CN110299310A - Crystal grain soft mode encapsulation engagement thermometric jig and its setting method - Google Patents
Crystal grain soft mode encapsulation engagement thermometric jig and its setting method Download PDFInfo
- Publication number
- CN110299310A CN110299310A CN201910515004.6A CN201910515004A CN110299310A CN 110299310 A CN110299310 A CN 110299310A CN 201910515004 A CN201910515004 A CN 201910515004A CN 110299310 A CN110299310 A CN 110299310A
- Authority
- CN
- China
- Prior art keywords
- crystal grain
- soft mode
- grain soft
- thermometric
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
The application provides a kind of crystal grain soft mode encapsulation engagement thermometric jig and setting method, and crystal grain soft mode encapsulation engagement thermometric jig includes: panel；The encapsulation of crystal grain soft mode；Thermocouple is embedded in crystal grain soft mode on panel and encapsulates engaging zones middle position；And anisotropic conductive film, it is covered in crystal grain soft mode packaging area.
Description
Technical field
This application involves a kind of crystal grain soft modes to encapsulate engagement thermometric jig and its setting method, in particular to one kind is to the opposite sex
Conductive film attaches set temperature and carries out actual measurement, it is ensured that the actual temperature measured reaches the crystal grain soft mode of prescribed requirement
Encapsulation engagement thermometric jig and its setting method.
Background technique
With the development of display technology, display technology enters the flexible epoch, and OLED is current mainstream Technology of Flexibility, often at present
Actuation techniques are shone by COF (Chip On Film) driving display.Crystal grain soft mode encapsulation engagement (COF Bonding)
In have a procedure be anisotropic conductive film (Anisotropic Conductive Film, ACF) attach link, specific implementation
Process be exactly pass through crystal grain soft mode encapsulation engagement (COF Bonding) equipment will be anisotropic conductive with certain temperature, pressure, time
Film (ACF) sticker is on panel.During ACF is attached, it is influenced by temperature, is easy to produce bubble.In order to solve
Air bubble problem needs to monitor anisotropic conductive film (ACF) and attaches actual temperature whether in specification.But in specific operation process
In, technical staff is to encapsulate the temperature parameter setting being fixed in engagement (COF Bonding) equipment, ginseng in crystal grain soft mode
Actual measurement is not carried out after the completion of number setting, due to having the release film of a thickness, setting temperature on anisotropic conductive film (ACF) glue
It is had differences between degree and actual temperature.To evade the wind that temperature difference causes anisotropic conductive film (ACF) to attach generation bubble
Danger needs to make a kind of anisotropic conductive film (ACF) attaching thermometric jig, attaches set temperature to anisotropic conductive film (ACF)
Carry out actual measurement, it is ensured that the actual temperature measured reaches prescribed requirement.
Summary of the invention
The embodiment of the present application provides a kind of crystal grain soft mode encapsulation engagement thermometric jig and its setting method, existing to solve
During anisotropic conductive film attaches, the technical issues of being influenced by temperature, be easy to produce bubble.
The embodiment of the present application provides a kind of crystal grain soft mode encapsulation engagement thermometric jig comprising:
Panel；
The encapsulation of crystal grain soft mode；
Thermocouple is embedded in crystal grain soft mode on panel and encapsulates engaging zones middle position；And
Anisotropic conductive film is covered in crystal grain soft mode packaging area.
In the crystal grain soft mode encapsulation engagement thermometric jig of the application, the thermocouple is to monitor anisotropic conductive film patch
Whether attached actual temperature is in specification.
In the crystal grain soft mode encapsulation engagement thermometric jig of the application, there is one layer of 50um thickness on the opposite sex conductive film
Release film.
In the crystal grain soft mode encapsulation engagement thermometric jig of the application, the thermocouple is with the fixed position of fixation adhesive tape in face
Crystal grain soft mode encapsulates engaging zones middle position on plate.
Another embodiment of the application provides a kind of crystal grain soft mode encapsulation engagement thermometric jig setting method, including following step
It is rapid:
Thermocouple is embedded in panel and crystal grain soft mode encapsulates engaging zones middle position；
The position of the fixed thermocouple；And
Anisotropic conductive film is covered in crystal grain soft mode packaging area.
In the crystal grain soft mode encapsulation engagement thermometric jig setting method of the application, the thermocouple is led to monitor the opposite sex
Conductive film attaches actual temperature whether in specification.
