JP3585457B2 - Apparatus for bonding substrates to form a liquid crystal display element and method for bonding substrates - Google Patents

Apparatus for bonding substrates to form a liquid crystal display element and method for bonding substrates Download PDF

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JP3585457B2
JP3585457B2 JP2001203857A JP2001203857A JP3585457B2 JP 3585457 B2 JP3585457 B2 JP 3585457B2 JP 2001203857 A JP2001203857 A JP 2001203857A JP 2001203857 A JP2001203857 A JP 2001203857A JP 3585457 B2 JP3585457 B2 JP 3585457B2
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substrate
chamber
liquid crystal
pressure
rubber film
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JP2003015142A (en
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晴弘 虎谷
隆 富永
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Iinuma Gauge Manufacturing Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
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Description

【０００１】
【発明の属する技術分野】
本発明は、液晶素子を形成するために液晶材料を挟んで基板を貼り付ける貼り付け装置、および、貼り付け方法に関する。
【０００２】
【従来の技術】
液晶表示装置が益々広い分野で使用されるようになり、液晶表示素子のより迅速かつ容易な製造方法が望まれている。
ここで、液晶表示素子の製造工程には、一対の基板で液晶材料を挟み込む工程がある。この工程に関しては、従来の一対の基板を離間配置しておいてその間に液晶材料を注入する方法に加えて、一方の基板に液晶材料を滴下して、その後に、もう一方の基板を押圧して貼り合せる方法も開発されている。しかしながら、なかなか基板を均等に押圧することができないという問題がある。
【０００３】
【発明が解決しようとする課題】
本発明は、上記問題に鑑み、一対の基板を均等に貼り合せることのできる装置、および、方法を提供することを目的とする。
【０００４】
【課題を解決するための手段】
請求項１の発明によれば、液晶表示素子を形成するために一対の基板を液晶材料を介装して貼り合わせる基板貼り合せ装置であって、
第１基板を載置せしめる第１基板支持部材と、第２基板を第１基板の上方に離間させて弾性支持し下向きの荷重を受けると第２基板が第１基板に向かって移動することを可能にする第２基板支持部材とを有する基板配設容器と、
基板配設容器を密閉可能なふた部材と、
ふた部材の内側に周辺が密着されたゴム膜であって、ふた部材で基板配設容器を密閉したときに、上側に第１チャンバを、下側に第２チャンバを形成するゴム膜と、
ゴム膜が下方に膨張変形して第２基板を第１基板に向けて押圧する差圧が発生するように第１チャンバの圧力と第２チャンバの圧力を調整する圧力調整手段と、
第２基板を第１基板に向けて押圧する際に、液晶材料を加熱する加熱手段と、を具備し、加熱手段で熱膨張せしめられた液晶の表面張力で第１基板と第２基板を貼り合わせることを特徴とする基板貼り合せ装置が提供される。
このように構成された基板貼り合せ装置では、第１基板が第１基板支持部材に載置され、第２基板が第２基板支持部材により第１基板の上方に離間させて弾性支持される、基板配設容器は、ふた部材により密閉されるが、ふた部材の内側には周囲が密着されたゴム膜が配設されていて、ふた部材で基板配設容器を密閉したときに、ゴム膜の上側には第１チャンバが、下側には第２チャンバが形成される。圧力調整手段で第１チャンバの圧力と第２チャンバの圧力を調整して差圧を発生させ、ゴム膜を下方に膨張変形せしめて第２基板を第１基板に向けて押圧する。この際に、加熱手段により液晶材料は熱膨張せしめられ、その表面張力により第１基板と第２基板が貼り合わせられる。
【０００５】
請求項２の発明によれば、請求項１の装置において、圧力調整手段は、真空ポンプと、大気導入弁とを含み、第１チャンバと第２チャンバを共に大気圧以下にした状態でゴム膜を膨張変形せしめる、ことを特徴とする基板貼り合せ装置が提供される。
【０００６】
請求項３の発明によれば、請求項１の装置において、加熱手段が第１基板支持部材に付設されたヒータである、ことを特徴とする基板貼り合せ装置が提供される。
【０００７】
請求項４の発明によれば、請求項３の装置において、ヒータで加熱された第１基板支持部材を急速冷却可能な冷却装置を有する、ことを特徴とする基板貼り合せ装置が提供される。
【０００８】
請求項５の発明によれば、液晶表示素子を形成するために一対の基板を液晶材料を介装して貼り合せる方法であって、
基板配設容器の第１基板支持部材に第１基板を載置せしめ、第１基板上に液晶材料を滴下し、第２基板を第２基板支持部材で第１基板の上方に離間させて下方から弾性支持する基板配設ステップと、
基板配設容器を内側に周辺が密着されたゴム膜を有するふた部材で密閉し、ゴム膜の上側に第１チャンバを、下側に第２チャンバを形成する２チャンバ形成ステップと、
