1274391 贫明說明 【發明所屬之技術領域】 本發明係有關—種對位機構與裝置 曰曰片/晶圓鍵合領域中，具有自適性旋轉=:種 合材料之鍵合面保持平行以及具有支機構，使兩鍵 鍵合力又能夠_鍵合面平行度之—j，用以承受高 使用該機構之晶仏日日圓鍵合裝置。自相整機構以及 ❿ 【先前技術】 隨著科技進步，傳統之單一材料已經I ^ 計上之需求。由於每一種材料都具有1特^⑽兀件設 ::^電二遷移率、熱傳導率，收率=械 者:光、甬:過=材:在應用的領域上’如半導體:件或 者疋先通訊几件荨，並無所謂最佳之材料。因此，在元件 設計上’如果能透過製程方法以及設備來結合多種材料之 特性以獲得難之性能，必定可崎A轉之㈣領域以 及效能。 近年來，一種整合材料特性之晶片/晶圓鍵合技術 (Chip/Wafer bonding technique)已經逐漸克服晶格四配 之問題’而趨於成熟形成整合異質性材料之重要技術。然 而在現行之晶片/晶圓鍵合機台中，由於面臨到多接點晶片 與大尺寸晶圓材料的趨勢，因此晶片或晶圓在鍵合時會產 生鍵合面平行度校正之問題，這是因為，在上下雨鍵合材 料10、11相對之鍵合面101、111，如圖一所示，姐不平 整且平行，因此在鍵合的過程中，會因為上下鍵合面101、 6 1274391 111的不平行而導致晶片晶圓之損壞或黏著力不足。 基於上述之問題，在習用技術中有揭露相單多之對位 方法，例如中華民國專利公告號504493所揭露之一種晶片 安裝裝置及晶片安裝裝置之平行度調整方法，其係於基板 間標記多個對應位置，運用視覺辯識測定晶片基板間平行 - 度，並演算出平行度修正量，再根據演算修正量來修正平 . 行度。然而此技術因為需要視覺影像搭配複雜構件來校正 角度，因此具有對位調整耗時之缺點。 > 此外，中華民國專利公告號548417所揭露之一種具有 可平面性調整機構之探針接觸系統，其係利用接觸基板， 安裝探針板與導電彈性體，使其接觸三處位置運用間隙感 測器量測，再以旋轉調整裝置調整三處位置間隙相同。同 樣的，該技術也具有對位調整耗時之缺點。 又如，中華民國專利公告號568349所揭露之一種用於 奈米轉印之平行度調整裝置，其係利用密閉彈性膜及其所 包覆之流體，藉其接觸該平行度調整機構進行受壓調整。 > 在此技術中雖然其調整速度較前兩項之技術來得快，然後 卻具有無法承受高壓之鍵合負荷的缺點 綜合上述，因此亟需一種自適調整機構以及使用該機 構之晶片/晶圓鍵合裝置來解決習用技術之缺點。 【發明内容】 本發明的主要目的是提供一種自適調整機構以及使用 該機構之晶片/晶圓鍵合裝置，利用一自適調整機構藉由預 壓過程之壓力，使兩鍵合材料之鍵合平面平行形貼合，達 7 1274391 到快速對位調整以及增加鍵合精度之目的。 兮機要目的是提供一種自適調整機構以及使用 構=====_中利用，機 合之受力増加鍵 構，ί係了 ：二述片,:η:上提供-種自適調整機 括一萬向二;片一鍵，整機構包 二接：該平台可隨著萬向軸承之轉動而進侧面相 數個平衡支撐部，其係分一亚轉動，以及複 供維持平台於自適調整對位時之平衡Γ、’台相連接，以提 整機構’其係更包::支’而該自適調 轴承之另-側面相連接；以二，支撐桿係與該萬向 撐桿上與該走撐相 1 *疋板，其係套設於該支 個壓力叙之本體相連=提二板之-側面係與該複數 較佳的是， 产的是，該平衡支撐部係 貫阻尼之版合。其中該堡力 老、差力紅或者是彈 為了達到上述之目的，本私：或者是輪。 構，其係設置於晶片/晶 ^ ^提供一種自適調整機 括：-萬向輪承，·—平置上，該自適調整機構包 連接，該平台 ：：？、係與該萬向軸承之-側面相 數個壓力缸，爱 q承之轉動而進行轉動；以及複 提供維持平#自平台㈣接，以 8 1274391 w • 為了達到上述之目的，本發明更提供一種晶片/晶圓鍵 合裝置，包括：一萬向軸承；一平台，其係與該萬向軸承 I 之一侧面相連接，該平台可隨著萬向軸承之轉動而進行轉 動；複數個壓力缸，其係分別以一活塞桿體與該平台相連 接；以及至少一支撐機構，其係可提供該平台一支撐力。 較佳的是，該支撐機構更包括有：一螺桿部，其係具 ^ 有一第一方向螺紋體以及一第二方向螺紋體；一動力輸入 部，其係與該螺桿部相連接，可以提供一第一方向轉動以 ❿ 及一第二方向轉動之動力給該螺桿部進行轉動；一對支架 部，其係分別與該第一方向螺紋體以及該第二方向螺紋體 相連接，該對支架部可藉由該動力輸入部之第一方向轉動 以及該第二方向轉動進行一往復運動；以及一支撐部，其 係與該對支架部相連接，該支撐部可藉由該往復運動，選 擇提供以及釋放該支撐力。其中，該支撐部更包括有一座 體以及一柱體，該柱體可於該座體内往復移動。該對支架 部分別具有與該螺桿部相連接之一滑塊體，該滑塊體上更 ⑩ 具有一桿件與該柱體相連接。該動力輸入部係可為一伺服 馬達以及一歩進馬達其中之一。 【實施方式】 為使貴審查委員能對本發明之特徵、目的及功能有 ^ 更進一步的認知與暸解，下文特將本發明之系統的相關鈿 部結構以及設計的理念原由進行說明，以使得審查委員可 _ 以了解本發明之特點，詳細說明陳述如下： 請參閱圖二A以及圖二B所示，其中圖二A係為本發 9 1274391 . 明之自適調整結構較佳實施例立體示意圖；圖二B係為本 發明之萬向軸承與平台連接剖面示意圖。該自適調整機構 2包括：一平台20、一萬向轴承21以及複數個壓力缸24。 該平台20可承載要進行鍵合之材料。該萬向軸承21之一 側面與該平台20連接，萬向軸承21之用意係在使該平台 20可以作特定角度之旋轉運動，以增加平台20之運動自 由度。如圖二A所示，在本實施例中，該萬向轴承21係採 用一球面軸承與該平台20相連接。 ⑩ 再回到圖二A所示，該萬向軸承21之另一侧面上更連 接有一支撐桿22，該支撐桿22上連接有一固定板23。該 複數個壓力缸24,其本體241係被固定在該固定板23上。 每一個壓力缸24上具有可以進行往復運動的活塞桿體 242，該活塞桿體242通過該固定板23而以一端與該平台 20相連接。在該平台20未受到壓力時，該複數個壓力缸 24可以維持平台之水平度。在本實施例中，該壓力缸24 係為一氣壓缸，除了氣壓缸之外，也可以使用油壓缸。藉 ⑩ 由萬向軸承21以及該複數個壓力缸24可以使該平台20進 行轉動運動，使該平台20可以配合鍵合材料接面之狀況調 整至一適當位置，使上、下鍵合材料之鍵合接面保持平行 之狀態。前述之壓力缸24係為了維持在平台20受到預壓 力時之平衡，因此除了油壓缸、氣壓缸之外，另外也可以 是彈簧、阻尼以及其組成其中之一。因為彈簧具有彈性恢 ^ 復之功能，而阻尼可以快速使平台在施力消失之後，迅速 ‘ 恢復到定位。因此只要具備有這樣功效之元件，皆可視為 其均等物。 1274391 . 請參閱圖三A所示，該圖係為本發明之晶片/晶圓鍵合 裝置較佳實施例示意圖。該晶片/晶圓鍵合裝置4係由圖二 A之一自適調整機構2與至少一支撐機構3所構成，該支 撐機構3係設置在一基座5上以提供支撐力給該平台20。 請參閱圖三B所示，該圖係為本發明晶片/晶圓鍵合裝置之 支撐結構較佳實施例示意圖。該支撐結構3可以透過一接 觸端350提供一支撐力給該平台（圖中未示），使該平台可 以抵抗在鍵合過程中之施力。該支撐結構3包括有一螺桿 • 部32、一動力輸入部31、一對支架部33、34以及一支撐 部35。該螺桿部32具有一第一方向螺紋體321以及一第 二方向螺紋體322 ;該第一方向螺紋體321係為一左旋螺 紋時，則該第二方向螺紋體322係一右旋螺紋；反之，該 第一方向螺紋體321係為一右旋螺紋時，則該第二方向螺 紋3 2 2為一左旋螺紋。 