CN110441931A - Press the device that the components such as IC and optical filter are controlled in LCM liquid crystal module - Google Patents

Press the device that the components such as IC and optical filter are controlled in LCM liquid crystal module Download PDF

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Publication number
CN110441931A
CN110441931A CN201910573262.XA CN201910573262A CN110441931A CN 110441931 A CN110441931 A CN 110441931A CN 201910573262 A CN201910573262 A CN 201910573262A CN 110441931 A CN110441931 A CN 110441931A
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CN
China
Prior art keywords
pressing
liquid crystal
crystal module
fixedly installed
lcm liquid
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Granted
Application number
CN201910573262.XA
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Chinese (zh)
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CN110441931B (en
Inventor
郝建华
李会斌
李子考
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Shanwei Hengweiye Technology Co ltd
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Yancheng Hua Xu Photoelectric Technology Co Ltd
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Priority to CN201910573262.XA priority Critical patent/CN110441931B/en
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Publication of CN110441931B publication Critical patent/CN110441931B/en
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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

Abstract

The invention discloses the devices that the components such as IC and optical filter are controlled in pressing LCM liquid crystal module, including pressing table, delivery chute, pressing base, press cylinder and pressing rubber slab, delivery chute is offered above the pressing table, pressing base is installed inside the delivery chute, described pressing cylinder one end is fixedly installed with pressing rubber slab, the present invention is scientific and reasonable, it is safe and convenient to use, when being pressed to LCM liquid crystal module, Buffer Unit is squeezed using telescopic block, so that telescopic block is in telescopic chute internal slide, the dynamics of pressing cylinder pressing can be buffered, simultaneously, the dynamics of pressing cylinder pressing can also be buffered using pressing rubber slab, it can effectively avoid the pressing dynamics of pressing cylinder are excessive LCM liquid crystal module is caused to be damaged, simultaneously, using fixed convex button and fixed soft rubber to pressing Installation is fixed in rubber slab, when pressing rubber slab serious wear, convenient for carrying out demolition and replacement to pressing rubber slab.

Description

Press the device that the components such as IC and optical filter are controlled in LCM liquid crystal module
Technical field
The present invention relates to technical fields, and the device of the components such as IC and optical filter is specifically controlled in pressing LCM liquid crystal module.
Background technique
Liquid crystal module is simply exactly to shield+back light unit.The display unit of LCD TV is exactly liquid crystal module, ground Position is equivalent to the kinescope in CRT.Other parts include power circuit, signal processing circuit etc., and mould group is broadly divided into screen and back Light lamp group part.Two parts are assembled together, but are independent from each other when work.
The principle of liquid crystal display is that back light unit issues uniform face light, and light passes to our eyes by liquid crystal display In.The effect of screen is exactly to handle by pixel these light, to show image.
Liquid crystal module needs to press the control components such as IC and optical filter, in pressing, there are following in production Problem: when pressing liquid crystal module, needing to heat up to components such as the control IC that will be pressed and optical filters, So that it is more quick in pressing, but heating can generate some pernicious gases, if handling it not in time, Air environment can be polluted, also, if cooling down to liquid crystal module not in time, will lead to liquid crystal mould after pressing The group long time treatment condition of high temperature, will affect the normal use of liquid crystal module, so, people are badly in need of a kind of pressing LCM liquid crystal mould The device of the components such as IC and optical filter is controlled in group to solve the above problems.
Summary of the invention
The purpose of the present invention is to provide the devices that the components such as IC and optical filter are controlled in pressing LCM liquid crystal module, with solution Certainly propose in the prior art the problem of.