圧力調整手段で、ゴム膜が下方に膨張変形して第２基板を第１基板に向けて押圧する差圧が発生するように第１チャンバの圧力と第２チャンバの圧力を調整する圧力調整ステップとを含み、
圧力調整ステップにおいて、加熱手段により液晶材料を加熱し、加熱手段で熱膨張せしめられた液晶材料の表面張力で第１基板と第２基板を貼り合わせることを特徴とする方法が提供される。
【０００９】
このような方法によれば、基板配設ステップで、基板配設容器の第１基板支持部材に第１基板を載置せしめ、第１基板上に液晶材料を滴下し、第２基板を第２基板支持部材で第１基板の上方に離間させて下方から弾性支持し、２チャンバ形成ステップで、基板配設容器を内側に周囲が密着されたゴム膜を有するふた部材で密閉し、ゴム膜の上側に第１チャンバを、下側に第２チャンバを形成し、圧力調整ステップで、圧力調整手段により、ゴム膜が下方に膨張変形して第２基板を第１基板に向けて押圧する差圧が発生するように第１チャンバの圧力と第２チャンバの圧力が調整されるが、その際に、加熱手段で液晶材料が加熱され、加熱手段で熱膨張せしめられた液晶材料の表面張力で第１基板と第２基板で貼り合わせられる。
【００１０】
請求項６の発明によれば、請求項５の方法の圧力調整ステップで、第１チャンバと第２チャンバをともに同じ値の負圧にしてから、差圧が発生せしめられるようにした、ことを特徴とする方法が提供される。
【００１１】
請求項７の発明によれば、請求項５の方法の圧力調整ステップで、第１チャンバと第２チャンバの差圧を予め設定した所定のパターンに従って変化させるようにした、ことを特徴とする方法が提供される。
【００１２】
【発明の実施の形態】
以下、添付の図面を参照して本発明の基板貼り付け装置、および、それを使った基板貼り付け方法について説明する。
図１は、本発明の基板貼り付け装置の全体の構造を示す図であって、貼り付け作業が内部で実行される作業室１０が架台１００の上に載置されている。
作業室１０は、基板が配設される基板配設容器２０と、基板配設容器２０を覆うふた部材３０から構成される。
【００１３】
基板配設容器２０は、外枠部材２１と、中間部材２２を介して外枠部材２１の内側に配設されている基板配設プレート２３から成る。基板配設プレート２３の上面には互いに貼り合わせられる、第１基板１と第２基板２の水平方向の位置決めをおこなう位置決め部材２４、および、第２基板２を下方から支持する基板支持部材２５が設けられている。なお、第１基板１は例えばＩＣ基板であり、第２基板２は例えばガラス基板である。
【００１４】
第１基板１は位置決め部材２４で水平方向の位置決めをされて基板配設プレート２３の上に載置される。そして、基板配設プレート２３の上に載置された第１基板１の上に液晶材料３が適切な手段で滴下された後に、第２基板２が基板支持部材２５で第１基板１の上方に支持される。
【００１５】
基板配設プレート２３の下面には、基板配設プレート２３を加熱するヒータ４０が密着して配設されているが、ヒータ４０は基板配設プレート２３の中央を除外して設けられていて、ヒータ４０が配設されていない部分には加熱した基板配設プレート２３を初期設定温度まで急速に冷却する冷却装置５０の一部が基板配設プレート２３に接するように配設されており、冷却装置５０は内部に低温水が循環されるように低温水槽７０と連結されている。
また、基板配設プレート２３と中間部材２２の間、中間部材２２と外枠部材２１の間のシール性を確保するために、中間部材２２と外枠部材２１にそれぞれＯリング２７が配設されている。
【００１６】
一方、ふた部材３０は、ふた本体３１と、ふた本体３１にリング部材３２で周辺部を取り付けたゴム膜３３から成る。ゴム膜３３としては、例えば、デュポン社のバイトン（登録商標）（ＶｉｔｏｎＴＭ）が使用される。
そして、ふた部材３０の外側には架台１００に立設された支柱１１０に軸承されたアーム３４が取り付けられ、このアーム３４にはサブアーム３５を介して他端が架台１００に取り付けられたダンパー１２０が取り付けられ、ふた３０は小さな力でも容易に開閉できるようにされている。
なお、基板配設容器２０の外枠部材２１の上面にはふた部材３０を閉じた際にふた部材３０が密着できるようにＯリング２７が配設されている。
【００１７】
図１に示されるようにふた部材３０を閉じると、作業容器１０の内部には、ゴム膜３３の上側の第１チャンバＡと、ゴム膜３３の下側の第２チャンバＢが形成される。
ここで、基板配設容器２０の外枠部材２１には抜気孔２１ａが設けられ、ふた３０のふた本体部材３１にも抜気孔３１ａが設けられており、これらはそれぞれ、配管６１、６２を介して真空ポンプ６０に接続されていて、配管６１、６２の途中には、真空排気弁６１ａ，６２ａ、および、大気を導入するための大気導入弁６１ｂ，６２ｂがそれぞれ設けられている。なお、真空排気弁と大気導入弁はそれぞれ開閉弁と調節弁から構成されている。
これらを用いて、第１チャンバＡと、第２チャンバＢの圧力が、後述するように制御される。
【００１８】
図２は、基板配設容器２０のみを上方から見た図であって、図示されるように、一度に２０組の第１基板と第２基板を貼り合せることができる。
また、図２において破線のハッチングが施されているのがヒータ４０の配設されている領域であり、ヒータ４０の配置されていない中央部分には冷却装置５０が接している。
【００１９】
図３は１組の第１基板１と第２基板２を拡大して上方から見た図であり、図示されるように第１基板１と第２基板２は第２基板２の方が大きくされているが、これは第１基板１を基板支持手段２５で支持するためである。また第１基板１が第２基板２よりも図中左側にオフセットして配置されているが、これは第１基板１に後工程で外部導線をつなげるためである。
【００２０】
図４は図３のＩＶ−ＩＶ線に沿って見た断面図であり、図示されるように、基板支持部材２５はピストン２５ａをバネ２５ｂで下方から押し上げて構成されている。また、位置決め部材２４の第１基板１を位置決めする部分は第１基板１の高さよりも低い厚さとされているが、これは、後述するように、第２基板２を第１基板１に向けて押圧したときに第２基板２が位置決め部材２４に妨害されずに第１基板１に向かって押しさげられるようにするためである。