該動力輸入部31，其係與該螺桿部32相連接，可以 提供一第一方向轉動以及一第二方向轉動之動力給該螺桿 ❿ 部進行轉動，如：順時針轉動以及逆時針轉動；在本實施 例中，該動力輸入部31可以為一伺服馬達或者是一步進馬 達，但不在此限。在該螺桿部32之中央位置設置有一支撐 部35，該支撐部35具有一座體351，該螺桿部32通過該 座體351，該座體351内更具有一柱體352可在該座體351 上進行上下之往復運動。該對支架部33、34，分別具有一 ^ 滑塊體331、341，其中一支架部33之滑塊體331與該第 • 一方向螺紋體321相連接；而另一支架部34之滑塊體341 係與該第二方向螺紋體322相連接。該對支架部33、34之 1274391 • 鬼體331、341上分別具有一桿件332、342，該桿件332、 稭由—連接元件353與該柱體352相連接。 凊芩閱圖三C所示，該圖係為本發明晶片/晶圓鍵合裝 置，支撐結構俯視配置示意圖。由於該支撐機構3係可透 =該體提供支㈣給該平台，為了能夠在提供支撐力時 =支撐以及平衡該平台之位置，因此利用三點共面之方 式，在該基座5上之三個位置上設置三個支撐機構3，以 _ 同時提供支撐力給該平台，以三點支撐維持該平台之平衡。 請參閱圖四所示，該圖係為本發明晶片/晶圓鍵合裝置 、施不意圖。首先提供如圖三A之晶片/晶圓鍵合裝置4， 在平台20上面承載一鍵合材料1〇，另外之一鍵合材料n ^在承載材料10之上方，當上壓板4〇提供施力對兩鍵合 才料ίο、11進行預壓的時候，該平台2〇會以萬向轴承21 進行特定角度之旋轉運動90,透過克服壓力缸24之出力， f兩鍵合材料1〇、U產生自適性之調整進而使兩材料之鍵 合面12平行貼合。 一預壓之後，隨著鍵合壓力板40施力的增加，再透過該 —組支撐機構3(圖中僅示兩組）對平台2〇提供支撐力91。 接下來說明支撐結構之運作，在還沒提供該平台2〇支撐力 =時，如圖五B所不，該支撐結構3此時之柱體脱尚未 與平台接觸。當使該支撐機構3需要提供平台支撐力時， ^ 可透過忒動力輸入部31提供轉動以帶動該螺桿部32轉 • 動’使該支架部33、34之滑塊體331、341往座體351方 向移動’在往座體351方向移動之同時滑塊體331、341上 之桿件332、342會帶動該柱體352往上運動，如圖五A所 1274391 示 力輪入部觸，在提供支撐力的過程巾係透過動 力產生輪出，提供該平台支㈣，以維持在施 後，則，動口力|^王中平台之穩定度。當鍵合過程結束之 構3回31又可以反方向之運轉，使該支撐機 調整機構之植人之狀悲。透過本發明之支撐機構與自適 4構δ可承受至少-倾上之鍵合力。1274391 Description of the invention [Technical field to which the invention pertains] The present invention relates to a pair of alignment mechanisms and devices in the field of wafer/wafer bonding, having an adaptive rotation =: the bonding faces of the seed materials are kept parallel and have The branching mechanism enables the two-key bonding force to be able to withstand the high-parallel locking mechanism of the wafer. Self-contained organization and ❿ [Prior technology] With the advancement of technology, traditional single materials have been in demand. Since each material has 1 special (10) element set:: ^ electric two mobility, thermal conductivity, yield = weapon: light, 甬: over = material: in the field of application 'such as semiconductor: piece or 疋There are a few pieces of communication first, there is no such thing as the best material. Therefore, in terms of component design, if the characteristics of various materials can be combined through process methods and equipment to obtain difficult performance, it is bound to be able to turn to (4) fields and performance. In recent years, a chip/wafer bonding technique that integrates material properties has gradually overcome the problem of lattice matching, and has matured to form an important technology for integrating heterogeneous materials. However, in the current wafer/wafer bonding machine, due to the trend of multi-contact wafers and large-sized wafer materials, wafers or wafers may have a problem of parallelism correction of bonding surfaces during bonding. This is because, in the case of the rain bonding materials 10, 11 opposite to the bonding faces 101, 111, as shown in Fig. 1, the sister is not flat and parallel, so in the process of bonding, the upper and lower bonding faces 101, 6 The non-parallelity of 1274391 111 results in damage to the wafer wafer or insufficient adhesion. Based on the above problems, there are many methods for aligning the same in the conventional technology, such as a wafer mounting device and a method for adjusting the parallelism of the wafer mounting device