CN202841720U

CN202841720U - Auxiliary tool for printing conducting resin on flexible printed circuit

Info

Publication number: CN202841720U
Application number: CN 201220518622
Authority: CN
Inventors: 邹平; 刘伟; 杨锡辉
Original assignee: Xiamen G&P Electronic Co Ltd
Current assignee: Xiamen G&P Electronic Co Ltd
Priority date: 2012-10-11
Filing date: 2012-10-11
Publication date: 2013-03-27
Anticipated expiration: 2022-10-11

Abstract

The utility model relates to the manufacturing technique of a flexible printed circuit (FPC), in particular to an auxiliary tool for printing conducting resin on a FPC product connected with an integrated circuit (IC) package component in a welded mode. The auxiliary tool for printing the conducting resin on the FPC comprises a surface plate. The surface plate is of a certain thickness which is at least larger than the thickness of the IC package component connected on the FPC insulating base plate in a welded mode. A hollowed-out window is formed in the surface plate. Due to the fact that the hollowed-out window is formed in the surface plate, the IC package component can decline into the hollowed-out window when the FPC insulating base plate is placed on the surface plate, so that the conducting resin can be printed on the FPC in a smoother way.

Description

The accessory of flexible PCB printing conductive glue

Technical field

The utility model relates to the FPC(flexible PCB) manufacturing process, especially the FPC product that is welded with the IC packaging is carried out the used aid of printing conductive glue.

Background technology

Certain some product type need to be printed on conducting resinl and is welded with the IC packaging and consists of at the FPC insulated substrate in flexible PCB (FPC) product.Because conducting resinl is non-refractory, and need higher temperature in the paster Reflow Soldering of the weld job operation of realization IC packaging and the hot pressing process, such processing temperature is unaffordable to conducting resinl.Therefore, in this class FPC product, be need to be first by hot pressing and paster Reflow Soldering operation with on the welding of IC packaging and the FPC insulated substrate, then carry out again the Job Operations of printing conductive glue.

In this class FPC product owing to being welded with the IC packaging first so that the FPC insulated substrate at the thickness in the zone that is positioned at the IC packaging much larger than other thickness of welding region not.Thereby so that, its Job Operations that carries out printing conductive glue is had deficiency; Conducting resinl thickness for example occurs and print inhomogeneous badly, even easily cause most of device failure.

The utility model content

Therefore, the utility model proposes a kind of accessory of flexible PCB printing conductive glue, can make the flexible PCB that is welded with the IC packaging can be smooth when printing conductive glue by this aid, thereby make its Job Operations that carries out printing conductive glue can smooth and easyly be carried out.

The following technical scheme of the concrete employing of the utility model:

The accessory of flexible PCB printing conductive glue comprises a flat board, and this flat board has certain thickness, and this dull and stereotyped thickness is at least greater than the thickness of the IC packaging that welds on the FPC insulated substrate, and should offer the hollow out window on the flat board.The hollow out window is and penetrates this dull and stereotyped window.Arrange by this dull and stereotyped hollow out window, and when making the FPC insulated substrate on being positioned over flat board, the IC packaging can sink down into this hollow out window.

Further, described flat board is the phenolic resins plate.

The use of the accessory by flexible PCB printing conductive glue of the present utility model can be achieved as follows technical purpose:

1), in the time of can solving printing conductive glue, the IC packaging that welds on the FPC insulated substrate is weighed wounded damage, guarantees the IC packaging electrical property quality of welding on the FPC insulated substrate;

2), can solve conducting resinl thickness and print inhomogeneous bad phenomenon, guarantee conducting resinl print thickness uniformity.

Description of drawings

Fig. 1 is the folded composition of the flexible PCB of splicing fingers class;

Fig. 2 a is the stereogram of the accessory of flexible PCB printing conductive glue;

Fig. 2 b is the cutaway view of the accessory of flexible PCB printing conductive glue;

Fig. 3 a is the schematic diagram in the front of a flexible PCB;

Fig. 3 b is the schematic diagram of the reverse side of a flexible PCB;

Fig. 4 a is that a flexible PCB carries out for the first time die-cut schematic diagram of profile;

Fig. 4 b is that a flexible PCB carries out for the first time die-cut schematic diagram of profile.