【００２１】
以下、上記のように構成された装置を使用して第１基板１と第２基板２を液晶材料３を介装して貼り合せる作業手順について説明する。
先ずは、作業容器１０のふた部材３０をあけて基板配設容器２０の位置決め部材２４が形成している配置位置にしたがって第１基板１を配設する。
次に、配設された第１基板１の上面に液晶材料３を所定量滴下するが、この液晶材料３には熱硬化樹脂が混入されている。次いで、第２基板２を基板支持部材２５で支持させて所定位置に配置する。このようにして２０対の第１基板１と第２基板２を配置する。
【００２２】
以下、図４に示されるタイミングチャートにしたがって抜気と加熱をおこなう。
（１）ｔ０〜ｔ１：
先ず、ふた部材３０をあけた状態で、真空ポンプ６０により第１チャンバＡを抜気し、第１チャンバＡの圧力を大気圧からＰ４まで降下させ、Ｐ４まで降下したらふた３０を閉じる。これは、ふた３０をしめたときにゴム膜３３がいきなりガラス第２基板２に当たるのを防止するためにおこなう。
【００２３】
（２）ｔ１〜ｔ２〜ｔ３：
次いで、真空ポンプ６０により第２チャンバＢをＰ４になるまで抜気するが初めは緩やかにゆっくり抜気して異物の巻きこみを防止する。
（３）ｔ３〜ｔ４：
第１チャンバＡと第２チャンバＢの圧力を共にＰ４で所定の時間Ｔ１の間保持して液晶材料３の内部に含まれている気泡を排出する。この時、第１チャンバＡと第２チャンバＢの圧力は共にＰ４とされるのでゴム膜３３は平らに保たれている。
【００２４】
（４）ｔ４〜ｔ５：
次に、第１チャンバＡはＰ４に保ったまま第２チャンバＢに大気を導入して第２チャンバＢの圧力をＰ４からＰ３まで上げる。
（５）ｔ５〜ｔ６：
さらに第１チャンバＡへ大気を導入して第１チャンバＡの圧力をＰ４からＰ２へ高め、第１チャンバＡの圧力を第２チャンバＢの圧力よりも高くしてゴム膜３３を第２基板へ向けて膨張変形させる。同時にヒータ４０によって基板配設プレート２３の温度をそれまでのＴＨ１からＴＨ２まで上昇せしめる。
【００２５】
（６）ｔ６〜ｔ７：
第１チャンバＡの圧力をＰ２、第２チャンバＢの圧力をＰ３、基板配設プレート２３の温度をＴＨ２にして所定の時間Ｔ２の間保持し、第１基板１に第２基板２を差圧Ｐ２−Ｐ３で押しつける。すると液晶材料の表面張力により、第１基板１と第２基板２は貼り合わせられる。
（７）ｔ７〜ｔ８〜ｔ９：
まず、第１チャンバＡの圧力をＰ２のままで、第２チャンバＢの圧力をＰ２まで上げる。その後、第１チャンバＡの圧力、第２チャンバＢの圧力を共に、大気圧まで上昇させる。この間、基板配設プレート２３の温度はＴＨ２からＴＨ１へ降下させる。
【００２６】
上記のようにして、第２基板が液晶材料３をはさんで第１基板に貼り合せられるが、ゴム膜３３を介して空気圧で第２基板を押圧しているので均等な貼り合わせが実現される。
【００２７】
【発明の効果】
請求項１の発明は、液晶表示素子を形成するために一対の基板を液晶材料を介装して貼り合わせる基板貼り合せ装置であるが、第１基板を載置せしめる第１基板支持部材と、第２基板を第１基板の上方に離間させて弾性支持し下向きの荷重を受けると第２基板が第１基板に向かって移動することを可能にする第２基板支持部材とを有する基板配設容器と、基板配設容器を密閉可能なふた部材と、ふた部材の内側に周囲が密着されたゴム膜であって、ふた部材で基板配設容器を密閉したときに、上側に第１チャンバを、下側に第２チャンバを形成するゴム膜と、ゴム膜が下方に膨張変形して第２基板を第１基板に向けて押圧する差圧が発生するように第１チャンバの圧力と第２チャンバの圧力を調整する圧力調整手段と、第２基板を第１基板に向けて押圧する際に、液晶材料を加熱する加熱手段と、を具備し、加熱手段により熱膨張せしめられた液晶材料の表面張力で第１基板と第２基板が貼り合せられる。したがって、この装置では、ゴム膜の膨張変形を利用して第２基板を第１基板に向けて押圧して両基板を貼り合せるので均等な貼り合せができる。
【００２８】
同様に、請求項５の発明は、液晶表示素子を形成するために、一対の基板を液晶材料を介装して貼り合せる方法であるが、基板配設容器の第１基板支持部材に第１基板を載置せしめ、第１基板上に液晶材料を滴下し、第２基板を第２基板支持部材で第１基板の上方に離間させて下方から弾性支持する基板配設ステップと、基板配設容器を内側に周囲が密着されたゴム膜を有するふた部材で密閉し、ゴム膜の上側に第１チャンバを、下側に第２チャンバを形成する２チャンバ形成ステップと、圧力調整手段で、ゴム膜が下方に膨張変形して第２基板を第１基板に向けて押圧する差圧が発生するように第１チャンバの圧力と第２チャンバの圧力を調整する圧力調整ステップとを含み、圧力調整ステップにおいて、加熱手段により液晶材料を加熱し、加熱手段により熱膨張せしめられた液晶材料の表面張力により第１基板と第２基板が貼り合せられる。したがって、この方法では、ゴム膜の膨張変形を利用して第２基板を第１基板に向けて押圧して両基板を貼り合せるので均等な貼り合せができる。熱膨張した液晶材料の表面張力により、第１基板と第２基板を貼り合わせる。
【図面の簡単な説明】
【図１】本発明の実施の形態の構成を示す側面図である。
【図２】作業容器のふたをあけ基板配設容器を上から見た図である。
【図３】一組の第１基板と第２基板を拡大して示す図である。
【図４】図３のＩＶ−ＩＶ線に沿って見た断面図である。
【図５】第１チャンバと第２チャンバの圧力の変化および基板配設プレートの温度の変化を示すタイミングチャートである。
【符号の説明】
１…第１基板
２…第２基板
３…液晶材料
１０…作業室
２０…基板配設容器
２１…外枠部材
２２…中間部材
２３…基板配設プレート
２４…位置決め部材
２５…基板支持部材
２７…Ｏリング
３０…ふた
３１…ふた本体部材
３３…ゴム膜
４０…ヒータ
５０…冷却装置
６０…真空ポンプ
６１ａ，６２ａ…真空排気弁
６１ｂ，６１ｂ…大気導入弁
