CN1866090A - Adjustable pressing device - Google Patents
Adjustable pressing device Download PDFInfo
- Publication number
- CN1866090A CN1866090A CN 200610073265 CN200610073265A CN1866090A CN 1866090 A CN1866090 A CN 1866090A CN 200610073265 CN200610073265 CN 200610073265 CN 200610073265 A CN200610073265 A CN 200610073265A CN 1866090 A CN1866090 A CN 1866090A
- Authority
- CN
- China
- Prior art keywords
- pressure head
- chamber
- fluid
- cushion
- pressing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The disclosed adjustable stitching device comprises: with buffer layer or liquid free to absorb and adjust stress, letting the first/second pressure head and target parallel or with small included angle, and using heater and cooling device to control head temperature.
Description
Technical field
The present invention is about a kind of adjustable pressing device, and especially in regard to a kind of adjustable pressing device that is applicable to large size panel.
Background technology
The module assembling manufacture craft of LCD comprises: with display panels, glass-based version, printed circuit board (PCB), drive circuit board, flexible circuit board or anisotropic conductive film (anisotropic conductivefilm, ACF) etc. assembly engages one another, it is electrically connected, and these manufacture crafts, usually need use press fit device, but make inter-module fluid-tight engagement to be laminated, and form complete electric connection; In addition, along with the panel size demand develops towards large scale, and output requires also to grow with each passing day, therefore, how to avoid large-sized panel, in the pressing process, damage or flaw occurs because of error, and the yields that causes reduces or output reduces, and is a very important subject under discussion.
Can engage closely mutually in order to make between thing to be laminated, the press fit device in present existing other field, various solutions are proposed, for example: TaiWan, China patent announcement number 00191297 is to utilize steel ball, make holder can do oscillating motion, so can automatically absorb the depth of parallelism of holder, make that the surface of the semiconductor subassembly of desiring to be engaged to winding can be parallel consistent with the composition surface of thermal head; In addition, TaiWan, China patent publication No. 200410822: then be to utilize following workbench to do the adjustment of levelness, make that workbench is parallel with last processing plane down with sphere air-bearing; In addition, in hot-press arrangement, mention the levelness adjusting gear, on nanometer transfer printing board, please refer to TaiWan, China patent announcement number 00570290, on carrier, utilize the elastic membrane that is sealed with fluid to carry out the adjustment of the depth of parallelism.
When traditional LCD press fit device is applied to large size panel, become big because object plane to be laminated is long-pending, but the zone of actual pressing is relatively very little, and without any utilizing cushion, automatically adjust the mechanism of levelness simultaneously for two pressure heads up and down, so in the process of pressing, if do not adjust the levelness of thing to be laminated and board, perhaps because thing to be laminated itself has presented slight warpage, when doing pressing action, glass substrate is because of being subjected to the relation of inhomogeneous power effect, to cause frangible thing to be laminated, for example: glass-based version pressurized is uneven and cracked, or thing to be laminated can't reach the excellent electrical property connection mutually, and the shortcoming that causes yields to descend.
Though aforesaid conventional art is to mention various evolutionary approach, but all only limit to the adjustment of single face platform, and the non-pressing that directly is applied in field of liquid crystal, because panel size is increasing, for example the machine board size of six generations factory's production is 1500 * 1850mm, the machine board size of seven five generations factory's production is more up to being 1950 * 2250mm, therefore when pressing, the region area of actual pressing is distal to the size of thing to be laminated for a short time, therefore, traditional evolutionary approach, and can't solve the problem that aforementioned large size panel is run into fully when pressing.
In view of this, the present invention proposes a kind of press fit device, can be in the process of actual pressing, allow institute's applied pressure, well-proportioned acting on the assembly to be laminated, and utilize the effect of heating and cooling package, thing to be laminated can be engaged mutually closely, form complete electric connection.
Summary of the invention
One of purpose of the present invention is for providing a kind of adjustable pressing device, its utilization can freely absorb and adjust stressed cushion or fluid, make in the process of pressing, effect by cushion and/or fluid, allow first pressure head, second pressure head and thing to be laminated can keep the parallel of parallel or little angle, come driving fit thing to be laminated; And, by heater and separately or merge and use cooling component, utilize the fluid between chamber and pressure head or the conduction of cushion, control the temperature of pressure head, can engage closely mutually in order to thing to be laminated, to reach complete electric connection purpose.