To achieve the above object, the invention provides the following technical scheme: controlling IC and optical filter in pressing LCM liquid crystal module The device of equal components, the device include pressing table, support post, manipulation case, pressing cylinder, force fit plate and pressing base;
Delivery chute is offered above the pressing table, the delivery chute internal slide is equipped with pressing base, described defeated Sending sliding slot is inverted " t " type, and pressing base is avoided to occur break-off in delivery chute internal slide, the delivery chute be through It opens up, guarantees that pressing base can take out inside delivery chute, convenient for carrying out demolition and replacement to pressing base, the pressing base is used It being carried in the LCM liquid crystal module that will be pressed, the pressing table side backside face is fixedly installed with support post, By being welded to connect between the pressing table and support post, the support post top is fixedly installed with manipulation case, the behaviour It controls and is connected between case and support post by fixed screw, so that convenient for manipulation case is dismantled and overhauled, the manipulation case Inside is equipped with control circuit board, controls for the normal use to whole device, the fixed peace of the manipulation case front end face Equipped with control switch, the control switch is electrically connected with the power supply, and the manipulation case lower end is fixedly installed with pressing cylinder, described Pressing cylinder presses LCM liquid crystal module, the pressing cylinder is connect with relief valve, for pressure for generating pressure The pressing pressure for closing cylinder carries out decompression operation, avoids pressing pressure excessive and damages to LCM liquid crystal module, the pressing gas Cylinder one end is fixedly installed with force fit plate, so that each uniform force of LCM liquid crystal module;
One middle side part of pressing base offers locating slot, is interspersed with locating rod inside the locating slot, for pressing The mobile position of seat is positioned, so that pressing base can be made to be exactly in when needing to press LCM liquid crystal module Immediately below force fit plate, so that being not in the deviation on position, the support post bottom end is used for through exhausting component is equipped with The peculiar smell generated when pressing to LCM liquid crystal module detaches, and avoids polluting air, and described pressing table one end is solid Dingan County avoids LCM liquid crystal module from being pressed equipped with cooling component for cooling down to the LCM liquid crystal module after pressing When heating for a long time cause LCM mould group to be in the condition of high temperature, the service life of LCM liquid crystal module is impacted.
As optimal technical scheme, each edge in force fit plate upper surface is fixedly installed with fixed convex button, the force fit plate Lower surface is fitted with pressing rubber slab, when so that pressing to LCM liquid crystal module, can play certain buffer function, keep away Exempt from pressing pressure it is excessive cause LCM liquid crystal module damage, each edge of the pressing rubber slab corresponds to fixes at fixed convex button position Fixed soft rubber is installed, described fixed soft rubber one end offers fixation hole, and the pressing rubber slab is with fixed soft rubber Integrated formed structure, the fixed soft rubber are socketed on the outside of fixed convex button, so that pressing rubber slab is easily installed and dismantles, just It is replaced in pressing rubber slab.
As optimal technical scheme, pressing base bottom end two sides, which are internally embedded, is equipped with several balls, for reducing Frictional force between pressing base and delivery chute so that pressing base in delivery chute internal slide more smoothly, the pressure It closes and offers telescopic chute inside seat, several Buffer Units are installed inside the telescopic chute, the Buffer Unit is used for LCM Pressure in liquid crystal module bonding processes is buffered, and is fixedly installed with telescopic block, the telescopic block above the Buffer Unit Upper center is fixedly installed with limit heating ring, for being heated to the LCM liquid crystal module edge that will be pressed, so that LCM liquid crystal module is easier to carry out pressing, and is connected between the limit heating ring and telescopic block by fixed screw, the control The output end of switch is electrically connected the input terminal of limit heating ring.
As optimal technical scheme, the length and width of the telescopic chute is equal to the length and width of telescopic block, avoids Occurs shaking phenomenon when telescopic block moves inside telescopic chute.
As optimal technical scheme, the Buffer Unit includes buffering sleeve, buffer spring and buffering loop bar;
It is connected between the buffering sleeve and telescopic chute bottom end by fixed screw, the buffering sleeve inner vertical installation There is buffer spring, the buffering sleeve is internally located at buffer spring top and is slidably fitted with buffering loop bar, buffering sleeve and buffering Loop bar is mutually slidably connected, so that the pressing pressure to pressing base buffers, avoids pressing pressure excessive to LCM liquid crystal mould Group damages.