７０…低温水槽[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an attaching apparatus and an attaching method for attaching a substrate with a liquid crystal material interposed therebetween to form a liquid crystal element.
[0002]
[Prior art]
2. Description of the Related Art As liquid crystal display devices are used in more and more fields, a quicker and easier method of manufacturing liquid crystal display devices is desired.
Here, the manufacturing process of the liquid crystal display element includes a process of sandwiching a liquid crystal material between a pair of substrates. Regarding this step, in addition to the conventional method in which a pair of substrates are spaced apart and a liquid crystal material is injected between them, a liquid crystal material is dropped on one substrate, and then the other substrate is pressed. A method of bonding together has also been developed. However, there is a problem that the substrate cannot be pressed evenly.
[0003]
[Problems to be solved by the invention]
In view of the above problems, an object of the present invention is to provide an apparatus and a method capable of uniformly bonding a pair of substrates.
[0004]
[Means for Solving the Problems]
According to the invention of claim 1, there is provided a substrate bonding apparatus for bonding a pair of substrates with a liquid crystal material interposed therebetween to form a liquid crystal display element,
A first substrate supporting member on which the first substrate is placed; and a second substrate, which is elastically supported by being separated from the first substrate and receives a downward load, whereby the second substrate moves toward the first substrate. A substrate disposition container having a second substrate support member for enabling;
A lid member capable of sealing the substrate mounting container,
A rubber film having a periphery closely adhered to the inside of the lid member, and a rubber film forming a first chamber on the upper side and a second chamber on the lower side when the substrate disposing container is sealed with the lid member;
Pressure adjusting means for adjusting the pressure of the first chamber and the pressure of the second chamber such that the rubber film expands and deforms downward to generate a differential pressure that presses the second substrate toward the first substrate;
Heating means for heating the liquid crystal material when the second substrate is pressed toward the first substrate, wherein the first substrate and the second substrate are bonded by the surface tension of the liquid crystal thermally expanded by the heating means. There is provided a substrate bonding apparatus characterized by bonding.