In the crystal grain soft mode encapsulation engagement thermometric jig setting method of the application, there is one layer on the opposite sex conductive film
The release film of 50um thickness.
In the crystal grain soft mode encapsulation engagement thermometric jig setting method of the application, the thermocouple is fixed with fixation adhesive tape
Position crystal grain soft mode on panel encapsulates engaging zones middle position.
Compared to the anisotropic conductive film attached process of existing crystal grain soft mode encapsulation technology, the crystal grain soft mode of the application is encapsulated
When engaging thermometric jig improves crystal grain soft mode encapsulation (COF Bonding), anisotropic conductive film (ACF) attach can because temperature and
Bubble is led to the problem of, is pasted by the setting effective monitoring opposite sex conductive film (ACF) that crystal grain soft mode encapsulates engagement thermometric jig
Attached process, the yield of (COF Bonding) reduces visitor so that reaching reduces quality penalty cost when promoting the encapsulation of crystal grain soft mode
It tells probability, promotes Products competitiveness.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, below to required in embodiment
Attached drawing to be used is briefly described.The accompanying drawings in the following description is only the section Example of the application, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the first implementation status diagram of the crystal grain soft mode encapsulation engagement thermometric jig of the application；
Fig. 2 is the second implementation status diagram of the crystal grain soft mode encapsulation engagement thermometric jig of the application；
Fig. 3 is that the third of the crystal grain soft mode encapsulation engagement thermometric jig of the application implements status diagram.
Specific embodiment
The schema in attached drawing is please referred to, wherein identical component symbol represents identical component.The following description is to be based on
Illustrated by the application specific embodiment, be not construed as limitation the application other specific embodiments not detailed herein.
Referring to referring to Fig.1-3, Fig. 1-3 is each implementation shape of the crystal grain soft mode encapsulation engagement thermometric jig of the application
State schematic diagram.
The application crystal grain soft mode encapsulation engagement thermometric jig includes: panel 110；Crystal grain soft mode encapsulation region 120；Thermocouple
130；And anisotropic conductive film 150, it is covered in crystal grain soft mode encapsulation region 120.
Another embodiment of the application provides a kind of crystal grain soft mode encapsulation engagement thermometric jig setting method, respectively corresponds Fig. 1-
Fig. 3: the following steps are included:
In Fig. 1, thermocouple 130 is embedded in panel 110 and crystal grain soft mode encapsulates 120 middle position of bonding land；
In Fig. 2, pass through the position of the fixed thermocouple 130 of fixed glue 140；And
In Fig. 3, by the covering 150 of anisotropic conductive film in crystal grain soft mode encapsulation region 120.
In this application, the thermocouple attaches actual temperature whether in specification to monitor anisotropic conductive film.
In this application, there is the release film of one layer of 50um thickness on the anisotropic conductive film.
In this application, the thermocouple is encapsulated in engaging zones with the fixed position of fixation adhesive tape crystal grain soft mode on panel
Between position.
Compared to the anisotropic conductive film attached process of existing crystal grain soft mode encapsulation technology, the crystal grain soft mode of the application is encapsulated
When engaging thermometric jig improves crystal grain soft mode encapsulation (COF Bonding), anisotropic conductive film (ACF) attach can because temperature and
Bubble is led to the problem of, is pasted by the setting effective monitoring opposite sex conductive film (ACF) that crystal grain soft mode encapsulates engagement thermometric jig
Attached process, the yield of (COF Bonding) reduces visitor so that reaching reduces quality penalty cost when promoting the encapsulation of crystal grain soft mode
It tells probability, promotes Products competitiveness.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the appended right of the present invention
It is required that protection scope.
Claims (8)
1. a kind of crystal grain soft mode encapsulation engagement thermometric jig characterized by comprising
Panel；
The encapsulation of crystal grain soft mode；
Thermocouple is embedded in crystal grain soft mode on panel and encapsulates engaging zones middle position；And
Anisotropic conductive film is covered in crystal grain soft mode packaging area.
2. crystal grain soft mode encapsulation engagement thermometric jig according to claim 1, which is characterized in that the thermocouple is to supervise
It controls anisotropic conductive film and attaches actual temperature whether in specification.