disclosed in the Republic of China Patent Publication No. 504493, which are marked by a plurality of substrates. For the corresponding position, the parallelism between the wafer substrates is determined by visual identification, and the parallelism correction amount is calculated, and the flatness is corrected according to the calculation correction amount. However, this technique has the disadvantage of time adjustment and time consuming because it requires visual images to be combined with complex components to correct the angle. In addition, a probe contact system having a planarity adjustment mechanism disclosed in the Republic of China Patent Publication No. 548417 utilizes a contact substrate to mount a probe card and a conductive elastic body to contact the three positions to sense a gap. The measuring device is measured, and then the rotation position adjustment device adjusts the same position at three positions. In the same way, this technology also has the disadvantage of time adjustment and time consuming. For example, a parallelism adjusting device for nano transfer disclosed in the Republic of China Patent Publication No. 568349 utilizes a closed elastic film and a fluid coated thereon, and is pressed by the parallelity adjusting mechanism. Adjustment. > In this technology, although the adjustment speed is faster than the first two technologies, and then has the disadvantage of being unable to withstand the high-voltage bonding load, it is necessary to have an adaptive adjustment mechanism and a wafer/wafer using the same. Bonding devices to address the shortcomings of conventional technology. SUMMARY OF THE INVENTION A primary object of the present invention is to provide an adaptive adjustment mechanism and a wafer/wafer bonding apparatus using the same, which utilizes an adaptive adjustment mechanism to press a bonding plane of two bonding materials by a pressure of a pre-pressing process. Parallel fit, up to 7 1274391 to fast alignment adjustment and increased bonding accuracy. The purpose of the downtime is to provide an adaptive adjustment mechanism and the use of the structure =====_, the force of the machine is added to the key structure, the system is: two pieces,: η: provided on - a kind of adaptive adjustment One million to two; one button, the whole body is packaged two: the platform can enter the side with several balance support parts as the universal bearing rotates, the system is divided into one sub-rotation, and the re-supply maintains the platform for self-adjustment The balance of the alignment, the 'stage connection, the adjustment mechanism' is further packaged:: the branch and the other side of the self-adjusting bearing is connected; the second, the support rod and the universal strut Corresponding to the support, the 疋 , , , , , , = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = The version. Among them, the old power, the poor red or the bullet, in order to achieve the above purpose, the private: or the wheel. Structure, which is disposed on the wafer/crystal ^ ^ provides an adaptive adjustment mechanism: - universal wheel bearing, - flat, the adaptive adjustment mechanism package connection, the platform ::? And the