For above and other objects of the present invention, feature and advantage can be become apparent, cited below particularlyly go out preferred embodiment, and conjunction with figs., be described in detail below:
Description of drawings
Fig. 1 a-Fig. 1 b is the adjustable pressing device schematic side view of first embodiment of the invention.
Fig. 2 a-Fig. 2 b is the adjustable pressing device schematic side view of second embodiment of the invention.
Fig. 3 a-Fig. 3 b is the adjustable pressing device schematic side view of third embodiment of the invention.
The primary clustering symbol description
500～the first chambers;
510～the first pressure heads;
510a～first pressure head the face;
520～first fluid;
530～fluid;
525～the first cushions;
600～the second chambers;
610～the second pressure heads;
610a～second pressure head the face;
620～the second fluids;
625～the second cushions;
635～cushion;
700～control device;
800～thing to be laminated;
1000～adjustable pressing device.
Embodiment
First embodiment
Fig. 1 a-Fig. 1 b is the first embodiment of the present invention, is a kind of adjustable pressing device 1000, comprising: first chamber 500 and second chamber, 600, two chambers are the relative position configuration; Simultaneously, within first chamber 500 and second chamber 600, be respectively arranged with first pressure head 510 and second pressure head 610, and, first pressure head 510 also is the position configuration with respect to second pressure head 610, carry out the action of pressing in order to 510 pairs of things 800 to be laminated of first pressure head, wherein, thing 800 to be laminated can be at least a above assembly (as the IC assembly, optical module, display assembly etc.), material is (as plastics, glass, pottery, semiconductor etc.), substrate, for example: printed circuit board (PCB), drive circuit board, flexible circuit board or anisotropic conductive film etc., or above-mentioned bond.
In addition, between first chamber 500 and first pressure head 510, first fluid 520 is arranged; And utilize first seal assembly 540, seal first fluid 520 in first chamber 500; In like manner, second fluid 620 be arranged between second chamber 600 and second pressure head 610, and second seal assembly 640 is arranged between second chamber 600 and second pressure head 610, is used to seal second fluid 620.
Please refer to Fig. 1 b, first pressure head 520 and second pressure head 620 are adjusted the levelness of first pressure head 510 and second pressure head 610 respectively by the buffer action of the first fluid 520 and second fluid 620 when pressing.
Specifically, the adjustable pressing device 1000 of present embodiment, its first chamber 500 and second chamber 600 can be by the thermal conductivity preferable material, for example material such as the higher metal species of heat-conduction coefficient, ceramic-like; And the first fluid 520 and second fluid 620 can be selected from gas, liquid or its combination, and first fluid and this second fluid can be the combination of at least a above fluid, and first fluid and this second fluid can be different fluids; Acting as of fluid, please also refer to Fig. 1 a and Fig. 1 b: when first pressure head 510 descend and second pressure head 610 rise compress thing 800 to be laminated before, if thing 800 to be laminated itself just has slight warpage, make the angle θ that presents inclination between thing 800 to be laminated and the surface level, at this moment, first pressure head 510 and second pressure head 610 just can utilize the buffer action of the first fluid 520 and second fluid 620 respectively, and the levelness of integral body is finely tuned, compress thing 800 to be laminated with the mould merging, and the effect of the first fluid 520 and second fluid 620 will be reached pressure head exactly because of regulating the purpose of the needed cushion space of levelness.
According to the press fit device of adjusting of the present invention, please refer to Fig. 1 b, thing 800 to be laminated, because of itself just has slight warpage, cause and surface level between present the angle θ of inclination, in the pressing process, first pressure head 510 and second pressure head 610 all can cooperate thing 800 to be laminated, allow the first pressure head face 510a and the second pressure head face 610a do the action of developing thing 800 to be laminated, also present the angle of inclination, allow the application of force can be on average on thing 800 to be laminated.That is to say, first pressure head 510 and second pressure head 610 are parallel to each other in thing 800 to be laminated, but and surface level has an angle that tilts, thus, when pressing large-size glass substrate, just be difficult for slight warpage, and in the process of pressing because of glass substrate itself, because of unbalance stress cracked.
