Background technology
The link microminiaturization of electronic device makes heat binding replace original welding now, the link bit conducting on the splitting both sides of ion by ACF ion glue under HTHP, thereby by components and parts composition function assembly.At present, the hot-press equipment of medium-sized and small enterprises is mostly this press of pulsed or pre-this pressure all-in-one of pulsed adopts electronic impulse mode to heat, general pulse frequency and the voltage of using is all that board is fixing, for pressure head when heating of long pin pin or special-shaped pin pin, because pressure head is long or indenter shape is peculiar, problem on pressure head face is different, and with regard to long pressure head, the pressure head temperature difference middle and both sides can reach 20 °.The temperature that applies for ACF ion glue is different, and ion explosion situation is also different, but only 20 ° of ACF ion glue working temperature bounds often cannot be carried out the hot pressing of high-quality.
Summary of the invention
The object of the present invention is to provide a kind of this press pressure head that promotes hot pressing yield, it has all features of even hot pressing high conformity of pressure head temperature.To solve in prior art this press pressure head because pressure head is long or the peculiar the problems referred to above that exist of indenter shape.
For reaching this object, the present invention by the following technical solutions:
A kind of this press pressure head that promotes hot pressing yield, it comprises pressure head body, and wherein, a side of the pressure head face of described pressure head body is arranged at intervals with at least two hot spots, on described hot spot, be all connected with heater wire, described heater wire is parallel on the heater circuit of electromagnetic heater.
Especially, described hot spot is provided with two, and these two hot spots are located along the same line, and are positioned at the both ends of pressure head face one side.
Especially, described hot spot is set to more than two, and all hot spots are all located along the same line, and the spacing between adjacent two hot spots equates.
Especially, described hot spot is set to more than two, and all hot spots are not on same straight line.
Beneficial effect of the present invention is, compared with prior art this press pressure head of described lifting hot pressing yield is by setting up the hot spot and the setting position of optimizing hot spot on pressure head face, each hot spot is parallel on heater circuit by heater wire, thereby improved the present situation of pressure head non-uniform temperature, promote hot pressing consistency, guarantee the functional yield of hot pressing.
Accompanying drawing explanation
Fig. 1 is the structural representation of this press pressure head of the lifting hot pressing yield that provides of the specific embodiment of the invention 1.
In figure:
1, pressure head body; 2, pressure head face; 3, hot spot; 4, heater wire; 5, heater circuit.
Embodiment
Below in conjunction with accompanying drawing and by embodiment, further illustrate technical scheme of the present invention.
Refer to shown in Fig. 1, Fig. 1 is the structural representation of this press pressure head of the lifting hot pressing yield that provides of the specific embodiment of the invention 1.
In the present embodiment, a kind of this press pressure head that promotes hot pressing yield comprises pressure head body 1, the both ends correspondence of pressure head face 2 one sides of described pressure head body 1 is provided with two hot spots 3, on described hot spot 3, be all connected with heater wire 4, described heater wire 4 is parallel on the heater circuit 5 of electromagnetic heater.Described two hot spots 3 are located along the same line.
This press pressure head of above-mentioned lifting hot pressing yield is after the heater wire of change many places, two sections of pressure heads and abnormity part also can obtain good intensification, guarantee that ACF glue is heated and the consistency of pressurized, function with the assembly after confirmation hot pressing, but because of multi-wire parallel connection, therefore electric current wants high compared with wall scroll heating, and single circuital current is little compared with wall scroll, therefore adjust electric current, need adjust according to corresponding ratio, and former dial gauge needs again to think calibration according to actual current.
Above embodiment has just set forth basic principle of the present invention and characteristic; the present invention is not limited by above-mentioned example; without departing from the spirit and scope of the present invention, the present invention also has various variations and change, and these variations and change all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (4)
1. this press pressure head that promotes hot pressing yield, it comprises pressure head body, it is characterized in that, a side of the pressure head face of described pressure head body is arranged at intervals with at least two hot spots, on described hot spot, be all connected with heater wire, described heater wire is parallel on the heater circuit of electromagnetic heater.