plurality of pressure cylinders on the side of the universal bearing, the rotation of the love cylinder is rotated; and the maintenance is provided by the platform (four), to 8 1274391 w. In order to achieve the above purpose, the present invention further A wafer/wafer bonding apparatus is provided, comprising: a universal bearing; a platform connected to one side of the universal bearing I, the platform being rotatable with the rotation of the universal bearing; The pressure cylinders are respectively connected to the platform by a piston rod body; and at least one supporting mechanism for providing a supporting force of the platform. Preferably, the supporting mechanism further comprises: a screw portion having a first direction threaded body and a second direction threaded body; and a power input portion connected to the screw portion for providing a first direction of rotation is rotated by a power in a second direction to rotate the screw portion; a pair of bracket portions are respectively coupled to the first direction thread body and the second direction thread body, the pair of brackets The portion can be reciprocated by the first direction rotation of the power input portion and the second direction rotation; and a support portion connected to the pair of bracket portions, the support portion can be selected by the reciprocating motion Provide and release the support. The support portion further includes a body and a cylinder, and the cylinder is reciprocally movable in the body. The pair of bracket portions respectively have a slider body connected to the screw portion, and the slider body further has a rod member connected to the column body. The power input unit can be one of a servo motor and a plunging motor. [Embodiment] In order to enable the reviewing committee to have a further understanding and understanding of the features, objects and functions of the present invention, the following is a description of the relevant internal structure of the system of the present invention and the concept of the design, so that the review Members can understand the characteristics of the present invention, and the detailed description is as follows: Please refer to FIG. 2A and FIG. 2B, wherein FIG. 2A is a perspective view of a preferred embodiment of the self-adapting adjustment structure of the present invention; The second B is a schematic cross-sectional view of the universal bearing and the platform of the present invention. The adaptive adjustment mechanism 2 includes a platform 20, a universal bearing 21, and a plurality of pressure cylinders 24. The platform 20 can carry the material to be bonded. One side of the universal bearing 21 is coupled to the platform 20, and the universal bearing 21 is intended to allow the platform 20 to rotate at a specific angle to increase the freedom of movement of the platform 20. As shown in Fig. 2A, in the present embodiment, the universal bearing 21 is coupled to the platform 20 by a spherical bearing. 