As optimal technical scheme, the exhausting component include exhaust column, extraction fan, filter cartridge, active carbon filter plate and Dismantle handle;
The exhaust column is installed through support post bottom end, and one end, which is internally embedded, inside the exhaust column is equipped with exhausting Fan, the extraction fan allow to useless by what is generated in LCM liquid crystal module bonding processes for generating negative pressure inside exhaust column Gas is adsorbed, and exhaust gas diffusion is avoided to pollute air, and the output end of the control switch is electrically connected the defeated of extraction fan Enter end, the exhaust column other end is equipped with filter cartridge, active carbon filter plate is equipped with inside the filter cartridge, for taking away Exhaust gas be filtered processing, avoid exhaust gas from directly discharging the pollution caused by atmospheric environment, active carbon filter plate top End middle part is fixedly installed with disassembly handle, so that convenient for carrying out demolition and replacement to active carbon filter plate.
As optimal technical scheme, insertion is equipped with sealing rubber ring between the filter cartridge and active carbon filter plate, keeps away Exempt from the leakage for gas occur.
As optimal technical scheme, the cooling component includes the first cooling frame, the second cooling frame, cryogenic chamber, partly leads Body cooling piece, cooling holes, buckle, card slot and screw hole mounting plate;
Described pressing table one end side is fixedly installed with the first cooling frame, the pressure by screw hole mounting plate and hex(agonal)screw The one end He Tai other side is fixedly installed with the second cooling frame by screw hole mounting plate and hex(agonal)screw, so that the first cooling frame and the Two cooling framves are easily installed, and offer cryogenic chamber, the cryogenic chamber inside the first cooling frame and the second cooling frame Inside is equipped with semiconductor chilling plate, for generating Cryogenic air, cools down to the LCM liquid crystal module after pressing, described The output end of control switch is electrically connected the input terminal of semiconductor chilling plate, opens on the inside of the first cooling frame and the second cooling frame Equipped with several cooling holes, for the Cryogenic air inside cryogenic chamber to be conducted to the LCM liquid crystal module surface to pressing, Cool down to LCM liquid crystal module, second cooling frame one end two sides are mounted on buckle, first cooling frame one end two Side offers card slot, is fixedly connected between the first cooling frame and the second cooling frame by buckle and card slot, so that being convenient for First cooling frame and the second cooling frame are dismantled, allow to carry out more the semiconductor chilling plate inside cryogenic chamber It changes.
Compared with prior art, the beneficial effects of the present invention are:
1, when pressing to LCM liquid crystal module, Buffer Unit is squeezed using telescopic block, so that telescopic block is in telescopic chute When internal slide, the dynamics of pressing cylinder pressing can be buffered, meanwhile, it can also be to pressing gas using pressing rubber slab The dynamics of cylinder pressing is buffered, and can effectively avoid the pressing dynamics of pressing cylinder are excessive LCM liquid crystal module is caused to be damaged, Meanwhile installation is fixed to pressing rubber slab using fixed convex button and fixed soft rubber, when pressing rubber slab serious wear, Convenient for carrying out demolition and replacement to pressing rubber slab, also, utilize ball, can effectively reduce pressing base and delivery chute it Between frictional force, using the positioning of locating slot and locating rod, can effectively be kept away so that the movement of pressing base is more smoothly Exempt from inconsistent phenomenon occur when pressing to LCM liquid crystal module, pressing is caused to fail.
2, it is provided with exhausting component, forms negative pressure in pressing base side using extraction fan and exhaust column, it can be by LCM liquid crystal The exhaust gas generated in mould group heating bonding processes is absorbed, and avoids the harmful gases diffusion generated in heating process to air In, meanwhile, using the active carbon filter plate inside filter cartridge, the pernicious gas of sucking can be adsorbed, avoid directly arranging The pollution caused by atmospheric environment is put, using disassembly handle, active carbon filter plate can be dismantled, so that convenient for activity Charcoal filter plate is replaced.