In the substrate bonding apparatus configured as described above, the first substrate is placed on the first substrate support member, and the second substrate is elastically supported by being separated from the first substrate by the second substrate support member. The substrate mounting container is sealed by a lid member, but a rubber film having a tightly adhered periphery is provided inside the lid member, and when the substrate mounting container is closed by the lid member, the rubber film is closed. A first chamber is formed on the upper side, and a second chamber is formed on the lower side. The pressure in the first chamber and the pressure in the second chamber are adjusted by the pressure adjusting means to generate a differential pressure, so that the rubber film is expanded and deformed downward, and the second substrate is pressed toward the first substrate. At this time, the liquid crystal material is thermally expanded by the heating means, and the first substrate and the second substrate are bonded by the surface tension.
[0005]
According to a second aspect of the present invention, in the device of the first aspect, the pressure adjusting means includes a vacuum pump and an atmospheric introduction valve, and the rubber film is formed in a state where both the first chamber and the second chamber are set to the atmospheric pressure or less. The substrate bonding apparatus is characterized in that the substrate is expanded and deformed.
[0006]
According to a third aspect of the present invention, there is provided the substrate bonding apparatus according to the first aspect, wherein the heating means is a heater attached to the first substrate supporting member.
[0007]
According to a fourth aspect of the present invention, there is provided the substrate bonding apparatus according to the third aspect, further comprising a cooling device capable of rapidly cooling the first substrate supporting member heated by the heater.
[0008]
According to the invention of claim 5, there is provided a method of bonding a pair of substrates with a liquid crystal material interposed therebetween to form a liquid crystal display element,
The first substrate is placed on the first substrate supporting member of the substrate disposing container, a liquid crystal material is dropped on the first substrate, and the second substrate is separated from the first substrate by the second substrate supporting member and is moved downward. A substrate disposing step for elastically supporting from
A two-chamber forming step of sealing the substrate disposing container with a lid member having a rubber film whose inner periphery is in close contact, forming a first chamber above the rubber film and a second chamber below the rubber film;
A pressure adjusting step of adjusting the pressure of the first chamber and the pressure of the second chamber so that the rubber film expands and deforms downward to generate a differential pressure that presses the second substrate toward the first substrate. And
In the pressure adjusting step, a method is provided in which the liquid crystal material is heated by the heating means, and the first substrate and the second substrate are bonded to each other with the surface tension of the liquid crystal material thermally expanded by the heating means.
[0009]
According to such a method, in the substrate disposing step, the first substrate is placed on the first substrate supporting member of the substrate disposing container, a liquid crystal material is dropped on the first substrate, and the second substrate is displaced on the second substrate. The substrate supporting member is elastically supported from below by being separated from above the first substrate by the substrate supporting member, and in a two-chamber forming step, the substrate disposing container is hermetically sealed with a lid member having a rubber film whose inside is closely adhered to the inside thereof, and A first chamber is formed on the upper side, and a second chamber is formed on the lower side. In the pressure adjusting step, the pressure adjusting means expands and deforms the rubber film downward to press the second substrate toward the first substrate. The pressure in the first chamber and the pressure in the second chamber are adjusted so that the liquid crystal material is heated by the heating means, and the liquid crystal material is thermally expanded by the heating means. The first and second substrates are bonded together.
[0010]
According to the sixth aspect of the present invention, in the pressure adjusting step of the fifth aspect, the differential pressure is generated after the first chamber and the second chamber are both set to the same negative pressure. A featured method is provided.
[0011]
According to a seventh aspect of the present invention, in the pressure adjusting step of the fifth aspect, the differential pressure between the first chamber and the second chamber is changed according to a predetermined pattern set in advance. Is provided.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a substrate bonding apparatus and a substrate bonding method using the same according to the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a view showing the overall structure of a substrate sticking apparatus according to the present invention. A work chamber 10 in which a sticking operation is performed is placed on a gantry 100.
The working chamber 10 includes a substrate disposing container 20 on which the substrate is disposed, and a lid member 30 that covers the substrate disposing container 20.
[0013]
The substrate disposing container 20 includes an outer frame member 21 and a substrate disposing plate 23 disposed inside the outer frame member 21 via the intermediate member 22. A positioning member 24 for positioning the first substrate 1 and the second substrate 2 in the horizontal direction and a substrate supporting member 25 for supporting the second substrate 2 from below are attached to the upper surface of the substrate disposing plate 23. Is provided. Note that the first substrate 1 is, for example, an IC substrate, and the second substrate 2 is, for example, a glass substrate.
[0014]
The first substrate 1 is positioned in the horizontal direction by the positioning member 24 and placed on the substrate mounting plate 23. Then, after the liquid crystal material 3 is dropped on the first substrate 1 placed on the substrate disposing plate 23 by an appropriate means, the second substrate 2 is placed above the first substrate 1 by the substrate supporting member 25. Supported by
[0015]
On the lower surface of the substrate disposing plate 23, a heater 40 for heating the substrate disposing plate 23 is disposed in close contact with the heater, but the heater 40 is provided except for the center of the substrate disposing plate 23, In a portion where the heater 40 is not provided, a part of a cooling device 50 for rapidly cooling the heated substrate mounting plate 23 to an initial set temperature is provided so as to be in contact with the substrate mounting plate 23. The device 50 is connected to a low-temperature water tank 70 so that low-temperature water is circulated therein.