In addition, the adjustable pressing device 1000 of present embodiment also comprises temperature control member 700, be disposed on first chamber 500 and second chamber 600, and this temperature control member 700 can be heater, hot soup spoon for example, thermopair or cooling component, for example cold soupspoon, be used for controlling the temperature of first chamber 500 and second chamber 600, make chamber can maintain default temperature, and, first chamber 500 and second chamber 600 are by heating or cooling component heating and cooling, conduction through the first fluid 520 and second fluid 620, this first pressure head 510 and this second pressure head 610 are heated or cool off, thus, assembly to be laminated is glass substrate and anisotropic conductive film (ACF) for example, be subjected to the intensification of second pressure head 610 in anisotropic conductive film, the glue material is heated and melts, when thing 800 to be laminated in 610 times step-downs of second pressure head, make the pressure head face 510a that wins, the thing 800 to be laminated and the second pressure head face 610a are in pressurized process, combination closely, form the crimping mode of heat pressing type, allow thing 800 to be laminated, for example anisotropic conductive film and glass-based version, combination closely mutually is to reach the purpose of electric connection.
Second embodiment
The second embodiment of the present invention and first embodiment are similar, and just both main differences are: the material and the mode difference that are used for cushioning pressure head.Shown in Fig. 2 a-Fig. 2 b, this embodiment makes the fluid 520,620 between chamber 500,600 and pressure head 510,610 into cushion 525,625.Wherein, first pressure head 510 and second pressure head 610 are respectively by the metamorphosis of this first cushion 525 and this second cushion 625, the levelness of adjusting this first pressure head 510 and second pressure head 610 when pressing is with driving fit thing 800 to be laminated, and when separating first pressure head 510 and second pressure head 610, first cushion 525 and 625 reinstatements of second cushion.
In addition, though on first chamber 500 shown in Fig. 2 a-Fig. 2 b and second chamber 600, all dispose temperature control equipment 700, the insider should understand, and temperature control equipment 700 also can be disposed at first chamber 500 and second chamber 600 separately.
The 3rd embodiment
The present embodiment and first embodiment and second embodiment are similar, please refer to Fig. 3 a-Fig. 3 b, and just three's difference is: the material that the 3rd embodiment is used to cushion first pressure head 510 and second pressure head 610 is respectively fluid 530 and cushion 635.In brief, its mode of action adopts the fluid behaviour among first embodiment respectively, and the tool flexible materials characteristic material of second embodiment, cushions first pressure head 510 and second pressure head 610.When pressing thing 800 to be laminated of different nature,, come as adjustment because of the tight demand difference of pressing degree and heating or cooling.
Though the present invention with several preferred embodiments openly as above; right its is not in order to qualification the present invention, any insider, without departing from the spirit and scope of the present invention; when can changing arbitrarily and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (23)
1. adjustable pressing device comprises:
One first chamber;
One first pressure head is arranged in this first chamber;
One first fluid is arranged between this first chamber and this first pressure head;
One first seal assembly is used to seal this first fluid in this first chamber;
One second chamber, with respect to this first chamber location configuration,
One second pressure head is arranged in this second chamber, and is configured to and this first pressure head carries out pressing to a thing to be laminated with respect to this second ram position;
One second fluid is arranged between this second chamber and this second pressure head;
One second seal assembly is arranged between this second chamber and this second pressure head, is used to seal this second fluid;
Wherein, this first pressure head and this second pressure head are adjusted the levelness of this first pressure head and this second pressure head respectively by the buffer action of this first fluid layer and this second fluid when pressing.
2. adjustable pressing device according to claim 1 is characterized in that, this first chamber and this second chamber are equiped with a heater, in order to this first pressure head and this second pressure head are heated.
3. adjustable pressing device according to claim 1 is characterized in that, this first chamber and this second chamber are equiped with a cooling component, in order to this first pressure head and this second pressure head are cooled off.
4. adjustable pressing device according to claim 1 is characterized in that, this first fluid and this second fluid are selected from gas, liquid or its combination.
5. adjustable pressing device according to claim 1 is characterized in that, the combination that this first fluid and this second fluid are at least a above fluid.
6. adjustable pressing device according to claim 1 is characterized in that, this first fluid and this second fluid are different fluids.
7. adjustable pressing device according to claim 2 is characterized in that, this first chamber and this second chamber heat up by this heater, via the conduction of this first fluid and this second fluid, this first pressure head and this second pressure head is heated.