3, it is provided with cooling component, generates Cryogenic air inside cryogenic chamber using semiconductor chilling plate, and pass through drop Warm hole distributes, and can carry out cooling operation to the LCM liquid crystal module after pressing, avoid the warming temperature in bonding processes The excessively high service life to LCM liquid crystal module impacts, meanwhile, using screw hole mounting plate, buckle and card slot, convenient for first Cooling frame and the second cooling frame are dismantled, convenient for being overhauled and being replaced to semiconductor chilling plate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that the device of the components such as IC and optical filter is controlled in present invention pressing LCM liquid crystal module;
Fig. 2 is the peace that the device pressing rubber slab of the components such as IC and optical filter is controlled in present invention pressing LCM liquid crystal module Assembling structure schematic diagram;
Fig. 3 is the installation that the device Buffer Unit of the components such as IC and optical filter is controlled in present invention pressing LCM liquid crystal module Structural schematic diagram;
Fig. 4 is the structure that the device Buffer Unit of the components such as IC and optical filter is controlled in present invention pressing LCM liquid crystal module Schematic diagram;
Fig. 5 is the structure that the device exhausting component of the components such as IC and optical filter is controlled in present invention pressing LCM liquid crystal module Schematic diagram;
Fig. 6 is the structure that the device cooling component of the components such as IC and optical filter is controlled in present invention pressing LCM liquid crystal module Schematic diagram.
Figure label: 1, pressing table;2, delivery chute;3, support post;4, case is manipulated;5, control switch;6, gas is pressed Cylinder;7, force fit plate;8, fixed convex button;9, rubber slab is pressed;10, fixed soft rubber;11, pressing base;12, ball;13, it stretches Slot;
14, Buffer Unit;1401, sleeve is buffered;1402, buffer spring;1403, loop bar is buffered;
15, telescopic block;16, limit heating ring;17, locating slot;18, locating rod;
19, exhausting component;1901, exhaust column;1902, extraction fan;1903, filter cartridge;1904, active carbon filter plate; 1905, handle is dismantled;
20, cool down component;2001, the first cooling frame;2002, the second cooling frame;2003, cryogenic chamber;2004, semiconductor Cooling piece;2005, cooling holes;2006, it buckles;2007, card slot;2008, screw hole mounting plate.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Embodiment: as shown in Figure 1, controlling the device of the components such as IC and optical filter, the device packet in pressing LCM liquid crystal module Include pressing table 1, support post 3, manipulation case 4, pressing cylinder 6, force fit plate 7 and pressing base 11;
Delivery chute 2 is offered above pressing table 1,2 internal slide of delivery chute is equipped with pressing base 11, delivery chute 2 For inverted " t " type, pressing base 11 is avoided to occur break-off in 2 internal slide of delivery chute, delivery chute 2 be through opening up, Guarantee that pressing base 11 can take out inside delivery chute 2, convenient for carrying out demolition and replacement to pressing base 11, pressing base 11 is used for The LCM liquid crystal module that will be pressed is carried, 1 side backside face of pressing table is fixedly installed with support post 3, pressing By being welded to connect between platform 1 and support post 3,3 top of support post is fixedly installed with manipulation case 4, and manipulation case 4 and support are vertical It is connected between column 3 by fixed screw, so that manipulating convenient for manipulation case 4 is dismantled and overhauled and being equipped with control inside case 4 Circuit board is controlled for the normal use to whole device, and manipulation 4 front end face of case is fixedly installed with control switch 5, is controlled Switch 5 is electrically connected with the power supply, and manipulation 4 lower end of case is fixedly installed with pressing cylinder 6, and pressing cylinder 6 is right for generating pressure LCM liquid crystal module is pressed, and pressing cylinder 6 is connect with relief valve, carries out decompression behaviour for the pressing pressure to pressing cylinder 6 To make, avoids pressing pressure excessive and LCM liquid crystal module is damaged, pressing 6 one end of cylinder is fixedly installed with force fit plate 7, so that Each uniform force of LCM liquid crystal module;
11 1 middle side part of pressing base offers locating slot 17, and locating rod 18 is interspersed with inside locating slot 17, for pressing The mobile position of seat 11 is positioned, so that can make pressing base 11 just when needing to press LCM liquid crystal module Immediately below force fit plate 7, so that being not in the deviation on position, 3 bottom end of support post, which is run through, is equipped with exhausting component 19, The peculiar smell generated when for pressing to LCM liquid crystal module detaches, and avoids polluting air, 1 one end of pressing table It is fixedly installed with cooling component 20, for cooling down to the LCM liquid crystal module after pressing, LCM liquid crystal module is avoided to carry out Heating when pressing causes LCM mould group to be in the condition of high temperature for a long time, impacts to the service life of LCM liquid crystal module.