O-rings 27 are provided on the intermediate member 22 and the outer frame member 21 in order to secure sealing properties between the substrate mounting plate 23 and the intermediate member 22 and between the intermediate member 22 and the outer frame member 21. ing.
[0016]
On the other hand, the lid member 30 includes a lid main body 31 and a rubber film 33 whose peripheral portion is attached to the lid main body 31 by a ring member 32. As the rubber film 33, for example, Viton (registered trademark) (Viton ™ ) of DuPont is used.
An arm 34 is attached to the outside of the lid member 30 and is supported by a column 110 erected on the gantry 100. A damper 120 having the other end attached to the gantry 100 via a sub arm 35 is attached to the arm 34. The lid 30 is attached so that it can be easily opened and closed with a small force.
An O-ring 27 is provided on the upper surface of the outer frame member 21 of the substrate mounting container 20 so that the lid member 30 can be in close contact with the lid member 30 when the lid member 30 is closed.
[0017]
When the lid member 30 is closed as shown in FIG. 1, a first chamber A above the rubber film 33 and a second chamber B below the rubber film 33 are formed inside the working container 10.
Here, a vent hole 21 a is provided in the outer frame member 21 of the substrate disposing container 20, and a vent hole 31 a is also provided in the lid body member 31 of the lid 30, and these are provided via pipes 61 and 62, respectively. In the middle of the pipes 61 and 62, vacuum exhaust valves 61a and 62a and atmosphere introduction valves 61b and 62b for introducing the atmosphere are provided, respectively. In addition, the vacuum exhaust valve and the atmosphere introduction valve are respectively constituted by an on-off valve and a control valve.
Using these, the pressures in the first chamber A and the second chamber B are controlled as described later.
[0018]
FIG. 2 is a view of only the substrate disposing container 20 as viewed from above. As shown, 20 sets of the first substrate and the second substrate can be bonded at a time.
In FIG. 2, a hatched area indicated by a broken line is an area where the heater 40 is provided, and the cooling device 50 is in contact with a central portion where the heater 40 is not provided.
[0019]
FIG. 3 is an enlarged view of a set of the first substrate 1 and the second substrate 2 viewed from above. As shown, the first substrate 1 and the second substrate 2 are larger in the second substrate 2. This is because the first substrate 1 is supported by the substrate supporting means 25. Further, the first substrate 1 is arranged to be offset to the left side of the second substrate 2 in the drawing, in order to connect external conductors to the first substrate 1 in a later step.
[0020]
FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 3, and as shown, the substrate support member 25 is configured by pushing up a piston 25a from below with a spring 25b. Further, the portion of the positioning member 24 for positioning the first substrate 1 has a thickness lower than the height of the first substrate 1. This is because the second substrate 2 faces the first substrate 1 as described later. This is because the second substrate 2 can be pushed down toward the first substrate 1 without being disturbed by the positioning member 24 when pressed.
[0021]
Hereinafter, an operation procedure for bonding the first substrate 1 and the second substrate 2 with the liquid crystal material 3 interposed therebetween using the apparatus configured as described above will be described.
First, the first substrate 1 is arranged according to the arrangement position of the positioning member 24 of the substrate arrangement container 20 with the lid member 30 of the working container 10 opened.
Next, a predetermined amount of liquid crystal material 3 is dropped on the upper surface of the first substrate 1 provided, and a thermosetting resin is mixed in the liquid crystal material 3. Next, the second substrate 2 is supported by the substrate support member 25 and arranged at a predetermined position. Thus, 20 pairs of the first substrate 1 and the second substrate 2 are arranged.
[0022]
Hereinafter, degassing and heating are performed according to the timing chart shown in FIG.
(1) t 0 to t 1 :
First, with the lid member 30 opened, the first chamber A is evacuated by the vacuum pump 60, the pressure in the first chamber A is reduced from the atmospheric pressure to P4, and when the pressure drops to P4, the lid 30 is closed. This is performed to prevent the rubber film 33 from suddenly hitting the glass second substrate 2 when the lid 30 is closed.
[0023]
(2) t 1 ~t 2 ~t 3:
Next, the second chamber B is evacuated by the vacuum pump 60 until the pressure reaches P4.
(3) t 3 ~t 4:
The pressure in the first chamber A and the pressure in the second chamber B are both maintained at P4 for a predetermined time T1, and bubbles contained in the liquid crystal material 3 are discharged. At this time, since the pressure in both the first chamber A and the second chamber B is set to P4, the rubber film 33 is kept flat.
[0024]
(4) t 4 to t 5 :
Next, while maintaining the first chamber A at P4, the atmosphere is introduced into the second chamber B to increase the pressure in the second chamber B from P4 to P3.
(5) t 5 ~t 6:
Further, the atmosphere is introduced into the first chamber A to increase the pressure of the first chamber A from P4 to P2, and the pressure of the first chamber A is made higher than the pressure of the second chamber B to transfer the rubber film 33 to the second substrate. Inflate and deform. At the same time, the temperature of the substrate mounting plate 23 is raised from TH1 to TH2 by the heater 40.