8. adjustable pressing device according to claim 3 is characterized in that, this first chamber and this second chamber, cool off this first pressure head and this second pressure head via the conduction of this first fluid and this second fluid by this cooling component cooling.
9. adjustable pressing device comprises:
One first chamber;
One first pressure head is arranged in this first chamber;
One first cushion is arranged between this first chamber and this first pressure head;
One first seal assembly is arranged between this first chamber and this first pressure head, is used to seal this first cushion;
One second chamber is with respect to this first chamber location configuration;
One second pressure head is arranged in this second chamber, and is configured to and this first pressure head carries out pressing to a thing to be laminated with respect to this second ram position;
One second cushion is arranged between this second chamber and this second pressure head;
One second seal assembly is arranged between this second chamber and this second pressure head, is used to seal this second cushion;
Wherein, this first pressure head and this second pressure head are respectively by the metamorphosis of this first cushion and this second cushion, the levelness of adjusting this first pressure head and this second pressure head when pressing is with driving fit thing to be laminated, and when separating this first pressure head and this second pressure head, this first cushion and this second cushion reinstatement.
10. adjustable pressing device according to claim 9 is characterized in that, this first chamber and this second chamber are equiped with a heater, in order to this first pressure head and this second pressure head are heated.
11. adjustable pressing device according to claim 9 is characterized in that, this first chamber and this second chamber are equiped with a cooling component, in order to this first pressure head and this second pressure head are cooled off.
12. adjustable pressing device according to claim 9 is characterized in that, the combination that this first cushion and this second cushion are at least a above material.
13. adjustable pressing device according to claim 9 is characterized in that, this first cushion and this second cushion are different materials.
14. adjustable pressing device according to claim 10, it is characterized in that, this first chamber and this second chamber heat up by this heater, via the conduction of this first cushion and this second cushion, this first pressure head and this second pressure head are heated.
15. adjustable pressing device according to claim 11, it is characterized in that, this first chamber and this second chamber, cool off this first pressure head and this second pressure head via the conduction of this first cushion and this second cushion by this cooling component cooling.
16. an adjustable pressing device comprises:
One first chamber;
One first pressure head is arranged in this first chamber;
One fluid is arranged between this first chamber and this first pressure head;
One first seal assembly is used to seal this first cushion in this first chamber;
One second chamber, with respect to this first chamber location configuration,
One second pressure head is arranged in this second chamber, and is configured to and this first pressure head carries out pressing to a thing to be laminated with respect to this second ram position;
One cushion is arranged between this second chamber and this second pressure head;
One second seal assembly is arranged between this second chamber and this second pressure head, is used to seal this second cushion;
Wherein, this first pressure head and this second pressure head are respectively by the buffer action of this first fluid layer metamorphosis and this second cushion, the levelness of adjusting this first pressure head and this second pressure head when pressing is with this thing to be laminated of driving fit, and when separating this first pressure head and this second pressure head, this second cushion reinstatement.
17. adjustable pressing device according to claim 16 is characterized in that, this first chamber and this second chamber are equiped with a heater, in order to this first pressure head and this second pressure head are heated.
18. adjustable pressing device according to claim 16 is characterized in that, this first chamber and this second chamber are equiped with a cooling component, in order to this first pressure head and this second pressure head are cooled off.
19. adjustable pressing device according to claim 16 is characterized in that, this first fluid is selected from gas, liquid or its combination.
20. adjustable pressing device according to claim 16 is characterized in that, this fluid is at least a above combination of fluids.
21. adjustable pressing device according to claim 16 is characterized in that, this cushion is the combination of at least a above material.
22. adjustable pressing device according to claim 17 is characterized in that, this first chamber and this second chamber heat up by this heater, via the conduction of this fluid and this cushion, this first pressure head and this second pressure head are heated.