As shown in Fig. 2, each edge in 7 upper surface of force fit plate is fixedly installed with fixed convex button 8,7 lower surface of force fit plate is fitted with Rubber slab 9 is pressed, when so that pressing to LCM liquid crystal module, certain buffer function can be played, avoid pressing pressure mistake LCM liquid crystal module is caused to be damaged greatly, the pressing each edge of rubber slab 9, which corresponds to, is fixedly installed with fixed soft rubber at 8 position of fixed convex button Glue 10, fixed 10 one end of soft rubber offer fixation hole, and pressing rubber slab 9 is an integral molding structure with fixed soft rubber 10, Gu Determine soft rubber 10 and be socketed in 8 outside of fixed convex button, so that pressing rubber slab 9 is easily installed and dismantles, convenient for pressing rubber slab 9 It is replaced.
As shown in figure 3,11 bottom end two sides of pressing base are internally embedded and are equipped with several balls 12, for reducing pressing base 11 With the frictional force between delivery chute 2 so that pressing base 11 in 2 internal slide of delivery chute more smoothly, pressing base 11 Inside offers telescopic chute 13, several Buffer Units 14 are equipped with inside telescopic chute 13, and Buffer Unit 14 is used for LCM liquid crystal Pressure in mould group bonding processes is buffered, and telescopic block 15, the length of telescopic chute 13 are fixedly installed with above Buffer Unit 14 It is equal to the length and width of telescopic block 15 with width, occurs shaking when telescopic block 15 being avoided to move inside telescopic chute 13 existing As, 15 upper center of telescopic block is fixedly installed with limit heating ring 16, the model XYZ-1001 of limit heating ring 16, for pair The LCM liquid crystal module edge that will be pressed is heated, so that LCM liquid crystal module is easier to carry out pressing, limit heating It is connected between ring 16 and telescopic block 15 by fixed screw, the output end of control switch 5 is electrically connected the defeated of limit heating ring 16 Enter end.
As shown in figure 4, Buffer Unit 14 includes buffering sleeve 1401, buffer spring 1402 and buffering loop bar 1403;
It buffers and is connected between sleeve 1401 and 13 bottom end of telescopic chute by fixed screw, buffering 1401 inner vertical of sleeve peace Equipped with buffer spring 1402, buffering sleeve 1401 is internally located at 1402 top of buffer spring and is slidably fitted with buffering loop bar 1403, Buffering sleeve 1401 is mutually slidably connected with buffering loop bar 1403, so that buffering to the pressing pressure of pressing base 11, keeps away Exempt from that pressing pressure is excessive to damage LCM liquid crystal module.
As shown in figure 5, exhausting component 19 includes exhaust column 1901, extraction fan 1902, filter cartridge 1903, active carbon filter plate 1904 and disassembly handle 1905;
Exhaust column 1901 is installed through 3 bottom end of support post, and 1901 inside one end of exhaust column, which is internally embedded, is equipped with exhausting Fan 1902, the model SJ9225HA2 of extraction fan 1902, extraction fan 1902 make for generating negative pressure inside exhaust column 1901 The exhaust gas generated in LCM liquid crystal module bonding processes can be adsorbed by obtaining, and exhaust gas diffusion is avoided to pollute air, be controlled The output end for making switch 5 is electrically connected the input terminal of extraction fan 1902, and 1901 other end of exhaust column is equipped with filter cartridge 1903, mistake Active carbon filter plate 1904 is installed inside filter box 1903, for being filtered processing to the exhaust gas taken away, avoids exhaust gas direct Discharge polluted caused by atmospheric environment, between filter cartridge 1903 and active carbon filter plate 1904 insertion seal rubber is installed Circle avoids the occurrence of the leakage of gas, and 1904 top middle portion of active carbon filter plate is fixedly installed with disassembly handle 1905, so that being convenient for It carry out demolition and replacement to active carbon filter plate 1904.