[0025]
(6) t 6 to t 7 :
The pressure of the first chamber A is set to P2, the pressure of the second chamber B is set to P3, the temperature of the substrate disposing plate 23 is set to TH2, and is maintained for a predetermined time T2. Press with P2-P3. Then, the first substrate 1 and the second substrate 2 are bonded to each other by the surface tension of the liquid crystal material.
(7) t 7 ~t 8 ~t 9:
First, the pressure in the second chamber B is increased to P2 while the pressure in the first chamber A remains at P2. Thereafter, both the pressure in the first chamber A and the pressure in the second chamber B are increased to atmospheric pressure. During this time, the temperature of the substrate mounting plate 23 is decreased from TH2 to TH1.
[0026]
As described above, the second substrate is bonded to the first substrate with the liquid crystal material 3 interposed therebetween. However, since the second substrate is pressed with air pressure via the rubber film 33, uniform bonding is realized. You.
[0027]
【The invention's effect】
The invention according to claim 1 is a substrate bonding apparatus for bonding a pair of substrates with a liquid crystal material interposed therebetween to form a liquid crystal display element. A first substrate support member on which the first substrate is placed, A second substrate supporting member for elastically supporting the second substrate above the first substrate and for allowing the second substrate to move toward the first substrate when receiving a downward load; A container, a lid member capable of sealing the substrate disposition container, and a rubber film whose periphery is closely adhered to the inside of the lid member, and when the substrate disposition container is sealed with the lid member, the first chamber is disposed on the upper side. A rubber film forming a second chamber below, and a pressure in the first chamber and a second pressure generated by the rubber film expanding and deforming downward to generate a differential pressure for pressing the second substrate toward the first substrate. Pressure adjusting means for adjusting the pressure of the chamber, and the second substrate as the first substrate Only in the time of pressing, comprising a heating means for heating the liquid crystal material, the first substrate and the second substrate by the surface tension of a liquid crystal material is caused to thermal expansion are bonded by the heating means. Therefore, in this device, the second substrate is pressed toward the first substrate by utilizing the expansion and deformation of the rubber film, and the two substrates are bonded to each other, so that uniform bonding can be performed.
[0028]
Similarly, the invention according to claim 5 is a method of bonding a pair of substrates with a liquid crystal material interposed therebetween in order to form a liquid crystal display element. Disposing a substrate, placing a liquid crystal material on the first substrate, dropping the second substrate above the first substrate with a second substrate support member, and elastically supporting the second substrate from below; and disposing the substrate. A two-chamber forming step of forming a first chamber on the upper side of the rubber film and a second chamber on the lower side of the container, and sealing the container with a rubber member; A pressure adjusting step of adjusting the pressure of the first chamber and the pressure of the second chamber so that the film expands and deforms downward to generate a differential pressure that presses the second substrate toward the first substrate. In the step, the liquid crystal material is heated by a heating means. The first substrate and the second substrate due to the surface tension of a liquid crystal material is caused to thermal expansion are bonded by the heating means. Therefore, in this method, since the second substrate is pressed toward the first substrate by utilizing the expansion deformation of the rubber film, and the two substrates are bonded, uniform bonding can be performed. The first substrate and the second substrate are attached to each other by the surface tension of the thermally expanded liquid crystal material.
[Brief description of the drawings]
FIG. 1 is a side view showing a configuration of an embodiment of the present invention.
FIG. 2 is a view of the work container with the lid opened and the substrate disposition container viewed from above.
FIG. 3 is an enlarged view showing a set of a first substrate and a second substrate.