10 Returning to Fig. 2A, the other side of the universal bearing 21 is further connected with a support rod 22 to which a fixing plate 23 is attached. The plurality of pressure cylinders 24, the body 241 of which is fixed to the fixing plate 23. Each of the cylinders 24 has a piston rod body 242 that is reciprocable, and the piston rod body 242 is connected to the platform 20 at one end by the fixing plate 23. The plurality of cylinders 24 maintain the level of the platform when the platform 20 is not under pressure. In the present embodiment, the cylinder 24 is a pneumatic cylinder, and a hydraulic cylinder may be used in addition to the pneumatic cylinder. By means of the universal bearing 21 and the plurality of pressure cylinders 24, the platform 20 can be rotated, so that the platform 20 can be adjusted to an appropriate position with the bonding material joint surface, so that the upper and lower bonding materials are The bonding joints are kept in a parallel state. The aforementioned pressure cylinder 24 is maintained in balance with the preload force of the platform 20, and thus may be one of a spring, a damping, and a combination thereof in addition to the hydraulic cylinder and the pneumatic cylinder. Because the spring has the function of elastic recovery, the damping can quickly make the platform quickly return to the position after the force is lost. Therefore, any component that has such an effect can be regarded as an equalizer. 1274391. Please refer to FIG. 3A, which is a schematic diagram of a preferred embodiment of the wafer/wafer bonding apparatus of the present invention. The wafer/wafer bonding apparatus 4 is composed of an adaptive adjustment mechanism 2 of Fig. 2A and at least one supporting mechanism 3, which is disposed on a base 5 to provide a supporting force to the platform 20. Please refer to FIG. 3B, which is a schematic diagram of a preferred embodiment of the support structure of the wafer/wafer bonding apparatus of the present invention. The support structure 3 can provide a supporting force to the platform (not shown) through a contact end 350, so that the platform can resist the force applied during the bonding process. The support structure 3 includes a screw portion 32, a power input portion 31, a pair of bracket portions 33, 34, and a support portion 35. The screw portion 32 has a first direction threaded body 321 and a second direction threaded body 322. When the first direction threaded body 321 is a left-handed thread, the second-direction threaded body 322 is a right-handed thread; When the first direction thread body 321 is a right-hand thread, the second direction thread 3 2 2 is a left-hand thread. The power input portion 31 is connected to the screw portion 32, and can provide a first direction of rotation and a second direction of rotation to rotate the screw portion, such as: clockwise rotation and counterclockwise rotation; In this embodiment, the power input unit 31 can be a servo motor or a stepping motor, but not limited thereto. A support portion 35 is disposed at a central portion of the screw portion 32. The support portion 35 has a body 351. The screw portion 32 passes through the base 351. The base 351 further has a cylinder 352 at the base 351. Reciprocating up and down. The pair of bracket portions 33, 34 respectively have a slider body 331, 341, wherein the slider body 331 of one bracket portion 33 is connected to the