As shown in fig. 6, cooling component 20 includes the first cooling cooling of frame 2001, second frame 2002, cryogenic chamber 2003, half Conductor cooling piece 2004, cooling holes 2005, buckle 2006, card slot 2007 and screw hole mounting plate 2008;
1 one end side of pressing table is fixedly installed with the first cooling frame 2001 by screw hole mounting plate 2008 and hex(agonal)screw, 1 one end other side of pressing table is fixedly installed with the second cooling frame 2002 by screw hole mounting plate 2008 and hex(agonal)screw, so that the One cooling frame 2001 and the second cooling frame 2002 are easily installed, and are opened up inside the first cooling frame 2001 and the second cooling frame 2002 There is cryogenic chamber 2003, semiconductor chilling plate 2004, the model of semiconductor chilling plate 2004 are installed inside cryogenic chamber 2003 Cool down for generating Cryogenic air to the LCM liquid crystal module after pressing for HT064200, the output end of control switch 5 It is electrically connected the input terminal of semiconductor chilling plate 2004, is offered on the inside of the first cooling frame 2001 and the second cooling frame 2002 several A cooling holes 2005, for the Cryogenic air inside cryogenic chamber 2003 to be conducted to the LCM liquid crystal module surface to pressing, Cool down to LCM liquid crystal module, second cooling 2002 one end two sides of frame are mounted on buckle 2006, the first cooling frame 2,001 1 End two sides offer card slot 2007, pass through buckle 2006 and card slot between the first cooling frame 2001 and the second cooling frame 2002 2007 are fixedly connected, so that allowing to convenient for dismantling to the first cooling frame 2001 and the second cooling frame 2002 to low temperature Semiconductor chilling plate 2004 inside chamber 2003 is replaced.
The working principle of the invention is: firstly, by components such as the control IC pressed and optical filters according to pressing Sequence is stacked together, and the control components such as IC and optical filter stacked are placed in the limit heating ring 16 of pressing base 11, The power supply that limit heating ring 16 is connected using control switch 5 heats the control components edge such as IC and optical filter, then pushes away Dynamic pressing base 11, when pressing base 11 is moved to 1 middle part of pressing table, will be determined so that pressing base 11 moves inside delivery chute 2 Position bar 18 is inserted into locating slot 17, and the position of pressing base 11 is fixed, and then, controls pressing cylinder 6 using baric systerm Elongation is pressed using force fit plate 7 and pressing 9 pairs of control components such as IC and optical filter of rubber slab, during pressing, benefit With the Buffer Unit 14 inside pressing rubber slab 9 and pressing base 11, a degree of buffering can be carried out to the pressure of pressing, It can effectively prevent that pressing pressure is excessive to cause LCM liquid crystal module to be damaged, when pressing rubber slab 9 is led due to prolonged use When causing serious wear, fixed soft rubber 10 is removed on the outside of fixed convex button 8, is carry out demolition and replacement to pressing rubber slab 9;
When pressing to the control components such as IC and optical filter, due to being heated up, certain harmful gas can be generated Body, at this point, the power supply of extraction fan 1902 is connected using control switch 5, so that certain negative pressure is generated inside exhaust column 1901, It will heat up in the exhaust gas sucking exhaust column 1901 generated in bonding processes, and utilize the active carbon filter plate inside filter cartridge 1903 1904 pairs its be filtered, when active carbon filter plate 1904 since prolonged filtering noxious gas leads to the reduction of its filter capacity When, it is carry out demolition and replacement using disassembly handle 1905 to active carbon filter plate 1904;
After the control components such as IC and optical filter pressing finishes, locating rod 18 is pulled up, again to the position of pressing base 11 It is moved, so that pressing base 11 is moved to 20 lower section of cooling component, at this point, can also remain residual temperature, will affect LCM liquid crystal module Service life, at this point, using control switch 5 connect semiconductor chilling plate 2004 power supply, utilize semiconductor chilling plate 2004 Low temperature is generated inside cryogenic chamber 2003, and the Cryogenic air inside cryogenic chamber 2003 is discharged by cooling holes 2005, Cooling processing is carried out to the LCM liquid crystal module after heating pressing, high temperature is avoided to cause shadow to the service life of LCM liquid crystal module It rings, when the damage of semiconductor chilling plate 2004 is replaced, to the spiral shell of the first cooling frame 2001 and the second cooling frame 2002 Hole mounting plate 2008 is dismantled, and then utilizes buckle 2006 and card slot 2007 by the first cooling frame 2001 and the second cooling frame 2002 remove, and internal semiconductor chilling plate 2004 is overhauled and replaced.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.