FIG. 4 is a sectional view taken along line IV-IV in FIG. 3;
FIG. 5 is a timing chart showing changes in the pressures of the first chamber and the second chamber and changes in the temperature of the substrate mounting plate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... 1st board | substrate 2 ... 2nd board | substrate 3 ... Liquid crystal material 10 ... Work room 20 ... Board arrangement container 21 ... Outer frame member 22 ... Intermediate member 23 ... Substrate arrangement plate 24 ... Positioning member 25 ... Substrate support member 27 ... O-ring 30 Lid 31 Lid body member 33 Rubber film 40 Heater 50 Cooling device 60 Vacuum pumps 61 a and 62 a Vacuum exhaust valves 61 b and 61 b Atmospheric introduction valve 70 Low-temperature water tank

Claims (7)

液晶表示素子を形成するために一対の基板を液晶材料を介装して貼り合わせる基板貼り合せ装置であって、
第１基板を載置せしめる第１基板支持部材と、第２基板を第１基板の上方に離間させて下方から弾性支持する第２基板支持部材とを有する基板配設容器と、
基板配設容器を密閉可能なふた部材と、
ふた部材の内側に周辺部が密着されたゴム膜であって、ふた部材で基板配設容器を密閉したときに、上側に第１チャンバを、下側に第２チャンバを形成するゴム膜と、
ゴム膜が下方に膨張変形して第２基板を第１基板に向けて押圧する差圧が発生するように第１チャンバの圧力と第２チャンバの圧力を調整する圧力調整手段と、
第２基板を第１基板に向けて押圧する際に、液晶材料を加熱する加熱手段とを具備し、
加熱手段で熱膨張せしめられた液晶材料の表面張力で第１基板と第２基板を貼り合せることを特徴とする基板貼り合せ装置。A substrate bonding apparatus for bonding a pair of substrates with a liquid crystal material interposed therebetween to form a liquid crystal display element,
A substrate disposing container having a first substrate supporting member on which the first substrate is placed, and a second substrate supporting member for elastically supporting the second substrate from below by separating the second substrate above the first substrate;
A lid member capable of sealing the substrate mounting container,
A rubber film having a peripheral portion closely adhered to the inside of the lid member, and a rubber film forming a first chamber on an upper side and a second chamber on a lower side when the substrate disposing container is sealed with the lid member;
Pressure adjusting means for adjusting the pressure of the first chamber and the pressure of the second chamber such that the rubber film expands and deforms downward to generate a differential pressure that presses the second substrate toward the first substrate;
Heating means for heating the liquid crystal material when pressing the second substrate toward the first substrate,
A substrate bonding apparatus for bonding a first substrate and a second substrate with a surface tension of a liquid crystal material thermally expanded by a heating means. 圧力調整手段は、真空ポンプと、大気導入弁とを含み、第１チャンバと第２チャンバを共に大気圧以下にした状態でゴム膜を膨張変形せしめる、ことを特徴とする請求項１に記載の基板貼り合せ装置。The pressure adjusting means includes a vacuum pump and an air introduction valve, and expands and deforms the rubber film in a state where both the first chamber and the second chamber are at or below the atmospheric pressure. Substrate bonding equipment. 加熱手段は第１基板支持部材に付設されたヒータである、ことを特徴とする請求項１に記載の基板貼り合せ装置。The substrate bonding apparatus according to claim 1, wherein the heating means is a heater attached to the first substrate support member. ヒータで加熱された第１基板支持部材を急速冷却可能な冷却装置を有する、ことを特徴とする請求項３に記載の基板貼り合せ装置。The substrate bonding apparatus according to claim 3, further comprising a cooling device capable of rapidly cooling the first substrate support member heated by the heater. 液晶表示素子を形成するために一対の基板を液晶材料を介装して貼り合せる方法であって、
基板配設容器の第１基板支持部材に第１基板を載置せしめ、第１基板上に液晶材料を滴下し、第２基板を第２基板支持部材で第１基板の上方に離間させて下方から弾性支持する基板配設ステップと、
基板配設容器を内側に周辺が密着されたゴム膜を有するふた部材で密閉し、ゴム膜の上側に第１チャンバを、下側に第２チャンバを形成する２チャンバ形成ステップと、
圧力調整手段で、ゴム膜が下方に膨張変形して第２基板を第１基板に向けて押圧する差圧が発生するように第１チャンバの圧力と第２チャンバの圧力を調整する圧力調整ステップとを含み、
圧力調整ステップにおいて、加熱手段により液晶材料を加熱し、加熱手段で熱膨張せしめられた液晶材料の表面張力で第１基板と第２基板を貼り合せることを特徴とする方法。A method of bonding a pair of substrates with a liquid crystal material interposed therebetween to form a liquid crystal display element,
The first substrate is placed on the first substrate supporting member of the substrate disposing container, a liquid crystal material is dropped on the first substrate, and the second substrate is separated from the first substrate by the second substrate supporting member and is moved downward. A substrate disposing step for elastically supporting from
A two-chamber forming step of sealing the substrate disposing container with a lid member having a rubber film whose inner periphery is in close contact, forming a first chamber above the rubber film and a second chamber below the rubber film;
A pressure adjusting step of adjusting the pressure of the first chamber and the pressure of the second chamber so that the rubber film expands and deforms downward to generate a differential pressure that presses the second substrate toward the first substrate. And
In the pressure adjusting step, a liquid crystal material is heated by a heating means, and the first substrate and the second substrate are bonded to each other with a surface tension of the liquid crystal material thermally expanded by the heating means. 圧力調整ステップにおいて、第１チャンバと第２チャンバをともに同じ値の負圧にしてから、差圧を発生せしめる、ことを特徴とする請求項５に記載の方法。The method according to claim 5, wherein in the pressure adjusting step, both the first chamber and the second chamber are set to the same negative pressure, and then the differential pressure is generated. 圧力調整ステップにおいて、第１チャンバと第２チャンバの差圧を予め設定した所定のパターンに従って変化させる、ことを特徴とする請求項５に記載の方法。The method according to claim 5, wherein, in the pressure adjusting step, a differential pressure between the first chamber and the second chamber is changed according to a predetermined pattern set in advance.
JP2001203857A 2001-07-04 2001-07-04 Apparatus for bonding substrates to form a liquid crystal display element and method for bonding substrates Expired - Lifetime JP3585457B2 (en)

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