23. adjustable pressing device according to claim 18 is characterized in that, this first chamber and this second chamber, cool off this first pressure head and this second pressure head via the conduction of this fluid and this cushion by this cooling component cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610073265XA CN100388073C (en) | 2006-04-06 | 2006-04-06 | Adjustable pressing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610073265XA CN100388073C (en) | 2006-04-06 | 2006-04-06 | Adjustable pressing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1866090A true CN1866090A (en) | 2006-11-22 |
| CN100388073C CN100388073C (en) | 2008-05-14 |
Family
ID=37425152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610073265XA Expired - Fee Related CN100388073C (en) | 2006-04-06 | 2006-04-06 | Adjustable pressing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100388073C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306633A (en) * | 2011-09-06 | 2012-01-04 | 友达光电（苏州）有限公司 | Heat sensitive buffer material |
| CN104185414A (en) * | 2014-08-15 | 2014-12-03 | 无锡宇宁光电科技有限公司 | Bonding machine pressing head capable of improving hot-press yield |
| CN110441931A (en) * | 2019-06-27 | 2019-11-12 | 盐城华旭光电技术有限公司 | Press the device that the components such as IC and optical filter are controlled in LCM liquid crystal module |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3585457B2 (en) * | 2001-07-04 | 2004-11-04 | 株式会社飯沼ゲージ製作所 | Apparatus for bonding substrates to form a liquid crystal display element and method for bonding substrates |
| JP2003302912A (en) * | 2002-04-10 | 2003-10-24 | Shin-Etsu Engineering Co Ltd | System for bonding substrate for flat panel |
| TWI246457B (en) * | 2002-12-24 | 2006-01-01 | Ind Tech Res Inst | Hot embossing auto-leveling apparatus and method |
| CN1273853C (en) * | 2003-03-21 | 2006-09-06 | 碧悠电子工业股份有限公司 | Panel stacking device and method for stacking liquid crystal display panels |
-
2006
- 2006-04-06 CN CNB200610073265XA patent/CN100388073C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306633A (en) * | 2011-09-06 | 2012-01-04 | 友达光电（苏州）有限公司 | Heat sensitive buffer material |
| CN102306633B (en) * | 2011-09-06 | 2014-07-09 | 友达光电（苏州）有限公司 | Heat sensitive buffer material |
| CN104185414A (en) * | 2014-08-15 | 2014-12-03 | 无锡宇宁光电科技有限公司 | Bonding machine pressing head capable of improving hot-press yield |
| CN110441931A (en) * | 2019-06-27 | 2019-11-12 | 盐城华旭光电技术有限公司 | Press the device that the components such as IC and optical filter are controlled in LCM liquid crystal module |
| CN110441931B (en) * | 2019-06-27 | 2023-03-28 | 汕尾市恒炜烨科技有限公司 | Device for controlling IC and optical filter component in press fit LCM liquid crystal module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100388073C (en) | 2008-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1881360A2 (en) | Display device | |
| KR102075486B1 (en) | Cooler for adhesive layer of display device and method for separating panel from display device using the same | |
| CN103454799B (en) | Vacuum is to box device and to cassette method and production equipment | |
| US11073730B2 (en) | Display device | |
| KR20090033255A (en) | Wafer bonding apparatus | |
| CN1629917A (en) | Drive chip and display device with the same | |
| WO2012001864A1 (en) | Process for production of display device | |
| CN1866090A (en) | Adjustable pressing device | |
| US5106451A (en) | Heat sink and method of attachment | |
| CN1792641A (en) | Thermal transfer press machine and thermal transfer press method | |
| JP2021086915A (en) | Placement table and inspection device | |
| CN1694590A (en) | Biscreen display device and making method thereof | |
| WO2011111420A1 (en) | Liquid crystal display device, and method for producing same | |
| WO2016015032A1 (en) | Flexible circuit board with graphite substrate and circuit arrangements using same | |
| TWI274391B (en) | Self-adaptive adjustment device and chip/wafer bonding apparatus utilizing the same | |
| KR101805916B1 (en) | Liquid crystal module | |
| KR101078252B1 (en) | Thermal conductive and release sheet used in bonding anisotropic conductive film | |
| US20110157514A1 (en) | Photoflash | |
| TWI409124B (en) | Thermocompression bonding device | |
| KR102282067B1 (en) | Attaching sheet and manufacturing method therefor | |
| TWI304766B (en) | Adjustable press bonding apparatus | |
| KR101998330B1 (en) | Liquid crystal display device | |
| CN111987013A (en) | Flexible circuit film bonding apparatus and method of bonding flexible circuit film using the same | |
| TW491955B (en) | Liquid crystal panel production apparatus | |
| US9081124B2 (en) | Backlight module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080514 Termination date: 20210406 |