Claims (8)

1. pressing the device for controlling the components such as IC and optical filter in LCM liquid crystal module, it is characterised in that: the device includes pressing table (1), support post (3), manipulation case (4), pressing cylinder (6), force fit plate (7) and pressing base (11);
It is offered delivery chute (2) above the pressing table (1), delivery chute (2) internal slide is equipped with pressing base (11), pressing table (1) the side backside face is fixedly installed with support post (3), and support post (3) top is fixedly mounted Have manipulation case (4), manipulation case (4) front end face is fixedly installed with control switch (5), the control switch (5) and power supply electricity Property connection, manipulation case (4) lower end be fixedly installed with presses cylinder (6), described pressing cylinder (6) one end is fixedly installed with pressure Plywood (7);
(11) one middle side part of pressing base offers locating slot (17), is interspersed with locating rod inside the locating slot (17) (18), through being equipped with exhausting component (19), described pressing table (1) one end is fixedly installed with drop for support post (3) bottom end Warm component (20).
2. controlling the device of the components such as IC and optical filter in pressing LCM liquid crystal module according to claim 1, feature exists In: each edge in force fit plate (7) upper surface is fixedly installed with fixed convex button (8), and force fit plate (7) lower surface is fitted with pressure It closes rubber slab (9), each edge of the pressing rubber slab (9) corresponds to and is fixedly installed with fixed soft rubber at fixed convex button (8) position (10), the pressing rubber slab (9) is an integral molding structure with fixed soft rubber (10).
3. controlling the device of the components such as IC and optical filter in pressing LCM liquid crystal module according to claim 1, feature exists In: pressing base (11) the bottom end two sides, which are internally embedded, is equipped with several balls (12), opens up inside the pressing base (11) Have telescopic chute (13), several Buffer Units (14), Buffer Unit (14) top are installed inside the telescopic chute (13) It is fixedly installed with telescopic block (15), telescopic block (15) upper center is fixedly installed with limit heating ring (16), the control The output end for switching (5) is electrically connected the input terminal of limit heating ring (16).
4. controlling the device of the components such as IC and optical filter in pressing LCM liquid crystal module according to claim 1, feature exists In: the length and width of the telescopic chute (13) is equal to the length and width of telescopic block (15).
5. controlling the device of the components such as IC and optical filter in pressing LCM liquid crystal module according to claim 3, feature exists In: the Buffer Unit (14) includes buffering sleeve (1401), buffer spring (1402) and buffering loop bar (1403);
It is connect between the buffering sleeve (1401) and telescopic chute (13) bottom end by fixed screw, the buffering sleeve (1401) Inner vertical is equipped with buffer spring (1402), and the buffering sleeve (1401) is internally located at the sliding of buffer spring (1402) top Buffering loop bar (1403) is installed.
6. controlling the device of the components such as IC and optical filter in pressing LCM liquid crystal module according to claim 1, feature exists In: the exhausting component (19) includes exhaust column (1901), extraction fan (1902), filter cartridge (1903), active carbon filter plate (1904) and handle (1905) are dismantled;
The exhaust column (1901) is installed through support post (3) bottom end, and the internal one end of the exhaust column (1901) is internally embedded It is equipped with extraction fan (1902), the output end of the control switch (5) is electrically connected the input terminal of extraction fan (1902), the pumping Air hose (1901) other end is equipped with filter cartridge (1903), is equipped with active carbon filter plate inside the filter cartridge (1903) (1904), active carbon filter plate (1904) top middle portion is fixedly installed with disassembly handle (1905).