first direction threaded body 321; and the slider portion of the other bracket portion 34 The body 341 is coupled to the second direction threaded body 322. The pair of bracket portions 33, 34 1274391 • the ghost bodies 331, 341 respectively have a rod member 332, 342, and the rod member 332 and the straw-connecting member 353 are connected to the column body 352. Referring to Figure 3C, the figure is a schematic diagram of a top view of the support structure of the wafer/wafer bonding apparatus of the present invention. Since the supporting mechanism 3 can pass through the body to provide the support (4) to the platform, in order to be able to support and balance the position of the platform when providing the supporting force, the three-point coplanar manner is used on the base 5 Three support mechanisms 3 are provided at three locations to provide support to the platform at the same time, maintaining the balance of the platform with three points of support. Please refer to FIG. 4, which is a wafer/wafer bonding apparatus of the present invention. First, a wafer/wafer bonding device 4 as shown in FIG. 3A is provided, and a bonding material 1 承载 is carried on the platform 20, and another bonding material n ^ is above the carrier material 10, and when the upper pressing plate 4 is provided When the force is pre-compressed by the two-bonding material ίο, 11, the platform 2 〇 will perform a specific angular rotation motion 90 with the universal bearing 21, and by overcoming the output of the pressure cylinder 24, f two bonding materials 1 〇, U produces an adjustment of the self-adhesiveness so that the bonding faces 12 of the two materials are bonded in parallel. After a preloading, as the force applied by the bonding pressure plate 40 increases, the support force 91 is provided to the platform 2 through the set of support mechanisms 3 (only two sets are shown). Next, the operation of the support structure will be described. When the support force of the platform is not provided, as shown in Fig. 5B, the support structure 3 is not yet in contact with the platform. When the supporting mechanism 3 is required to provide the platform supporting force, the rotating power supply portion 31 can be rotated to drive the screw portion 32 to rotate to move the slider bodies 331, 341 of the bracket portions 33 and 34 to the seat body. 351 direction movement 'moves in the direction of the seat 351 while the rods 332, 342 on the slider bodies 331, 341 will drive the cylinder 352 upward, as shown in Figure 5A, 1274391, the force wheel is touched, provided The support process towel is rotated through the power to provide the platform support (4) to maintain the stability of the platform after the application. When the bonding process ends, the structure 3 can be operated in the opposite direction, so that the support mechanism adjusts the mechanism of the implanted person. Through the support mechanism of the present invention and the adaptive structure δ can withstand at least the tilting bonding force.