Embodiment

Now the present invention is further described with embodiment by reference to the accompanying drawings.

The structure of shown in Figure 1 is a kind of flexible PCB product type of splicing fingers class is schematic diagram.This class both need printing conductive glue on the FPC insulated substrate, need again to weld the IC packaging.Concrete, that the two-sided conducting metal level 2(that all is formed with on FPC insulated substrate 1 is generally copper foil layer) and welding resisting layer 3, IC packaging 4 is arranged on the certain position on the FPC insulated substrate 1, and consists of to electrically conduct with conducting metal level 2 by welding and be connected.And, in order to protect IC packaging 4, generally also strengthen physical strength by glue 6 bondings one reinforcing chip 7 at relative another reverse side of welding IC packaging 4.5 is the conducting resinl printing zone.

Consult shown in Fig. 2 a and Fig. 2 b, carry out the operation of printing conductive glue and a kind of accessory of usefulness includes: a flat board 8 for the flexible PCB of above-mentioned splicing fingers class shown in Figure 1, this flat board 8 has certain thickness, the thickness of this flat board 8 is at least greater than the thickness of IC packaging 4 of welding on the above-mentioned FPC insulated substrate 1, and should offer hollow out window 81 on the flat board 8, hollow out window 81 by this flat board 8 arranges, and make FPC insulated substrate 1 when being positioned on dull and stereotyped 8, IC packaging 4 can sink down into this hollow out window 81, thereby makes the face of printing conductive glue smooth.Preferably, dull and stereotyped 8 use modal phenolic resins plate (being bakelite plate) to make.

The below illustrates the use principle of above-mentioned accessory as example take a kind of flexible circuit panel products of splicing fingers class of the IC of containing packaging.Consult shown in Fig. 3 a and Fig. 3 b, this flexible PCB is double sided board.Wherein be welded with the IC packaging on the front shown in Fig. 3 a, and positive interposition is equipped with the splicing fingers pad, needs printing conductive glue (ACP conducting resinl), the end positions of the reverse side shown in Fig. 3 b also has the splicing fingers pad, needs equally printing conductive glue.Printing conductive glue carries out with regard to minute following 2 steps equally:

(1) the positive conducting resinl of printing: because the face of printing conductive glue is when the same face with the IC packaging that welds, when stating in the use accessory cooperation printing conductive glue, must allow flexible PCB before printing conductive glue, profile around the IC packaging be cut, and can not use the disposable die-cut mode except profile of conventional method.Consult shown in Fig. 4 a, punch out first IC packaging profile on every side.Then this flexible PCB is placed on above-mentioned accessory, the IC packaging just can sink down in the hollow out window of accessory flat board, thus the smooth shape when guaranteeing to print.Behind the complete conducting resinl to be printed, the remainder of die-cut flexible PCB shown in Fig. 4 b again, and flexible PCB unit sheet can be broken away from from layout;

(2) conducting resinl of printing reverse side: because the face of printing conductive glue and the IC packaging that welds are at coplanar not, when stating in the use accessory and cooperating printing conductive glue, directly flexible PCB directly are placed on and carry out printing conductive glue on the accessory flat board and get final product.Use hollow out window that the accessory purpose is used for allowing the IC packaging be positioned at the accessory flat board and and guarantee that the conducting resinl printing surface of flexible PCB is positioned at same level, the smooth shape when guaranteeing to print.

The above describes as an example of a two-sided flexible PCB example; If single sided board, then can according to the face of top IC packaging and printing conductive glue whether the situation of coplanar or antarafacial carry out.

Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.

Claims

1. the accessory of flexible PCB printing conductive glue comprises a flat board, and this flat board has certain thickness, and this dull and stereotyped thickness is at least greater than the thickness of the IC packaging that welds on the FPC insulated substrate, and should offer the hollow out window on the flat board.

2. the accessory of flexible PCB printing conductive glue according to claim 1, it is characterized in that: described flat board is the phenolic resins plate.