7. controlling the device of the components such as IC and optical filter in pressing LCM liquid crystal module according to claim 6, feature exists In: insertion is equipped with sealing rubber ring between the filter cartridge (1903) and active carbon filter plate (1904).
8. controlling the device of the components such as IC and optical filter in pressing LCM liquid crystal module according to claim 1, feature exists Include the first cooling frame (2001), the second cooling frame (2002), cryogenic chamber (2003), partly lead in: the cooling component (20) Body cooling piece (2004), cooling holes (2005), buckle (2006), card slot (2007) and screw hole mounting plate (2008);
Pressing table (1) one end side is fixedly installed with the first cooling frame by screw hole mounting plate (2008) and hex(agonal)screw (2001), pressing table (1) one end other side is fixedly installed with the second drop by screw hole mounting plate (2008) and hex(agonal)screw Warm frame (2002), first cooling frame (2001) and the second cooling frame (2002) inside offer cryogenic chamber (2003), It is equipped with semiconductor chilling plate (2004) inside the cryogenic chamber (2003), the output end of the control switch (5) electrically connects The input terminal of semiconductor chilling plate (2004) is connect, is offered on the inside of first cooling frame (2001) and the second cooling frame (2002) Several cooling holes (2005), second cooling frame (2002) one end two sides are mounted on buckle (2006), first drop Warm frame (2001) one end two sides offer card slot (2007), it is described first cooling frame (2001) with second cooling frame (2002) it Between by buckle (2006) be fixedly connected with card slot (2007).
CN201910573262.XA 2019-06-27 2019-06-27 Device for controlling IC and optical filter component in press fit LCM liquid crystal module Active CN110441931B (en)

Priority Applications (1)

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CN201910573262.XA CN110441931B (en) 2019-06-27 2019-06-27 Device for controlling IC and optical filter component in press fit LCM liquid crystal module

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10151703A (en) * 1996-11-22 1998-06-09 Tigers Polymer Corp Buffer sheet for hot press
CN1866090A (en) * 2006-04-06 2006-11-22 友达光电股份有限公司 Adjustable pressing device
CN202399615U (en) * 2011-12-27 2012-08-29 天马微电子股份有限公司 Laminating device for display panel
CN205450501U (en) * 2016-02-26 2016-08-10 苏州市吴江区英飞大自动化设备有限公司 Accurate counterpoint rigging machine
CN207340295U (en) * 2017-07-13 2018-05-08 信丰迅捷兴电路科技有限公司 A kind of circuit board pressing device
CN207875066U (en) * 2018-02-05 2018-09-18 深圳生溢快捷电路有限公司 A kind of mixed pressure gold filled side blind slot plate process units
CN108663829A (en) * 2017-03-31 2018-10-16 深圳市鑫佳鑫电子有限公司 The full attaching process of COF thermoplastic optical adhesive film displays and equipment
CN109031718A (en) * 2018-08-13 2018-12-18 盐城华旭光电技术有限公司 A kind of pressing device for the production of LCM liquid crystal module

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10151703A (en) * 1996-11-22 1998-06-09 Tigers Polymer Corp Buffer sheet for hot press
CN1866090A (en) * 2006-04-06 2006-11-22 友达光电股份有限公司 Adjustable pressing device
CN202399615U (en) * 2011-12-27 2012-08-29 天马微电子股份有限公司 Laminating device for display panel
CN205450501U (en) * 2016-02-26 2016-08-10 苏州市吴江区英飞大自动化设备有限公司 Accurate counterpoint rigging machine
CN108663829A (en) * 2017-03-31 2018-10-16 深圳市鑫佳鑫电子有限公司 The full attaching process of COF thermoplastic optical adhesive film displays and equipment
CN207340295U (en) * 2017-07-13 2018-05-08 信丰迅捷兴电路科技有限公司 A kind of circuit board pressing device
CN207875066U (en) * 2018-02-05 2018-09-18 深圳生溢快捷电路有限公司 A kind of mixed pressure gold filled side blind slot plate process units
CN109031718A (en) * 2018-08-13 2018-12-18 盐城华旭光电技术有限公司 A kind of pressing device for the production of LCM liquid crystal module

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