2. this press pressure head of lifting hot pressing yield according to claim 1, is characterized in that, described hot spot is provided with two, and these two hot spots are located along the same line, and are positioned at the both ends of pressure head face one side.
3. this press pressure head of lifting hot pressing yield according to claim 1, is characterized in that, described hot spot is set to more than two, and all hot spots are all located along the same line, and the spacing between adjacent two hot spots equates.
4. this press pressure head of lifting hot pressing yield according to claim 1, is characterized in that, described hot spot is set to more than two, and all hot spots are not on same straight line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410404621.6A CN104185414A (en) | 2014-08-15 | 2014-08-15 | Bonding machine pressing head capable of improving hot-press yield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410404621.6A CN104185414A (en) | 2014-08-15 | 2014-08-15 | Bonding machine pressing head capable of improving hot-press yield |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104185414A true CN104185414A (en) | 2014-12-03 |
Family
ID=51966040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410404621.6A Pending CN104185414A (en) | 2014-08-15 | 2014-08-15 | Bonding machine pressing head capable of improving hot-press yield |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104185414A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2837881Y (en) * | 2005-11-14 | 2006-11-15 | 比亚迪股份有限公司 | Hot press ram for packaging of drive chip for LCD module |
| CN1866090A (en) * | 2006-04-06 | 2006-11-22 | 友达光电股份有限公司 | Adjustable pressing device |
| CN101024310A (en) * | 2006-02-24 | 2007-08-29 | 宇富半导体材料科技股份有限公司 | Precision ceramic package heat-press head for COG process |
| CN101813838A (en) * | 2009-02-20 | 2010-08-25 | 株式会社日立高新技术 | ACF thermo-compression bonding device |
| CN201869379U (en) * | 2010-09-17 | 2011-06-15 | 华映视讯（吴江）有限公司 | Fixing device for panel pressure heater wire and panel pressure heating system |
| CN102137523A (en) * | 2011-04-19 | 2011-07-27 | 武汉理工大学 | Electromagnetic induction heating press-roller |
| CN102135672A (en) * | 2011-01-20 | 2011-07-27 | 苏州凯蒂亚半导体制造设备有限公司 | Hot-pressing sticking mechanism |
| CN204157219U (en) * | 2014-08-15 | 2015-02-11 | 无锡宇宁光电科技有限公司 | A kind of this bonding press promoting hot pressing yield |
-
2014
- 2014-08-15 CN CN201410404621.6A patent/CN104185414A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2837881Y (en) * | 2005-11-14 | 2006-11-15 | 比亚迪股份有限公司 | Hot press ram for packaging of drive chip for LCD module |
| CN101024310A (en) * | 2006-02-24 | 2007-08-29 | 宇富半导体材料科技股份有限公司 | Precision ceramic package heat-press head for COG process |
| CN1866090A (en) * | 2006-04-06 | 2006-11-22 | 友达光电股份有限公司 | Adjustable pressing device |
| CN101813838A (en) * | 2009-02-20 | 2010-08-25 | 株式会社日立高新技术 | ACF thermo-compression bonding device |
| CN201869379U (en) * | 2010-09-17 | 2011-06-15 | 华映视讯（吴江）有限公司 | Fixing device for panel pressure heater wire and panel pressure heating system |
| CN102135672A (en) * | 2011-01-20 | 2011-07-27 | 苏州凯蒂亚半导体制造设备有限公司 | Hot-pressing sticking mechanism |
| CN102137523A (en) * | 2011-04-19 | 2011-07-27 | 武汉理工大学 | Electromagnetic induction heating press-roller |
| CN204157219U (en) * | 2014-08-15 | 2015-02-11 | 无锡宇宁光电科技有限公司 | A kind of this bonding press promoting hot pressing yield |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141203 |