3. crystal grain soft mode encapsulation engagement thermometric jig according to claim 1, which is characterized in that the opposite sex conductive film
On have the release film of one layer of 50um thickness.
4. crystal grain soft mode encapsulation engagement thermometric jig according to claim 1, which is characterized in that the thermocouple is with fixation
The fixed position of adhesive tape crystal grain soft mode on panel encapsulates engaging zones middle position.
5. a kind of crystal grain soft mode encapsulation engagement thermometric jig setting method, comprising the following steps:
Thermocouple is embedded in panel and crystal grain soft mode encapsulates engaging zones middle position；
The position of the fixed thermocouple；And
Anisotropic conductive film is covered in crystal grain soft mode packaging area.
6. crystal grain soft mode encapsulation engagement thermometric jig setting method according to claim 5, which is characterized in that the thermoelectricity
Coupling attaches actual temperature whether in specification to monitor anisotropic conductive film.
7. crystal grain soft mode encapsulation engagement thermometric jig setting method according to claim 5, which is characterized in that the opposite sex
There is the release film of one layer of 50um thickness on conductive film.
8. crystal grain soft mode encapsulation engagement thermometric jig setting method according to claim 5, which is characterized in that the thermoelectricity
Coupling encapsulates engaging zones middle position with the fixed position of fixation adhesive tape crystal grain soft mode on panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910515004.6A CN110299310A (en) | 2019-06-14 | 2019-06-14 | Crystal grain soft mode encapsulation engagement thermometric jig and its setting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910515004.6A CN110299310A (en) | 2019-06-14 | 2019-06-14 | Crystal grain soft mode encapsulation engagement thermometric jig and its setting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110299310A true CN110299310A (en) | 2019-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910515004.6A Pending CN110299310A (en) | 2019-06-14 | 2019-06-14 | Crystal grain soft mode encapsulation engagement thermometric jig and its setting method |
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Citations (8)
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|---|---|---|---|---|
| JPH04302446A (en) * | 1991-03-29 | 1992-10-26 | Toshiba Corp | Mounting method of semiconductor element |
| JP2000047179A (en) * | 1998-07-31 | 2000-02-18 | Hosiden Corp | Liquid crystal display element |
| CN101325192A (en) * | 2008-06-13 | 2008-12-17 | 友达光电（苏州）有限公司 | Substrate easy to measure temperature and manufacturing method thereof |
| JP2009267178A (en) * | 2008-04-28 | 2009-11-12 | Panasonic Corp | Electronic component mounting device, and bonding defect detection method |
| CN101813838A (en) * | 2009-02-20 | 2010-08-25 | 株式会社日立高新技术 | ACF thermo-compression bonding device |
| CN102695947A (en) * | 2009-12-18 | 2012-09-26 | 东京毅力科创株式会社 | Temperature measuring apparatus |
| CN105790027A (en) * | 2016-03-08 | 2016-07-20 | 京东方科技集团股份有限公司 | Outer lead crimping device |
| CN106226927A (en) * | 2016-08-29 | 2016-12-14 | 贵州晟昌科技有限公司 | A kind of production technology of liquid crystal module |
-
2019
- 2019-06-14 CN CN201910515004.6A patent/CN110299310A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04302446A (en) * | 1991-03-29 | 1992-10-26 | Toshiba Corp | Mounting method of semiconductor element |
| JP2000047179A (en) * | 1998-07-31 | 2000-02-18 | Hosiden Corp | Liquid crystal display element |
| JP2009267178A (en) * | 2008-04-28 | 2009-11-12 | Panasonic Corp | Electronic component mounting device, and bonding defect detection method |
| CN101325192A (en) * | 2008-06-13 | 2008-12-17 | 友达光电（苏州）有限公司 | Substrate easy to measure temperature and manufacturing method thereof |
| CN101813838A (en) * | 2009-02-20 | 2010-08-25 | 株式会社日立高新技术 | ACF thermo-compression bonding device |
| CN102695947A (en) * | 2009-12-18 | 2012-09-26 | 东京毅力科创株式会社 | Temperature measuring apparatus |
| CN105790027A (en) * | 2016-03-08 | 2016-07-20 | 京东方科技集团股份有限公司 | Outer lead crimping device |
| CN106226927A (en) * | 2016-08-29 | 2016-12-14 | 贵州晟昌科技有限公司 | A kind of production technology of liquid crystal module |
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