之pp = 所述者’僅為本發明之較佳實施例，當不能以 制本發明範圍。即大凡依本發对請專利$謂所做之 均等變化及修飾，仍將不失本發明之要義所在，故都應視 為本發明的進一步實施狀況。 綜合上述，本發明提供之裝置，其係具有可提供平行 調整、承受高負荷以及調整速度快等特性。因此足以滿足 業界之需求，進而k咼該產業之競爭力，誠已符合發明專 利法所規定申明發明所需具備之要件，故爰依法呈提發明 專利之申請，謹請責審查委員允撥時間惠予審視，並賜 準專利為禱。The pp = the above is merely a preferred embodiment of the invention, and is not intended to limit the scope of the invention. That is to say, the equivalent changes and modifications made by the company to the patents of the present invention will remain without losing the essence of the invention, and therefore should be regarded as further implementation of the invention. In summary, the present invention provides a device that provides parallel adjustment, high load carrying, and fast adjustment. Therefore, it is sufficient to meet the needs of the industry, and thus the competitiveness of the industry. Cheng has already met the requirements for the invention of the invention as stipulated in the invention patent law. Therefore, the application for the invention patent is submitted according to law, and the review committee is requested to allow the time. I will review it and give the patent a prayer.
13 1274391 【圖式簡單說明】 圖一係為晶片/晶圓鍵合面示意圖。 圖二A係為本發明之自適調整結構較佳實施例立體示意 圖。 圖二B係為本發明之萬向軸承與平台連接剖面示意圖。 圖三A係為本發明之晶片/晶圓鍵合裝置較佳實施例示意 - 圖。 _ 圖三B係為本發明晶片/晶圓鍵合裝置之支撐結構較佳實 施例示意圖。 圖三C係為本發明晶片/晶圓鍵合裝置之支撐結構俯視配 置示意圖。 圖四係為本發明晶片/晶圓鍵合裝置實施示意圖。 圖五A以及圖五B係為本發明之支撐結構動作示意圖。 【主要元件符號說明】 I 10-下鍵合材料 101-鍵合面 11- 上鍵合材料 111-鍵合面 12- 鍵合接面 2-自適調整機構 20-平台 以-萬向軸承 14 1274391 22-支撐桿 2 3 -固定板 24-壓力缸 241- 壓力缸本體 242- 活塞桿體 3- 支撐機構 3卜動力輸入部 _ 32-螺桿部 32卜第一方向螺紋體 322-第二方向螺紋體 33- 支架部 331- 滑塊體 332- 桿件 34- 支架部 341-滑塊體 ® 342-桿件 35- 支撐部 350- 接觸端 351- 座體 352- 柱體 353- 連接元件 4- 晶片/晶圓鍵合裝置 40-上壓板 15 1274391 5-基座 90- 旋轉調整運動 91- 支撐力13 1274391 [Simple description of the diagram] Figure 1 is a schematic diagram of the wafer/wafer bonding surface. Figure 2A is a perspective view of a preferred embodiment of the adaptive adjustment structure of the present invention. Figure 2B is a schematic cross-sectional view of the universal bearing and the platform of the present invention. Figure 3A is a schematic view of a preferred embodiment of the wafer/wafer bonding apparatus of the present invention. Figure 3B is a schematic view of a preferred embodiment of the support structure of the wafer/wafer bonding apparatus of the present invention. Figure 3C is a top plan view showing the support structure of the wafer/wafer bonding apparatus of the present invention. Figure 4 is a schematic diagram of the implementation of the wafer/wafer bonding apparatus of the present invention. Figure 5A and Figure 5B are schematic views of the operation of the support structure of the present invention. [Main component symbol description] I 10-lower bonding material 101-bonding surface 11-upper bonding material 111-bonding surface 12-bonding joint 2 - adaptive adjustment mechanism 20-platform to - universal bearing 14 1274391 22-support rod 2 3 - fixed plate 24 - pressure cylinder 241 - cylinder body 242 - piston rod body 3 - support mechanism 3 power input portion _ 32 - screw portion 32 first direction thread body 322 - second direction thread Body 33 - Bracket 331 - Slider body 332 - Rod 34 - Bracket 341 - Slider body 342 - Rod 35 - Support 350 - Contact 351 - Seat 352 - Cylinder 353 - Connecting element 4 Wafer/wafer bonding device 40 - upper platen 15 1274391 5-base 90 - rotary adjustment movement 91 - support force